JPS61270887A - Flexible printed wiring board - Google Patents
Flexible printed wiring boardInfo
- Publication number
- JPS61270887A JPS61270887A JP11240185A JP11240185A JPS61270887A JP S61270887 A JPS61270887 A JP S61270887A JP 11240185 A JP11240185 A JP 11240185A JP 11240185 A JP11240185 A JP 11240185A JP S61270887 A JPS61270887 A JP S61270887A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- flexible printed
- wiring board
- copper foil
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、フレキシブルな合成樹脂ヅートよりなる基材
上に銅箔を形成して構成されるフレキシブルプリント配
線基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a flexible printed wiring board constructed by forming copper foil on a base material made of flexible synthetic resin.
従来の技術
近年、プリント配線基板を用いる電子機器の小型化、軽
量化が進むにつれて、７レキシプルプリント配線基板が
多く用いられるようになった。そして、これらの基板に
は、チップ部品が多く搭載され、その取付けはりフロー
半田付工法による取付けが行なわれている。以下第４〜
６図に基づき従来例について説明する。2. Description of the Related Art In recent years, as electronic devices using printed wiring boards have become smaller and lighter, 7-lexiple printed wiring boards have come into widespread use. Many chip components are mounted on these boards, and they are mounted using a flow soldering method. 4th below
A conventional example will be explained based on FIG.
第４〜６図において、１はフレキシブルプリント配線基
板であシ、フレキシブルな合成樹脂シートよりなる基材
２上に所定のプリント配線回路ブロック人を形成する銅
箔３を設けるとともに、そのブロック人の周囲には当該
基板１の補強のための銅箔４を設けている。そして、チ
ップ部品６はハンダ６．７によってブロック人の銅箔３
に取付けられている。4 to 6, reference numeral 1 is a flexible printed wiring board, on which a copper foil 3 forming a predetermined printed wiring circuit block is provided on a base material 2 made of a flexible synthetic resin sheet. A copper foil 4 is provided around the substrate 1 to reinforce it. Then, the chip component 6 is connected to the block copper foil 3 by solder 6.7.
installed on.
このようなフレキシブルプリント配線基板１を構成する
場合、リジツト基板を用いてリフローハンダ付け（熱輻
射、紫外線加熱ハンダ付は工法）を行なっており、また
、ハンダ塗布はスクリーンハンダ印刷版によるクリーム
ハンダの塗布で実現している。。When constructing such a flexible printed wiring board 1, reflow soldering is performed using a rigid board (thermal radiation and ultraviolet heating soldering are methods), and solder application is performed using cream solder using a screen solder printing plate. This is achieved by coating. .
このスクリーンノ・ンダ印刷版を用いたリジット基板上
でのクリームノ・ンダ印刷は、リジット基板それ自体の
剛性による平面性がスクリーン印刷を容易に実現可能に
させている。更に、リフロー加熱時においては、リジッ
ト基板の剛性が熱変形を抑え、これによるチップ部品の
移動、流れ出しを抑える効果を有している。In cream-printing on a rigid substrate using this screen-printing plate, the flatness due to the rigidity of the rigid substrate itself makes screen printing easily possible. Furthermore, during reflow heating, the rigidity of the rigid substrate suppresses thermal deformation, which has the effect of suppressing movement and outflow of chip components.
発明が解決しようとする問題点
しかし、可撓性を有するフレキシブルプリント配線基板
１は、銅箔自身での剛性がなく、一方で変形も発生しや
すく、基材と銅箔の可撓性を均一平面に保つことがむず
かしいため、このスクリーンハンダ印刷によるノ・ンダ
塗布は極めて困難であった。更に、リフロー加熱時には
基材の熱変形と銅箔の熱収縮率の変化差が大きいことが
原因でフレキシブルプリント配線基板が大きく変形し、
チップ部品の移動、流れ出し現象が発生しやすいという
欠点を有していた。Problems to be Solved by the Invention However, the flexible printed wiring board 1, which has flexibility, lacks the rigidity of the copper foil itself, and is also prone to deformation. Since it is difficult to maintain a flat surface, it is extremely difficult to apply solder using screen solder printing. Furthermore, during reflow heating, there is a large difference in the thermal deformation of the base material and the thermal shrinkage rate of the copper foil, which causes the flexible printed wiring board to be significantly deformed.
This method has the disadvantage that chip components tend to move or flow out.
本発明は、スクリーンノ・ンダ印刷版によるリフローハ
ンダの確実な塗布が可能で、確実なりフローハンダ付け
ができるフレキシブルプリント配線基板を提供すること
を目的とするものである。SUMMARY OF THE INVENTION An object of the present invention is to provide a flexible printed wiring board that allows reliable application of reflow solder using a screen-printing plate and allows reliable flow soldering.
