Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/28—Applying non-metallic protective coatings
  • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0213—Electrical arrangements not otherwise provided for
  • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
  • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
  • H05K1/0224—Patterned shielding planes, ground planes or power planes
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0213—Electrical arrangements not otherwise provided for
  • H05K1/0237—High frequency adaptations
  • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
  • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0284—Details of three-dimensional rigid printed circuit boards
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
  • H05K1/0298—Multilayer circuits
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/18—Printed circuits structurally associated with non-printed electric components
  • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/01—Dielectrics
  • H05K2201/0104—Properties and characteristics in general
  • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/0929—Conductive planes
  • H05K2201/09336—Signal conductors in same plane as power plane
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
  • H05K2201/09681—Mesh conductors, e.g. as a ground plane
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
  • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10431—Details of mounted components
  • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
  • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/06—Lamination
  • H05K2203/063—Lamination of preperforated insulating layer
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
  • H05K2203/1305—Moulding and encapsulation
  • H05K2203/1311—Foil encapsulation, e.g. of mounted components
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
  • H05K2203/1305—Moulding and encapsulation
  • H05K2203/1316—Moulded encapsulation of mounted components
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
  • H05K2203/1305—Moulding and encapsulation
  • H05K2203/1322—Encapsulation comprising more than one layer
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
  • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0011—Working of insulating substrates or insulating layers
  • H05K3/0014—Shaping of the substrate, e.g. by moulding

