JPS55134963A - Composite semiconductor device and manufacture thereof - Google Patents
Composite semiconductor device and manufacture thereofInfo
- Publication number
- JPS55134963A JPS55134963A JP4283879A JP4283879A JPS55134963A JP S55134963 A JPS55134963 A JP S55134963A JP 4283879 A JP4283879 A JP 4283879A JP 4283879 A JP4283879 A JP 4283879A JP S55134963 A JPS55134963 A JP S55134963A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- mask
- transistor
- polycrystalline
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 6
- 230000015572 biosynthetic process Effects 0.000 abstract 3
- 229910052681 coesite Inorganic materials 0.000 abstract 3
- 229910052906 cristobalite Inorganic materials 0.000 abstract 3
- 239000000377 silicon dioxide Substances 0.000 abstract 3
- 235000012239 silicon dioxide Nutrition 0.000 abstract 3
- 229910052682 stishovite Inorganic materials 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
- 229910052905 tridymite Inorganic materials 0.000 abstract 3
- 229910052581 Si3N4 Inorganic materials 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 2
- 239000012535 impurity Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/082—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including bipolar components only
- H01L27/0823—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including bipolar components only including vertical bipolar transistors only
- H01L27/0826—Combination of vertical complementary transistors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Bipolar Transistors (AREA)
- Bipolar Integrated Circuits (AREA)
Abstract
PURPOSE:To devise the improvement of characteristics by having the base layer of an npn-transistor higher impurity concentration than the collector layer wherein the formation of a composite device with a pnp-transistor is made possible. CONSTITUTION:An n-epitaxial layer 56 is separated by n<+>-layers 58, 59 provided on a p-type Si substrate 52 and epitaxial formation is made for an n-layer 63 and a polycrystalline layer 64 through an Si3N4 mask 61. Then, etching is done by using an Si3N4 mask 65 and grooves are formed after leaving the layer 63. After removing the mask 65, an n<+>-layer 69 and an SiO2 layer 70 are stacked and the mask 61 is removed. Furthermore, epitaxial formation is made for an n-layer 73 and a polycrystalline Si layer 74 and the groove reaches the substrate 52 is etched by applying an SiO2 mask 75. After removing the mask 75, a p<+>-layer 82 and an SiO2 layer 83 are provided and they are covered with a polycrystalline Si layer 84. Finally, a main surface 85 is formed by abrashing and etching the side of the substrate 52 and fixed positioning p-layer and n-layers are selectively formed for the exposed n-layer and p-layers and the base of an npn-transistor Q2 is made to have higher concentration than the collector transistor Q2 is simultaneously formed with a pnp-transistor Q1. A high hfe and punch-through free device is developed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4283879A JPS55134963A (en) | 1979-04-09 | 1979-04-09 | Composite semiconductor device and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4283879A JPS55134963A (en) | 1979-04-09 | 1979-04-09 | Composite semiconductor device and manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55134963A true JPS55134963A (en) | 1980-10-21 |
Family
ID=12647110
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4283879A Pending JPS55134963A (en) | 1979-04-09 | 1979-04-09 | Composite semiconductor device and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55134963A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56131943A (en) * | 1980-03-19 | 1981-10-15 | Fujitsu Ltd | Semiconductor device |
JPS5974672A (en) * | 1982-10-20 | 1984-04-27 | Mitsubishi Electric Corp | Semiconductor integrated circuit device |
US4692784A (en) * | 1983-04-12 | 1987-09-08 | Nec Corporation | Dielectric insulation type semiconductor integrated circuit having low withstand voltage devices and high withstand voltage devices |
-
1979
- 1979-04-09 JP JP4283879A patent/JPS55134963A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56131943A (en) * | 1980-03-19 | 1981-10-15 | Fujitsu Ltd | Semiconductor device |
JPS5974672A (en) * | 1982-10-20 | 1984-04-27 | Mitsubishi Electric Corp | Semiconductor integrated circuit device |
US4692784A (en) * | 1983-04-12 | 1987-09-08 | Nec Corporation | Dielectric insulation type semiconductor integrated circuit having low withstand voltage devices and high withstand voltage devices |
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