JP6540843B1 - ポリプロピレン樹脂の親水化処理方法 - Google Patents
ポリプロピレン樹脂の親水化処理方法 Download PDFInfo
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- JP6540843B1 JP6540843B1 JP2018039480A JP2018039480A JP6540843B1 JP 6540843 B1 JP6540843 B1 JP 6540843B1 JP 2018039480 A JP2018039480 A JP 2018039480A JP 2018039480 A JP2018039480 A JP 2018039480A JP 6540843 B1 JP6540843 B1 JP 6540843B1
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- Prior art keywords
- polypropylene resin
- persulfate
- solution
- concentration
- treatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
Abstract
Description
まず、ヨウ素滴定により処理液(過硫酸塩の溶液S)中に含まれる全酸化剤濃度を測定する。このヨウ素滴定とは、過硫酸塩の溶液Sにヨウ化カリウム(KI)を加えてヨウ素(I2)を遊離させ、このI2をチオ硫酸ナトリウム標準溶液で滴定してI2の量を求め、そのI2の量から酸化剤濃度を求めるものである。次に、過硫酸塩の溶液Sの過酸化水素濃度のみを過マンガン酸カリウム滴定により求め、ヨウ素滴定値から過マンガン酸カリウム滴定値を差し引くことにより過硫酸濃度を算出した。
過硫酸塩の溶液Sにより親水化処理されたポリプロピレン樹脂板7に対し、下記表1に示す流れでめっき処理を施し、密着性試験用サンプルとした。
図1に示す装置を用いて、ポリプロピレン樹脂板7の表面処理を行った。処理槽2の仕様及び条件は次の通りである。
処理槽2の容積:40L
ポリプロピレン樹脂板7の大きさ:500mm×500mm×厚さ5mm
<過硫酸塩の溶液Sの性状と表面処理条件>
硫酸濃度:92wt%
過硫酸濃度:10g/L
処理温度:120℃
処理時間:60分
表面処理条件を表2に示すように種々設定を変更したこと以外は実施例1と同様にしてクロムめっきを施し、めっきの密着性を評価した。結果を親水化処理条件とともに表2にあわせて示す。
過硫酸塩溶液の代わりに、硫酸濃度92wt%の硫酸溶液を用いた以外は実施例1と同様にしてクロムめっきを施し、めっきの密着性を評価した。結果を処理条件とともに表2にあわせて示す。
2 処理槽
3 恒温ヒータ
4 配管
5 ポンプ
6 供給槽
7 ポリプロピレン樹脂板
S,S1 過硫酸塩の溶液
Claims (3)
- めっきの前処理としてのポリプロピレン樹脂の親水化処理方法であって、ポリプロピレン樹脂を、過硫酸塩を溶解した硫酸濃度が75〜98wt%で過硫酸濃度が2g/L以上のクロム及びマンガンフリーの溶液で処理し、前記過硫酸塩を溶解した溶液の温度が80〜130℃である、ポリプロピレン樹脂の親水化処理方法。
- 前記過硫酸塩を溶解した溶液に該過硫酸塩以外の無機塩を溶解した混合溶液を用いる、請求項1に記載のポリプロピレン樹脂の親水化処理方法。
- 前記過硫酸塩を溶解した溶液を貯留しポリプロピレン樹脂を処理するための処理槽と、該処理槽内に過硫酸塩を溶解した溶液を供給する過硫酸塩溶液貯槽と、前記処理槽を加熱する恒温ヒータとを備えた処理装置の前記処理槽にポリプロピレン樹脂を浸漬し、該ポリプロピレン樹脂の表面を処理する、請求項1又は2に記載のポリプロピレン樹脂の親水化処理方法。
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JP2018039480A JP6540843B1 (ja) | 2018-03-06 | 2018-03-06 | ポリプロピレン樹脂の親水化処理方法 |
PCT/JP2019/000140 WO2019171741A1 (ja) | 2018-03-06 | 2019-01-08 | ポリプロピレン樹脂の親水化処理方法 |
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JP2018039480A JP6540843B1 (ja) | 2018-03-06 | 2018-03-06 | ポリプロピレン樹脂の親水化処理方法 |
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JP6540843B1 true JP6540843B1 (ja) | 2019-07-10 |
JP2019151905A JP2019151905A (ja) | 2019-09-12 |
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WO (1) | WO2019171741A1 (ja) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS53112229A (en) * | 1977-02-08 | 1978-09-30 | Mitsubishi Gas Chem Co Inc | Partial electroless plating method |
ATE111294T1 (de) * | 1988-03-03 | 1994-09-15 | Blasberg Oberflaechentech | Gedruckte schaltplatte mit metallisierten löchern und deren herstellung. |
JP2007100174A (ja) * | 2005-10-05 | 2007-04-19 | Okuno Chem Ind Co Ltd | スチレン系樹脂成形体へのめっき用前処理方法 |
US8394289B2 (en) * | 2006-04-18 | 2013-03-12 | Okuno Chemicals Industries Co., Ltd. | Composition for etching treatment of resin molded article |
EP1870491B1 (de) * | 2006-06-22 | 2015-05-27 | Enthone, Inc. | Verbessertes Verfahren zur Direktmetallisierung von elektrisch nicht leitfähigen Substratoberflächen, insbesondere Polyimidoberflächen |
JP2011162806A (ja) * | 2010-02-04 | 2011-08-25 | Rohm & Haas Denshi Zairyo Kk | 無電解めっきを行うための前処理液 |
JP2017101304A (ja) * | 2015-12-04 | 2017-06-08 | 株式会社Jcu | 樹脂表面のエッチング方法およびこれを利用した樹脂へのめっき方法 |
JP6750293B2 (ja) * | 2016-04-28 | 2020-09-02 | 栗田工業株式会社 | プラスチック表面の処理方法 |
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JP2019151905A (ja) | 2019-09-12 |
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