FI120102B - Enkristall odlingsförfarande - Google Patents
Enkristall odlingsförfarande Download PDFInfo
- Publication number
- FI120102B FI120102B FI925866A FI925866A FI120102B FI 120102 B FI120102 B FI 120102B FI 925866 A FI925866 A FI 925866A FI 925866 A FI925866 A FI 925866A FI 120102 B FI120102 B FI 120102B
- Authority
- FI
- Finland
- Prior art keywords
- crucible
- crystal
- constant
- temperature
- liquid surface
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/14—Heating of the melt or the crystallised materials
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/20—Controlling or regulating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1004—Apparatus with means for measuring, testing, or sensing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1032—Seed pulling
- Y10T117/1068—Seed pulling including heating or cooling details [e.g., shield configuration]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1032—Seed pulling
- Y10T117/1072—Seed pulling including details of means providing product movement [e.g., shaft guides, servo means]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Claims (6)
1. Förfarande för odling av monokristall, väri a} signal en bringas att infalla pä en smalt väts-keyta av rämaterial för monokristall insatt i degel; 5 b): den smälta vätskeytans position mats g en ora de- tektering av en reflekterad signal, som kommer fran ifrä-gavarande suvaita vätskeyta;: och e) for köntrollering av vätskeytans position höjs degeln enligt den. uppmätta positioners awikelse frän in-· 10 ställningspositioiisvärdet, k ä n n e t e e k n a t av att d) degeln höjs med en konstant höjningshastighet för degeln, ifall den smälta vätskeytans position är tikattan som inställnihgspositionsvärdet, 15 e) degelns ho jningshastighet sätts att vara ifrä- gavarande konstanta hastighet, som minskas med ett fast korrigeringsvärde för nämnda konstanta hastighet, ifall den smälta vätskeytans position är högre än inställnings-posi tionsvärdet, 20 f) degelns höjningshastighet sätts att vara ifrä- gävarande konstanta hastighet, som ökas med ett fast korrigeringsvärde för nämnda konstanta hastighet, ifall den smälta vätskeytans position är lägre än inställningsposi-tionsvärdet. 25
2. Förfarande enligt patentkrav 1, kannet eek- nat av att i steg e), f) sinks eller höjs korrigerings-värdet stegvis, tills nämnda position motsvarar install-ningspositionsvärdet, varvid efter varje sänknings-/höjningssteg väntas den tid som gär ät tili inställnings-30 tiden.
3. Förfarande enligt patentkrav 1, k ä n n e t e c k -n a t av att signalen bestar av ett laserijus.
4. Förfarande enligt patentkrav 1, kannetee k — nät av att i steg e), f) bildas en övre och nedre posi-35 tion, när positionen är ovanom eller nedanom toleransvär- 1 det (0,1 mm) för vätskeytans övergäng.
5. Förfarande enligt pa tent kr av 1, kannet e c k -nat av att näinnda konstanta hastighet iiar deiinierats att vara fröets höjningshastigiiet ganger degelns höjnings-förhällande. 5
6. Förfarande enligt patentkrav 2, känneteck- n a t av att näinnda korrigeringsvärde för sänkning och höjning av den kons tanta hastigheten förstoras ögIi minskas med en fast korrigeringsprocent för nämnda konsteilta has-tigliet ganger mängden upprepningar, alltid när näinnda 10 sänkning och höjning görs tills man uppnär korrigeringens gränsvärdc.
