ES440561A1 - Perfeccionamientos en estructuras semiconductoras. - Google Patents

Perfeccionamientos en estructuras semiconductoras.

Info

Publication number
ES440561A1
ES440561A1 ES440561A ES440561A ES440561A1 ES 440561 A1 ES440561 A1 ES 440561A1 ES 440561 A ES440561 A ES 440561A ES 440561 A ES440561 A ES 440561A ES 440561 A1 ES440561 A1 ES 440561A1
Authority
ES
Spain
Prior art keywords
transistor
epitaxial layer
vertical transistor
fabrication
logic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES440561A
Other languages
English (en)
Inventor
Jorge Agraz-Guerena
Alan W Fulton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of ES440561A1 publication Critical patent/ES440561A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/082—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including bipolar components only
    • H01L27/0821—Combination of lateral and vertical transistors only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0214—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L
    • H01L27/0229—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L of bipolar structures
    • H01L27/0233—Integrated injection logic structures [I2L]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/07—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common
    • H01L27/0744—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common without components of the field effect type
    • H01L27/075—Bipolar transistors in combination with diodes, or capacitors, or resistors, e.g. lateral bipolar transistor, and vertical bipolar transistor and resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/01—Bipolar transistors-ion implantation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/085—Isolated-integrated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/087—I2L integrated injection logic

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
  • Logic Circuits (AREA)
ES440561A 1974-09-03 1975-08-29 Perfeccionamientos en estructuras semiconductoras. Expired ES440561A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/502,674 US4199775A (en) 1974-09-03 1974-09-03 Integrated circuit and method for fabrication thereof

Publications (1)

Publication Number Publication Date
ES440561A1 true ES440561A1 (es) 1977-03-01

Family

ID=23998861

Family Applications (2)

Application Number Title Priority Date Filing Date
ES440561A Expired ES440561A1 (es) 1974-09-03 1975-08-29 Perfeccionamientos en estructuras semiconductoras.
ES442842A Expired ES442842A1 (es) 1974-09-03 1975-11-20 Procedimiento de fabricacion de dispositivos semiconductoresintegrados.

Family Applications After (1)

Application Number Title Priority Date Filing Date
ES442842A Expired ES442842A1 (es) 1974-09-03 1975-11-20 Procedimiento de fabricacion de dispositivos semiconductoresintegrados.

Country Status (15)

