FI117234B - Printed circuit board, manufacturing method and electronic device - Google Patents

Description

117234

Printed circuit board, manufacturing method and electronic device

Background of the Invention

The present invention relates to a printed circuit board comprising a dielectric layer and a conductive pattern of conductive material arranged on at least one surface of the dielectric layer, and a support pattern of at least one surface of the dielectric layer consisting of strips of material spaced apart.

The invention further relates to an electronic device comprising at least one circuit board comprising an insulating layer and a conductor pattern of at least one surface of the insulating layer made of an electrically conductive material having at least one surface of the insulating layer having a support pattern formed at a distance materiaalijuovista.

Yet another object of the invention is a method of manufacturing a printed circuit board, wherein a conductive pattern is applied to at least one surface of the dielectric layer, and a support pattern is formed on at least one surface of the dielectric layer formed by spaced strips of material.

As is known, some kind of circuit board is included in almost all electronic products. Various components can be mounted on the circuit board, such as: T: microprocessors and other integrated circuits, resistors, capacitors and other such standard components as well as special components. The function of the circuit board is to act as the interface and switching platform for the components. In addition: the circuit board transmits signals and operating voltages to and from components. Still, "V 25 circuit board conducts waste heat from components, works components me- * *!" as a cantilever support structure and protects components from electromagnetic interference.

There is a conductor layer on the surface of the circuit board that forms a conductive conductor pattern. The wire pattern is designed as needed so that the components to be fitted to the circuit board 30 function as intended. The printed circuit board is made of a blank or a laminate consisting of a non - conductive material. an insulating layer or a base layer which is electrically coated with a material such as copper. The insulating layer is typically made of a layer V · or thermoplastic. The circuit board manufacturing process removes unnecessary electrically conductive material from the surface of the base layer in the conductor pattern, leaving a conductor pattern on the surface. Unnecessary electrically conductive material is removed, for example, by 2 117234 by etching or the like. The conductor pattern can also be grown on the insulating layer, or it can be produced in a separate process and transferred to the surface of the insulating layer. Other methods of manufacturing a circuit board are also known.

The printed circuit board may also be a multilayer printed circuit board consisting of several layers of conductors separated by electrically insulating layers of material. Multilayer circuit boards are disclosed, for example, in EP 1 119 227.

As is well known, in the development of most electronic devices, only smaller and more versatile device designs are always sought. In addition, the design of devices is becoming more and more freestanding, as device design has become a very important factor in the competition between different device manufacturers.

The on-15 gem of known circuit boards, both single-layer and multi-layer, is that they have the shape of a straight two-dimensional planar surface. They are difficult, if not impossible, to be shaped three-dimensionally without breaking the circuit board structure, which limits, at least to some extent, the size reduction of the device, but above all the device design. Because of the shape of the electronic device, it may be necessary to use a printed circuit board which is divided into a plurality of sections 20 which are interconnected by the use of flexible connecting elements or flexes. The configuration of such a circuit board structure is complicated and expensive. Another problem is that sometimes a push button on an electronic device - such as a power switch on a mobile phone - has to be fitted based on space issues or kftyt- ·: ··: comfort on one of the pages of the device - for example, mat. 25 to the end of the handset - perpendicular to the side on which most of the switches are mounted and on which the circuit board is mounted. Then mentioned! ···. When the switch is pressed, the circuit board is subjected to a bending force, which may * * * be removed from the circuit board for a long time.

It is an object of the present invention to provide a novel and improved circuit board, a method for manufacturing a circuit board, and an electronic device. which avoid the problems mentioned above.

9 ·

The circuit board according to the invention is characterized in that the circuit board comprises a thermoplastic insulating layer and that the circuit board is deformable in a permanent three-dimensional shape at room temperature and / or at elevated temperature.

3, 117234

Further, the electronic device according to the invention is characterized in that the circuit board comprises a thermoplastic insulating layer, and that the circuit board can be shaped in a permanent three-dimensional shape at room temperature and / or at elevated temperature.

