JP6566064B1 - ポリフェニレンサルファイド樹脂表面の処理方法 - Google Patents
ポリフェニレンサルファイド樹脂表面の処理方法 Download PDFInfo
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- JP6566064B1 JP6566064B1 JP2018039481A JP2018039481A JP6566064B1 JP 6566064 B1 JP6566064 B1 JP 6566064B1 JP 2018039481 A JP2018039481 A JP 2018039481A JP 2018039481 A JP2018039481 A JP 2018039481A JP 6566064 B1 JP6566064 B1 JP 6566064B1
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- persulfate
- polyphenylene sulfide
- sulfide resin
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
Description
まず、ヨウ素滴定により処理液(過硫酸塩の溶液S)中に含まれる全酸化剤濃度を測定する。このヨウ素滴定とは、過硫酸塩の溶液Sにヨウ化カリウム(KI)を加えてヨウ素(I2)を遊離させ、このI2をチオ硫酸ナトリウム標準溶液で滴定してI2の量を求め、そのI2の量から酸化剤濃度を求めるものである。次に、過硫酸塩の溶液Sの過酸化水素濃度のみを過マンガン酸カリウム滴定により求め、ヨウ素滴定値から過マンガン酸カリウム滴定値を差し引くことにより過硫酸濃度を算出した。
過硫酸塩の溶液Sにより親水化処理されたPPS樹脂板7に対し、下記表1に示す流れでめっき処理を施し、密着性試験用サンプルとした。
図1に示す装置を用いて、PPS樹脂板7の表面処理を行った。処理槽2の仕様及び条件は次の通りである。
処理槽2の容積:40L
PPS樹脂板7の大きさ:500mm×500mm×厚さ5mm
<過硫酸塩の溶液Sの性状と表面処理条件>
硫酸濃度:75wt%
過硫酸濃度:10g/L
処理温度:30℃
処理時間:10分
表面処理条件を表2に示すように種々設定を変更したこと以外は実施例1と同様にしてクロムめっきを施し、めっきの密着性を評価した。結果を親水化処理条件とともに表2にあわせて示す。
過硫酸塩溶液の代わりに、硫酸濃度75wt%の硫酸溶液を用いた以外は実施例1と同様にしてクロムめっきを施し、めっきの密着性を評価した。結果を処理条件とともに表2にあわせて示す。
2 処理槽
3 恒温ヒータ
4 配管
5 ポンプ
6 供給槽
7 ポリフェニレンサルファイド樹脂板
S,S1 過硫酸塩の溶液
Claims (3)
- めっきの前処理としてのポリフェニレンサルファイド樹脂表面の処理方法であって、ポリフェニレンサルファイド樹脂を、過硫酸塩を溶解した硫酸濃度が55〜90wt%で過硫酸濃度が2g/L以上のクロム及びマンガンフリーの溶液で処理し、前記過硫酸塩を溶解した溶液の温度が20〜80℃である、ポリフェニレンサルファイド樹脂表面の処理方法。
- 前記過硫酸塩を溶解した溶液に該過硫酸塩以外の無機塩を溶解した混合溶液を用いる、請求項1に記載のポリフェニレンサルファイド樹脂表面の処理方法。
- 前記過硫酸塩を溶解した溶液を貯留しポリフェニレンサルファイド樹脂を処理するための処理槽と、該処理槽内に過硫酸塩を溶解した溶液を供給する過硫酸塩溶液貯槽と、前記処理槽を加熱する恒温ヒータとを備えた処理装置の前記処理槽にポリフェニレンサルファイド樹脂を浸漬し、該ポリフェニレンサルファイド樹脂の表面を処理する、請求項1又は2に記載のポリフェニレンサルファイド樹脂表面の処理方法。
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JP2018039481A JP6566064B1 (ja) | 2018-03-06 | 2018-03-06 | ポリフェニレンサルファイド樹脂表面の処理方法 |
PCT/JP2019/000141 WO2019171742A1 (ja) | 2018-03-06 | 2019-01-08 | ポリフェニレンサルファイド樹脂表面の処理方法 |
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JP2019151906A JP2019151906A (ja) | 2019-09-12 |
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JP7484389B2 (ja) * | 2020-04-28 | 2024-05-16 | 栗田工業株式会社 | 樹脂成形体のエッチング方法及び樹脂成形体用エッチング処理システム |
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JPS53112229A (en) * | 1977-02-08 | 1978-09-30 | Mitsubishi Gas Chem Co Inc | Partial electroless plating method |
CA1267350A (en) * | 1985-08-22 | 1990-04-03 | Union Carbide Corporation | Treatment of drilled copper clad thermoplastic laminates using concentrated sulfuric acid |
ATE111294T1 (de) * | 1988-03-03 | 1994-09-15 | Blasberg Oberflaechentech | Gedruckte schaltplatte mit metallisierten löchern und deren herstellung. |
JP2007100174A (ja) * | 2005-10-05 | 2007-04-19 | Okuno Chem Ind Co Ltd | スチレン系樹脂成形体へのめっき用前処理方法 |
JP5177426B2 (ja) * | 2006-04-18 | 2013-04-03 | 奥野製薬工業株式会社 | 樹脂成形体に対するエッチング処理用組成物 |
EP1870491B1 (de) * | 2006-06-22 | 2015-05-27 | Enthone, Inc. | Verbessertes Verfahren zur Direktmetallisierung von elektrisch nicht leitfähigen Substratoberflächen, insbesondere Polyimidoberflächen |
JP2017101304A (ja) * | 2015-12-04 | 2017-06-08 | 株式会社Jcu | 樹脂表面のエッチング方法およびこれを利用した樹脂へのめっき方法 |
JP6750293B2 (ja) * | 2016-04-28 | 2020-09-02 | 栗田工業株式会社 | プラスチック表面の処理方法 |
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