FR2557593B1 - Alliage de cuivre faiblement allie, procede pour le fabriquer, et son utilisation - Google Patents

Alliage de cuivre faiblement allie, procede pour le fabriquer, et son utilisation

Info

Publication number
FR2557593B1
FR2557593B1 FR8419978A FR8419978A FR2557593B1 FR 2557593 B1 FR2557593 B1 FR 2557593B1 FR 8419978 A FR8419978 A FR 8419978A FR 8419978 A FR8419978 A FR 8419978A FR 2557593 B1 FR2557593 B1 FR 2557593B1
Authority
FR
France
Prior art keywords
manufacturing
same
copper alloy
alloyed copper
low alloyed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8419978A
Other languages
English (en)
Other versions
FR2557593A1 (fr
Inventor
Jorg Steeb
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wieland Werke AG
Original Assignee
Wieland Werke AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wieland Werke AG filed Critical Wieland Werke AG
Publication of FR2557593A1 publication Critical patent/FR2557593A1/fr
Application granted granted Critical
Publication of FR2557593B1 publication Critical patent/FR2557593B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4924—Bases or plates or solder therefor characterised by the materials
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
FR8419978A 1983-12-30 1984-12-28 Alliage de cuivre faiblement allie, procede pour le fabriquer, et son utilisation Expired FR2557593B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3347535A DE3347535C1 (de) 1983-12-30 1983-12-30 Niedriglegierte Kupferlegierung,Verfahren zu ihrer Herstellung sowie ihre Verwendung

Publications (2)

Publication Number Publication Date
FR2557593A1 FR2557593A1 (fr) 1985-07-05
FR2557593B1 true FR2557593B1 (fr) 1987-10-30

Family

ID=6218426

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8419978A Expired FR2557593B1 (fr) 1983-12-30 1984-12-28 Alliage de cuivre faiblement allie, procede pour le fabriquer, et son utilisation

Country Status (7)

Country Link
US (1) US4610843A (fr)
DE (1) DE3347535C1 (fr)
FI (1) FI71956C (fr)
FR (1) FR2557593B1 (fr)
GB (1) GB2152077B (fr)
IT (1) IT1179902B (fr)
SE (1) SE456427B (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112708799A (zh) * 2020-12-21 2021-04-27 江西理工大学 一种高强导电抗软化铜合金及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54104596A (en) * 1978-02-03 1979-08-16 Nippon Mining Co Copper alloy for lead frame
DE2948916C2 (de) * 1979-12-05 1981-12-10 Wieland-Werke Ag, 7900 Ulm Kupfer-Zinn-Legierung, Verfahren zu ihrer Herstellung sowie ihre Verwendung
JPS5834536B2 (ja) * 1980-06-06 1983-07-27 日本鉱業株式会社 半導体機器のリ−ド材用の銅合金
JPS5727051A (en) * 1980-07-25 1982-02-13 Nippon Telegr & Teleph Corp <Ntt> Copper nickel tin alloy for integrated circuit conductor and its manufacture

Also Published As

Publication number Publication date
SE8406669L (sv) 1985-07-01
GB2152077B (en) 1987-04-23
GB8431681D0 (en) 1985-01-30
FR2557593A1 (fr) 1985-07-05
SE456427B (sv) 1988-10-03
FI71956C (fi) 1987-03-09
SE8406669D0 (sv) 1984-12-28
US4610843A (en) 1986-09-09
FI844601L (fi) 1985-07-01
GB2152077A (en) 1985-07-31
DE3347535C1 (de) 1988-10-20
IT8468290A0 (it) 1984-12-28
IT1179902B (it) 1987-09-16
FI71956B (fi) 1986-11-28
FI844601A0 (fi) 1984-11-23

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Legal Events

Date Code Title Description
ST Notification of lapse