問題点を解決するだめの手段
上記の問題点を解決するため、本発明のフレキシブルプ
リント配線基板は、プリント配線回路ブロック間および
周囲の部分に設けた補強用の銅箔を多数の独立した銅箔
によって形成したことを特徴とするものである。Means for Solving the Problems In order to solve the above-mentioned problems, the flexible printed wiring board of the present invention includes reinforcing copper foils provided between and around the printed wiring circuit blocks, and a large number of independent copper foils. It is characterized by being formed by.
作用
本発明のフレキシブルプリント配線基板は、基材の樹脂
による可撓性に優れた性質に加え、平面になじむ腰のな
さの性質と、片面又は両面銅箔部分の剛弾性による腰の
強さの双方の欠点と長所を補ない合うように金属面の剛
性を有しつつ樹脂のなじみやすさをプリント配線ブロッ
クの間及び周囲の部分に交互に作り出して全体として平
板上に置いた時の平面へのなじみ易さによる平面度均一
化を図ることができると共に、加熱時、補強部分と回路
形成部分の熱収縮差を少なくすることにより補強部分全
体に銅箔のみを残す場合に比べ、可熱時の平面度を保つ
ことを可能にすることができる。Function The flexible printed wiring board of the present invention has excellent flexibility due to the resin base material, as well as flexibility that adapts to flat surfaces, and stiffness due to the rigid elasticity of the copper foil portion on one or both sides. In order to compensate for the shortcomings and strengths of both, we alternately create the rigidity of a metal surface and the ease of conformability of a resin between and around the printed wiring blocks, so that the overall surface becomes flat when placed on a flat plate. It is possible to achieve uniform flatness due to the ease of conformability, and by reducing the difference in thermal shrinkage between the reinforced part and the circuit forming part during heating, compared to leaving only copper foil on the entire reinforced part, It is possible to maintain the flatness of the surface.
実施例
以下、本発明の実施例のフレキシブルプリント配線基板
を図面を参照して説明する。EXAMPLES Below, flexible printed wiring boards according to examples of the present invention will be described with reference to the drawings.
第１図および第２図は本発明の一実施例を示す。1 and 2 show one embodiment of the invention.
第１図および第２図において、連続したフレキシブルプ
リント配線基板１上に一定の間隔で必要の回路ブロック
Ａのための銅箔３が形成されており、この回路ブロック
人の間および周囲部分には一定間隔（通常銅箔幅２〜１
５ｍ、スリット幅１〜５期間隔）でエツチングされた銅
箔部分９と非銅箔部分１ｏによる補強部分が構成されて
いる。このため、フレキシブルプリント配線基板の平面
性が高まりスクリーンハンダ印刷版によるノ・ンダの塗
布前後でのリジット基板８上での平面性を確保でき、ク
リーム状ハンダが極めて良好に印刷可能となる。1 and 2, copper foils 3 for necessary circuit blocks A are formed at regular intervals on a continuous flexible printed wiring board 1, and between and around the circuit blocks. Regular intervals (usually copper foil width 2 to 1
A reinforcing portion is constituted by a copper foil portion 9 etched with a slit width of 1 to 5 m and a non-copper foil portion 1o. Therefore, the flatness of the flexible printed wiring board is improved, and the flatness on the rigid board 8 can be ensured before and after applying the solder using the screen solder printing plate, and creamy solder can be printed extremely well.
つまり、一定間隔にスリット状に補強用の銅箔９を設け
た場合は、回路ブロック部分の熱膨張が補強部分でも平
均的に発生し吸収され、クリーム状ハンダ上でのチップ
部品５の流れ出しや移動することを抑えることが出来る
。In other words, when reinforcing copper foil 9 is provided in the form of slits at regular intervals, the thermal expansion of the circuit block portion is evenly generated and absorbed by the reinforcing portion, and the chip components 5 are prevented from flowing out on the creamy solder. It can prevent you from moving.
なお、補強部分のスリットの間隔や方向、形状は５周囲
の回路ブロックとの効果の度合いにより変えることで求
めようとする効果を高めることが出来る。Note that the desired effect can be enhanced by changing the spacing, direction, and shape of the slits in the reinforcing portion depending on the degree of effect with the surrounding circuit blocks.
