FI111509B - Läpimetalloidulla reiällä varustettu painettu piirilevy ja menetelmä sen valmistamiseksi sekä läpiporattu painettu piirilevy - Google Patents
Läpimetalloidulla reiällä varustettu painettu piirilevy ja menetelmä sen valmistamiseksi sekä läpiporattu painettu piirilevy Download PDFInfo
- Publication number
- FI111509B FI111509B FI904312A FI904312A FI111509B FI 111509 B FI111509 B FI 111509B FI 904312 A FI904312 A FI 904312A FI 904312 A FI904312 A FI 904312A FI 111509 B FI111509 B FI 111509B
- Authority
- FI
- Finland
- Prior art keywords
- printed circuit
- layer
- electrically conductive
- substrate
- circuit board
- Prior art date
Links
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
- C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
- C08G61/123—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31—Surface property or characteristic of web, sheet or block
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Chemically Coating (AREA)
- Burglar Alarm Systems (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Electroplating Methods And Accessories (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
- Silicon Polymers (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19883806884 DE3806884C1 (en) | 1988-03-03 | 1988-03-03 | Through-plated contact printed circuit and method for fabricating it |
| DE3806884 | 1988-03-03 | ||
| DE3832507 | 1988-09-24 | ||
| DE3832507 | 1988-09-24 | ||
| EP8900204 | 1989-03-01 | ||
| PCT/EP1989/000204 WO1989008375A1 (en) | 1988-03-03 | 1989-03-01 | New through-hole plated printed circuit board and process for manufacturing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FI904312A0 FI904312A0 (fi) | 1990-08-31 |
| FI111509B true FI111509B (fi) | 2003-07-31 |
Family
ID=25865472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FI904312A FI111509B (fi) | 1988-03-03 | 1990-08-31 | Läpimetalloidulla reiällä varustettu painettu piirilevy ja menetelmä sen valmistamiseksi sekä läpiporattu painettu piirilevy |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US5194313A (ru) |
| EP (1) | EP0402381B1 (ru) |
| JP (1) | JP2657423B2 (ru) |
| KR (1) | KR960014476B1 (ru) |
| AT (1) | ATE111294T1 (ru) |
| AU (1) | AU622650B2 (ru) |
| BG (1) | BG51470A3 (ru) |
| CA (1) | CA1315417C (ru) |
| DE (1) | DE68918085T2 (ru) |
| DK (1) | DK170690B1 (ru) |
| FI (1) | FI111509B (ru) |
| RU (1) | RU1816344C (ru) |
| WO (1) | WO1989008375A1 (ru) |
Families Citing this family (48)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5300208A (en) * | 1989-08-14 | 1994-04-05 | International Business Machines Corporation | Fabrication of printed circuit boards using conducting polymer |
| AU644602B2 (en) * | 1989-08-31 | 1993-12-16 | Blasberg-Oberflachentechnik Gmbh | Plated-through printed circuit board with resist and process for producing it |
| DE3928832C2 (de) * | 1989-08-31 | 1995-04-20 | Blasberg Oberflaechentech | Verfahren zur Herstellung von durchkontaktierten Leiterplatten und Leiterplatten-Halbzeug |
| ATE145313T1 (de) * | 1989-09-14 | 1996-11-15 | Atotech Deutschland Gmbh | Verfahren zur direkten metallisierung von leiterplatten |
| DE3931003A1 (de) * | 1989-09-14 | 1991-03-28 | Schering Ag | Verfahren zur direkten metallisierung von leiterplatten |
| US5693209A (en) * | 1989-09-14 | 1997-12-02 | Atotech Deutschland Gmbh | Process for metallization of a nonconductor surface |
| DE3935831A1 (de) * | 1989-10-27 | 1991-05-02 | Hoellmueller Maschbau H | Anlage zur herstellung von durchkontaktierten leiterplatten und multilayern |
| US5106537A (en) * | 1990-04-12 | 1992-04-21 | Olin Hunt Sub Iii Corp. | Liquid dispersion for enhancing the electroplating of a non-conductive surface |
| GB2243838A (en) * | 1990-05-09 | 1991-11-13 | Learonal | Process for metallising a through-hole printed circuit board by electroplating |