The process according to the invention is further characterized in that an insulating layer of thermoplastic is produced so that the circuit board with its conductor and support patterns can be formed into a permanent three-dimensional shape.

An essential idea of the invention is that the circuit board has not only a conductor pattern but also a mechanical support pattern on the surface of the material layer made of electrically insulating material. The support pattern is preferably formed of the same conductive layer as the conductor pattern. The support pattern comprises lines of material whose spacing, width, shapes direction are selected based on the mechanical and design requirements set on the circuit board.

An advantage of the invention is that, thanks to the support pattern, the design possibilities of the circuit board are quite substantially diversified. In addition, the circuit board can be utilized as a lightweight yet sufficiently mechanical stiffening element of the electronic device.

An essential idea of a preferred embodiment of the invention is that the dielectric layer is made of thermoplastic or thermoplastic composite.

The advantage is that the circuit board can be 3D-shaped by a number of X * techniques, either at elevated temperature or even at room temperature.

: **. * An essential embodiment of another preferred embodiment of the invention *: ··; the idea is that the circuit board is a multilayer printed circuit board with superimposed layers: 25 multiple layers of insulation and conductor layers and mechanicals fitted between them!!! support patterns. The support patterns on the various layers are preferably aligned with each other * ···. so that they form a line pattern that overlaps with each other.

The advantage is that the interlaced support pattern is very lightweight, but adds quite a bit. essentially the design capabilities of the multilayer circuit board.

In a third preferred embodiment of the invention,

• M

the idea is that in a method of manufacturing a circuit board, an adapter - *: ··: is provided with a protective layer on top of the components loaded on the circuit board to provide support. components during the PCB molding process.

The advantage is that the components remain well seated on the circuit board during this · · «'·" 35 design.

4, 117234

An essential idea of a fourth preferred embodiment of the invention is that in a method of manufacturing a circuit board, the circuit board, the components deposited thereon and the protective layer imprinted thereon are molded into a mold, such as an injection mold, and plastic is molded over the circuit board.

5 The advantage is that the circuit board can be integrated into the plastic product quickly and with a minimum of duty cycle.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention is explained in more detail in the accompanying drawings, in which Fig. 1 schematically shows a circuit board 10 according to the invention in perspective view, Fig. 2 schematically shows a multilayer circuit board according to the invention perspective view Fig. 5 schematically shows a side view and a partial cross-section of a fifth circuit board according to the invention; attached.

In the figures, the invention is illustrated in simplified form.

; ... Similar parts are denoted by the same reference numerals in the figures.

♦ · · ··· · ..; Γ 25 Detailed Description of the Invention »·

Fig. 1 is a schematic perspective view of a circuit board according to the invention.

The circuit board 1 comprises an insulating layer 2, which is also an electrical insulator. In the embodiment shown, the insulating layer 2 is made of *. 30 thermoplastic. The material of the insulating layer 2 may comprise, for example, polyolefin, polymethylpentene (PMP), polystyrene (PS), polyethersulfone (PES), polyphenylene ether (PPE), polyphenylene sulfone (PPS) or the like. The insulating layer 2 may also be made of a thermosetting, elastomeric *: ··: reinforcing material, thermoplastic elastomer or any material meeting the electrical properties required to withstand the requirements of the circuit board 11 and other requirements of the circuit board 1 in question. The dielectric layer 2 may comprise a single material layer or may comprise several layers of different materials. In addition to the matrix material, the insulating layer 2 may comprise reinforcements 5 such as fiber reinforcements or other fillers mixed therewith.

In the figure, a conductor pattern 3 is disposed on the upper surface of the insulating layer 2. Briefly, the circuit board 1 is made of a preform or laminate comprising an insulating layer 2 and a conductor layer that completely covers it. In the conductor pattern 3, the redundant conductor layer material 10 is removed from the surface of the dielectric layer 2 by some known method, such as etching, leaving a surface conductor pattern 3. The conductor layer, such as the conductor pattern 3 thereof, is made of an electrically conductive material as well as be silver, gold or any other sufficiently conductive material. The conductor pattern 3 can also be produced by growing on the insulating layer.

