JPS63115169A - Screen mask for cream solder printing - Google Patents
Screen mask for cream solder printingInfo
- Publication number
- JPS63115169A JPS63115169A JP61260807A JP26080786A JPS63115169A JP S63115169 A JPS63115169 A JP S63115169A JP 61260807 A JP61260807 A JP 61260807A JP 26080786 A JP26080786 A JP 26080786A JP S63115169 A JPS63115169 A JP S63115169A
- Authority
- JP
- Japan
- Prior art keywords
- cream solder
- patterns
- pattern
- printing
- screen mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 86
- 239000006071 cream Substances 0.000 title claims abstract description 71
- 238000005476 soldering Methods 0.000 claims description 5
- 230000007547 defect Effects 0.000 abstract description 17
- 239000011248 coating agent Substances 0.000 abstract description 15
- 238000000576 coating method Methods 0.000 abstract description 15
- 239000000463 material Substances 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Printing Plates And Materials Therefor (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、フラットパッケージＩＣやリード付きチップ
キャリアＩＣ等の高密度リード付きＩＣを印刷配線基板
上へ半田付けする際に使用するクリーム半田印刷用スク
リーンマスクの印刷パターンに関する。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to cream solder printing used when soldering high-density leaded ICs such as flat package ICs and leaded chip carrier ICs onto printed wiring boards. The present invention relates to a printing pattern for a screen mask.
（従来の技術）
近年、高密度実装を行うために印刷配線基板上に集積回
路（ＩＣ）を内蔵するパフケージが搭載されるようにな
ってきている。特にフラットパッケージＩＣ及びリード
付きチップキャリアＩＣは他のチップ型面実装部品と共
に高密度化、薄型化に適しているため、広く使用される
ようになってきている。ところで、これらＩＣと印刷配
線基板とを接続するリード端子のリード数と、そのリー
ドピッチは高密度化の要求と共に多端子、小ピンチ化の
傾向にあり、最近ではビン数１００以上、リードピンチ
０．６３５ ｗ以下のもが広く使われるようになってい
る。(Prior Art) In recent years, puff cages containing integrated circuits (ICs) have been mounted on printed wiring boards in order to perform high-density packaging. In particular, flat package ICs and leaded chip carrier ICs are becoming widely used because they are suitable for higher density and thinner designs along with other chip-type surface mount components. By the way, the number of leads and the lead pitch of the lead terminals that connect these ICs and printed wiring boards are trending toward higher density and smaller pins. Those with a power of .635 W or less are now widely used.
しかし、これらフラットパッケージＩＣやリード付きチ
ップキャリアＩＣのリードピッチが小さくなるにしたが
って、半田付は前に印刷配線基板上に印刷塗布されるク
リーム半田の印刷性が悪くなり、クリーム半田未塗布不
良や、隣接する塗布部との印刷ブリッジ不良が発生し易
く、後工程にて改修することが必要となっている。However, as the lead pitch of these flat package ICs and leaded chip carrier ICs becomes smaller, the printability of the cream solder that is printed and coated on the printed wiring board before soldering becomes worse, resulting in defects such as cream solder not being applied. , printing bridge defects with adjacent coating parts are likely to occur, and repair is required in a post-process.
このような状況から、半田付は接続の不良率を低減させ
るために種々の提案がなされおり、この種の先行技術と
して、実開昭６１−１２２６７号、特開昭６１−１３６
５４号等があげられる。Under these circumstances, various proposals have been made for soldering to reduce the defective rate of connections, and prior art of this type include Utility Model Application Publication No. 61-12267 and Japanese Patent Application Publication No. 61-136.
Examples include No. 54.
以下、これらの従来技術の構成を図を用いて説明する。Hereinafter, the configurations of these conventional techniques will be explained using figures.
第７図は従来のクリーム半田印刷用スクリーンマスクに
より、印刷配線基板上の接続部にクリーム半田を塗布し
た第１の例を示す平面図である。FIG. 7 is a plan view showing a first example in which cream solder is applied to a connecting portion on a printed wiring board using a conventional cream solder printing screen mask.
