ES8606525A1 - Procedimiento y aparato de chapado o ataque quimico de un substrato utilizando un liquido de tratamiento y un haz energetico, tal como un laser. - Google Patents
Procedimiento y aparato de chapado o ataque quimico de un substrato utilizando un liquido de tratamiento y un haz energetico, tal como un laser.Info
- Publication number
- ES8606525A1 ES8606525A1 ES533329A ES533329A ES8606525A1 ES 8606525 A1 ES8606525 A1 ES 8606525A1 ES 533329 A ES533329 A ES 533329A ES 533329 A ES533329 A ES 533329A ES 8606525 A1 ES8606525 A1 ES 8606525A1
- Authority
- ES
- Spain
- Prior art keywords
- substrate
- additive
- chemical process
- laser beam
- subtractive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/024—Electroplating of selected surface areas using locally applied electromagnetic radiation, e.g. lasers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/026—Electroplating of selected surface areas using locally applied jets of electrolyte
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/14—Etching locally
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Electroplating Methods And Accessories (AREA)
- ing And Chemical Polishing (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
- Chemically Coating (AREA)
- Weting (AREA)
Abstract
PROCEDIMIENTO Y APARATO DE CHAPADO O ATAQUE QUIMICO DE UN SUSTRATO UTILIZANDO UN LIQUIDO DE TRATAMIENTO Y UN HAZ ENERGETICO, TAL COMO UN LASER. CONSISTE EN DIRIGIR EL HAZ DE ENERGIA HACIA EL SUSTRATO PARA CALENTAR UN PUNTO DEL MISMO, HACIA EL CUAL SE DIRIGE SIMULTANEAMENTE UN CHORRO DEL LIQUIDO DE TRATAMIENTO, SIENDO COLINEALES EL HAZ Y EL CHORRO, EN EL CUAL EL DIAMETRO DEL HAZ Y EL DIAMETRO DEL CHORRO SON SIMILARES Y EL CHORRO ACTUA COMO GUIA DE ONDAS PARA EL HAZ. CONSTA DE: UNA BOQUILLA (20) DE CHORRO (21) PARA EMITIRLO HACIA EL SUSTRATO; UNA LENTE (43) QUE ENFOCA EL HAZ (44) DE ENERGIA EN EL CENTRO DE LA BOQUILLA DE CHORRO, PROPAGANDOSE EL HAZ DE ENERGIA A TRAVES DE LA LENTE Y LA BOQUILLA DE CHORRO HACIA EL SUSTRATO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/504,016 US4497692A (en) | 1983-06-13 | 1983-06-13 | Laser-enhanced jet-plating and jet-etching: high-speed maskless patterning method |
Publications (2)
Publication Number | Publication Date |
---|---|
ES533329A0 ES533329A0 (es) | 1986-04-01 |
ES8606525A1 true ES8606525A1 (es) | 1986-04-01 |
Family
ID=24004519
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES533329A Expired ES8606525A1 (es) | 1983-06-13 | 1984-06-12 | Procedimiento y aparato de chapado o ataque quimico de un substrato utilizando un liquido de tratamiento y un haz energetico, tal como un laser. |
Country Status (8)
Country | Link |
---|---|
US (1) | US4497692A (es) |
EP (1) | EP0128401B1 (es) |
JP (1) | JPS6122633A (es) |
AT (1) | ATE31087T1 (es) |
CA (1) | CA1259947A (es) |
DE (1) | DE3467779D1 (es) |
ES (1) | ES8606525A1 (es) |
IE (1) | IE55633B1 (es) |
Families Citing this family (61)
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---|---|---|---|---|
EP0261296B1 (fr) * | 1986-09-25 | 1992-07-22 | Laude, Lucien Diégo | Appareillage pour le dépôt électrolytique ponctuel assisté par laser de métaux sur des solides |
JPH01149324A (ja) * | 1987-12-04 | 1989-06-12 | Yazaki Corp | 高圧ケーブルの製造方法 |
JP2585784B2 (ja) * | 1989-02-03 | 1997-02-26 | 株式会社東芝 | 自動現像装置および方法 |
US5292418A (en) * | 1991-03-08 | 1994-03-08 | Mitsubishi Denki Kabushiki Kaisha | Local laser plating apparatus |