The conductor pattern 3 includes, inter alia, switching points 4 whose function is to connect electrical components to the electrical circuit of the conductor pattern 3. In addition, the conductor pattern includes conductors 5 whose function is to conduct signals and operating voltages to and from the components, parts used for conducting heat, 20 and other similar parts of conductor patterns known per se. It should be noted that the conductor patterns 3 shown in the figures are exemplary only and are intended for: T: only to illustrate aspects of the invention.

A support pattern 6 is also provided on the surface of the insulating layer 2. This consists of strips of material, i.e. basebands 7 arranged at a distance from one another and edge strips 8 following the shapes of the conductor pattern 3.

The support pattern 6 is formed from the same conductive layer and in the same quenching process as the conductor pattern 3. That is, the support pattern lines 7 and 8 ***** in the present embodiment of the invention are copper and have been obtained with the conductive layer omitted not only the material forming the conductor pattern 30 but also the material forming the lines 7, 8 of the support pattern 6. However, it should be noted that the support pattern 6 may be produced in a different manufacturing process and by a different method than the wire pattern 3.

The support pattern 6 covers substantially the entire portion free of the conductor pattern from the upper surface of the circuit board 1. The base lines 7 of the base pattern 6 form a 35 lattice pattern of the same shape throughout the base pattern 6. It is clear that the base lines 7 of the base pattern 6 may be than that shown in Figure 1. In addition, the width and height of the base strips 7, i.e. the height measured from the surface of the insulating layer 2, as well as the distance between them, may be different at different points in the support pattern 6.

The brackets 8 of Figure 6 form a boundary between the support pattern 6 and the wire pattern 5. The edge strips 8 are arranged at a certain distance from the conductive parts of the conductor pattern 3 so that a conductor pattern region 9 is formed on the printed circuit board. However, it should be noted that the edge strips 8 are not necessary, but the support pattern 6 can be implemented without them.

The support pattern 6 shown in Figure 1 is electrically isolated from the conductor pattern 3. In another embodiment of the invention, the support pattern 6 is used as the ground plane of the circuit board 1, in which case the electrical components of the circuit board 1 are suitably arranged. The support pattern 6 may also be utilized for conducting a supply voltage or other similar electrical function.

The support pattern 6 stiffens the structure of the circuit board 1, whereby the dielectric layer 2, whose function is to act as a mechanical support structure, can be made thinner. As a result, the total thickness of the circuit board 1 as well as its weight can be reduced.

Further, the support pattern 6 increases the mechanical toughness of the circuit board, which, combined with the fact that the dielectric layer 2 is made of thermoplastic, allows the circuit board 1 to be molded at elevated temperature or even at normal room temperature to a 3D * shape. However, by virtue of the support pattern 6, the circuit board 1 can be designed and dimensioned by: 25 25 such that, at its normal operating temperature, it is a substantially rigid structure which can be used as a stiffening element of the electronic device.

m · ***** Although in the case of the circuit board 1 shown in Fig. 1, the support pattern 6 is formed in the same manufacturing process as the conductor pattern 3, this is not necessary. The support pattern 6 may also be formed before or after the conductor pattern 3 ···. The support pattern 6 may also be of a different material than the conductor pattern 3.

. ···. Figure 2 is a schematic perspective view of a multilayer circuit board according to the invention. The circuit board 1 comprises two layers, namely a first layer 10a and a second layer 10b, which are typically disassociated on the circuit board, which is illustrated by arrows A. In Figure 2 the layers are shown separately for simplicity of presentation. It should be noted in this connection that, of course, the multilayer circuit board of the invention may have three or more layers 10.