この図において、印刷配線基板に整列して設けられた接
続パターン１に対応して矩形のクリーム半田塗布パター
ン２を互い違いに、つまり、千鳥状に配置したスクリー
ンマスクを使用してクリーム半田を印刷塗布するように
している。In this figure, cream solder is printed and applied using screen masks in which rectangular cream solder application patterns 2 are arranged alternately, that is, in a staggered manner, corresponding to connection patterns 1 arranged in alignment on a printed wiring board. I try to do that.
このように、矩形のクリーム半田塗布パターン２を互い
違いに配置したことにより、隣接する塗布部との隣接辺
の長さが短くなり、印刷ブリッジ不良及び半田ブリフジ
の不良を減少させることができる。By arranging the rectangular cream solder application patterns 2 alternately in this manner, the length of the adjacent sides of adjacent application parts is shortened, and printing bridging defects and solder bridging defects can be reduced.
第８図は従来のクリーム半田印刷用スクリーンマスクに
より印刷配線基板上の千鳥状に配設された接続パターン
３上にクリーム半田を塗布した第２の例を示す平面図で
ある。FIG. 8 is a plan view showing a second example in which cream solder is applied onto connection patterns 3 arranged in a staggered manner on a printed wiring board using a conventional cream solder printing screen mask.
この場合、クリーム半田印刷用スクリーンマスクのクリ
ーム半田塗布パターン４も印刷配線基板上の接続パター
ン３をはみ出さない範囲で、互い違いに印刷塗布するよ
うにしている。In this case, the cream solder application patterns 4 of the screen mask for cream solder printing are also printed and applied alternately within a range that does not extend beyond the connection patterns 3 on the printed wiring board.
このように、印刷配線基板上の接続パターン４も互い違
いに配置したことにより、互い違いに配置して印刷され
たクリーム半田が溶融時に基板上の接続部に拡がっても
隣接する接続パターン３との隣接辺の長さが短く保たれ
るため、半田プリフジの不良を減少させることができる
。In this way, since the connection patterns 4 on the printed wiring board are also arranged alternately, even if the cream solder printed in the staggered arrangement spreads to the connection part on the board when melted, it will not be adjacent to the adjacent connection pattern 3. Since the length of the sides is kept short, defects in solder prefix can be reduced.
（発明が解決しようとする問題点）
しかしながら、これら−従来の方法では、（１）リード
ピッチがより小さくなった場合に、印刷されたクリーム
半田が隣接する接続パターンのクリーム半田と連なかっ
てしまい、半田溶融時に半田ブリッジ不良を発生し易く
なったり、（２）また、所定の印刷厚さに対してスクリ
ーンマスクの印刷スリット幅寸法Ｗが小さ過ぎるために
、スクリーンマスクからのクリーム半田の版抜は性が悪
くなり、クリーム半田が印刷されないため、半田オープ
ン不良が発生し易いといった問題があった。(Problems to be Solved by the Invention) However, in these conventional methods, (1) when the lead pitch becomes smaller, the printed cream solder does not connect with the cream solder of the adjacent connection pattern; (2) Also, because the printing slit width dimension W of the screen mask is too small for the predetermined printing thickness, it is difficult to remove the cream solder from the screen mask. There was a problem that solder open defects were likely to occur because the solder was not printed and the cream solder was not printed.
本発明は、上記問題点を除去し、クリーム半田印刷時に
おけるクリーム半田の隣接する接続パターンとの連なが
り不良や、版抜は不良を減少させ、半田溶融時の半田接
続品質を向上させ得るクリーム半田印刷用スクリーンマ
スクを提供することを目的とする。The present invention eliminates the above-mentioned problems, reduces failures in connection of cream solder with adjacent connection patterns during cream solder printing, and reduces failures in printing, and improves solder connection quality during solder melting. The purpose is to provide a screen mask for cream solder printing.
