ES540984A0 - Procedimiento para la produccion de imagenes - Google Patents
Procedimiento para la produccion de imagenesInfo
- Publication number
- ES540984A0 ES540984A0 ES540984A ES540984A ES540984A0 ES 540984 A0 ES540984 A0 ES 540984A0 ES 540984 A ES540984 A ES 540984A ES 540984 A ES540984 A ES 540984A ES 540984 A0 ES540984 A0 ES 540984A0
- Authority
- ES
- Spain
- Prior art keywords
- images
- procedure
- production
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0505—Double exposure of the same photosensitive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/135—Electrophoretic deposition of insulating material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/138—Corona discharge process
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Materials For Photolithography (AREA)
- Paints Or Removers (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Silver Salt Photography Or Processing Solution Therefor (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB848405958A GB8405958D0 (en) | 1984-03-07 | 1984-03-07 | Production of images |
GB848430376A GB8430376D0 (en) | 1984-12-01 | 1984-12-01 | Production of images |
Publications (2)
Publication Number | Publication Date |
---|---|
ES540984A0 true ES540984A0 (es) | 1986-04-16 |
ES8606679A1 ES8606679A1 (es) | 1986-04-16 |
Family
ID=26287427
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES540984A Expired ES8606679A1 (es) | 1984-03-07 | 1985-03-06 | Procedimiento para la produccion de imagenes |
Country Status (6)
Country | Link |
---|---|
US (1) | US4632900A (es) |
EP (1) | EP0155231B2 (es) |
JP (2) | JPH0685077B2 (es) |
CA (1) | CA1271660A (es) |
DE (1) | DE3586263D1 (es) |
ES (1) | ES8606679A1 (es) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0155231B2 (de) * | 1984-03-07 | 1997-01-15 | Ciba-Geigy Ag | Verfahren zur Herstellung von Abbildungen |
GB8430377D0 (en) * | 1984-12-01 | 1985-01-09 | Ciba Geigy Ag | Modified phenolic resins |
JPS61206293A (ja) * | 1985-03-08 | 1986-09-12 | 日本ペイント株式会社 | 回路板の製造方法 |
JPS62123444A (ja) | 1985-08-07 | 1987-06-04 | Japan Synthetic Rubber Co Ltd | ポジ型感放射線性樹脂組成物 |
US4732836A (en) * | 1986-05-02 | 1988-03-22 | Hoechst Celanese Corporation | Novel mixed ester O-quinone photosensitizers |
US4902785A (en) * | 1986-05-02 | 1990-02-20 | Hoechst Celanese Corporation | Phenolic photosensitizers containing quinone diazide and acidic halide substituents |
US4732837A (en) * | 1986-05-02 | 1988-03-22 | Hoechst Celanese Corporation | Novel mixed ester O-quinone photosensitizers |
US5162510A (en) * | 1986-05-02 | 1992-11-10 | Hoechst Celanese Corporation | Process for the preparation of photosensitive compositions containing a mixed ester o-quinone photosensitizer |
US5035976A (en) * | 1986-05-02 | 1991-07-30 | Hoechst Celanese Corporation | Photosensitive article having phenolic photosensitizers containing quinone diazide and acid halide substituents |
JPS6317592A (ja) * | 1986-07-09 | 1988-01-25 | 三菱電機株式会社 | プリント配線板の製造方法 |