Definitions

• the invention relates to a printed wiring board comprising an insulating layer and a circuit pattern arranged on at least one surface of the insulating layer and made of a conductive material.
• the invention also relates to an electronic device comprising at least one printed wiring board, which comprises an insulating layer and a circuit pattern arranged on at least one surface of the insulating layer and made of a conductive material.
• the invention further relates to a method for manufacturing a printed wiring board, in which method a circuit pattern is arranged on at least one surface of an insulating layer.
• the printed wiring board acts as a connection and switching base for components.
• the printed wiring board transmits signals and op- erating voltages to and from the components.
• the printed wiring board also transmits waste heat of the components away, acts as a mechanical support structure for the components and protects the components from electromagnetic interference.
• a conduc- tor layer constituting a circuit pattern, which is electrically conductive.
• a circuit pattern is designed in such a manner that the components to be arranged on the printed wiring board function in the intended manner.
• the printed wiring board is made of a blank or laminate comprising an insulating layer made of a non-conductive material or a basic layer coated with a conductive material, such as copper.
• the insulating layer is typically made of thermosetting plastic or thermoplastic.
• useless conductive material of the circuit pattern is removed from the surface of the basic layer, whereupon the circuit pattern remains on the surface.
• the useless conductive material is removed, for instance, by etching or other similar manner.
• a circuit pattern can also be grown onto the insulating layer or it can be manufactured in a separate process and transferred onto the surface of the insulating layer. There are also other known methods for manufacturing printed wiring boards.
• the printed wiring board can also be a multilayer printed board consisting of several conductor layers separated from each other by means of electrically insulating material layers. Multilayer printed boards are described in the patent application EP 1 1 19 227, for example. [0007] As is known, development of most electronic devices aims at device constructions which are smaller and smaller and more versatile. Also, the outer appearance of devices is shaped more freely because the design of the devices has become a very important factor in the product competition between different device manufacturers. [0008] A problem of known printed wiring boards - both single-layer and multilayer printed boards - is that they have a shape of a straight two- dimensional plane surface.
• the printed wiring board is subjected to bending force, which may, in the course of time, detach the switch from the printed wiring board.
• the printed wiring board of the invention is characterized in that at least one surface of the insulating layer is provided with a support pattern, which comprises material lines arranged at a distance from each other.
• the electronic device of the invention is further characterized in that at least one surface of the insulating layer is provided with a support pattern, which comprises material lines arranged at a distance from each other.
• the method of the invention is further characterized by providing at least one surface of the insulating layer with a support pattern, which comprises material lines arranged at a distance from each other.
• a support pattern which comprises material lines arranged at a distance from each other.
• the essential idea of the invention is that in the printed wiring board, not only a circuit pattern but also a mechanical support pattern are arranged on the surface of the material layer made of a conductive material.
• the support pattern is most preferably formed of the same conductive layer as the circuit pattern.
• the support pattern comprises material lines, whereby their distance from each other, their width, shape and direction are selected according to the mechanical and design requirements set to the printed wiring board.
• the invention provides the advantage that the support pattern increases design possibilities of the printed wiring board essentially.
• the printed wiring board can be utilized as a light stiffening element of an electronic device, which, however, provides a sufficient mechanical support.
• the insulating layer is made of thermoplastic or a thermoplastic composite.
• the printed wiring board can be shaped to be three-dimensional either at elevated temperature or even at room temperature by various techniques.
• the printed wiring board is a multilayer printed board, which comprises several insulating layers one upon the other as well as conductor layers and mechanical support patterns arranged between them. The support patterns in the different layers are preferably arranged in such a manner that they form a line pattern where different support lines stagger.
• the method for manufacturing a printed wiring board comprises providing the components mounted on the printed wiring board with a protective layer, which supports the components during the manufacture of the printed wiring board. [0020] It provides the advantage that the components remain in their places on the printed wiring board during this manufacture. [0021]
• the essential idea of a fourth preferred embodiment of the invention is that in the method for manufacturing a printed wiring board, the printed wiring board, the components mounted thereon and the protective layer arranged on them are arranged into a mould, such as an injection mould, and plastic is mould onto the printed wiring board. [0022] It provides the advantage that the printed wiring board can be quickly integrated into a plastic product without many operating stages.
• Figure 1 schematically shows a perspective view of a printed wiring board of the invention
• Figure 2 schematically shows a perspective exploded view of a multilayer printed board of the invention
• Figure 3 schematically shows a part of a third printed wiring board of the invention from above
• Figure 4 schematically shows a part of a fourth printed wiring board of the invention from above
• Figure 5 schematically shows a part of a fifth printed wiring board of the invention from the side and partly in cross-section
• Figure 6 schematically shows a sixth printed wiring board of the invention
