GB9803972D0 - A deposition method and apparatus therefor - Google Patents

A deposition method and apparatus therefor

Info

Publication number
GB9803972D0
GB9803972D0 GBGB9803972.0A GB9803972A GB9803972D0 GB 9803972 D0 GB9803972 D0 GB 9803972D0 GB 9803972 A GB9803972 A GB 9803972A GB 9803972 D0 GB9803972 D0 GB 9803972D0
Authority
GB
United Kingdom
Prior art keywords
deposition method
apparatus therefor
therefor
deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB9803972.0A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Noble Peter J W
Original Assignee
Noble Peter J W
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Noble Peter J W filed Critical Noble Peter J W
Priority to GBGB9803972.0A priority Critical patent/GB9803972D0/en
Publication of GB9803972D0 publication Critical patent/GB9803972D0/en
Priority to PCT/GB1999/000556 priority patent/WO1999044402A1/en
Priority to AU26316/99A priority patent/AU2631699A/en
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
GBGB9803972.0A 1998-02-25 1998-02-25 A deposition method and apparatus therefor Ceased GB9803972D0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GBGB9803972.0A GB9803972D0 (en) 1998-02-25 1998-02-25 A deposition method and apparatus therefor
PCT/GB1999/000556 WO1999044402A1 (en) 1998-02-25 1999-02-24 A deposition method and apparatus therefor
AU26316/99A AU2631699A (en) 1998-02-25 1999-02-24 A deposition method and apparatus therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9803972.0A GB9803972D0 (en) 1998-02-25 1998-02-25 A deposition method and apparatus therefor

Publications (1)

Publication Number Publication Date
GB9803972D0 true GB9803972D0 (en) 1998-04-22

Family

ID=10827577

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB9803972.0A Ceased GB9803972D0 (en) 1998-02-25 1998-02-25 A deposition method and apparatus therefor

Country Status (3)

Country Link
AU (1) AU2631699A (en)
GB (1) GB9803972D0 (en)
WO (1) WO1999044402A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090099081A (en) * 2007-01-05 2009-09-21 바스프 에스이 Process for producing electrically conductive surfaces
KR20110030539A (en) 2008-06-18 2011-03-23 바스프 에스이 Process for producing electrodes for solar cells
DE102009020774B4 (en) * 2009-05-05 2011-01-05 Universität Stuttgart Method for contacting a semiconductor substrate

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3116078A1 (en) * 1981-04-22 1983-01-20 IVO Irion & Vosseler, Zählerfabrik GmbH & Co, 7730 Villingen-Schwenningen "EMBOSSING FILM"
US4970196A (en) * 1987-01-15 1990-11-13 The Johns Hopkins University Method and apparatus for the thin film deposition of materials with a high power pulsed laser
JPH01129492A (en) * 1987-11-16 1989-05-22 Fuji Kagakushi Kogyo Co Ltd Manufacture of printed board
US4832255A (en) * 1988-07-25 1989-05-23 International Business Machines Corporation Precision solder transfer method and means
DE3908097A1 (en) * 1989-03-13 1990-09-20 Irion & Vosseler EMBOSSING FILM FOR APPLYING GUIDED TRACKS TO SOLID OR PLASTIC SUBSTRATES
JPH02291194A (en) * 1989-04-28 1990-11-30 Nec Corp Manufacture of printed-wiring pattern
JPH035095A (en) * 1989-06-02 1991-01-10 Matsushita Electric Works Ltd Sheet-shaped solder and method of using this solder
JP3471154B2 (en) * 1995-12-19 2003-11-25 リコーエレメックス株式会社 Reproduction method of thermal transfer ribbon
JPH1027521A (en) * 1996-07-11 1998-01-27 Sumitomo Bakelite Co Ltd Electroconductive transfer film

Also Published As

Publication number Publication date
WO1999044402A1 (en) 1999-09-02
AU2631699A (en) 1999-09-15

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)