US4751172A (en) * | 1986-08-01 | 1988-06-14 | Shipley Company Inc. | Process for forming metal images |
JPS6356918A (ja) * | 1986-08-27 | 1988-03-11 | Mitsubishi Electric Corp | 半導体素子の製造方法 |
EP0662636A3 (en) * | 1986-10-23 | 1995-11-22 | Ciba Geigy Ag | Imaging processes. |
US4857437A (en) * | 1986-12-17 | 1989-08-15 | Ciba-Geigy Corporation | Process for the formation of an image |
DE3701569A1 (de) * | 1987-01-21 | 1988-08-04 | Basf Ag | Copolymerisate mit o-nitrocarbinolestergruppierungen, deren verwendung sowie verfahren zur herstellung von halbleiterbauelementen |
GB8708747D0 (en) * | 1987-04-11 | 1987-05-20 | Ciba Geigy Ag | Formation of image |
JP2594053B2 (ja) * | 1987-05-13 | 1997-03-26 | 日本ペイント株式会社 | ポジ型感光性樹脂組成物 |
JP2608408B2 (ja) * | 1987-05-13 | 1997-05-07 | 日本ペイント株式会社 | ポジ型感光性樹脂組成物 |
DE3717652A1 (de) * | 1987-05-26 | 1988-12-08 | Hoechst Ag | Einstufiges elektrochemisches bilderzeugungsverfahren fuer reproduktionsschichten |
DE3717653A1 (de) * | 1987-05-26 | 1988-12-08 | Hoechst Ag | Verfahren zur selektiven additivkorrektur von fehlstellen in kopierschichten |
JPS6420694A (en) * | 1987-07-15 | 1989-01-24 | Kansai Paint Co Ltd | Manufacture of printed wiring board |
JPH07119374B2 (ja) * | 1987-11-06 | 1995-12-20 | 関西ペイント株式会社 | ポジ型感光性カチオン電着塗料組成物 |
JPH0234984A (ja) * | 1988-04-13 | 1990-02-05 | Mitsubishi Electric Corp | プリント回路基板の製造方法 |
JP2585070B2 (ja) * | 1988-08-02 | 1997-02-26 | 日本ペイント株式会社 | 画像形成方法 |
CA1334897C (en) * | 1988-08-02 | 1995-03-28 | Mamoru Seio | Electrodeposition coating composition and image-forming method using the same |
JP2804579B2 (ja) * | 1989-02-14 | 1998-09-30 | 関西ペイント株式会社 | ポジ型感光性電着塗料組成物及びこれを用いた回路板の製造方法 |
JP2721843B2 (ja) * | 1989-03-23 | 1998-03-04 | 関西ペイント株式会社 | プリント配線板の製造方法 |
JP2584672B2 (ja) * | 1989-04-28 | 1997-02-26 | 富士写真フイルム株式会社 | 感光性組成物 |
JPH02302092A (ja) * | 1989-05-16 | 1990-12-14 | Kansai Paint Co Ltd | プリント配線板の製造方法 |
JPH0353587A (ja) * | 1989-07-20 | 1991-03-07 | Nippon Paint Co Ltd | レジストパターンの形成方法 |
US5236810A (en) * | 1989-10-03 | 1993-08-17 | Kansai Paint Co., Ltd. | Process for preparing printed-circuit board |
US5232815A (en) * | 1989-12-15 | 1993-08-03 | W. R. Grace & Co.-Conn. | Autodeposition emulsion and methods of using thereof to selectively protect metallic surfaces |
EP0468002A4 (en) * | 1989-12-15 | 1995-08-09 | Grace W R & Co | Autodeposition emulsion for selectively protecting metallic surfaces |
US5508141A (en) * | 1989-12-15 | 1996-04-16 | W. R. Grace & Co.-Conn. | Autodeposition emulsion and methods of using thereof to selectively protect metallic surfaces |
EP0449022A3 (en) * | 1990-03-26 | 1992-03-11 | Shipley Company Inc. | Method of controlling photoresist film thickness and stability of an electrodeposition bath |
US5055164A (en) * | 1990-03-26 | 1991-10-08 | Shipley Company Inc. | Electrodepositable photoresists for manufacture of hybrid circuit boards |
JP2865147B2 (ja) * | 1990-06-20 | 1999-03-08 | 関西ペイント株式会社 | ポジ型感光性電着塗料組成物 |
JPH0465184A (ja) * | 1990-07-05 | 1992-03-02 | Kansai Paint Co Ltd | 電着前処理方法 |