• Figure 7 schematically shows the printed wiring board shown in Figure 6 from the side and fixed to the electronic device.
• FIG. 1 shows a perspective view of a printed wiring board of the invention schematically.
• a printed wiring board 1 comprises an insulating layer 2, which, according to its electrical properties, is an insulator.
• the insulating layer 2 is made of thermoplastic.
• the manufacturing material of the insulating layer 2 may comprise, for instance, polyolefin, such as polyethylene or polypropylene, polymethyl pentene (PMP), polystyrene (PS), polyether sulfone (PES), polyphenylene ether (PPE), polyphenylene sulfone (PPS) or the like.
• the insulating layer 2 can also be made of thermosetting plastic, an elastomeric material, a thermoplastic elastomer or any other material having the necessary electrical properties, resisting the chemicals used in the manufacture of printed wiring boards and fulfilling other requirements set to the printed wiring board 1.
• the insulating layer 2 may comprise one single material layer or it may contain several layers made of different materials.
• the insulating layer 2 can comprise reinforcements, such as fibre reinforcements, mixed with the matrix material, or other filling materials.
• the surface illustrated as the upper surface of the Insulating layer 2 is provided with a circuit pattern 3.
• the printed wiring board 1 is made of a blank or laminate comprising the insulating layer 2 and a conductor layer, which covers the insulating layer entirely.
• Useless material of the conductor layer has been removed from the surface of the insulating layer 2 in the circuit pattern 3 by a method known per se, such as by etch- ing, whereupon the circuit pattern 3 has remained on the surface.
• the conductor layer and the circuit pattern 3 formed thereof are made of a conductive material, which, in this case, is copper but which can also be silver, gold or any other material having a sufficient conductivity.
• the circuit pattern 3 can also be manufactured by growing it onto the insulating layer.
• the circuit pattern 3 includes connecting points 4, which connect electric components to the electric circuit of the circuit pattern 3.
• the circuit pattern comprises conductors 5, the purpose of which is to transmit signals and operating voltages to and from the components, heat transmission parts and other similar parts of circuit patterns known per se. It is to be noted that the circuit patterns 3 shown in the figures are presented by way of example and only intended for describing the features of the invention.
• the support pattern 6 consists of material lines, i.e. basic lines 7 arranged at a distance from each other and edge lines 8 following the shapes of the circuit pattern 3.
• the support pattern 6 is formed of the same conductive layer and in the same manufacturing process as the circuit pattern 3.
• the lines 7 and 8 of the support pattern are made of copper and provided in such a manner that neither the material forming the circuit pattern 3 nor the material forming the lines 7, 8 of the support pattern 6 have been removed from the conductor layer.
• the support pattern 6 substantially entirely covers that part that does not comprise the circuit pattern 3.
• the basic lines 7 of the support pattern 6 form a grid-like pat- tern, the basic shape of which is similar throughout the entire support pattern 6. It is obvious that the basic lines 7 of the support pattern 6 can also be arranged in a shape different from that of Figure 1. Also, the width and the height, i.e. the height from the surface of the insulating layer 2, of the basic bands 7 as well as the distance between them can be different in the different parts of the support pattern 6. [0031]
• the edge lines 8 of the support pattern 6 form a limit between the support pattern 6 and the circuit pattern 3.
• the edge lines 8 are arranged at a certain minimum distance from the conductive parts of the circuit pattern 3 so that a circuit pattern area 9 bordering the circuit pattern is formed on the printed wiring board.
• the support pattern 6 shown in Figure 1 is electrically insulated from the circuit pattern 3.
• the support pattern 6 is used as a ground plane of the printed wiring board 1 , in which case the electrical components of the printed wiring board 1 are suitably arranged in contact with the lines 7, 8 of the support pattern.
• the support pattern 6 can also be used for transmitting the operating voltage or for another similar electrical function.
• the support pattern 6 makes the structure of the printed wir- ing board 1 stiffer, whereby the insulating layer 2, one purpose of which is to function as a mechanical support structure, can be made thinner.
• the support pattern 6 also increases the mechanical toughness of the printed wiring board, which, together with the fact that the insulat- ing layer 2 is made of thermoplastic, allows the printed wiring board 1 to be moulded into a three-dimensional shape at elevated temperature or, in some embodiments, even at normal room temperature. Due to the support pattern 6, however, the printed wiring board 1 can be manufactured and dimensioned in such a manner that it is a substantially stiff structure at its normal operating temperature, in which case it can be used as an element that stiffens the electronic device or its part. [0035] Although in the printed wiring board 1 shown in Figure 1 the support pattern 6 is formed in the same manufacturing process as the circuit pattern 3, this is not necessary.
• FIG. 1 shows a perspective exploded view of a multilayer printed board of the invention schematically.
• the printed wiring board 1 comprises two layers, i.e. the first layer 10a and the second layer 10b, which are arranged typically undetachably one upon the other in the printed wiring board, which is illustrated by arrows A.
• the layers are shown separate from each other in Figure 2. It is to be noted herein that the multilayer printed board of the invention can naturally comprise three or more layers 10.
• the multilayer printed board 1 can be provided, for instance, by manufacturing a first circuit pattern 3a and a first support pattern 6a onto the surface of a first insulating layer 2a. After this, another blank or laminate comprising a second insulating layer 2b and a conductor layer is attached onto them. A second circuit pattern 3b and a second support pattern 6b are made from the conductor layer. Another possibility is to attach the second insulating layer 2b onto the first layer 10a, i.e. the first circuit pattern 3a and the first support pattern 6a. On top of this layer, a conductor layer is manufactured, and the necessary circuit and support patterns are etched from this layer. The circuit and support patterns 3a, 3b, 6a, 6b can also be manufactured by growing.