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3125444A JP2732723B2 (ja) | 1991-04-26 | 1991-04-26 | 液面温度制御方法 |
JP12544491 | 1991-04-26 | ||
JP3099329A JP2735960B2 (ja) | 1991-04-30 | 1991-04-30 | 液面制御方法 |
JP9932991 | 1991-04-30 | ||
JP3138048A JP2726773B2 (ja) | 1991-06-10 | 1991-06-10 | シリコン単結晶引き上げ方法 |
JP13804891 | 1991-06-10 | ||
PCT/JP1991/001790 WO1992019797A1 (en) | 1991-04-26 | 1991-12-27 | Process for pulling up single crystal |
JP9101790 | 1991-12-27 |
Publications (3)
Publication Number | Publication Date |
---|---|
FI925866A FI925866A (fi) | 1992-12-23 |
FI925866A0 FI925866A0 (fi) | 1992-12-23 |
FI120102B true FI120102B (sv) | 2009-06-30 |
Family
ID=27308924
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI925866A FI120102B (sv) | 1991-04-26 | 1992-12-23 | Enkristall odlingsförfarande |
FI20040787A FI120546B (sv) | 1991-04-26 | 2004-06-08 | Enkristall odlingsförfarande |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20040787A FI120546B (sv) | 1991-04-26 | 2004-06-08 | Enkristall odlingsförfarande |
Country Status (6)
Country | Link |
---|---|
US (1) | US5408952A (sv) |
EP (2) | EP0911430B1 (sv) |
KR (1) | KR100237848B1 (sv) |
DE (2) | DE69132009T2 (sv) |
FI (2) | FI120102B (sv) |
WO (1) | WO1992019797A1 (sv) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5888299A (en) * | 1995-12-27 | 1999-03-30 | Shin-Etsu Handotai Co., Ltd. | Apparatus for adjusting initial position of melt surface |
US5746828A (en) * | 1996-01-16 | 1998-05-05 | General Signal Corporation | Temperature control system for growing high-purity monocrystals |
JPH09221386A (ja) * | 1996-02-08 | 1997-08-26 | Komatsu Electron Metals Co Ltd | 単結晶引上装置 |
US6071340A (en) * | 1996-02-28 | 2000-06-06 | General Signal Technology Corporation | Apparatus for melt-level detection in Czochralski crystal growth systems |
DE69601424T2 (de) * | 1996-06-27 | 1999-06-02 | Wacker Siltronic Gesellschaft Fuer Halbleitermaterialien Ag, 84489 Burghausen | Verfahren und Vorrichtung zur Steuerung des Kristallwachstums |
US6503594B2 (en) | 1997-02-13 | 2003-01-07 | Samsung Electronics Co., Ltd. | Silicon wafers having controlled distribution of defects and slip |
US6045610A (en) * | 1997-02-13 | 2000-04-04 | Samsung Electronics Co., Ltd. | Methods of manufacturing monocrystalline silicon ingots and wafers by controlling pull rate profiles in a hot zone furnance |
SG64470A1 (en) | 1997-02-13 | 1999-04-27 | Samsung Electronics Co Ltd | Methods of manufacturing monocrystalline silicon ingots and wafers by controlling pull rate profiles in a hot zone furnace and ingots and wafers manufactured thereby |
US6485807B1 (en) | 1997-02-13 | 2002-11-26 | Samsung Electronics Co., Ltd. | Silicon wafers having controlled distribution of defects, and methods of preparing the same |
JP2991162B2 (ja) * | 1997-07-18 | 1999-12-20 | 日本電気株式会社 | プロセスシミュレーション方法、プロセスシミュレータ及びプロセスシミュレーションプログラムを記録した記録媒体 |
EP0903428A3 (de) | 1997-09-03 | 2000-07-19 | Leybold Systems GmbH | Einrichtung und Verfahren für die Bestimmung von Durchmessern eines Kristalls |