CA2048164C (en) * | 1990-08-02 | 1998-11-10 | Kurt G. Olson | Photoimageable electrodepositable photoresist composition |
US5268256A (en) * | 1990-08-02 | 1993-12-07 | Ppg Industries, Inc. | Photoimageable electrodepositable photoresist composition for producing non-tacky films |
US5314789A (en) * | 1991-10-01 | 1994-05-24 | Shipley Company Inc. | Method of forming a relief image comprising amphoteric compositions |
JPH05287222A (ja) * | 1992-04-10 | 1993-11-02 | Kansai Paint Co Ltd | ポジ型感光性電着塗料組成物及びそれを用いる回路板の製造方法 |
US5384229A (en) * | 1992-05-07 | 1995-01-24 | Shipley Company Inc. | Photoimageable compositions for electrodeposition |
US5348843A (en) * | 1992-06-12 | 1994-09-20 | Permar Systems, Inc. | Method for making porcelain tags and signs by selectively radiating a frit containing-emulsion coating applied thereto |
US5314782A (en) * | 1993-03-05 | 1994-05-24 | Morton International, Inc. | Deep UV sensitive resistant to latent image decay comprising a diazonaphthoquinone sulfonate of a nitrobenzyl derivative |
US5308744A (en) * | 1993-03-05 | 1994-05-03 | Morton International, Inc. | Source of photochemically generated acids from diazonaphthoquinone sulfonates of nitrobenzyl derivatives |
US5449834A (en) * | 1994-07-13 | 1995-09-12 | Ppg Industries, Inc. | Method of synthesizing 2,6-dinitro benzyl compounds |
US5600035A (en) * | 1994-07-13 | 1997-02-04 | Ppg Industries, Inc. | Positive photoactive compounds based on 2,6-dinitro benzyl groups and 2,5-dinitro benzyl groups |
US5589553A (en) * | 1995-03-29 | 1996-12-31 | Shipley Company, L.L.C. | Esterification product of aromatic novolak resin with quinone diazide sulfonyl group |
US5721088A (en) * | 1995-12-20 | 1998-02-24 | Ppg Industries, Inc. | Electrodepositable photoimageable compositions with improved edge coverage |
US7090958B2 (en) * | 2003-04-11 | 2006-08-15 | Ppg Industries Ohio, Inc. | Positive photoresist compositions having enhanced processing time |
CA2837855C (en) | 2011-06-17 | 2021-01-19 | Henkel Ag & Co. Kgaa | Single bath autodeposition coating for combination metal substrates and methods therefor |
KR101852457B1 (ko) | 2015-11-12 | 2018-04-26 | 삼성에스디아이 주식회사 | 신규한 중합체를 포함하는 수지 조성물 및 이를 이용한 유기막 |
CN111247486A (zh) * | 2017-10-19 | 2020-06-05 | 富士胶片株式会社 | 电路基板的制造方法及触摸面板的制造方法 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1227602A (es) * | 1967-11-24 | 1971-04-07 | ||
DE1772976A1 (de) * | 1968-07-30 | 1971-08-12 | Teldix Gmbh | Fotomechanisches Verfahren zur Herstellung von Leiterplatten |
JPS505083B1 (es) * | 1970-09-16 | 1975-02-28 | ||
JPS505084B1 (es) * | 1970-09-16 | 1975-02-28 | ||
BE789196A (fr) * | 1971-09-25 | 1973-03-22 | Kalle Ag | Matiere a copier photosensible |
DE2150691C2 (de) * | 1971-10-12 | 1982-09-09 | Basf Ag, 6700 Ludwigshafen | Lichtempfindliches Gemisch und Verwendung eines lichtempfindlichen Gemisches zur Herstellung einer Flachdruckplatte |
US3738835A (en) * | 1971-10-21 | 1973-06-12 | Ibm | Electrophoretic photoresist composition and a method of forming etch resistant masks |
JPS5221526B2 (es) * | 1972-01-10 | 1977-06-11 | ||