• the circuit and support patterns 3a, 3b, 6a, 6b can also be manufactured in a sepa- rate process and transferred onto the surface of the insulating layer 2a, 2b or by another manner known per se by a person skilled in the art.
• Both the first insulating layer 2a and the second insulating layer 2b can comprise several laminated layers.
• the insulating layers 2a, 2b can also have various thicknesses.
• Figure 2 only shows the circuit pattern areas 9a, 9b.
• the first circuit pattern 3a is in connection with the second circuit pattern 3b via the contact structures extending through the second insulating layer 2b. Such structures are known per se and are not discussed in greater detail herein.
• Both layers 10a, 10b further comprise a support pattern 6a,
• the support pattern 6a, 6b is preferably made of the same material as the circuit pattern in the corresponding layer 10a, 10b and most preferably formed in the same manufacturing process.
• the basic lines 7 of the first support pattern 6a are arranged to be staggered with the basic lines 7 of the second support pattern 6b, which is illustrated by means of extra lines L1 , L2 showing the position of the lines.
• the positioning of the basic lines 7 is such that parallel basic lines 7 of the different layers are not arranged one upon the other, but, when the printed wiring board is seen from above, the basic lines 7 of the different layers are next to each other.
• the experiments show that the staggered positions of the basic lines 7 is advantageous when the printed wiring board 1 is moulded into a three-dimensional shape.
• the direction, width, density and pattern of the basic lines 7 of the support patterns 6a, 6b can be different in the different layers 10a, 10b. It is not necessary that each layer of the multilayer printed board comprises a support pattern 6 in addition to the circuit pattern 3. Also, parallel basic lines 7 in the different layers 10a, 10b can also be positioned one upon the other, es- pecially if the printed wiring board 1 comprises a considerable number of layers 10a, 10b.
• Figure 3 shows a top view of a part of a third printed wiring board of the invention schematically.
• Figure 3 shows the part of the printed wiring board 1 that comprises a support pattern 6.
• Different kinds of support patterns 6 can be formed in the different parts of the printed wiring board 1.
• the structure of the basic lines 7 is denser than in the second partial pattern 11 b.
• the pattern of the support pattern 6 can be made stiffer in those parts of the printed wiring board 1 where it is subjected to mechanical stress during the moulding or when it is in its place in the electronic device.
• the support pattern 6 can be made very light in those parts of the printed wiring board 1 that are not so sensitive to load or stress.
• the surface of the printed wiring board 1 comprising the circuit pattern can also include parts which have no support pattern 6 and do not belong to the circuit pattern area.
• a part of the printed wiring board 1 is denoted by reference number 20.
• Figure 4 shows a top view of a part of a fourth printed wiring board of the invention schematically. The figure shows the part of the upper surface of the printed wiring board 1 that comprises a support pattern but no circuit pattern arranged on the upper surface.
• the printed wiring board 1 com- prises a first support pattern 6a on the upper surface of the insulating layer 2 and a second support pattern 6b on the lower surface of the insulating layer 2.
• a first support pattern 6a on the upper surface of the insulating layer 2 there are parallel basic lines 7a, which are arranged to extend from the top to the bottom.
• the basic lines of the lower surface are denoted by broken lines.
• the support patterns 6 of the upper and lower surfaces are arranged so that the malleability, stiffness and other corresponding properties are suitable in view of design and usage of the printed wiring board 1.
• the lower surface of the printed wiring board 1 can be provided with both the second support pattern 6b and the second circuit pattern, in which case both sides of the insulating layer 2 comprise a circuit pattern and a support pattern 6a, 6b.
• the first surface of the printed wiring board only comprises the circuit pattern 3 but no support pattern 6, whereas on the second surface of the printed wiring board there is only the support pattern 6 but no circuit pattern 3.
• the support pattern 6 can thus cover the second surface entirely.
• the first surface of the printed wiring board comprises both the circuit pattern 3 and the support pattern 6 and the second surface only comprises the circuit pattern 3.
• Figure 5 schematically shows a part of a fifth printed wiring board of the invention from the side and partly in cross-section.
• the printed wiring board 1 comprises an insulating layer 2 and a conductive layer with both a circuit pattern 3 and a support pattern 6.
• Components 12 belonging to the printed wiring board 1 are mounted thereon. The piling of the components 12 is carried out in a manner known per se and is not described in greater detail herein.
• a protective layer On top of the printed wiring board 1 and the components 12 there is a protective layer, which, in the embodiment of Figure 5, is a plastic film 13.
• the film 13 comprises holes 14 extending through it.
• the printed wiring board 1 and its components 12 and films 13 are arranged in a mould cavity of an injection mould such that plastic material to be injected into the mould is pressed against the printed wiring board 1 from the direction shown by arrows I. This is an IML process (In-Mould- Labelling), in which the printed wiring board 1 acts as an insert. It is to be noted that said injection mould is not shown in the figures.
• the protective layer protects and supports the components
• the printed wiring board 1 to be arranged in the injection mould can be a substantially unshaped two-dimensional printed wiring board or it can be preshaped into a three-dimensional shape.
• the printed wiring board 1 can maintain its given shape in the injection moulding or its shape can be changed in a controlled manner under the pressure of the plastic material to be injected into the mould.
• a printed wiring board 1 integrated into the plastic material is achieved.