| DE4040226C2 (de) * | 1990-12-15 | 1994-09-29 | Hoellmueller Maschbau H | Verfahren zur Herstellung von durchkontaktierten Leiterplatten oder Mehrlagenleiterplatten (Multilayern) |
| DE4202337A1 (de) * | 1992-01-29 | 1993-08-05 | Bayer Ag | Verfahren zur durchkontaktierung von zweilagigen leiterplatten und multilayern |
| DE4227836C2 (de) * | 1992-08-20 | 1997-09-25 | Atotech Deutschland Gmbh | Verfahren zur Metallisierung von Nichtleitern |
| US5262041A (en) * | 1992-12-11 | 1993-11-16 | Shipley Company Inc. | Additive plating process |
| US5840363A (en) * | 1993-04-30 | 1998-11-24 | Grundig Ag | Process for throughplating printed circuit boards using conductive plastics |
| DE4314259C2 (de) * | 1993-04-30 | 1997-04-10 | Grundig Emv | Verfahren zur Durchkontaktierung von Leiterplatten mittels leitfähiger Kunststoffe zur direkten Metallisierung |
| US5532025A (en) * | 1993-07-23 | 1996-07-02 | Kinlen; Patrick J. | Corrosion inhibiting compositions |
| US5415762A (en) * | 1993-08-18 | 1995-05-16 | Shipley Company Inc. | Electroplating process and composition |
| DE4436391A1 (de) * | 1994-10-12 | 1996-04-18 | Bayer Ag | Verfahren zur direkten galvanischen Durchkontaktierung von zweilagigen Leiterplatten und Multilayern |
| EP0731192B2 (en) † | 1995-03-10 | 2003-01-02 | Shipley Company LLC | Electroplating process and composition |
| FR2737507B1 (fr) | 1995-08-04 | 1997-09-26 | Scps | Structures poreuses complexes metallisees ou metalliques, premetallisees par depot d'un polymere conducteur |
| DE19637018A1 (de) * | 1996-09-12 | 1998-03-19 | Bayer Ag | Verfahren zur Herstellung von starren und flexiblen Schaltungen |
| EP0905285B1 (en) * | 1997-02-03 | 2000-12-27 | Okuno Chemical Industries Co., Ltd. | Method for electroplating nonconductive material |
| US6117554A (en) * | 1997-05-30 | 2000-09-12 | Poly-Med, Inc. | Modulated molecularly bonded inherently conductive polymers on substrates with conjugated multiple lamellae and shaped articles thereof |
| US6303500B1 (en) | 1999-02-24 | 2001-10-16 | Micron Technology, Inc. | Method and apparatus for electroless plating a contact pad |
| AU4562900A (en) | 1999-05-20 | 2000-12-12 | Bayer Aktiengesellschaft | Method of producing pi-conjugated polymers |
| US20050045851A1 (en) * | 2003-08-15 | 2005-03-03 | Konarka Technologies, Inc. | Polymer catalyst for photovoltaic cell |
| JP2002151845A (ja) * | 2000-11-16 | 2002-05-24 | Hitachi Chem Co Ltd | めっき前処理方法 |
| DE10124631C1 (de) | 2001-05-18 | 2002-11-21 | Atotech Deutschland Gmbh | Verfahren zum direkten elektrolytischen Metallisieren von elektrisch nichtleiteitenden Substratoberflächen |
| US20030027930A1 (en) * | 2001-07-20 | 2003-02-06 | Stanley Bruckenstein | Polymer-matrix materials and methods for making same |
| US20060147616A1 (en) * | 2004-12-20 | 2006-07-06 | Russell Gaudiana | Polymer catalyst for photovoltaic cell |
| EP1870491B1 (de) * | 2006-06-22 | 2015-05-27 | Enthone, Inc. | Verbessertes Verfahren zur Direktmetallisierung von elektrisch nicht leitfähigen Substratoberflächen, insbesondere Polyimidoberflächen |
| ATE549437T1 (de) * | 2006-09-07 | 2012-03-15 | Enthone | Abscheidung eines leitfähigen polymers und metallisierung eines nicht-leitenden substrats |
| US8366901B2 (en) * | 2006-09-07 | 2013-02-05 | Enthone Inc. | Deposition of conductive polymer and metallization of non-conductive substrates |
| EP1897974B1 (en) * | 2006-09-07 | 2012-08-01 | Enthone Inc. | Deposition of conductive polymer and metallization of non-conductive substrates |
| PT1988192E (pt) | 2007-05-03 | 2013-01-24 | Atotech Deutschland Gmbh | Processo para aplicação de um revestimento metálico a um substrato não condutor |
| EP2305856A1 (en) | 2009-09-28 | 2011-04-06 | ATOTECH Deutschland GmbH | Process for applying a metal coating to a non-conductive substrate |
| TR201802555T4 (tr) | 2010-10-29 | 2018-03-21 | Macdermid Enthone Inc | Dielektrik substratlar üzerine iletken polimerlerin depo edilmesine yönelik bileşim ve yöntem. |