The multilayer circuit board 1 can be manufactured, for example, by producing a first conductor pattern 3a and a first support pattern 6a on the surface of the first dielectric layer 2a. Thereafter, a second blank or laminate is formed which comprises a second insulating layer 2b and a conductive layer. From the conductor layer, a second conductor pattern 3b and a second support pattern 10 6b are formed. It may also be performed by attaching a first layer 10a, i. a second insulating layer 2b over a first conductor pattern 3a and a first support pattern 6a. On top of this, a conductor layer is fabricated, where the necessary conductor and support patterns are etched. The guide and support patterns 3a, 3b, 6a, 6b can also be made by incrementing. The conductor and support patterns 3a, 3b, 6a, 6b may also be produced in a separate process and applied to the surface of the insulating layer 2a, 2b, or by other means well known to those skilled in the art.

Both the first dielectric layer 2a and the second dielectric layer 2b may comprise several sub-layers. Further, the insulating layers 2a, 2b may have different thicknesses.

On the surface of the first insulating layer 2a there is a first conductor: T: Fig. 3a, and on the surface of the second insulating layer 2b respectively there is a second conductor 1 · * · .. line 3b. It should be noted that the details of the wire patterns 3a, 3b are not shown to simplify the presentation, but that only the wire pattern regions 9a, 9b are shown in Figure 2.

"V The first conductor pattern 3a communicates with the second conductor pattern 3b through contact structures extending through the second dielectric layer 2b. ***** Such structures are known per se and are not further discussed herein.

Further, each layer 10a, 10b has a support pattern 6a, 6b.

** ·

The support pattern 6a, 6b is preferably of the same material as the conductor pattern in the respective layer 10a, 10b and most preferably formed in the same manufacturing process.

• ·

The basic lines 7 of the first support pattern 6a are interleaved with the basic lines 7 of the support pattern 6b illustrated by the auxiliary lines L1, L2 describing the position of the lines ψ. In other words, the placement of the basebands 7 δ 117234 is such that the parallel basebands 7 of the different layers are not superimposed, but when viewed from the top of the circuit board, the basebands 7 of the different layers are adjacent. Studies have found that the interlaced position of the basebands 7 is advantageous when shaping the circuit board 1 to a three-dimensional shape.

A further advantage is that since the distance between the interleaved base lines 7 is greater than if the base lines were just overlapping, any stray capacitance caused by the lines 7 is substantially smaller.

The direction, width, density and pattern of the base lines 7 of the support patterns 6a, 6b may be different in different layers 10a, 10b. In addition to the conductor pattern 3, each layer of the multilayer circuit board need not necessarily have a support pattern 6. In addition, the parallel basic lines 7 on the different layers 10a, 10b may be superimposed, especially if the circuit board 1 comprises a substantial number of layers 10a, 10b.

Figure 3 schematically shows a top view of a third circuit board according to the invention. Figure 3 shows a part of the circuit board 1 comprising a support pattern 6. Different sections of the printed circuit board 1 may be provided with different support patterns 6. The first-to-first sub-pattern 11a of the support pattern 6 of the printed circuit board 1 shown in Figure 3 has basic lines 7 denser than the second sub-figure 11b. The pattern of the support pattern 6 may be formed, for example, in a more rigid manner in the parts of the circuit board 1 where it is subjected to mechanical stress during its forming process or when it is secured to an electronic device. On the other hand, in the less stressed or: ... 25 parts of the circuit board 1, the support pattern 6 can be made very light. Of course, other criteria affecting the shape, stiffness, and other properties of the support pattern 6 may be considered when designing the support pattern 6.

The surface of the conductor pattern of the circuit board 1 may also include portions which do not have a support pattern 6 and which do not fall within the conductor pattern region. Fig. 2-2 In part 3, such a part of circuit board 1 is illustrated by reference numeral 20.

Fig. 4 schematically shows a top view of a fourth circuit board according to the invention. The figure shows the top of the circuit board 1. **. a part of the surface having a support pattern but not a T conductor pattern adapted to the upper surface. The circuit board 1 comprises a first support pattern 6a on the upper surface of the insulating layer 2 # · \ '* i 35 and a second support pattern 6b on the lower surface of the insulating layer 2. In the embodiment shown, the upper surface of the dielectric layer 2 has base strips 7a parallel to one another and arranged to run from top to bottom. The lower surface of the dielectric layer 2, in turn, has base lines 7b parallel to each other and oriented in a direction perpendicular to the base lines 7a of the upper surface. The base lines of the underside are represented by dotted lines. The upper and lower surface support patterns 6 are arranged such that the formability, stiffness and other similar properties of the circuit board 1 are suitable for the design and use of the circuit board 1.