JP2896726B2 (ja) * | 1992-03-30 | 1999-05-31 | セイコーインスツルメンツ株式会社 | 微細加工装置 |
DE4229399C2 (de) * | 1992-09-03 | 1999-05-27 | Deutsch Zentr Luft & Raumfahrt | Verfahren und Vorrichtung zum Herstellen einer Funktionsstruktur eines Halbleiterbauelements |
DE4408660A1 (de) * | 1993-10-26 | 1995-04-27 | Bayer Ag | Mischungen mit selbstschmierenden Eigenschaften |
US5641391A (en) * | 1995-05-15 | 1997-06-24 | Hunter; Ian W. | Three dimensional microfabrication by localized electrodeposition and etching |
US5536388A (en) * | 1995-06-02 | 1996-07-16 | International Business Machines Corporation | Vertical electroetch tool nozzle and method |
US6284108B1 (en) | 1998-08-31 | 2001-09-04 | Louis DiFrancesco | Method and apparatus for momentum plating |
US8110247B2 (en) * | 1998-09-30 | 2012-02-07 | Optomec Design Company | Laser processing for heat-sensitive mesoscale deposition of oxygen-sensitive materials |
US20050156991A1 (en) * | 1998-09-30 | 2005-07-21 | Optomec Design Company | Maskless direct write of copper using an annular aerosol jet |
US7294366B2 (en) * | 1998-09-30 | 2007-11-13 | Optomec Design Company | Laser processing for heat-sensitive mesoscale deposition |
US7938079B2 (en) * | 1998-09-30 | 2011-05-10 | Optomec Design Company | Annular aerosol jet deposition using an extended nozzle |
US6636676B1 (en) * | 1998-09-30 | 2003-10-21 | Optomec Design Company | Particle guidance system |
US7045015B2 (en) | 1998-09-30 | 2006-05-16 | Optomec Design Company | Apparatuses and method for maskless mesoscale material deposition |
US7108894B2 (en) * | 1998-09-30 | 2006-09-19 | Optomec Design Company | Direct Write™ System |
US20030020768A1 (en) * | 1998-09-30 | 2003-01-30 | Renn Michael J. | Direct write TM system |
US20010054706A1 (en) * | 1999-07-19 | 2001-12-27 | Joseph A. Levert | Compositions and processes for spin etch planarization |
DE19963824A1 (de) * | 1999-12-30 | 2001-07-19 | Wacker Siltronic Halbleitermat | Verfahren und Vorrichtung zum Bearbeiten von Halbleitermaterial |
KR100790621B1 (ko) * | 2000-06-13 | 2007-12-31 | 엘리먼트 씩스 (프로덕션) (피티와이) 리미티드 | 복합 다이아몬드 콤팩트 |
US6699356B2 (en) | 2001-08-17 | 2004-03-02 | Applied Materials, Inc. | Method and apparatus for chemical-mechanical jet etching of semiconductor structures |
US6683277B1 (en) * | 2002-12-20 | 2004-01-27 | Osram Opto Semiconductors | Laser ablation nozzle assembly |
JP4521228B2 (ja) * | 2003-07-28 | 2010-08-11 | 正也 市村 | 光析出による金メッキ法及び金メッキ膜形成装置 |
US20080013299A1 (en) * | 2004-12-13 | 2008-01-17 | Optomec, Inc. | Direct Patterning for EMI Shielding and Interconnects Using Miniature Aerosol Jet and Aerosol Jet Array |
US7938341B2 (en) * | 2004-12-13 | 2011-05-10 | Optomec Design Company | Miniature aerosol jet and aerosol jet array |
US7674671B2 (en) | 2004-12-13 | 2010-03-09 | Optomec Design Company | Aerodynamic jetting of aerosolized fluids for fabrication of passive structures |
US8529738B2 (en) * | 2005-02-08 | 2013-09-10 | The Trustees Of Columbia University In The City Of New York | In situ plating and etching of materials covered with a surface film |
US8496799B2 (en) * | 2005-02-08 | 2013-07-30 | The Trustees Of Columbia University In The City Of New York | Systems and methods for in situ annealing of electro- and electroless platings during deposition |
KR20080005947A (ko) * | 2005-04-08 | 2008-01-15 | 더 트러스티스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 | 도금조 및 에칭조를 모니터링하기 위한 시스템 및 방법 |
