JPH02303180A - Solder printing apparatus for printed circuit board - Google Patents
Solder printing apparatus for printed circuit boardInfo
- Publication number
- JPH02303180A JPH02303180A JP12491189A JP12491189A JPH02303180A JP H02303180 A JPH02303180 A JP H02303180A JP 12491189 A JP12491189 A JP 12491189A JP 12491189 A JP12491189 A JP 12491189A JP H02303180 A JPH02303180 A JP H02303180A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- squeegees
- circuit board
- printed circuit
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 43
- 238000007639 printing Methods 0.000 title claims abstract description 24
- 239000006071 cream Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Screen Printers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
（イ）産業上の利用分野
本発明は、電子機器に用いられるプリント基板に表面実
装部品（Ｓ Ｍ Ｄ ： ５ｕｒｆａｃｅ Ｍｏｕｎｔ
Ｄｅｖｉｃｅ）を実装する場合、該ＳＭＤの実装前に
所定の銅膜個所にクリーム半田を塗布し、リフロー半田
付する方式におけるプリント基板用半田印刷装置に関す
る。DETAILED DESCRIPTION OF THE INVENTION (a) Industrial Application Field The present invention is applied to surface mount components (SMD) on printed circuit boards used in electronic equipment.
The present invention relates to a printed circuit board solder printing apparatus that applies cream solder to a predetermined copper film location and performs reflow soldering before mounting the SMD.
（ロ）従来の技術
一般に電子機器においては、リード線付きの電子部品及
びチップ部品と呼ばれるリードレスタイプの電子部品、
更にフラットタイプのＬＳＩ（大規模集積回路）をプリ
ント基板に各端子を所定の銅膜に半田付する方法が使用
され、このプリント基板を各機器に収納して組立ててい
る。(b) Conventional technology In general, electronic devices include electronic components with lead wires, leadless type electronic components called chip components,
Furthermore, a method is used in which a flat type LSI (Large Scale Integrated Circuit) is mounted on a printed circuit board and each terminal is soldered to a predetermined copper film, and this printed circuit board is housed and assembled into each device.
この場合、特に表面実装部品と呼ばれるチップ部品とし
てのチップ抵抗、チップコンデンサ、フラットタイプの
ＬＳＩ、 トランジスタ、ダイオードは予めプリント
基板に仮止め（仮固定）しておく必要があり、接着剤と
クリーム半田を塗布する方式が提案されている。そこで
前記塗布のために特公昭５９−５１７６０号公報に、プ
リント配線板へのソルダレジストの印刷方法が提案され
ており、所定のパターンのスクリーンを介してソルダレ
ジストを印刷する技術が示されている。In this case, chip resistors, chip capacitors, flat type LSIs, transistors, and diodes, which are chip components called surface-mounted components, must be temporarily fixed (temporarily fixed) to the printed circuit board in advance, using adhesive and cream solder. A method has been proposed to apply . Therefore, Japanese Patent Publication No. 59-51760 proposes a method of printing solder resist onto a printed wiring board for the above-mentioned application, and shows a technique of printing solder resist through a screen with a predetermined pattern. .
（八）発明が解決しようとする課題
前記従来技術は、プリント配線板上にソルダレシストを
印刷する方法で、スキージを傾斜させることでソルダレ
ジストを均一に塗布するもので、上記配線板に対して電
子部品ＳＭＤを仮固定する場合には上記技術を単に流用
しても、仮固定用材料のクリーム半田の特性によってス
キージの中央部にクリーム半田が偏在してしまい、印刷
性が極めて悪い。(8) Problems to be Solved by the Invention The prior art is a method of printing solder resist on a printed wiring board, in which the solder resist is applied uniformly by tilting a squeegee. When temporarily fixing a component SMD, even if the above-mentioned technique is simply used, the cream solder will be unevenly distributed in the center of the squeegee due to the characteristics of cream solder as a temporary fixing material, resulting in extremely poor printability.
そこで本発明は前記欠点を考慮して、スキージ自体の形
状を改良したプリント基板用半田印刷装置を提案するも
のである。In consideration of the above drawbacks, the present invention proposes a printed circuit board solder printing apparatus in which the shape of the squeegee itself is improved.