発明の効果
以上のように本発明のフレキシブルプリント配線基板は
、スクリーンハンダ印刷版によるリフロー加熱・・／ダ
付は工法を採用する上で、障害となるフレキシブルプリ
ント配線基板自体の平面度を実現させ、これによるハン
ダスクリーン印刷を可能にし、その印刷精度、安定性を
特別なコストを必要とせず実現させることができ、また
、リフロー加熱時において、フレキシブルプリント配線
基板の熱収縮、膨張、変形をより少なく抑えるととが出
来ることで、チップ部品の移動、脱落を防ぐ効果があり
、安定したフレキシブルプリント配線基板への直接的な
りフロー加熱が実現出来る極めて有益なものである。Effects of the Invention As described above, the flexible printed wiring board of the present invention does not realize the flatness of the flexible printed wiring board itself, which is an obstacle when using the reflow heating/dapping method using a screen solder printing plate. , which enables solder screen printing and achieves printing accuracy and stability without requiring special costs, and also reduces thermal contraction, expansion, and deformation of flexible printed wiring boards during reflow heating. By being able to keep the temperature to a minimum, it has the effect of preventing chip components from moving or falling off, and is extremely useful as it allows stable direct or flow heating to the flexible printed wiring board.
第１図は本発明の一実施例におけるフレキシブルプリン
ト配線基板の斜視図、第２図は第１図におけるａ−ａ’
断面図、第３図は同フレキシブルプリント配線基板のり
フロー加熱を示す斜視図、第４図は従来のフレキシブル
プリント配線基板の斜視図、第６図は第４図におけるｂ
−ｂ’断面図、第６図は同リフロー加熱時の斜視図であ
る。
１・・・・・・フレキシブルプリント配線基板、２・・
・・・・基材、人・・・・・・回路ブロック、３・・・
・・・回路ブロックの銅箔、６・・・・・・チップ部品
、６，７・・・・・・ハンダ、９・・・・・・補強用の
銅箔部、１ｏ・・・・・・補強部の非銅箔部。FIG. 1 is a perspective view of a flexible printed wiring board according to an embodiment of the present invention, and FIG. 2 is a-a' in FIG. 1.
3 is a perspective view showing glue flow heating of the same flexible printed wiring board, FIG. 4 is a perspective view of a conventional flexible printed wiring board, and FIG. 6 is b in FIG. 4.
-b' sectional view and FIG. 6 are perspective views during reflow heating. 1...Flexible printed wiring board, 2...
・・・Base material, person ・・・Circuit block, 3...
...Copper foil of circuit block, 6...Chip parts, 6,7...Solder, 9...Copper foil part for reinforcement, 1o...・Non-copper foil part of reinforcement part.
Claims (1)
を形成して構成されるフレキシブルプリント配線基板で
あって、基材上に所定のプリント配線回路ブロックを形
成する銅箔を一定の間隔で連続的に設けるとともに、そ
の回路ブロック間及び周囲の部分には当該基板の補強の
ための銅箔を設けてなり、前記補強銅箔は多数の独立し
た銅箔によって形成したことを特徴とするフレキシブル
プリント配線基板。A flexible printed wiring board consisting of copper foil formed on a base material made of a flexible synthetic resin sheet, in which the copper foil forming a predetermined printed wiring circuit block is continuously placed on the base material at regular intervals. The flexible printed wiring is provided with copper foil for reinforcing the board between and around the circuit blocks, and the reinforcing copper foil is formed of a large number of independent copper foils. substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11240185A JPS61270887A (en) | 1985-05-24 | 1985-05-24 | Flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11240185A JPS61270887A (en) | 1985-05-24 | 1985-05-24 | Flexible printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61270887A true JPS61270887A (en) | 1986-12-01 |
Family
ID=14585733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11240185A Pending JPS61270887A (en) | 1985-05-24 | 1985-05-24 | Flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61270887A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009071335A (en) * | 2003-10-10 | 2009-04-02 | Panasonic Corp | Production method of circuit forming substrate, material for manufacturing of the circuit forming substrate and handling method for circuit-forming substrate |
| EP1747704A4 (en) * | 2004-05-17 | 2011-10-12 | Meadville Entpr Hk Ltd | Printed wiring board, manufacturing method and electronic device |
-
1985
- 1985-05-24 JP JP11240185A patent/JPS61270887A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009071335A (en) * | 2003-10-10 | 2009-04-02 | Panasonic Corp | Production method of circuit forming substrate, material for manufacturing of the circuit forming substrate and handling method for circuit-forming substrate |
| EP1747704A4 (en) * | 2004-05-17 | 2011-10-12 | Meadville Entpr Hk Ltd | Printed wiring board, manufacturing method and electronic device |
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