JP4844715B2 (ja) * | 2005-08-25 | 2011-12-28 | 澁谷工業株式会社 | ハイブリッドレーザ加工装置 |
WO2007027907A2 (en) * | 2005-09-02 | 2007-03-08 | The Trustees Of Columbia University In The City Of New York | A system and method for obtaining anisotropic etching of patterned substrates |
CN100414002C (zh) * | 2005-10-10 | 2008-08-27 | 上海工程技术大学 | 高速电喷镀装置 |
US20070154634A1 (en) * | 2005-12-15 | 2007-07-05 | Optomec Design Company | Method and Apparatus for Low-Temperature Plasma Sintering |
DE102006003606A1 (de) * | 2006-01-25 | 2007-07-26 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zum Strukturieren einer Oberflächenschicht |
JP5017882B2 (ja) * | 2006-02-22 | 2012-09-05 | 澁谷工業株式会社 | ハイブリッドレーザ加工方法 |
DE102006030588A1 (de) * | 2006-07-03 | 2008-01-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Flüssigkeitsstrahlgeführtes Ätzverfahren zum Materialabtrag an Festkörpern sowie dessen Verwendung |
CN100388997C (zh) * | 2006-09-18 | 2008-05-21 | 南京航空航天大学 | 喷射液束电解-激光复合加工方法及其装置 |
JP5185948B2 (ja) * | 2006-12-06 | 2013-04-17 | ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク | メッキ及びエッチング浴組成をスクリーニングするマイクロ流体システム及び方法 |
US8530784B2 (en) * | 2007-02-01 | 2013-09-10 | Orbotech Ltd. | Method and system of machining using a beam of photons |
US20100310630A1 (en) * | 2007-04-27 | 2010-12-09 | Technische Universitat Braunschweig | Coated surface for cell culture |
TWI482662B (zh) | 2007-08-30 | 2015-05-01 | Optomec Inc | 機械上一體式及緊密式耦合之列印頭以及噴霧源 |
TWI538737B (zh) * | 2007-08-31 | 2016-06-21 | 阿普托麥克股份有限公司 | 材料沉積總成 |
TW200918325A (en) * | 2007-08-31 | 2009-05-01 | Optomec Inc | AEROSOL JET® printing system for photovoltaic applications |
US8887658B2 (en) * | 2007-10-09 | 2014-11-18 | Optomec, Inc. | Multiple sheath multiple capillary aerosol jet |
FR2941156A1 (fr) * | 2009-01-19 | 2010-07-23 | Cummins Filtration | Dispositif de filtration pour liquide circulant dans un moteur ou un equipement hydraulique, comprenant des moyens de chauffage du liquide jouxtant les moyens de filtration |
JP4961468B2 (ja) * | 2009-10-29 | 2012-06-27 | 三星ダイヤモンド工業株式会社 | レーザー加工方法、被加工物の分割方法およびレーザー加工装置 |
US8985050B2 (en) * | 2009-11-05 | 2015-03-24 | The Trustees Of Columbia University In The City Of New York | Substrate laser oxide removal process followed by electro or immersion plating |
US9025285B1 (en) * | 2009-12-16 | 2015-05-05 | Magnecomp Corporation | Low resistance interface metal for disk drive suspension component grounding |
US9583125B1 (en) | 2009-12-16 | 2017-02-28 | Magnecomp Corporation | Low resistance interface metal for disk drive suspension component grounding |
JP5220914B2 (ja) * | 2011-05-25 | 2013-06-26 | 株式会社スギノマシン | レーザー加工装置 |
US8764515B2 (en) * | 2012-05-14 | 2014-07-01 | United Technologies Corporation | Component machining method and assembly |
CN103572341B (zh) * | 2013-09-23 | 2016-01-20 | 江苏大学 | 激光光管电极的电化学复合沉积制造方法与装置 |
CN103590080A (zh) * | 2013-11-28 | 2014-02-19 | 铜陵学院 | 一种激光强化喷射电沉积快速成形加工装置及方法 |
US8859988B1 (en) * | 2014-05-30 | 2014-10-14 | Jens Guenter Gaebelein | Method for coupling a laser beam into a liquid-jet |
US10092980B1 (en) | 2014-05-30 | 2018-10-09 | Avonisys Ag | Method for coupling a laser beam into a liquid-jet |
KR102444204B1 (ko) | 2015-02-10 | 2022-09-19 | 옵토멕 인코포레이티드 | 에어로졸의 비행 중 경화에 의해 3차원 구조를 제조하는 방법 |
DE102015224115B4 (de) * | 2015-12-02 | 2021-04-01 | Avonisys Ag | Laserstrahl-bearbeitungsvorrichtung mit einer einkoppelvorrichtung zum einkoppeln eines fokussierten laserstrahls in einen flüssigkeitsstrahl |