US6340392B1 (en) | 1997-10-24 | 2002-01-22 | Samsung Electronics Co., Ltd. | Pulling methods for manufacturing monocrystalline silicone ingots by controlling temperature at the center and edge of an ingot-melt interface |
DE19806949A1 (de) * | 1998-02-19 | 1999-08-26 | Leybold Systems Gmbh | Verfahren zum Steuern von Kristallzüchtungsprozessen |
US5968263A (en) * | 1998-04-01 | 1999-10-19 | Memc Electronic Materials, Inc. | Open-loop method and system for controlling growth of semiconductor crystal |
US6776840B1 (en) * | 1999-03-22 | 2004-08-17 | Memc Electronic Materials, Inc. | Method and apparatus for controlling diameter of a silicon crystal in a locked seed lift growth process |
JP4548306B2 (ja) | 2005-10-31 | 2010-09-22 | 株式会社Sumco | シリコン単結晶の製造方法 |
JP4784401B2 (ja) * | 2006-05-30 | 2011-10-05 | 株式会社Sumco | シリコン単結晶の育成プロセスにおける融液の液面位置監視装置 |
US8221545B2 (en) | 2008-07-31 | 2012-07-17 | Sumco Phoenix Corporation | Procedure for in-situ determination of thermal gradients at the crystal growth front |
US20100024717A1 (en) | 2008-07-31 | 2010-02-04 | Benno Orschel | Reversed action diameter control in a semiconductor crystal growth system |
US8012255B2 (en) * | 2008-07-31 | 2011-09-06 | Sumco Phoenix Corporation | Method and apparatus for controlling diameter of a silicon crystal ingot in a growth process |
KR101415370B1 (ko) * | 2011-08-31 | 2014-07-07 | 주식회사 엘지실트론 | 잉곳 성장 장치 및 잉곳 제조 방법 |
KR101335538B1 (ko) * | 2012-07-18 | 2013-12-03 | 주식회사 엘지실트론 | 단결정 실리콘 잉곳 제조 장치 및 방법 |
DE102013002471B4 (de) | 2013-02-13 | 2016-08-18 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zur Bestimmung der Schmelzhöhe und zur Regulation der Erstarrung und Schmelzung einer Schmelze in einem Tiegel |
KR101638486B1 (ko) * | 2015-12-08 | 2016-07-11 | 웅진에너지 주식회사 | 단결정 잉곳 성장장치의 온도 프로파일 설정방법 |
CN105951175A (zh) * | 2016-05-30 | 2016-09-21 | 上海超硅半导体有限公司 | 单晶硅生长过程中粘壁硅的去除方法 |
CN111139520A (zh) * | 2018-11-05 | 2020-05-12 | 上海新昇半导体科技有限公司 | 一种直拉法引晶方法 |
CN109972201B (zh) * | 2019-04-07 | 2020-09-11 | 浙江晶盛机电股份有限公司 | 用于直拉法硅单晶生长过程的晶体直径控制方法 |
US11414778B2 (en) * | 2019-07-29 | 2022-08-16 | Globalwafers Co., Ltd. | Production and use of dynamic state charts when growing a single crystal silicon ingot |
JP2024506372A (ja) | 2021-02-16 | 2024-02-13 | グローバルウェーハズ カンパニー リミテッド | 結晶引き上げ装置の領域の過渡熱応答を取得する方法とシステム |
CN113235165B (zh) * | 2021-04-26 | 2022-10-14 | 上海大学 | 一种Fe1-xTMxS单晶材料的制备方法 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3621213A (en) * | 1969-11-26 | 1971-11-16 | Ibm | Programmed digital-computer-controlled system for automatic growth of semiconductor crystals |
GB1465191A (en) * | 1974-03-29 | 1977-02-23 | Nat Res Dev | Automatically controlled crystal growth |
JPS5482383A (en) * | 1977-12-14 | 1979-06-30 | Nippon Telegr & Teleph Corp <Ntt> | Manufacturing apparatus for single crystal |
WO1983002464A1 (en) * | 1982-01-04 | 1983-07-21 | Seymour, Robert, Stephen | Diameter control in czochralski crystal growth |
US4508970A (en) * | 1982-07-15 | 1985-04-02 | Motorola, Inc. | Melt level sensing system and method |
JPS6042294A (ja) * | 1983-08-12 | 1985-03-06 | Fujitsu Ltd | メルト表面位置測定装置 |
JPS6071593A (ja) * | 1983-09-26 | 1985-04-23 | Fujitsu Ltd | 結晶成長方法 |