Not only the second support pattern 6b but also the second conductor pattern can be arranged on the lower surface of the printed circuit board 1, whereby both the conductor pattern and the support pattern 6a, 6b are provided on both sides of the insulation layer 2. In another embodiment, the first surface of the circuit 10 has only a conductor pattern 3 but no support pattern 6, while the second surface of the circuit board has only a support pattern 6 but not the conductor pattern 3. The support pattern 6 may then cover the entire second surface. In a third embodiment, the first surface of the circuit board has both a wire pattern 3 and a support pattern 6, and the second surface has only a wire pattern 3.

Figure 5 is a diagrammatic view of a fifth circuit board according to the invention, seen from the side and partly in cross-section. The circuit board 1 comprises an insulating layer 2 and a conductor layer having both a conductor pattern 3 and a support pattern 6.

The circuit board 1 is loaded with its associated components 12. Component-20 path 12 is assembled in a manner known per se and is not discussed further herein.

A protective layer is provided on the printed circuit board 1 and the components 12, which in the embodiment shown in Fig. 5 is provided with a film 13 made of plastic. The film 13 comprises holes 14 extending therethrough.

: # ·. The circuit board 1 with its components 12 and membranes 13 is fitted into the mold cavity of the injection molding mold so that the plastic material injected into the mold is pressed against the circuit board 1 in the direction indicated by the arrows I. So this is a * ··· 'IML (In-Mold-Labeling) process in which the circuit board 1 acts as an insert. Note that said injection mold is not shown in the figures.

30 A protective layer protects and supports the components 12 mounted on the circuit board, particularly during the injection step of the plastic material. Otherwise, the plastic material flowing rapidly in the injection cavity could release the com · · ·. components from 12 circuit boards 1.

* ·

The circuit board 1, which can be fitted to the injection mold, may be substantially shaped: 35 unmodified two-dimensional circuit board, or it may be pre-shaped to three-dimensional.

*

The printed circuit board 1 may retain its given shape during the injection molding process, or its shape 10 117234 may change in a controlled manner under the pressure of the plastic material injected into the mold. Injection molding results in a printed circuit board 1 which is integrated with the plastic material. The printed circuit board 1 can be completely surrounded by plastic material by also fitting the plastic material to the back of the printed circuit board 1.

The circuit board 1 may also be integrated into or into the surface of rubber or other elastomeric material. Depending on the type of elastomer, its attachment to the circuit board 1 may be accomplished, for example, by cross-linking or other means known per se. A particularly flexible integrated structure is achieved when the dielectric layer or dielectric layers 2 of the circuit board 1 are made of an elastomeric material. 10 Due to the holes 14 of the film, the plastic material to be injected passes through the film 13 into contact with the plastic material of the insulating layer 2. This is promoted by the strip pattern of the backing layer which leaves exposed the surface of the bare insulating layer 2. If the material of the insulating layer 2 and the plastic material to be sprayed are suitably selected, a very strong bond is formed between them. Of course, the protective film 13 may not be reflective.

The protective layer can, of course, be used to protect circuit boards 1 other than those which are subject to injection molding.

The protective layer may be not only a plastic film, but also a lacquer layer or the like, which is applied over the printed circuit board 1 and components 12 prior to the forming of the printed circuit board 20. The protective layer can be any material that can be precisely formed around the components 12. The protective layer can naturally be applied to both single-layer and multi-layer circuit boards. In some embodiments, the protective layer can be removed from the circuit board after the molding process, while in others, it is left in place.

* *. . Figure 6 schematically shows a sixth circuit board according to the invention in top view and Figure 7 shows the same circuit board in side elevation and mounted on an electronic device.