JPS5344652B2 (es) * | 1972-05-29 | 1978-11-30 | ||
JPS505084A (es) * | 1972-08-26 | 1975-01-20 | ||
JPS5017827A (es) * | 1973-06-18 | 1975-02-25 | ||
JPS5024641A (es) * | 1973-07-09 | 1975-03-15 | ||
US4039414A (en) * | 1974-06-19 | 1977-08-02 | Scm Corporation | Ultraviolet curing of electrocoating compositions |
US3991033A (en) * | 1975-01-30 | 1976-11-09 | E. I. Du Pont De Nemours & Company | Photosensitive and degradable polyoxymethylene polymers and their application in imaging |
US4086210A (en) * | 1976-05-10 | 1978-04-25 | Eastman Kodak Company | Radiation sensitive polymeric o-nitrophenyl acetals |
US4080246A (en) * | 1976-06-29 | 1978-03-21 | Gaf Corporation | Novel etching composition and method for using same |
JPS5368577A (en) * | 1976-12-01 | 1978-06-19 | Hitachi Ltd | Removing method of positive type photo resist |
JPS54127575A (en) * | 1978-03-27 | 1979-10-03 | Nippon Electric Co | Method of producing hybrid thin film integrated circuit |
JPS55145491A (en) * | 1979-04-28 | 1980-11-13 | Sony Corp | Converter for color video signal |
JPS55148491A (en) * | 1979-05-09 | 1980-11-19 | Meidensha Electric Mfg Co Ltd | Method of fabricating printed circuit board |
DE2922746A1 (de) * | 1979-06-05 | 1980-12-11 | Basf Ag | Positiv arbeitendes schichtuebertragungsmaterial |
JPS561044A (en) * | 1979-06-16 | 1981-01-08 | Konishiroku Photo Ind Co Ltd | Photosensitive composition |
JPS562696A (en) * | 1979-06-21 | 1981-01-12 | Nippon Telegraph & Telephone | Circuit board |
DE2936019A1 (de) * | 1979-09-06 | 1981-04-02 | Robert Bosch Gmbh, 7000 Stuttgart | Elektrische maschine |
US4362853A (en) * | 1980-10-24 | 1982-12-07 | Ciba-Geigy Corporation | Resinous salts, their preparation, and their use in coatings |
US4414311A (en) * | 1982-03-18 | 1983-11-08 | American Hoechst Corporation | Cathodic deposition of light sensitive components |
EP0155231B2 (de) * | 1984-03-07 | 1997-01-15 | Ciba-Geigy Ag | Verfahren zur Herstellung von Abbildungen |
-
1985
- 1985-03-01 EP EP85810086A patent/EP0155231B2/de not_active Expired - Lifetime
- 1985-03-01 DE DE8585810086T patent/DE3586263D1/de not_active Expired - Lifetime
- 1985-03-05 CA CA000475738A patent/CA1271660A/en not_active Expired
- 1985-03-06 ES ES540984A patent/ES8606679A1/es not_active Expired
- 1985-03-07 JP JP60045713A patent/JPH0685077B2/ja not_active Expired - Fee Related
- 1985-03-07 US US06/708,998 patent/US4632900A/en not_active Expired - Lifetime
-
1993
- 1993-05-12 JP JP5134070A patent/JP2899776B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CA1271660A (en) | 1990-07-17 |
ES8606679A1 (es) | 1986-04-16 |
JPH06188540A (ja) | 1994-07-08 |
JP2899776B2 (ja) | 1999-06-02 |
JPH0685077B2 (ja) | 1994-10-26 |
US4632900A (en) | 1986-12-30 |
DE3586263D1 (de) | 1992-08-06 |
JPS60207139A (ja) | 1985-10-18 |
EP0155231A3 (en) | 1988-01-20 |
EP0155231A2 (de) | 1985-09-18 |
EP0155231B1 (de) | 1992-07-01 |
EP0155231B2 (de) | 1997-01-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC1A | Transfer granted |