• the printed wiring board 1 can be completely surrounded by plastic material by also arranging some of the plastic material on the back side of the printed wiring board 1.
• the printed wiring board 1 can also be integrated onto the surface of or inside the rubber or other elastomeric material. Depending on the type of elastomer, it can be attached to the printed wiring board 1 , for instance, by cross-linking or by another method known per se. A particularly flexible integrated structure is achieved when the insulating layer or insulating layers 2 of the printed wiring board 1 are made of an elastomeric material. [0057] Because of the holes 14 in the film, the plastic material to be injected comes into contact with the plastic material of the insulating layer 2 through the film 13. This is facilitated by the line pattern of the support layer, which reveals some of the plain surface of the insulating layer 2.
• the protective film 13 does not necessarily have to comprise holes.
• the protective layer can naturally also be used for protecting other printed wiring boards 1 than the ones treated by injection moulding.
• the protective layer can be a plastic film, but also a lacquer layer or a similar layer, which is spread onto the printed wiring board 1 and the components 12 before the printed wiring board is moulded.
• the protective layer can be made of any material that can be fitted accurately around the components 12. The protective layer can naturally be utilized in both single- layer and multilayer printed boards.
• the protective layer can be removed from the printed wiring board after the moulding, in other em- bodiments it is left in its place.
• Figure 6 shows a top view of a sixth printed wiring board of the invention schematically
• Figure 7 schematically shows a side view of the same printed wiring board in cross-section and fixed to an electronic device.
• the printed wiring board 1 shown in Figures 6 and 7 is a multilayer printed board, of which only the circuit pattern 3 and the support pattern 6 of the topmost layer can be seen.
• the lower circuit patters are suitably connected with the circuit pattern 3 of the topmost layer, and the support patterns are staggered with each other.
• the printed wiring board 1 shown in Figure 6 is planar and the components belonging thereto have not yet been arranged thereon.
• the circuit pattern area 9 is provided with a circuit pattern 3, which is manufactured according to the electrical purpose of the printed wiring board 1.
• the support pattern 6 is composed of basic lines 7 arranged crosswise at regular distances and edge lines 8 bordering the circuit pattern area 9.
• the support pattern 6 is made from the same material layer as the circuit pattern 3, and the material thereof is copper or a copper mixture, for instance, but any other circuit pattern material known per se can also be used.
• a part 16 following the shape of a spherical surface is provided in the printed wiring board 1 , and it is also otherwise preshaped to have a shape allowing it to be arranged in its place in the electronic device 15.
• Preshaping is carried out at elevated temperature under pressure or by means of a mould, whereby the printed wiring board 1 is moulded into a required shape. Preshaping can be performed before the components are mounted on the printed wiring board or after it.
• the shaping of the printed wiring board 1 into a three- dimensional shape can be carried out by methods based on shaping or mould moulding methods known per se and using under- or overpressure. Thus, the matter is not discussed in greater detail in this context.
• the support pattern 6 improves the malleability of the printed wiring board 1 by increasing the mechanical toughness of the printed wiring board 1 in a suitable manner, which was already planned in the design phase of the printed wiring board 1.
• the electronic device 15 can be, for instance, a mobile terminal or its accessory, a sensor, a dosing feeder or inhaler used for medical purposes, or another electronic device known per se.
• the printed wiring board 1 is formed into a part of the outer casing of an electronic device.
• the printed wiring board 1 can also be attached to the outer casing by methods described in connection with Figure 5, for instance.
• the electronic device 15 is provided with fastening parts, at which the printed wiring board 1 is arranged. In this case, special attention must be paid on a tapered part 17 provided in the printed wiring board 1.
• a casing part 18 of the electronic device shown in Figure 7 is provided with special fastening means 19, which make the printed wiring board 1 to bend about 90° at the tapered part 17 when the printed wiring board 1 is arranged in the electronic device 15.
• the end of the device 15 can be provided with a push button to direct the force pressing the button perpendicularly against the printed wiring board 1 , whereby stress caused by the forces in the direction of the printed wiring board can be avoided.
• the support pattern 6 modifies the properties of the printed wiring board 1 in the tapered part 17 suitably so that on the one hand, the printed wiring board 1 is easy to bend into a required shape at room temperature and, on the other hand, the printed wiring board 1 remains in its bent shape and does not tend to straighten.
• the structure of the printed wiring board 1 can also be sub- stantially stiff and unbendable at room temperature. Such a printed wiring board can be applied as a part of a mechanical support structure of an electronic device.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Electromagnetism (AREA)
• Manufacturing & Machinery (AREA)
• Structure Of Printed Boards (AREA)
• Non-Metallic Protective Coatings For Printed Circuits (AREA)
• Insulated Metal Substrates For Printed Circuits (AREA)

Priority Applications (2)

Applications Claiming Priority (2)

Publications (2)

Family

ID=32338458

Family Applications (1)

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Cited By (4)

Families Citing this family (2)

Citations (5)

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• 2004
  • 2004-05-17 FI FI20045179A patent/FI117234B/fi not_active IP Right Cessation
• 2005
  • 2005-05-16 WO PCT/FI2005/050160 patent/WO2005112526A1/en not_active Ceased
  • 2005-05-16 EP EP05740730A patent/EP1747704A4/en not_active Withdrawn
  • 2005-05-16 JP JP2007517318A patent/JP2007538394A/ja active Pending

Patent Citations (5)

Non-Patent Citations (1)

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