JPS56135965A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS56135965A JPS56135965A JP4088680A JP4088680A JPS56135965A JP S56135965 A JPS56135965 A JP S56135965A JP 4088680 A JP4088680 A JP 4088680A JP 4088680 A JP4088680 A JP 4088680A JP S56135965 A JPS56135965 A JP S56135965A
- Authority
- JP
- Japan
- Prior art keywords
- region
- type
- emitter region
- junction
- hfe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 230000006866 deterioration Effects 0.000 abstract 2
- 239000012535 impurity Substances 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000005215 recombination Methods 0.000 abstract 1
- 230000006798 recombination Effects 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0804—Emitter regions of bipolar transistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Bipolar Transistors (AREA)
Abstract
PURPOSE:To obtain a transistor bearable to a reverse bias at EB junction without an hFE deterioration phenomenon by avalanche break-down of the EB junction by a method wherein a side face of an emitter region is surrounded by an emitter region of low impurity concentration. CONSTITUTION:A P type silicon substrate 1 is formed with an N type first burried layer 2, a collector region 3-A, a P type second burried layer 4 and a P type separation region 5. Then, a P type impurity is implanted from the surface 3-A, a base region 9 being formed at the depth of the order of 1mu below the surface, and a P type region 8 for drawing out a base contact and the emitter region 10 being formed. The emitter region 10 is formed so as not to have a junction directly with the P type region 8 for drawing out the base contact. Since an N type epitaxial layer 3-a equivalent to the collector region exists on the side face of the emitter region 10, the hFE deterioration by recombination of the surfaces does not appear and accordingly, the EB withstand voltage is improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4088680A JPS56135965A (en) | 1980-03-28 | 1980-03-28 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4088680A JPS56135965A (en) | 1980-03-28 | 1980-03-28 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56135965A true JPS56135965A (en) | 1981-10-23 |
Family
ID=12592986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4088680A Pending JPS56135965A (en) | 1980-03-28 | 1980-03-28 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56135965A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0166923A2 (en) * | 1984-06-29 | 1986-01-08 | International Business Machines Corporation | High performance bipolar transistor having a lightly doped guard ring disposed between the emitter and the extrinsic base region |
JPS62272567A (en) * | 1986-05-21 | 1987-11-26 | Hitachi Ltd | Semiconductor device |
JP2011089126A (en) * | 2006-06-21 | 2011-05-06 | Hitachi Chem Co Ltd | Method for preventing adhesive or tackifier forming adhesive layer or tackifier layer of object to be wound-up from adhering to inner surface of reel |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50130374A (en) * | 1974-03-30 | 1975-10-15 | ||
JPS5136594A (en) * | 1974-07-19 | 1976-03-27 | Comex | |
JPS5349964A (en) * | 1976-10-18 | 1978-05-06 | Hitachi Ltd | Manufacture of semiconductor device |
-
1980
- 1980-03-28 JP JP4088680A patent/JPS56135965A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50130374A (en) * | 1974-03-30 | 1975-10-15 | ||
JPS5136594A (en) * | 1974-07-19 | 1976-03-27 | Comex | |
JPS5349964A (en) * | 1976-10-18 | 1978-05-06 | Hitachi Ltd | Manufacture of semiconductor device |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0166923A2 (en) * | 1984-06-29 | 1986-01-08 | International Business Machines Corporation | High performance bipolar transistor having a lightly doped guard ring disposed between the emitter and the extrinsic base region |
JPS62272567A (en) * | 1986-05-21 | 1987-11-26 | Hitachi Ltd | Semiconductor device |
JPH0834214B2 (en) * | 1986-05-21 | 1996-03-29 | 株式会社日立製作所 | Method for manufacturing semiconductor device |
JP2011089126A (en) * | 2006-06-21 | 2011-05-06 | Hitachi Chem Co Ltd | Method for preventing adhesive or tackifier forming adhesive layer or tackifier layer of object to be wound-up from adhering to inner surface of reel |
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