ES357288A1 - Un metodo de fabricar un dispositivo semiconductor. - Google Patents

Un metodo de fabricar un dispositivo semiconductor.

Info

Publication number
ES357288A1
ES357288A1 ES357288A ES357288A ES357288A1 ES 357288 A1 ES357288 A1 ES 357288A1 ES 357288 A ES357288 A ES 357288A ES 357288 A ES357288 A ES 357288A ES 357288 A1 ES357288 A1 ES 357288A1
Authority
ES
Spain
Prior art keywords
layer
ion implantation
field effect
source
implantation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES357288A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of ES357288A1 publication Critical patent/ES357288A1/es
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/0843Source or drain regions of field-effect devices
    • H01L29/0847Source or drain regions of field-effect devices of field-effect transistors with insulated gate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/106Masks, special

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Bipolar Integrated Circuits (AREA)
ES357288A 1967-08-18 1968-08-16 Un metodo de fabricar un dispositivo semiconductor. Expired ES357288A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3814467 1967-08-18

Publications (1)

Publication Number Publication Date
ES357288A1 true ES357288A1 (es) 1970-03-16

Family

ID=10401504

Family Applications (1)

Application Number Title Priority Date Filing Date
ES357288A Expired ES357288A1 (es) 1967-08-18 1968-08-16 Un metodo de fabricar un dispositivo semiconductor.

Country Status (10)

Country Link
US (1) US3596347A (es)
AT (1) AT296390B (es)
BE (1) BE719689A (es)
BR (1) BR6801562D0 (es)
CH (1) CH497048A (es)
DE (1) DE1764847B2 (es)
ES (1) ES357288A1 (es)
FR (1) FR1577669A (es)
GB (1) GB1233545A (es)
NL (1) NL6811526A (es)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1244225A (en) * 1968-12-31 1971-08-25 Associated Semiconductor Mft Improvements in and relating to methods of manufacturing semiconductor devices
US3590471A (en) * 1969-02-04 1971-07-06 Bell Telephone Labor Inc Fabrication of insulated gate field-effect transistors involving ion implantation
US4005450A (en) * 1970-05-13 1977-01-25 Hitachi, Ltd. Insulated gate field effect transistor having drain region containing low impurity concentration layer
US3855007A (en) * 1970-11-13 1974-12-17 Signetics Corp Bipolar transistor structure having ion implanted region and method
GB1355806A (en) * 1970-12-09 1974-06-05 Mullard Ltd Methods of manufacturing a semiconductor device
US3700978A (en) * 1971-03-18 1972-10-24 Bell Telephone Labor Inc Field effect transistors and methods for making field effect transistors
US3775191A (en) * 1971-06-28 1973-11-27 Bell Canada Northern Electric Modification of channel regions in insulated gate field effect transistors
SE361232B (es) * 1972-11-09 1973-10-22 Ericsson Telefon Ab L M
US3895975A (en) * 1973-02-13 1975-07-22 Communications Satellite Corp Method for the post-alloy diffusion of impurities into a semiconductor
US3947866A (en) * 1973-06-25 1976-03-30 Signetics Corporation Ion implanted resistor having controlled temperature coefficient and method
US3873372A (en) * 1973-07-09 1975-03-25 Ibm Method for producing improved transistor devices
US3959025A (en) * 1974-05-01 1976-05-25 Rca Corporation Method of making an insulated gate field effect transistor
US4173818A (en) * 1978-05-30 1979-11-13 International Business Machines Corporation Method for fabricating transistor structures having very short effective channels
DE3003391C2 (de) * 1980-01-31 1984-08-30 Josef Dipl.-Phys. Dr. 8041 Fahrenzhausen Kemmer Strahlungsdetektor mit einem passivierten pn-Halbleiterübergang
JPS583264A (ja) * 1981-06-30 1983-01-10 Fujitsu Ltd 高耐圧半導体集積回路およびその製造方法
DE3138747A1 (de) * 1981-09-29 1983-04-14 Siemens AG, 1000 Berlin und 8000 München Selbstsperrender feldeffekt-transistor des verarmungstyps
GB2215515A (en) * 1988-03-14 1989-09-20 Philips Electronic Associated A lateral insulated gate field effect transistor and a method of manufacture
US5169796A (en) * 1991-09-19 1992-12-08 Teledyne Industries, Inc. Process for fabricating self-aligned metal gate field effect transistors
US9324830B2 (en) 2014-03-27 2016-04-26 International Business Machines Corporation Self-aligned contact process enabled by low temperature

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3328210A (en) * 1964-10-26 1967-06-27 North American Aviation Inc Method of treating semiconductor device by ionic bombardment
NL6604962A (es) * 1966-04-14 1967-10-16
US3445926A (en) * 1967-02-28 1969-05-27 Electro Optical Systems Inc Production of semiconductor devices by use of ion beam implantation

Also Published As

Publication number Publication date
BR6801562D0 (pt) 1973-02-27
FR1577669A (es) 1969-08-08
AT296390B (de) 1972-02-10
US3596347A (en) 1971-08-03
NL6811526A (es) 1969-02-20
BE719689A (es) 1969-02-19
GB1233545A (es) 1971-05-26
CH497048A (de) 1970-09-30
DE1764847A1 (de) 1972-02-17
DE1764847B2 (de) 1974-01-24

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