The circuit board 1 shown in Figs. 6 and 7 is a multilayer circuit board from which only the top layer conductor pattern 3 and the support pattern 6 are visible. The lower conductor patterns are suitably connected to the upper layer conductor pattern 3 and the support patterns are interlaced relative to one another.

The circuit board 1 shown in Fig. 6 is still planar and has no integral components. The circuit board 1 has a conductor pattern 3 adapted to the conductor pattern region 9, which is manufactured according to the electrical use of the circuit board 1.

• # 11 117234

The support pattern 6 is composed of regular spaced base lines 7 and boundary lines 8 defining the conductor pattern region 9. The support pattern 6 is formed of the same layer of material as the conductor pattern 3 and is made of, for example, copper or copper alloy, but any other conductive pattern material known per se.

Before being fitted to the electronic device 15, the spherical surface portion 16 is molded into the circuit board 1 and otherwise preformed into a position where it can be fitted to the electronic device 15. The preforming is performed at elevated temperature 10 by pressure or mold in which the circuit board 1 is formed. Preformation can be done before or after the components are loaded on the circuit board.

The three-dimensional shaping of the circuit board 1 can be accomplished by methods based on known methods of forming under pressure or overpressure 15 or mold forming methods. Therefore, it will not be discussed further in this context.

The support pattern 6 improves the ductility of the circuit board 1 by increasing the mechanical toughness of the circuit board 1 in a suitable manner as already designed at the design stage of the circuit board 1.

After the pre-formatting, the circuit board 1 is fitted into the electronic device 15. The electronic device 15 may be, for example, a mobile phone or its accessory, a sensor, a dispenser for medical use: ·. or an inhaler, or other electronic device known per se.

• * ·

In another embodiment of the invention, the circuit board 1 • *,. 25 a portion of the outer shell of the electronic device is formed. The circuit board 1 can also be attached to the outer casing by the methods described, for example, in connection with FIG.

• · · '· *! In these embodiments, the air space otherwise between the circuit board 1 and the housing of the device can be eliminated, which is in itself a useless space.

The electronic device 15 is provided with fasteners to which the circuit board 1 is mounted. In particular, attention must be paid to the tapered portion 17 of the ptirile plate 1. The electronic part of the device shown in Fig. 7 is provided with special fastening means 19 which force the circuit board 1 to bend about 90 ° from the narrowed portion 17. ; · * Is fitted to the electronic device 15. Thanks to the bent circuit board, the push button can be fitted to the end of the device 35 so that the force exerting the button is perpendicular to the printed circuit board 1, thereby avoiding the stresses of the 117254 12 parallel to the printed circuit board. The support pattern 6 conveniently modifies the properties of the circuit board 1 in the narrowed portion 17 so that the circuit board 1 is easily bent to the required shape at room temperature and on the other hand the circuit board 1 remains in a bent shape and does not rotate.

The circuit board 1 may be of such a structure that it is substantially rigid and non-bending at room temperature. Such a circuit board can be utilized as part of the mechanical support structure of the electronic device. In addition, a relatively thin and flexible circuit board itself can be made quite rigid by appropriately three-dimensional shaping.

The drawings and the description related thereto are only intended to illustrate the idea of the invention. The details of the invention may vary within the scope of the claims.

»♦« • · 1 • 1 1 · »• · • ·· 0 • · • 1 * 1 · • 0 · • M» • ··· • · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · ·· • m 0 0 0 «· • * • 1 · •» ΦΜ • 0 · «0 1 0 ·· • · * • 1

Claims (44)