Country Link
US (2) US4199775A (es)
JP (1) JPS5160177A (es)
BE (1) BE832839A (es)
BR (1) BR7505600A (es)
CA (1) CA1044817A (es)
CH (1) CH591164A5 (es)
DE (1) DE2538326A1 (es)
ES (2) ES440561A1 (es)
FR (1) FR2284192A1 (es)
GB (1) GB1521518A (es)
HK (1) HK73179A (es)
IT (1) IT1044030B (es)
MY (1) MY8000165A (es)
NL (1) NL7510336A (es)
SE (1) SE408244B (es)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5318383B2 (es) * 1974-10-07 1978-06-14
NL7413264A (nl) * 1974-10-09 1976-04-13 Philips Nv Geintegreerde schakeling.
CA1056513A (en) * 1975-06-19 1979-06-12 Benjamin J. Sloan (Jr.) Integrated logic circuit and method of fabrication
JPS52156580A (en) * 1976-06-23 1977-12-27 Hitachi Ltd Semiconductor integrated circuit device and its production
JPS5838938B2 (ja) * 1976-08-03 1983-08-26 財団法人半導体研究振興会 半導体集積回路
DE2642210C2 (de) * 1976-09-20 1986-11-27 Siemens AG, 1000 Berlin und 8000 München Integrierte Schottky-Injektionslogik-Schaltungsanordnung
JPS5952546B2 (ja) * 1976-11-06 1984-12-20 三菱電機株式会社 半導体装置
JPS5398785A (en) * 1977-02-09 1978-08-29 Handotai Kenkyu Shinkokai Semiconductor ic
US4881111A (en) * 1977-02-24 1989-11-14 Harris Corporation Radiation hard, high emitter-base breakdown bipolar transistor
US4144098A (en) * 1977-04-28 1979-03-13 Hughes Aircraft Company P+ Buried layer for I2 L isolation by ion implantation
US4149906A (en) * 1977-04-29 1979-04-17 International Business Machines Corporation Process for fabrication of merged transistor logic (MTL) cells
US4159915A (en) * 1977-10-25 1979-07-03 International Business Machines Corporation Method for fabrication vertical NPN and PNP structures utilizing ion-implantation
DE2757091A1 (de) * 1977-12-21 1979-07-05 Siemens Ag Verfahren zum herstellen einer monolithischen kombination zweier komplementaerer bipolartransistoren
JPS5499580A (en) * 1977-12-27 1979-08-06 Nec Corp Semiconductor integrated circuit device
US4243895A (en) * 1978-01-04 1981-01-06 Nazarian Artashes R Integrated injection circuit
JPS54145486A (en) * 1978-05-08 1979-11-13 Handotai Kenkyu Shinkokai Gaas semiconductor device
DE2835330C3 (de) * 1978-08-11 1982-03-11 Siemens AG, 1000 Berlin und 8000 München Integrierter bipolarer Halbleiterschaltkreis sowie Verfahren zu seiner Herstellung
JPS5591155A (en) * 1978-12-27 1980-07-10 Toshiba Corp Semiconductor integrated circuit device
JPS55125667A (en) * 1979-03-22 1980-09-27 Hitachi Ltd Semiconductor device and fabricating the same
JPS55128861A (en) * 1979-03-28 1980-10-06 Hitachi Ltd Semiconductor integrated circuit device and method of fabricating the same
US4412376A (en) * 1979-03-30 1983-11-01 Ibm Corporation Fabrication method for vertical PNP structure with Schottky barrier diode emitter utilizing ion implantation
JPS55159900U (es) * 1979-05-01 1980-11-17
DE3071489D1 (en) * 1979-11-29 1986-04-17 Vlsi Technology Res Ass Method of manufacturing a semiconductor device with a schottky junction
US4255209A (en) * 1979-12-21 1981-03-10 Harris Corporation Process of fabricating an improved I2 L integrated circuit utilizing diffusion and epitaxial deposition
US4278985A (en) * 1980-04-14 1981-07-14 Gte Laboratories Incorporated Monolithic integrated circuit structure incorporating Schottky contact diode bridge rectifier
US4259680A (en) * 1980-04-17 1981-03-31 Bell Telephone Laboratories, Incorporated High speed lateral bipolar transistor
JPS56150848A (en) * 1980-04-23 1981-11-21 Semiconductor Res Found Semiconductor integrated circuit and lateral transistor
FR2482368A1 (fr) * 1980-05-12 1981-11-13 Thomson Csf Operateur logique a injection par le substrat et son procede de fabrication
US4488350A (en) * 1981-10-27 1984-12-18 Fairchild Camera & Instrument Corp. Method of making an integrated circuit bipolar memory cell
US4573064A (en) * 1981-11-02 1986-02-25 Texas Instruments Incorporated GaAs/GaAlAs Heterojunction bipolar integrated circuit devices
JPS5840854A (ja) * 1982-08-09 1983-03-09 Hitachi Ltd 半導体集積回路装置
US4982244A (en) * 1982-12-20 1991-01-01 National Semiconductor Corporation Buried Schottky clamped transistor
US4547793A (en) * 1983-12-27 1985-10-15 International Business Machines Corporation Trench-defined semiconductor structure
JPS60240156A (ja) * 1984-05-14 1985-11-29 Agency Of Ind Science & Technol 耐放射線半導体集積回路装置
US5166094A (en) * 1984-09-14 1992-11-24 Fairchild Camera & Instrument Corp. Method of fabricating a base-coupled transistor logic
US4956688A (en) * 1984-10-29 1990-09-11 Hitachi, Ltd. Radiation resistant bipolar memory
JPS61263150A (ja) * 1986-01-10 1986-11-21 Toshiba Corp 半導体装置の製造方法
US5068702A (en) * 1986-03-31 1991-11-26 Exar Corporation Programmable transistor
DE3618166A1 (de) * 1986-05-30 1987-12-03 Telefunken Electronic Gmbh Lateraltransistor
US5055418A (en) * 1987-07-29 1991-10-08 National Semiconductor Corporation Process for fabricating complementary contactless vertical bipolar transistors
US4843448A (en) * 1988-04-18 1989-06-27 The United States Of America As Represented By The Secretary Of The Navy Thin-film integrated injection logic
US5034337A (en) * 1989-02-10 1991-07-23 Texas Instruments Incorporated Method of making an integrated circuit that combines multi-epitaxial power transistors with logic/analog devices
US5016079A (en) * 1989-11-30 1991-05-14 Honeywell Inc. Integrated injection logic gate with heavily doped diffusion
US8087735B1 (en) 2007-05-31 2012-01-03 Steelcase Inc. Free standing furniture kit and method of assembly

