ES511549A0 - Metodo para imprimir circuitos electricamente funcionales sobre un substrato electricamenteaislante. - Google Patents

Metodo para imprimir circuitos electricamente funcionales sobre un substrato electricamenteaislante.

Info

Publication number
ES511549A0
ES511549A0 ES511549A ES511549A ES511549A0 ES 511549 A0 ES511549 A0 ES 511549A0 ES 511549 A ES511549 A ES 511549A ES 511549 A ES511549 A ES 511549A ES 511549 A0 ES511549 A0 ES 511549A0
Authority
ES
Spain
Prior art keywords
activated
foil
conductive layer
bonding
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES511549A
Other languages
English (en)
Other versions
ES8307437A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Irion and Vosseler Zaehlerfabrik GmbH and Co
IVO Irion and Vosseler Zahlerfabrik GmbH and Co
Original Assignee
Irion and Vosseler Zaehlerfabrik GmbH and Co
IVO Irion and Vosseler Zahlerfabrik GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Irion and Vosseler Zaehlerfabrik GmbH and Co, IVO Irion and Vosseler Zahlerfabrik GmbH and Co filed Critical Irion and Vosseler Zaehlerfabrik GmbH and Co
Publication of ES511549A0 publication Critical patent/ES511549A0/es
Publication of ES8307437A1 publication Critical patent/ES8307437A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S283/00—Printed matter
    • Y10S283/904—Credit card
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/913—Material designed to be responsive to temperature, light, moisture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/914—Transfer or decalcomania
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1405—Capsule or particulate matter containing [e.g., sphere, flake, microballoon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24967—Absolute thicknesses specified
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y10T428/2817—Heat sealable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Decoration By Transfer Pictures (AREA)
  • Printing Methods (AREA)
  • Wrappers (AREA)
  • Laminated Bodies (AREA)
  • Surface Heating Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Chemically Coating (AREA)
  • Materials For Medical Uses (AREA)
ES511549A 1981-04-22 1982-04-20 Metodo para imprimir circuitos electricamente funcionales sobre un substrato electricamenteaislante. Expired ES8307437A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19813116078 DE3116078A1 (de) 1981-04-22 1981-04-22 "praegefolie"

Publications (2)

Publication Number Publication Date
ES511549A0 true ES511549A0 (es) 1983-07-01
ES8307437A1 ES8307437A1 (es) 1983-07-01

Family

ID=6130633

Family Applications (2)

Application Number Title Priority Date Filing Date
ES511549A Expired ES8307437A1 (es) 1981-04-22 1982-04-20 Metodo para imprimir circuitos electricamente funcionales sobre un substrato electricamenteaislante.
ES1983270134U Expired ES270134Y (es) 1981-04-22 1983-02-01 Hoja metalica fina.

Family Applications After (1)

Application Number Title Priority Date Filing Date
ES1983270134U Expired ES270134Y (es) 1981-04-22 1983-02-01 Hoja metalica fina.

Country Status (8)