US10632746B2 (en) | 2017-11-13 | 2020-04-28 | Optomec, Inc. | Shuttering of aerosol streams |
EP3624571A1 (en) * | 2018-09-14 | 2020-03-18 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | A process for the manufacturing of printed conductive tracks on an object and 3d printed electronics |
CN113512741B (zh) * | 2020-04-10 | 2022-11-01 | 中国科学院宁波材料技术与工程研究所 | 激光冲击波辅助的电化学加工装置 |
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US2846346A (en) * | 1954-03-26 | 1958-08-05 | Philco Corp | Semiconductor device |
US2799637A (en) * | 1954-12-22 | 1957-07-16 | Philco Corp | Method for electrolytic etching |
US2930949A (en) * | 1956-09-25 | 1960-03-29 | Philco Corp | Semiconductive device and method of fabrication thereof |
US3039515A (en) * | 1959-02-24 | 1962-06-19 | Philco Corp | Fabrication of semiconductor devices |
US3345274A (en) * | 1964-04-22 | 1967-10-03 | Westinghouse Electric Corp | Method of making oxide film patterns |
US3486221A (en) * | 1967-06-14 | 1969-12-30 | Sprague Electric Co | High energy beam trimming of electrical components |
GB1242123A (en) * | 1968-11-12 | 1971-08-11 | Nat Res Dev | Improvements relating to a method and apparatus for laser beam cutting |
US3810829A (en) * | 1972-06-28 | 1974-05-14 | Nasa | Scanning nozzle plating system |
US4042006A (en) * | 1973-01-05 | 1977-08-16 | Siemens Aktiengesellschaft | Pyrolytic process for producing a band-shaped metal layer on a substrate |
US3965328A (en) * | 1974-12-19 | 1976-06-22 | Avco Corporation | Laser deep cutting process |
US4217183A (en) * | 1979-05-08 | 1980-08-12 | International Business Machines Corporation | Method for locally enhancing electroplating rates |
US4283259A (en) * | 1979-05-08 | 1981-08-11 | International Business Machines Corporation | Method for maskless chemical and electrochemical machining |
DE3111402A1 (de) * | 1980-03-25 | 1982-04-29 | Walter Winston Duley | "verfahren und vorrichtung zur laserstrahl-bearbeitung von werkstuecken" |
GB2074074B (en) * | 1980-04-17 | 1984-07-11 | Inoue Japax Res | Electrical discharge machining with controlled liquid machining medium flow |
EP0131367B1 (en) * | 1983-05-30 | 1989-04-05 | Inoue-Japax Research Incorporated | Method of and apparatus for machining ceramic materials |
-
1983
- 1983-06-13 US US06/504,016 patent/US4497692A/en not_active Expired - Lifetime
-
1984
- 1984-03-16 JP JP59049438A patent/JPS6122633A/ja active Granted
- 1984-05-11 CA CA000454199A patent/CA1259947A/en not_active Expired
- 1984-05-21 EP EP84105749A patent/EP0128401B1/en not_active Expired
- 1984-05-21 DE DE8484105749T patent/DE3467779D1/de not_active Expired
- 1984-05-21 AT AT84105749T patent/ATE31087T1/de active
- 1984-06-08 IE IE1438/84A patent/IE55633B1/en not_active IP Right Cessation
- 1984-06-12 ES ES533329A patent/ES8606525A1/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0128401A2 (en) | 1984-12-19 |
ATE31087T1 (de) | 1987-12-15 |
IE841438L (en) | 1984-12-13 |
JPS6122633A (ja) | 1986-01-31 |
US4497692A (en) | 1985-02-05 |
JPH0138372B2 (es) | 1989-08-14 |
ES533329A0 (es) | 1986-04-01 |
DE3467779D1 (en) | 1988-01-07 |
EP0128401A3 (en) | 1985-05-15 |
CA1259947A (en) | 1989-09-26 |
EP0128401B1 (en) | 1987-11-25 |
IE55633B1 (en) | 1990-12-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD1A | Patent lapsed |
Effective date: 19970401 |