FI117234B - Piirilevy, valmistusmenetelmä ja elektroninen laite - Google Patents

Piirilevy, valmistusmenetelmä ja elektroninen laite Download PDF

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Publication number
FI117234B
FI117234B FI20045179A FI20045179A FI117234B FI 117234 B FI117234 B FI 117234B FI 20045179 A FI20045179 A FI 20045179A FI 20045179 A FI20045179 A FI 20045179A FI 117234 B FI117234 B FI 117234B
Authority
FI
Finland
Prior art keywords
circuit board
pattern
support pattern
insulating layer
support
Prior art date
Application number
FI20045179A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Other versions
FI20045179L (fi
FI20045179A0 (fi
Inventor
Tero Peltola
Pauliina Mansikkamaeki
Juulia Loisa
Original Assignee
Aspocomp Technology Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aspocomp Technology Oy filed Critical Aspocomp Technology Oy
Priority to FI20045179A priority Critical patent/FI117234B/fi
Publication of FI20045179A0 publication Critical patent/FI20045179A0/fi
Priority to PCT/FI2005/050160 priority patent/WO2005112526A1/en
Priority to JP2007517318A priority patent/JP2007538394A/ja
Priority to EP05740730A priority patent/EP1747704A4/en
Publication of FI20045179L publication Critical patent/FI20045179L/fi
Application granted granted Critical
Publication of FI117234B publication Critical patent/FI117234B/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09336—Signal conductors in same plane as power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
FI20045179A 2004-05-17 2004-05-17 Piirilevy, valmistusmenetelmä ja elektroninen laite FI117234B (fi)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FI20045179A FI117234B (fi) 2004-05-17 2004-05-17 Piirilevy, valmistusmenetelmä ja elektroninen laite
PCT/FI2005/050160 WO2005112526A1 (en) 2004-05-17 2005-05-16 Printed wiring board, manufacturing method and electronic device
JP2007517318A JP2007538394A (ja) 2004-05-17 2005-05-16 プリント基板、製造方法および電子デバイス
EP05740730A EP1747704A4 (en) 2004-05-17 2005-05-16 PCB, METHOD OF MANUFACTURING AND ELECTRONIC EQUIPMENT

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20045179A FI117234B (fi) 2004-05-17 2004-05-17 Piirilevy, valmistusmenetelmä ja elektroninen laite
FI20045179 2004-05-17

Publications (3)

Publication Number Publication Date
FI20045179A0 FI20045179A0 (fi) 2004-05-17
FI20045179L FI20045179L (fi) 2005-11-18
FI117234B true FI117234B (fi) 2006-07-31

Family

ID=32338458

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20045179A FI117234B (fi) 2004-05-17 2004-05-17 Piirilevy, valmistusmenetelmä ja elektroninen laite

Country Status (4)

Country Link
EP (1) EP1747704A4 (https=)
JP (1) JP2007538394A (https=)
FI (1) FI117234B (https=)
WO (1) WO2005112526A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5539800B2 (ja) * 2010-07-07 2014-07-02 日本特殊陶業株式会社 配線基板の中間製品及び配線基板の製造方法
US20150257278A1 (en) * 2014-03-06 2015-09-10 Tactotek Oy Method for manufacturing electronic products, related arrangement and product
CN106794698B (zh) 2014-08-28 2019-02-26 惠普发展公司，有限责任合伙企业 打印头组件
US10136512B2 (en) 2014-12-09 2018-11-20 Microsoft Technology Licensing, Llc Avoiding reflections in PCB signal trace
CN115702490A (zh) * 2020-06-03 2023-02-14 住友电木株式会社 电路基板
EP4554347A1 (en) * 2023-11-10 2025-05-14 Rolls-Royce Deutschland Ltd & Co KG Printed circuit board assembly

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61270887A (ja) * 1985-05-24 1986-12-01 松下電器産業株式会社 フレキシブルプリント配線基板
JPS63211692A (ja) * 1987-02-27 1988-09-02 株式会社日立製作所 両面配線基板
US5278727A (en) * 1990-05-29 1994-01-11 Digital Equipment Corporation High density electrical interconnection device and method therefor
JPH05299786A (ja) * 1992-04-20 1993-11-12 Ibiden Co Ltd プリント配線板
US5300899A (en) * 1993-02-02 1994-04-05 Ast Research, Inc. Thin, flexible, stripline flex cable having two shielding ground planes formed as grids having mutually offset grid patterns
US5715140A (en) * 1996-05-03 1998-02-03 Ford Motor Company Overlay substrate for securing electronic devices in a vehicle
US5818315A (en) * 1996-12-31 1998-10-06 Lucent Technologies Inc. Signal trace impedance control using a grid-like ground plane
US6407345B1 (en) * 1998-05-19 2002-06-18 Ibiden Co., Ltd. Printed circuit board and method of production thereof
JP2001326429A (ja) * 2000-05-17 2001-11-22 Sony Corp プリント配線基板
JP2002076263A (ja) * 2000-08-31 2002-03-15 Hitachi Ltd 半導体装置
JP2002111142A (ja) * 2000-09-29 2002-04-12 Hitachi Kokusai Electric Inc プリント基板の構造
JP4646386B2 (ja) * 2000-11-30 2011-03-09 京セラ株式会社 配線基板の製造方法
JP2002190657A (ja) * 2000-12-21 2002-07-05 Sony Chem Corp フレキシブル配線板及びその製造方法
JP2003124637A (ja) * 2001-10-11 2003-04-25 Toppan Printing Co Ltd 多層配線板
TW564533B (en) * 2002-10-08 2003-12-01 Siliconware Precision Industries Co Ltd Warpage-preventing substrate

Also Published As

Publication number Publication date
WO2005112526A8 (en) 2006-02-16
EP1747704A1 (en) 2007-01-31
JP2007538394A (ja) 2007-12-27
FI20045179L (fi) 2005-11-18
FI20045179A0 (fi) 2004-05-17
EP1747704A4 (en) 2011-10-12
WO2005112526A1 (en) 2005-11-24

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