（問題点を解決するための手段）
本発明は、上記問題点を解決するために、印刷配線基板
上へ高密度リード付きＩＣを半田付けする際に使用する
クリーム半田印刷用スクリーンマスクにおいて、上記Ｉ
Ｃリードを半田接続すべき印刷配線基板上の接続パター
ンの形状が矩形であるにもかかわらず、この接続パター
ン上に印刷塗布するクリーム半田の印刷形状を複数個の
円形とし、かつ、隣接する接続パターン上に印刷塗布す
るクリーム半田の複数個の円形形状の中心位置が互い違
いになるように配置するようにしたものである。(Means for Solving the Problems) In order to solve the above problems, the present invention provides a screen mask for cream solder printing used when soldering an IC with high-density leads onto a printed wiring board. I
Although the shape of the connection pattern on the printed wiring board to which the C lead is soldered is rectangular, the shape of the cream solder printed and applied on this connection pattern is a plurality of circles, and the adjacent connections are A plurality of circular shapes of cream solder to be printed and applied on the pattern are arranged so that the center positions thereof are staggered.
（作用）
本発明によれば、上記のように構成したので、隣接する
クリーム半田パターン間の距離が従来の矩形の場合と同
一でありながら、従来の矩形パターンの幅寸法よりも大
きな寸法の直径の円形パターンを配置することにより、
クリーム半田印刷時のクリーム半田の連ながり不良や、
版抜は不良等の印刷不良を減少させることができる。(Function) According to the present invention, with the above configuration, the distance between adjacent cream solder patterns is the same as in the case of a conventional rectangular pattern, but the diameter is larger than the width dimension of the conventional rectangular pattern. By arranging a circular pattern of
Poor cream solder continuity during cream solder printing,
Printing can reduce printing defects such as defects.
（実施例）
以下、本発明の実施例について図面を参照しながら詳細
に説明する。(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.
第１図は本発明の一実施例を示すクリーム半田塗布状態
平面図、第２図は本発明のクリーム半田印刷用スクリー
ンマスクのセント状態を示す図、第３図はクリーム半田
塗布パターンの説明図、第４図は本発明の一実施例を示
すＩＣの実装状態を示す図である。FIG. 1 is a plan view showing an embodiment of the present invention in a cream solder application state, FIG. 2 is a diagram showing a cream solder printing screen mask of the present invention in a cent state, and FIG. 3 is an explanatory diagram of a cream solder application pattern. , FIG. 4 is a diagram showing the mounting state of an IC showing an embodiment of the present invention.
この実施例おいては印刷配線基板１１の接続パターン１
２は４方向に同列に形成されている。この接続パターン
１２上に印刷塗布されるクリーム半田のスクリーンマス
ク１７（第２図参照）に形成された印刷パターンにより
、複数個の円形のクリーム半田塗布パターン１６が形成
される。このクリーム半田塗布パターン１６は隣接する
クリーム半田塗布パターン１６とはその円形の中心が互
いに違いにずれるように配置される。即ち、第２図に示
されるように、クリーム半田を塗布したい印刷配線基板
１１を所定の位置にセントし、該印刷配線基板の矩形の
接続パターン１２上に、対応する複数の円形塗布パター
ンが重なるように、該円形パターンが形成、配置された
スクリーンマスク１７を所定の距離をもたせて覆い被せ
た後、該スクリーンマスク１７上に供給されたクリーム
半田をスキージ等の治具を使って擦りつけることによっ
て、クリーム半田がスクリーンマスク１７に形成された
円形パターンを通して印刷配線基板ｌｌ上に形成された
矩形パターン上に接するまでにスクリーンマスク１７と
共に押し付けられ、スキージ等の治具の移動によりスク
リーンマスク１７が印刷配線基板１１から離れる時に、
クリーム半田と印刷配線基板１１との接着力により、ク
リーム半田がスクリーンマスク１７から版抜けし、印刷
配線基板ｌｌ上に塗布される。なお、ここで使用するス
クリーンマスク１７の材質は一般に使用されているもの
、例えば、ステンレス版、銅版ニッケルメッキ版、樹脂
板等いずれでも可能である。In this embodiment, connection pattern 1 of printed wiring board 11
2 are formed in the same row in four directions. A plurality of circular cream solder application patterns 16 are formed by a printed pattern formed on a screen mask 17 (see FIG. 2) of cream solder that is printed and applied onto this connection pattern 12. This cream solder application pattern 16 is arranged such that the centers of its circles are different from those of the adjacent cream solder application patterns 16. That is, as shown in FIG. 2, the printed wiring board 11 to which cream solder is to be applied is placed at a predetermined position, and a plurality of corresponding circular application patterns are overlapped on the rectangular connection pattern 12 of the printed wiring board. After covering the screen mask 17 with the circular pattern formed and arranged at a predetermined distance, the cream solder supplied onto the screen mask 17 is rubbed using a jig such as a squeegee. As a result, the cream solder passes through the circular pattern formed on the screen mask 17 and is pressed together with the screen mask 17 until it comes into contact with the rectangular pattern formed on the printed wiring board ll, and the screen mask 17 is moved by moving a jig such as a squeegee. When leaving the printed wiring board 11,
Due to the adhesive force between the cream solder and the printed wiring board 11, the cream solder comes off the screen mask 17 and is applied onto the printed wiring board 11. The material of the screen mask 17 used here may be any commonly used material, such as a stainless steel plate, a copper plate, a nickel plated plate, or a resin plate.
