IT1179902B - Lega di rame debolmente legata procedimento per la sua preparazione e impiego - Google Patents
Lega di rame debolmente legata procedimento per la sua preparazione e impiegoInfo
- Publication number
- IT1179902B IT1179902B IT68290/84A IT6829084A IT1179902B IT 1179902 B IT1179902 B IT 1179902B IT 68290/84 A IT68290/84 A IT 68290/84A IT 6829084 A IT6829084 A IT 6829084A IT 1179902 B IT1179902 B IT 1179902B
- Authority
- IT
- Italy
- Prior art keywords
- preparation
- copper alloy
- weakly linked
- linked copper
- procedure
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
- H01L23/4924—Bases or plates or solder therefor characterised by the materials
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3347535A DE3347535C1 (de) | 1983-12-30 | 1983-12-30 | Niedriglegierte Kupferlegierung,Verfahren zu ihrer Herstellung sowie ihre Verwendung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IT8468290A0 IT8468290A0 (it) | 1984-12-28 |
| IT1179902B true IT1179902B (it) | 1987-09-16 |
Family
ID=6218426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT68290/84A IT1179902B (it) | 1983-12-30 | 1984-12-28 | Lega di rame debolmente legata procedimento per la sua preparazione e impiego |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4610843A (it) |
| DE (1) | DE3347535C1 (it) |
| FI (1) | FI71956C (it) |
| FR (1) | FR2557593B1 (it) |
| GB (1) | GB2152077B (it) |
| IT (1) | IT1179902B (it) |
| SE (1) | SE456427B (it) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112708799A (zh) * | 2020-12-21 | 2021-04-27 | 江西理工大学 | 一种高强导电抗软化铜合金及其制备方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54104596A (en) * | 1978-02-03 | 1979-08-16 | Nippon Mining Co | Copper alloy for lead frame |
| DE2948916C2 (de) * | 1979-12-05 | 1981-12-10 | Wieland-Werke Ag, 7900 Ulm | Kupfer-Zinn-Legierung, Verfahren zu ihrer Herstellung sowie ihre Verwendung |
| JPS5834536B2 (ja) * | 1980-06-06 | 1983-07-27 | 日本鉱業株式会社 | 半導体機器のリ−ド材用の銅合金 |
| JPS5727051A (en) * | 1980-07-25 | 1982-02-13 | Nippon Telegr & Teleph Corp <Ntt> | Copper nickel tin alloy for integrated circuit conductor and its manufacture |
-
1983
- 1983-12-30 DE DE3347535A patent/DE3347535C1/de not_active Expired
-
1984
- 1984-11-23 FI FI844601A patent/FI71956C/fi not_active IP Right Cessation
- 1984-12-14 GB GB08431681A patent/GB2152077B/en not_active Expired
- 1984-12-21 US US06/684,563 patent/US4610843A/en not_active Expired - Fee Related
- 1984-12-28 IT IT68290/84A patent/IT1179902B/it active
- 1984-12-28 SE SE8406669A patent/SE456427B/sv not_active IP Right Cessation
- 1984-12-28 FR FR8419978A patent/FR2557593B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| US4610843A (en) | 1986-09-09 |
| IT8468290A0 (it) | 1984-12-28 |
| FI844601L (fi) | 1985-07-01 |
| GB8431681D0 (en) | 1985-01-30 |
| FI71956C (fi) | 1987-03-09 |
| SE8406669D0 (sv) | 1984-12-28 |
| GB2152077A (en) | 1985-07-31 |
| FR2557593A1 (fr) | 1985-07-05 |
| FI844601A0 (fi) | 1984-11-23 |
| SE456427B (sv) | 1988-10-03 |
| SE8406669L (sv) | 1985-07-01 |
| DE3347535C1 (de) | 1988-10-20 |
| FR2557593B1 (fr) | 1987-10-30 |
| FI71956B (fi) | 1986-11-28 |
| GB2152077B (en) | 1987-04-23 |
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