Country Link
US (1) US4495232A (es)
EP (1) EP0063347B1 (es)
JP (1) JPS57193092A (es)
AT (1) ATE14495T1 (es)
BR (1) BR8202292A (es)
DE (2) DE3116078A1 (es)
ES (2) ES8307437A1 (es)
ZA (1) ZA821880B (es)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3145721A1 (de) * 1981-11-19 1983-05-26 Helmuth 2058 Lauenburg Schmoock Verfahren zum herstellen von gedruckten schaltungen
US4687680A (en) * 1983-12-28 1987-08-18 Oike Industrial Co., Ltd. Stamping foil
IL73386A0 (en) * 1984-01-09 1985-01-31 Stauffer Chemical Co Transfer laminate and method of forming an electrical circuit pattern therewith
DE3430111C1 (de) * 1984-08-16 1985-10-24 Leonhard Kurz GmbH & Co, 8510 Fürth Folie,insbesondere Heisspraegefolie,mit einer dekorativen Metallschicht und Verfahren zu deren Herstellung
US4892602A (en) * 1986-08-19 1990-01-09 Oike Industrial Co., Ltd. Heat-sensitive transfer medium
EP0263478B1 (en) * 1986-10-07 1993-03-03 Oike Industrial Co., Ltd. Heat-sensitive transfer medium
JPS63160295A (ja) * 1986-12-23 1988-07-04 凸版印刷株式会社 電気回路の形成方法
DE3708368C1 (en) * 1987-03-14 1988-10-27 Irion & Vosseler Process for the production of a stamping tool
US5026584A (en) * 1987-05-29 1991-06-25 Gerber Scientific Products, Inc. Sign making web with dry adhesive layer
US5063658A (en) * 1987-07-08 1991-11-12 Leonard Kurz Gmbh & Co. Embossing foil and a method of making
JPH0754780B2 (ja) * 1987-08-10 1995-06-07 株式会社村田製作所 積層セラミックコンデンサの製造方法
US4867839A (en) * 1987-09-04 1989-09-19 Shinko Electric Industries Co., Ltd. Process for forming a circuit substrate
DE3908097A1 (de) * 1989-03-13 1990-09-20 Irion & Vosseler Praegefolie zum aufbringen von leiterbahnen auf feste oder plastische unterlagen
US5057372A (en) * 1989-03-22 1991-10-15 The Dow Chemical Company Multilayer film and laminate for use in producing printed circuit boards
JPH0818456B2 (ja) * 1989-09-08 1996-02-28 帝人株式会社 スタンピングホイル
CH680483A5 (es) * 1989-10-20 1992-08-31 Kobe Properties Ltd
EP0525246A1 (de) * 1991-08-01 1993-02-03 Siemens Aktiengesellschaft Magneteinrichtung mit einem ein magnetisches Streufeld erzeugenden Jochkörper
US5344680A (en) * 1991-10-09 1994-09-06 Gerber Scientific Products, Inc. Sign making web with tack killing overcoat removable by washing and related method
DE4142138C2 (de) * 1991-12-20 1998-04-23 Bosch Gmbh Robert Elektrisches Steuergerät
US5262588A (en) * 1992-01-07 1993-11-16 International Business Machines Corporation Electromagnetic interference/radio frequency innterference seal
US5214242A (en) * 1992-01-07 1993-05-25 International Business Machines Corp. Electromagnetic interference/radio frequency interference conducting strip
ATE440480T1 (de) * 1993-12-30 2009-09-15 Miyake Kk Verbundfolie mit schaltungsfírmiger metallfolie oder dergleichen und verfahren zur herstellung
US6214444B1 (en) 1993-12-30 2001-04-10 Kabushiki Kaisha Miyake Circuit-like metallic foil sheet and the like and processing for producing them
US5751256A (en) * 1994-03-04 1998-05-12 Flexcon Company Inc. Resonant tag labels and method of making same
US5464690A (en) * 1994-04-04 1995-11-07 Novavision, Inc. Holographic document and method for forming
EP0688050A1 (fr) 1994-06-15 1995-12-20 Philips Cartes Et Systemes Procédé d'assemblage de carte à circuit intégré et carte ainsi obtenue
DE69512137T2 (de) * 1994-06-15 2000-05-25 Rue Cartes Et Systemes Paris D Herstellungsverfahren und Montage für IC-Karte.
TW404092B (en) * 1994-12-01 2000-09-01 Miyake Inc Circuit-like metallic foil sheet for resonance frequency characteristic tag and the like and its fabrication method
FR2736740A1 (fr) * 1995-07-11 1997-01-17 Trt Telecom Radio Electr Procede de production et d'assemblage de carte a circuit integre et carte ainsi obtenue
US5878487A (en) * 1996-09-19 1999-03-09 Ford Motor Company Method of supporting an electrical circuit on an electrically insulative base substrate