A circuit board comprising an insulating layer (2, 2a, 2b) and a conductor pattern (3, 3a, 3b) arranged on at least one surface of the insulating layer (2, 2a, 2b), which is made of a material which conducts electricity, and a support pattern (6, 6a, 6b) arranged on at least one surface of the insulation layer (2, 2a, 2b), said support pattern consisting of strips of material (7, 7a, 7b) arranged spaced apart from each other, characterized by the pattern board comprises an insulation layer (2, 2a, 2b) containing thermoplastic, and that the printed circuit board can be formed into a durable three-dimensional shape at room temperature and / or at elevated temperature. Pattern board according to claim 1, characterized in that the support pattern (6, 6a, 6b) is formed of the same material as the wiring pattern (3, 3a, 3b) on the same surface of the insulating layer (2, 2a, 2b). Pattern board according to claim 1 or 2, characterized in that the support pattern (6, 6a, 6b) is formed of the same conductive screen as the conductor pattern (3, 3a, 3b) on the same surface of the insulating layer (2.2a, 2b). Pattern board according to claim 1, characterized in that the support pattern (6, 6a, 6b) is formed of a material other than the conductor pattern (3, 3a, 3b) on the same surface of the insulating layer (2.2a, 2b). 20 5. A pattern card according to any of the preceding claims, characterized in that the support pattern (6, 6a, 6b) is arranged to cover the surface of the pattern card (1) substantially all of the part which is on said surface free from conduction pattern (3, 3a, 3b). 6. A pattern board according to any of the preceding claims, characterized in that the basic shape of the supporting pattern (6, 6a, 6b) is the same over the entire supporting pattern (6.6a, 6b). Pattern card according to any of claims 1-5, characterized in that the support pattern (6, 6a, 6b) comprises parts which differ from each other. pattern (11a, 11b). • · 111 '30 A pattern card according to any of the preceding claims, characterized in that the support pattern (6, 6a, 6b) comprises material strips (7, 7a, «, 5 * 'ί 7b) which intersect. 9. A pattern card according to any of the preceding claims, characterized by the fact that it is shaped three-dimensionally. • ·· '[' 1 35 Pattern board according to any of the preceding claims, characterized in that said insulation layer (2, 2a, 2b) comprises polyolefin. 18 1 1 7234 A printed circuit board according to any of the preceding claims, wherein the at least one insulation layer (2, 2a, 2b) comprises elastomeric material. A pattern card according to any of the preceding claims, characterized by the offset support pattern (6.6a, 6b) encoder cups. A pattern board according to any of the preceding claims, characterized in that it has a substantially rigid and inflexible structure at room temperature. A pattern board according to any of the preceding claims, characterized in that the support pattern (6, 6a, 6b) is arranged to function as the ground plane of the circuit board (1). 15. A circuit board according to any one of claims 1-13, characterized in that the support pattern (6.6a, 6b) is arranged to conduct operating voltage. A pattern board according to any of the preceding claims, characterized in that it is a multilayer pattern board comprising several insulation layers (2, 2a, 2b) and a support pattern (6, 6a, 6b) on at least one surface of the insulation layer. (2, 2a, 2b). A pattern board according to claim 16, characterized in that a support pattern (6, 6a, 6b) is arranged on the surface of several insulation layers (2, 2a, 2b). 20 A pattern board according to claim 17, characterized in that on the surface of each insulating layer (2.2a, 2b) a support pattern (6.6a, 6b) is arranged. * · · V : 19. A printed circuit board according to claim 17 or 18, characterized by *. of that at least some strips of material (7, 7a, 7b) of support patterns (6, 6a, 6b) *: ··: arranged on different surfaces are arranged overlapping. : · *: 25 A pattern board according to any of the preceding claims, characterized in that the support pattern (6, 6a, 6b) comprises an edge edge (8) which follows the shape of the wiring pattern (3, 3a, 3b). An electronic device comprising at least one circuit board (1), comprising an insulation layer (2.2a, 2b) and at least one surface of the insulation layer (2, 2a, 2b) provided with conductor pattern (3, 3a, 3b) which is made of a material conducting the electrolyte, on at least one surface of which an insulating layer (2, 2a, 2b) is provided with a support pattern (6, 6a, 6b) consisting of strips of material ( 7, 7a, 7b) spaced apart from each other, characterized in that the printed circuit board comprises an insulating layer (2, 2a, 2b) containing thermoplastic and that the printed circuit board can be formed into a durable three layer. ': dimensional shape at room temperature and / or at elevated temperature. 