FR2553793B1 (fr) * | 1983-10-19 | 1986-02-14 | Crismatec | Procede de commande d'une machine de tirage de monocristaux |
JPS60186498A (ja) * | 1984-03-05 | 1985-09-21 | Toshiba Ceramics Co Ltd | 半導体単結晶の製造方法 |
JPS6186493A (ja) * | 1984-10-04 | 1986-05-01 | Toshiba Mach Co Ltd | 半導体結晶引上機 |
JPS61122187A (ja) * | 1984-11-20 | 1986-06-10 | Toshiba Mach Co Ltd | 単結晶引上機 |
JPS6259594A (ja) * | 1985-09-11 | 1987-03-16 | Sumitomo Electric Ind Ltd | 結晶の引上げ方法 |
JPH0751476B2 (ja) * | 1986-06-23 | 1995-06-05 | 三菱マテリアル株式会社 | 単結晶引き上げ装置の群管理システム |
JPH0649631B2 (ja) * | 1986-10-29 | 1994-06-29 | 信越半導体株式会社 | 結晶径測定装置 |
SU1592414A1 (ru) * | 1986-11-26 | 1990-09-15 | Vni Pk T I Elektrotermicheskog | Cпocoб bыpaщиbahия пpoфилиpobahhыx kpиctaллob tугoплabkиx coeдиhehий и уctpoйctbo для eгo ocущectbлehия |
JP2563327B2 (ja) * | 1987-05-06 | 1996-12-11 | 国際電気株式会社 | 単結晶の直径制御方法及び装置 |
JPS6424089A (en) * | 1987-07-21 | 1989-01-26 | Shinetsu Handotai Kk | Device for adjusting initial position of melt surface |
JPH0639352B2 (ja) * | 1987-09-11 | 1994-05-25 | 信越半導体株式会社 | 単結晶の製造装置 |
JPS6483595A (en) * | 1987-09-25 | 1989-03-29 | Shinetsu Handotai Kk | Device for measuring crystal diameter |
FR2621053A1 (fr) * | 1987-09-29 | 1989-03-31 | Commissariat Energie Atomique | Procede de commande d'une machine de tirage de monocristaux |
JPH01126295A (ja) * | 1987-11-11 | 1989-05-18 | Kawasaki Steel Corp | 単結晶製造装置 |
JPH01128295A (ja) * | 1987-11-13 | 1989-05-19 | Sharp Corp | 半導体メモリ装置 |
FI87660C (sv) * | 1988-03-03 | 1993-02-10 | Leybold Ag | Förfarande och anordning för dragning av monokristaller |
JP2664088B2 (ja) * | 1989-05-25 | 1997-10-15 | 株式会社マックサイエンス | 熱変化温度測定方法 |
JP2678383B2 (ja) * | 1989-05-30 | 1997-11-17 | 信越半導体 株式会社 | 単結晶上装置 |
JPH0774117B2 (ja) * | 1989-10-20 | 1995-08-09 | 信越半導体株式会社 | ヒータの温度パターン作成方法及びこの温度パターンを用いたSi単結晶育成制御装置 |
-
1991
- 1991-12-27 KR KR1019920703354A patent/KR100237848B1/ko not_active IP Right Cessation
- 1991-12-27 EP EP98114809A patent/EP0911430B1/en not_active Expired - Lifetime
- 1991-12-27 US US07/962,185 patent/US5408952A/en not_active Expired - Lifetime
- 1991-12-27 WO PCT/JP1991/001790 patent/WO1992019797A1/ja active Application Filing
- 1991-12-27 DE DE69132009T patent/DE69132009T2/de not_active Expired - Lifetime
- 1991-12-27 DE DE69133236T patent/DE69133236T2/de not_active Expired - Lifetime
- 1991-12-27 EP EP92901939A patent/EP0536405B1/en not_active Expired - Lifetime
-
1992
- 1992-12-23 FI FI925866A patent/FI120102B/sv active IP Right Grant
-
2004
- 2004-06-08 FI FI20040787A patent/FI120546B/sv active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
DE69132009D1 (de) | 2000-04-06 |
FI925866A (fi) | 1992-12-23 |
DE69133236T2 (de) | 2004-02-26 |
US5408952A (en) | 1995-04-25 |
KR100237848B1 (ko) | 2000-01-15 |
EP0536405A1 (en) | 1993-04-14 |
FI120546B (sv) | 2009-11-30 |
FI925866A0 (fi) | 1992-12-23 |
DE69132009T2 (de) | 2000-08-03 |
FI20040787A (sv) | 2004-06-08 |
WO1992019797A1 (en) | 1992-11-12 |
EP0536405A4 (en) | 1995-11-15 |
DE69133236D1 (de) | 2003-05-15 |
EP0911430B1 (en) | 2003-04-09 |
KR930701643A (ko) | 1993-06-12 |
EP0911430A1 (en) | 1999-04-28 |
EP0536405B1 (en) | 2000-03-01 |
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