EP0901745A1 (en) * 1997-02-21 1999-03-17 Koninklijke Philips Electronics N.V. A method of selectively metallizing a substrate using a hot foil embossing technique
US6100178A (en) * 1997-02-28 2000-08-08 Ford Motor Company Three-dimensional electronic circuit with multiple conductor layers and method for manufacturing same
GB9709263D0 (en) 1997-05-07 1997-06-25 Astor Universal Limited Laminate structure
FR2769389B1 (fr) 1997-10-07 2000-01-28 Rue Cartes Et Systemes De Carte a microcircuit combinant des plages de contact exterieur et une antenne, et procede de fabrication d'une telle carte
GB9803972D0 (en) * 1998-02-25 1998-04-22 Noble Peter J W A deposition method and apparatus therefor
US6618939B2 (en) 1998-02-27 2003-09-16 Kabushiki Kaisha Miyake Process for producing resonant tag
DE19857157A1 (de) 1998-12-11 2000-06-15 Bolta Werke Gmbh Verfahren zur Herstellung einer selbsttragenden Metallfolie
DE19932600A1 (de) * 1999-07-13 2001-02-01 Bolta Werke Gmbh Verfahren zur Herstellung eines Prägeproduktes, insbesondere eines Elektroinstallationsproduktes
DE19932597C1 (de) * 1999-07-13 2000-10-05 Bolta Werke Gmbh Flächenelement mit einer strukturierten Metallschicht
DE19937843C1 (de) * 1999-08-13 2001-02-08 Bolta Werke Gmbh Verfahren zur Herstellung einer selbsttragenden Kupferfolie
US6521324B1 (en) * 1999-11-30 2003-02-18 3M Innovative Properties Company Thermal transfer of microstructured layers
US6497778B1 (en) 2000-04-19 2002-12-24 Novavision, Inc. Method for making holographic foil
US6638386B2 (en) 2000-04-19 2003-10-28 Novavision, Inc. Method for making holographic foil
DE10033507A1 (de) * 2000-07-11 2002-01-31 Pasquini Und Kromer Gmbh Verfahren und Vorrichtung zur Herstellung von elektrisch leitfähigen Mustern auf Trägern, sowie Folie dazu
US6988666B2 (en) * 2001-09-17 2006-01-24 Checkpoint Systems, Inc. Security tag and process for making same
EP1318706A1 (de) * 2001-12-07 2003-06-11 Horst J. Lindemann GmbH Verfahren und Vorrichtung zur Herstellung von elektrisch leitfähigen Mustern auf Trägern, sowie Folien dazu
US9955994B2 (en) 2002-08-02 2018-05-01 Flowcardia, Inc. Ultrasound catheter having protective feature against breakage
DE10255702B4 (de) * 2002-11-29 2011-08-11 Vipem Hackert GmbH, 08223 Verfahren zur Erzeugung mechanisch strukturierbarer Kupferfolien
US7758510B2 (en) 2003-09-19 2010-07-20 Flowcardia, Inc. Connector for securing ultrasound catheter to transducer
DE102005002818A1 (de) 2004-01-24 2005-08-11 Marquardt Gmbh Sensor für Haushaltsgeräte
US20070218378A1 (en) * 2006-03-15 2007-09-20 Illinois Tool Works, Inc. Thermally printable electrically conductive ribbon and method
US7497004B2 (en) * 2006-04-10 2009-03-03 Checkpoint Systems, Inc. Process for making UHF antennas for EAS and RFID tags and antennas made thereby
EP1855511A1 (en) * 2006-05-12 2007-11-14 Nederlandse Organisatie voor Toegepast-Natuuurwetenschappelijk Onderzoek TNO A process for preparing a heatsink system and heatsink system obtainable by said process
DE102007027998A1 (de) * 2007-06-14 2008-12-18 Leonhard Kurz Gmbh & Co. Kg Heißprägen von Leiterbahnen auf Photovoltaik-Silizium-Wafer
ES2655825T3 (es) 2011-08-03 2018-02-21 Graphic Packaging International, Inc. Sistemas y procedimientos para formar laminados con un material interactivo con la energía de las microondas con un patrón
JP6293145B2 (ja) 2012-08-02 2018-03-14 バード・ペリフェラル・バスキュラー・インコーポレーテッド 超音波カテーテルシステム
JP6290385B2 (ja) 2013-09-26 2018-03-07 グラフィック パッケージング インターナショナル インコーポレイテッドＧｒａｐｈｉｃ Ｐａｃｋａｇｉｎｇ Ｉｎｔｅｒｎａｔｉｏｎａｌ，Ｉｎｃ． 積層体並びに積層を行うシステム及び方法
MX2017007972A (es) * 2014-12-22 2017-09-29 Graphic Packaging Int Inc Sistemas y metodos para formar laminados.
US11596726B2 (en) 2016-12-17 2023-03-07 C.R. Bard, Inc. Ultrasound devices for removing clots from catheters and related methods