この場合、円形パターンは印刷配線基板１１との接触面
積に対する周長が矩形と比較して短いため、クリーム半
田と印刷配線基板１１との接着力に対するスクリーンマ
スクによる抵抗力が小さく、クリーム半田の版抜は性が
良好であり、従って、版抜は不良が減少する。In this case, since the circumference of the circular pattern relative to the contact area with the printed wiring board 11 is shorter than that of the rectangular pattern, the resistance of the screen mask to the adhesive force between the cream solder and the printed wiring board 11 is small, and the plate of the cream solder The punching property is good, and therefore, the number of defects is reduced in the punching process.
この点について第３図を参照しながら詳細に説明する。This point will be explained in detail with reference to FIG.
第３図は隣接する接続パターンへの塗布間隙と接続パタ
ーンへの塗布幅の関係を示したものであこの図において
、隣接する接続パターン上に印刷塗布されるクリーム半
田が運なかり不良となるのを防止するために、クリーム
半田塗布間隙をＸに固定すると、隣接する接続パターン
のピンチをｐとした場合、矩形のクリーム半田塗布パタ
ーン（矩形パターン）５の塗布幅ｄ、はｐ−ｘとなる。Fig. 3 shows the relationship between the coating gap between adjacent connection patterns and the coating width between the connection patterns. In order to prevent this, if the cream solder application gap is fixed at Become.
これに対して、円形パターン６の塗布幅ｄ、は、この場
合、塗布径ｄ２となり、隣接する接続パターンの円形パ
ターンとの中心の交互の位置ずれ量をＣとすれば、
ｄ 、 ＝ ｐ −ｘ
ｄ、 ＝ｐ−ｘ
ｄ、＞ｄ。On the other hand, the coating width d of the circular pattern 6 is the coating diameter d2 in this case, and if the amount of alternating positional deviation of the center of the adjacent connection pattern with the circular pattern is C, then d, = p − x d, =p-x d, > d.
となり、円形パターン６の塗布幅ｄ２は矩形パターン５
の塗布幅ｄ、の場合よりも塗布幅が大きくなり、従って
、スクリーンマスクによる印刷塗布厚ｔとの比もｔ／ｄ
、＜ｔ／ｄ、となり、矩形よりも円形で、かつ、中心を
交互にずらして配置した場合の方がクリーム半田の版抜
は性が良く、かつ前記塗布幅ｄ、とｄ、が等しく、かつ
、印刷塗布厚ｔが同じ場合には、クリーム半田塗布間隙
Ｘは円形パターンの方が矩形パターンにする場合よりも
大きくすることができ、印刷塗布されるクリーム半田の
連かり不良を防止することができる。Therefore, the coating width d2 of the circular pattern 6 is the same as that of the rectangular pattern 5.
The coating width is larger than that of the coating width d, and therefore the ratio to the printing coating thickness t by the screen mask is also t/d.
, <t/d, and the cream solder can be cut out better when the solder is arranged in a circular shape than in a rectangular shape, and the centers are alternately shifted, and the application widths d and d are equal. In addition, when the printed coating thickness t is the same, the cream solder coating gap X can be made larger for a circular pattern than for a rectangular pattern, thereby preventing poor continuity of the printed cream solder. Can be done.