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3591430A (en) * 1968-11-14 1971-07-06 Philco Ford Corp Method for fabricating bipolar planar transistor having reduced minority carrier fringing
US3656028A (en) * 1969-05-12 1972-04-11 Ibm Construction of monolithic chip and method of distributing power therein for individual electronic devices constructed thereon
DE1958992B2 (de) * 1969-11-25 1972-05-04 Deutsche Itt Industries Gmbh, 7800 Freiburg Lateraltransistor
US3657612A (en) * 1970-04-20 1972-04-18 Ibm Inverse transistor with high current gain
DE2021824C3 (de) * 1970-05-05 1980-08-14 Ibm Deutschland Gmbh, 7000 Stuttgart Monolithische Halbleiterschaltung
GB1355806A (en) * 1970-12-09 1974-06-05 Mullard Ltd Methods of manufacturing a semiconductor device
JPS555295B2 (es) * 1971-09-10 1980-02-05
BE789848A (fr) * 1971-10-12 1973-04-09 Basf Ag 6-(p-formylaminophenyl)-4,5-dihydropyridazone-(3), sa preparation et ses utilisations therapeutiques
DE2212168C2 (de) * 1972-03-14 1982-10-21 Ibm Deutschland Gmbh, 7000 Stuttgart Monolithisch integrierte Halbleiteranordnung
DE2262297C2 (de) * 1972-12-20 1985-11-28 Ibm Deutschland Gmbh, 7000 Stuttgart Monolithisch integrierbare, logisch verknüpfbare Halbleiterschaltungsanordnung mit I↑2↑L-Aufbau
NL7314466A (nl) * 1973-10-20 1975-04-22 Philips Nv Halfgeleiderinrichting.
GB1434961A (en) * 1973-11-08 1976-05-12 Plessey Co Ltd Integrated circuit arrangements
JPS562792B2 (es) * 1974-03-30 1981-01-21

Also Published As

Publication number Publication date
AU8438775A (en) 1977-03-03
FR2284192A1 (fr) 1976-04-02
BE832839A (fr) 1975-12-16
HK73179A (en) 1979-10-26
US4199775A (en) 1980-04-22
NL7510336A (nl) 1976-03-05
BR7505600A (pt) 1976-08-03
MY8000165A (en) 1980-12-31
FR2284192B1 (es) 1979-03-23
GB1521518A (en) 1978-08-16
SE408244B (sv) 1979-05-21
ES442842A1 (es) 1977-05-01
IT1044030B (it) 1980-02-29
CA1044817A (en) 1978-12-19
SE7509474L (sv) 1976-03-04
US4076556A (en) 1978-02-28
JPS5617828B2 (es) 1981-04-24
DE2538326A1 (de) 1976-03-11
JPS5160177A (en) 1976-05-25
CH591164A5 (es) 1977-09-15

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