| WO2016116876A1 (en) | 2015-01-20 | 2016-07-28 | Enthone Inc. | Compositions including a high molecular weight acid suitable for conductive polymer formation on dielectric substrates |
| EP2602357A1 (en) | 2011-12-05 | 2013-06-12 | Atotech Deutschland GmbH | Novel adhesion promoting agents for metallization of substrate surfaces |
| CN104204294B (zh) * | 2012-03-29 | 2018-12-07 | 德国艾托特克公司 | 促进介电衬底与金属层之间粘着度的方法 |
| EP2644744A1 (en) | 2012-03-29 | 2013-10-02 | Atotech Deutschland GmbH | Method for promoting adhesion between dielectric substrates and metal layers |
| CN104018196A (zh) * | 2013-02-28 | 2014-09-03 | 武汉孟鼎电化学技术有限公司 | 印制线路板无化学镀直接电镀方法 |
| US10151035B2 (en) * | 2016-05-26 | 2018-12-11 | Rohm And Haas Electronic Materials Llc | Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts |
| CN107723764A (zh) * | 2017-10-31 | 2018-02-23 | 电子科技大学 | 一种在绝缘基材上直接电镀的方法 |
| JP6566064B1 (ja) * | 2018-03-06 | 2019-08-28 | 栗田工業株式会社 | ポリフェニレンサルファイド樹脂表面の処理方法 |
| JP6540843B1 (ja) * | 2018-03-06 | 2019-07-10 | 栗田工業株式会社 | ポリプロピレン樹脂の親水化処理方法 |
| WO2022153995A1 (ja) * | 2021-01-14 | 2022-07-21 | 長野県 | 酸化還元反応により導電性を示す下地導電層用材料並びにそれを用いた製造プロセス、デバイス、めっき品、めっき品の製造方法及びコーティング液 |
| CN115613019B (zh) * | 2022-09-29 | 2024-08-09 | 南京科润工业介质股份有限公司 | 一种适用于全自动称量包装机分装的工件用余热发黑液 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1381243A (en) * | 1972-02-18 | 1975-01-22 | Kollmorgen Corp | Method for metallizing substrates |
| EP0206133B1 (de) * | 1985-06-12 | 1991-07-31 | BASF Aktiengesellschaft | Verwendung von Polypyrrol zur Abscheidung von metallischem Kupfer auf elektrisch nichtleitende Materialen |
| DE3520980A1 (de) * | 1985-06-12 | 1986-12-18 | Basf Ag, 6700 Ludwigshafen | Verfahren zum aufbringen einer schicht aus elektrisch leitfaehigen polymeren auf andere werkstoffe |
| JPS6223195A (ja) * | 1985-07-23 | 1987-01-31 | 日本写真印刷株式会社 | 導電性回路基板とその製造法 |
| JPS62136709A (ja) * | 1985-12-09 | 1987-06-19 | 三井東圧化学株式会社 | 導電性パタ−ンの形成方法 |
| IL82764A0 (en) * | 1986-06-06 | 1987-12-20 | Advanced Plating Technology Ap | Selective plating process for the electrolytic coating of circuit boards |
-
1989
- 1989-03-01 US US07/573,042 patent/US5194313A/en not_active Expired - Lifetime
- 1989-03-01 EP EP89902779A patent/EP0402381B1/en not_active Expired - Lifetime
- 1989-03-01 KR KR1019890702015A patent/KR960014476B1/ko not_active IP Right Cessation
- 1989-03-01 WO PCT/EP1989/000204 patent/WO1989008375A1/en active IP Right Grant
- 1989-03-01 DE DE68918085T patent/DE68918085T2/de not_active Expired - Lifetime
- 1989-03-01 AU AU31891/89A patent/AU622650B2/en not_active Ceased
- 1989-03-01 AT AT89902779T patent/ATE111294T1/de not_active IP Right Cessation
- 1989-03-01 JP JP50257289A patent/JP2657423B2/ja not_active Expired - Lifetime
- 1989-03-02 CA CA 592628 patent/CA1315417C/en not_active Expired - Fee Related
-
1990
- 1990-08-16 DK DK901960A patent/DK170690B1/da not_active IP Right Cessation
- 1990-08-31 FI FI904312A patent/FI111509B/fi not_active IP Right Cessation
- 1990-08-31 RU SU904831199A patent/RU1816344C/ru active
- 1990-09-03 BG BG9278490A patent/BG51470A3/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO1989008375A1 (en) | 1989-09-08 |
| EP0402381B1 (en) | 1994-09-07 |
| EP0402381A1 (en) | 1990-12-19 |
| DK170690B1 (da) | 1995-12-04 |
| AU622650B2 (en) | 1992-04-16 |
| JPH05506125A (ja) | 1993-09-02 |
| DE68918085D1 (de) | 1994-10-13 |
| JP2657423B2 (ja) | 1997-09-24 |
| DK196090D0 (da) | 1990-08-16 |
| US5194313A (en) | 1993-03-16 |
| BG51470A3 (en) | 1993-05-14 |
| KR960014476B1 (ko) | 1996-10-15 |
| KR900701145A (ko) | 1990-08-17 |
| AU3189189A (en) | 1989-09-22 |
| FI904312A0 (fi) | 1990-08-31 |
| DK196090A (da) | 1990-08-16 |
| DE68918085T2 (de) | 1995-01-26 |
| ATE111294T1 (de) | 1994-09-15 |
| RU1816344C (ru) | 1993-05-15 |
| CA1315417C (en) | 1993-03-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG | Patent granted |
Owner name: BLASBERG OBERFLAECHENTECHNIK GMBH |
|
| MA | Patent expired |