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2776235A (en) * 1952-09-18 1957-01-01 Sprague Electric Co Electric circuit printing
GB1268756A (en) * 1968-06-14 1972-03-29 Plessey Co Ltd Improvements in or relating to electrical or electronic components
FR2135471B1 (es) * 1971-05-04 1973-05-11 Cellophane Sa
US3703603A (en) * 1971-05-10 1972-11-21 Circuit Stik Inc Rub-on sub-element for electronic circuit board
US4012552A (en) * 1975-03-10 1977-03-15 Dennison Manufacturing Company Decorative metal film heat transfer decalcomania
JPS5514418Y2 (es) * 1976-07-31 1980-04-02
JPS5734778Y2 (es) * 1976-10-20 1982-07-31
JPS54103568A (en) * 1978-01-31 1979-08-15 Matsushita Electric Works Ltd Method of forming electric circuit
JPS559837A (en) * 1978-07-04 1980-01-24 Masato Hamanishi Reverse lookkup japanese dictionary
JPS5734778U (es) * 1980-07-31 1982-02-24

Also Published As

Publication number Publication date
DE3264868D1 (en) 1985-08-29
JPS57193092A (en) 1982-11-27
EP0063347A1 (de) 1982-10-27
US4495232A (en) 1985-01-22
JPH0225274B2 (es) 1990-06-01
DE3116078A1 (de) 1983-01-20
ZA821880B (en) 1983-06-29
ATE14495T1 (de) 1985-08-15
BR8202292A (pt) 1983-04-05
ES8307437A1 (es) 1983-07-01
ES270134Y (es) 1984-03-01
ES270134U (es) 1983-08-01
EP0063347B1 (de) 1985-07-24

Similar Documents

Publication Publication Date Title
ES511549A0 (es) Metodo para imprimir circuitos electricamente funcionales sobre un substrato electricamenteaislante.
KR850000902A (ko) 플래스틱 회로판의 제조방법 및 회로이송 시스템
EP0129697A3 (en) Method of making printed circuit boards
EP0124847A3 (en) A flexible base plate for printed circuit board and a method for the preparation thereof
KR850007317A (ko) 미리 형성된 패터언을 가진 장치기판 장치-부착 점착제 트랜스퍼 장치
KR900004226A (ko) 관통공에서 전기적 접속하는 가요성 양면 회로 기판 제조방법
KR940703126A (ko) 프린트 기판의 제조방법 및 프린트기판(process for manufacturing a printed circuit and printed circuit)
US5522963A (en) Method for machining and depositing metallurgy on ceramic layers
EP0996318A3 (en) Novel composite foil, process for producing the same and copper-clad laminate
JP2566424B2 (ja) 導電性回路転写箔およびその製造法
GB1595245A (en) Method of producing thinclad materials for printed circuits
JPS60262638A (ja) 金属ベ−ス積層板
IE801669L (en) Manufacture of printed circuits
JPS58115886A (ja) プリント配線板の製造方法
JPS6310588A (ja) プリント配線板の製造方法
JPS5996793A (ja) プリント基板の製造方法
JPS6235595A (ja) 転写シ−トの製造方法
JPS58225697A (ja) 金属ベ−スプリント配線板の製造方法
JPH04356996A (ja) Ｆｐｃの端子加工方法　　　　
JPS60133789A (ja) 回路基板およびその製造方法
JPS6221297A (ja) 印刷配線板の製造法
JPS6255997A (ja) プリント回路用基板の製造方法
JPS58202585A (ja) プリント配線板の製造方法
JPH02298097A (ja) スルホール部付片面屈曲フレキシブルプリント配線板の製法
JPS5923588A (ja) プリント配線基板