輛）課題を解決するための手段
本発明は、プリント基板用半田印刷装置において、半田
印刷のためのスキージの形状を、半田が均一に塗布され
るように印刷時の移動方向に対し半田が収束する向きに
湾曲又は折曲させた構成である。4) Means for Solving the Problems The present invention provides a solder printing device for printed circuit boards, in which the shape of the squeegee for solder printing is adjusted such that the solder converges in the direction of movement during printing so that the solder is evenly applied. The structure is curved or bent in the direction of
（＊）作用
本発明では、種々の電子機器に用いるプリント基板に半
田を塗布する場合にスキージの移動方向に対して半田が
収束するので効率良く行える。(*) Function In the present invention, when applying solder to printed circuit boards used in various electronic devices, the solder converges in the direction of movement of the squeegee, so it can be performed efficiently.
（へ）実施例
図面に従って本発明を説明すると、第１図はスクリーン
印刷時の印刷原理図、第２図はスキージ平面図を示す。(f) Example The present invention will be explained with reference to the drawings. Fig. 1 shows a printing principle diagram during screen printing, and Fig. 2 shows a plan view of a squeegee.
次に本発明装置の動作について説明すると、図面におい
て（１）はスキージ、（２）はメタルマスク、（３）は
プリント基板、（４）は印刷テーブル、（５）はクリー
ム半田を示す。Next, the operation of the apparatus of the present invention will be described. In the drawings, (1) shows a squeegee, (2) a metal mask, (3) a printed circuit board, (4) a printing table, and (5) a cream solder.
前記スキージはその形状として第２図（イ）は円弧形状
に湾曲させた例、（ロ）（ハ）は中心部を折曲させた例
、（ニ）はジグザグ形状に折曲きせた例を示し、いずれ
の例もスキージは一対で構成しである。クリーム半田（
５）は第２図の各々の例において一対のスキージ（１）
（１）の中間位置に配置し、スキージ（１）（１）を第
１図のＡ又はＢ方向に移動させる。The shapes of the squeegee shown in Fig. 2 (a) are examples in which the squeegee is curved into an arc shape, (b) and (c) are examples in which the center portion is bent, and (d) is an example in which the squeegee is bent in a zigzag shape. In each example, the squeegee consists of a pair. Cream solder (
5) is a pair of squeegees (1) in each example of FIG.
(1), and move the squeegee (1) (1) in the direction A or B in FIG.
例えばＡ方向にスキージを移動きせると、クリーム半田
（５）はスキージ（１）＜１＞の一方でスキージと共に
移動し、メタルマスク（２）を通してクリーム半田（５
）はプリント基板（３）の所定の銅膜部分に塗布される
。For example, when the squeegee is moved in the A direction, the cream solder (5) moves with the squeegee on one side of the squeegee (1) and passes through the metal mask (2).
) is applied to a predetermined copper film portion of the printed circuit board (3).
逆にＢ方向にスキージを移動させると、クリーム半田（
５）は前記一対のスキージ（１）（１）の他方でＢ方向
に移動し、前述と同様にプリント基板（３）の所定の銅
膜部分に塗布される。前述のＡ方向又はＢ方向の往復運
動を繰返して、多数のプリント基板にクリーム半田を塗
布する作業が可能となり、前記スキージの形状によって
、前記印刷塗布の回数は数１０回に達し得る。なお前記
スキージ（１）（１）は第１図のように互に傾斜させた
状態で対向させて使用すれば効率が良い。Conversely, if you move the squeegee in direction B, cream solder (
5) is moved in the direction B by the other of the pair of squeegees (1) (1), and is applied to a predetermined copper film portion of the printed circuit board (3) in the same manner as described above. By repeating the reciprocating movement in the A direction or the B direction, it is possible to apply cream solder to a large number of printed circuit boards, and depending on the shape of the squeegee, the number of printing applications can reach several dozen times. Note that it is more efficient if the squeegees (1) and (1) are used in an inclined state facing each other as shown in FIG.
このときスキージ（１）は所定の押圧力を加えて、Ａ又
はＢの方向に移動させるもので、メタルマスク（２）と
してステンレス又はニッケル等より成る金属板のマスク
を通してプリント基板（３）に所定のクリーム半田層が
形成される。この場合微小なマスクギャップで印刷され
るパターンの膜厚は、はぼメタルマスク〈２〉の厚みに
相当する。At this time, the squeegee (1) is moved in the direction A or B by applying a predetermined pressing force to the printed circuit board (3) through a metal mask (2) made of stainless steel or nickel. A cream solder layer is formed. In this case, the film thickness of the pattern printed with a minute mask gap corresponds to the thickness of the metal mask <2>.
（））発明の効果
本発明のプリント基板用半田印刷装置によれば、従来の
同装置に比し、スキージを湾曲又は折曲させた形状にし
であるので、従来に比べてクリーム半田の印刷状態が均
一になり、更に連続印刷可能回数が増加する。()) Effects of the Invention According to the printed circuit board solder printing device of the present invention, the squeegee is curved or bent compared to the conventional device, so the cream solder is printed in a better condition than the conventional device. becomes uniform, further increasing the number of times that continuous printing can be performed.
又高密度実装の狭いピッチのクリーム半田印刷に効果が
犬で、品質の向上に伴い修正作業が減少する。It is also very effective for cream solder printing with narrow pitches for high-density mounting, and as the quality improves, correction work decreases.
第１図は本発明のプリント基板用半田印刷装置の要部原
理図、第２図は同装置に用いるスキージの平面図を示す
。
（１）・・・スキージ、（２）・・・メタルマスク、（
３）・・・プリント基板、 （４）・・・印刷台、 （
５）・・・クリーム半田。FIG. 1 shows the principal part of a solder printing apparatus for printed circuit boards according to the present invention, and FIG. 2 shows a plan view of a squeegee used in the apparatus. (1)...Squeegee, (2)...Metal mask, (
3)...Printed circuit board, (4)...Printing table, (
5) Cream solder.
Claims (1)
載置されるスクリーンと、該スクリーン上にクリーム半
田等のプリント基板用半田が供給されかつ所定のパター
ンが形成された前記スクリーンを通して前記プリント基
板の所定個所に前記半田層を印刷するプリント基板用半
田印刷装置において、前記スキージを印刷時の移動方向
に対し、前記半田を収束する向きに湾曲又は折曲させた
ことを特徴とするプリント基板用半田印刷装置。(1) A screen is placed on a printed circuit board on which a copper film pattern has been printed in advance, and solder for the printed circuit board, such as cream solder, is supplied onto the screen and the printed circuit board is passed through the screen on which a predetermined pattern is formed. A printed circuit board solder printing apparatus that prints the solder layer at a predetermined location on a board, wherein the squeegee is curved or bent in a direction that converges the solder with respect to a moving direction during printing. solder printing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12491189A JPH02303180A (en) | 1989-05-18 | 1989-05-18 | Solder printing apparatus for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12491189A JPH02303180A (en) | 1989-05-18 | 1989-05-18 | Solder printing apparatus for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02303180A true JPH02303180A (en) | 1990-12-17 |
Family
ID=14897166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12491189A Pending JPH02303180A (en) | 1989-05-18 | 1989-05-18 | Solder printing apparatus for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02303180A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008010525A (en) * | 2006-06-28 | 2008-01-17 | Fuji Mach Mfg Co Ltd | Flux transfer apparatus |
| JP2011139085A (en) * | 2011-02-16 | 2011-07-14 | Fuji Mach Mfg Co Ltd | Flux transfer device |
| JP2015208965A (en) * | 2014-04-28 | 2015-11-24 | トッパン・フォームズ株式会社 | Conductive circuit formation apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5858370B2 (en) * | 1980-06-30 | 1983-12-24 | ロンシール工業株式会社 | Open cell manufacturing method |
-
1989
- 1989-05-18 JP JP12491189A patent/JPH02303180A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5858370B2 (en) * | 1980-06-30 | 1983-12-24 | ロンシール工業株式会社 | Open cell manufacturing method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008010525A (en) * | 2006-06-28 | 2008-01-17 | Fuji Mach Mfg Co Ltd | Flux transfer apparatus |
| JP4726005B2 (en) * | 2006-06-28 | 2011-07-20 | 富士機械製造株式会社 | Flux transfer device |
| JP2011139085A (en) * | 2011-02-16 | 2011-07-14 | Fuji Mach Mfg Co Ltd | Flux transfer device |
| JP2015208965A (en) * | 2014-04-28 | 2015-11-24 | トッパン・フォームズ株式会社 | Conductive circuit formation apparatus |
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