117234 Electronic device according to claim 21, characterized in that the support pattern (6, 6a, 6b) is formed of the same material as the conductor pattern (3, 3a, 3b) on the same surface of the insulating layer (2, 2a, 2b). Electronic device according to claim 21, characterized in that the support pattern (6, 6a, 6b) is formed of a material other than the conductor pattern (3, 3a, 3b) on the same surface of the insulating layer (2, 2a, 2b). Electronic device according to claim 21 or 22, characterized in that the support pattern (6, 6a, 6b) is formed of the same conductive layer as the conductor pattern (3, 3a, 3b) on the same surface of the insulating layer (2, 2a, 2b) . Electronic device according to the preceding claims according to claims 21-24, characterized in that the support pattern (6, 6a, 6b) is arranged to cover the surface of the printed circuit board (1) substantially all of the portion free of the conductive pattern (3, 3a) on said surface. , 3b). Electronic device as claimed in claims 21-25, characterized in that the support pattern (6, 6a, 6b) comprises material strips (7, 7a, 7b) that intersect. Electronic device according to the nigot of claims 21-26, characterized in that the printed circuit board (1) is shaped three-dimensionally. 28. An electronic device as claimed in claim 21-27, characterized in that the printed circuit board (1) is a multilayer pattern board comprising several insulating layers (2, 2a, 2b) and a supporting pattern (6, 6a, 6b) pi it ** v: at least one surface of the insulating layer (2, 2a, 2b). An electronic device according to claim 28, characterized in that the surface of a plurality of insulating layers (2, 2a, 2b) is a support pattern (6, 6a, 6b): arranged. • I 30. Electronic device according to claim 28, characterized in that a support pattern (6, 6a, 6b) is arranged on the surface of each insulation layer (2, 2a, 2b). Electronic device according to Claim 29 or 30, characterized in that at least some material strips (7, 7a, 7b) of support pattern (6, 6a, 6b) arranged on different surfaces are arranged overlapping. *: **: 32. Electronic device according to the claim of claims 21-31, characterized in that it comprises fasteners (19), and that the circuit board. (1) is arranged in said fastener (19) in that the printed circuit board (1) is in three-dimensional shape. Electronic device according to any one of claims 21-32, characterized in that it is a mobile phone or ancillary equipment therefor. 34. A method of producing a printed circuit board in which methods are provided on at least one surface of the insulating layer (2, 2a, 2b), a wiring pattern (3, 3a, 3b), and at least one surface of the insulating layer ( 2.2a, 2b) a support pattern (6.6a, 6b) consisting of strips of material (7.7a, 7b) spaced apart from each other, characterized by the insulation layer (2, 2a, 2b) being made of thermoplastic so that the pattern board with its wiring pattern (3, 3a, 3b) and support pattern (6, 6a, 6b) can be formed into a permanent three-dimensional shape. The method according to claim 34, characterized in that the support pattern (6, 6a, 6b) is made of the same material as the wiring pattern (3, 3a, 3b). 15 The method according to claim 34 or 35, characterized in that the printed circuit board (1) is formed three-dimensionally. 37. A method according to claim 36, characterized in that the printed circuit board (1) is formed of components (12) on the printed circuit board (1). 20 The method according to claim 36, characterized in that the printed circuit board (1) is formed after the insertion of the components (12). v : 39. The method of claim 38, characterized in that a protective layer is arranged on the components (12), which are arranged to provide support for the components: (12) during the forming process. : 25 40. A method according to claim 39, characterized in that the protective layer is a lacquer layer. 41. A method according to claim 39, characterized in that the protective layer is a plastic film (13). 42. A method according to claim 41, characterized in that the plastic film (13) comprises heels (14) extending through it. 43. A method according to any of claims 38-42, characterized by: · · ·:. This means that the circuit board (1) is arranged in a mold and is molded in plastic to be formed in said mold. . 44. A method according to claim 43, characterized in that the mold is an injection mold.