第４図はこのようにしてクリーム半田が塗布された後、
フラットパッケージＩＣが実装された状態を示す図であ
り、第４図（ａ）はその平面図、第４図（ｂ）はその側
断面図を示している。Figure 4 shows after the cream solder is applied in this way.
4(a) is a plan view thereof, and FIG. 4(b) is a side sectional view thereof. FIG.
この図に示されるように、印刷配線基板ｌｌ上には接続
パターン１２が形成され、その上に前記した円形のクリ
ーム半田塗布パターンが形成され、そこにフラットパッ
ケージＩＣｌ３のリード端子１４が半田付けされる。１
３はその半田を示している。As shown in this figure, a connection pattern 12 is formed on the printed wiring board ll, and the above-described circular cream solder application pattern is formed on the connection pattern 12, and the lead terminals 14 of the flat package ICl3 are soldered thereto. Ru. 1
3 indicates the solder.
次に、本発明の他の実施例を第５図及び第６図を参照し
ながら説明する。Next, another embodiment of the present invention will be described with reference to FIGS. 5 and 6.
第５図は本発明の他の実施例を示すクリーム半田塗布状
態平面図、第６図は本発明の他の実施例を示すＩＣの実
装状態を示す図である。FIG. 5 is a plan view showing a state in which cream solder is applied, showing another embodiment of the present invention, and FIG. 6 is a diagram showing a state in which an IC is mounted, showing another embodiment of the invention.
この実施例においては、接続パターン１２′も互い違い
に配置される点が前記実施例と相違する。This embodiment differs from the previous embodiment in that the connection patterns 12' are also arranged alternately.
即ち、互い違いに配置される接続パターン１２′上には
第１図に示されると同様の円形クリーム半田塗布パター
ン１６が形成される。そして、第４図に示されると同様
にフラットパッケージＩＣｌ３が実装される。That is, circular cream solder application patterns 16 similar to those shown in FIG. 1 are formed on the alternately arranged connection patterns 12'. Then, the flat package ICl3 is mounted in the same manner as shown in FIG.
なお、本発明は上記実施例に限定されるものではなく、
本発明の趣旨に基づいて種々の変形が可能であり、これ
らを本発明の範囲から排除するものではない。Note that the present invention is not limited to the above embodiments,
Various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.
（発明の効果）
以上、詳細に説明したように、本発明によれば、印刷配
線基板上にクリーム半田を印刷塗布する時に使用スるス
クリーンマスクの印刷パターンを複数個の円形パターン
で形成し、かつ、隣接する接続パターンへの印刷パター
ンの円形パターンの中心位置を互い違いになるようにず
らして配置したことにより、隣接するクリーム半田塗布
パターン間の距離を従来の矩形の場合と同一でありなが
ら、従来の矩形パターンの幅寸法よりも大きな寸法の直
径を有する円形パターンを配置することができる。従っ
て、クリーム半田印刷時のクリーム半田の連ながり不良
や、基板上に半田が塗布されない、所謂、版抜は不良が
減少し、半田リフロー時の半田ブリフジ不良や、半田オ
ーブン不良を減少させることができる。(Effects of the Invention) As described in detail above, according to the present invention, the print pattern of the screen mask used when printing and applying cream solder on a printed wiring board is formed with a plurality of circular patterns, In addition, by arranging the circular patterns of the printed patterns for adjacent connection patterns so that they are staggered, the distance between adjacent cream solder coating patterns can be kept the same as in the case of conventional rectangular patterns. Circular patterns can be arranged having diameters larger than the width dimensions of conventional rectangular patterns. Therefore, defects in the continuity of cream solder during cream solder printing, so-called plate-cutting defects in which solder is not applied on the board, are reduced, and defects in solder bridging during solder reflow and solder oven defects are reduced. Can be done.
第１図は本発明の一実施例を示すクリーム半田塗布状態
平面図、第２図は本発明のクリーム半田印刷用スクリー
ンマスクのセント状態を示す図、第３図はクリーム半田
塗布パターンの説明図、第４図は本発明の一実施例を示
すＩＣの実装状態を示す図、第５図は本発明の他の実施
例を示すクリーム半田塗布状態平面図、第６図は本発明
の他の実施例を示すＩＣの実装状態を示す図、第７図は
従来の第１のクリーム半田塗布状態平面図、第８図は従
来の第２のクリーム半田塗布状態平面図である。
１１・・・印刷配線基板、１２．１２’・・・接続パタ
ーン、１３・・・半田、１４・・・リード端子、１５・
・・フラットパッケージＩＣ，１６・・・クリーム半田
塗布パターン、１７・・・クリーム半田のスクリーンマ
スク。FIG. 1 is a plan view showing an embodiment of the present invention in a cream solder application state, FIG. 2 is a diagram showing a cream solder printing screen mask of the present invention in a cent state, and FIG. 3 is an explanatory diagram of a cream solder application pattern. , FIG. 4 is a diagram showing an IC mounting state showing one embodiment of the present invention, FIG. 5 is a plan view showing another embodiment of the present invention in a cream solder application state, and FIG. 6 is a diagram showing another embodiment of the present invention. FIG. 7 is a plan view of a conventional first cream solder coating state, and FIG. 8 is a plan view of a conventional second cream solder coating state. 11... Printed wiring board, 12. 12'... Connection pattern, 13... Solder, 14... Lead terminal, 15.
...Flat package IC, 16...Cream solder application pattern, 17...Cream solder screen mask.
Claims (1)
リード付きＩＣを半田付けする際に使用するクリーム半
田印刷用スクリーンマスクにおいて、前記ＩＣの一つの
リードに対応した接続パターン上に印刷すべきスクリー
ンマスクの半田印刷パターンを複数の円形形状にすると
共に隣接する接続パターン上に印刷すべきスクリーンマ
スクの半田印刷パターンの複数個の円形形状の中心位置
を交互にずらすようにしたことを特徴とするクリーム半
田印刷用スクリーンマスク。In a cream solder printing screen mask used when soldering an IC with high-density leads by printing cream solder onto a printed wiring board, a screen to be printed on a connection pattern corresponding to one lead of the IC. A cream characterized in that the solder printing patterns of the mask are made into a plurality of circular shapes, and the center positions of the plurality of circular shapes of the solder printing patterns of the screen mask to be printed on adjacent connection patterns are alternately shifted. Screen mask for solder printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26080786A JPH0739220B2 (en) | 1986-11-04 | 1986-11-04 | Cream Solder screen mask |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26080786A JPH0739220B2 (en) | 1986-11-04 | 1986-11-04 | Cream Solder screen mask |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63115169A true JPS63115169A (en) | 1988-05-19 |
| JPH0739220B2 JPH0739220B2 (en) | 1995-05-01 |
Family
ID=17353022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26080786A Expired - Fee Related JPH0739220B2 (en) | 1986-11-04 | 1986-11-04 | Cream Solder screen mask |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0739220B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0281689A (en) * | 1988-09-19 | 1990-03-22 | Tamura Seisakusho Co Ltd | Screen mask for cream solder printing |
| EP1465468A1 (en) * | 2003-03-31 | 2004-10-06 | SANYO ELECTRIC Co., Ltd. | Metal mask and method of printing lead-free solder paste using same |
| US11033990B2 (en) * | 2018-11-29 | 2021-06-15 | Raytheon Company | Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies |
-
1986
- 1986-11-04 JP JP26080786A patent/JPH0739220B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0281689A (en) * | 1988-09-19 | 1990-03-22 | Tamura Seisakusho Co Ltd | Screen mask for cream solder printing |
| EP1465468A1 (en) * | 2003-03-31 | 2004-10-06 | SANYO ELECTRIC Co., Ltd. | Metal mask and method of printing lead-free solder paste using same |
| US7243834B2 (en) | 2003-03-31 | 2007-07-17 | Sanyo Electric Co., Ltd. | Metal mask and method of printing lead-free solder paste using same |
| US11033990B2 (en) * | 2018-11-29 | 2021-06-15 | Raytheon Company | Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0739220B2 (en) | 1995-05-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |