JPS5621367A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5621367A JPS5621367A JP9584079A JP9584079A JPS5621367A JP S5621367 A JPS5621367 A JP S5621367A JP 9584079 A JP9584079 A JP 9584079A JP 9584079 A JP9584079 A JP 9584079A JP S5621367 A JPS5621367 A JP S5621367A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- drain
- source
- layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 238000000137 annealing Methods 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 238000009413 insulation Methods 0.000 abstract 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Bipolar Transistors (AREA)
Abstract
PURPOSE:To improve annealing effect for source layer and drain layer remarkably, by protecting the top of a channel section with metallic film and radiating laser beam thereon. CONSTITUTION:A field oxide film 2 and a gate oxide film 3 are prepared on a p- type Si substrate 1. And a gate electrode 4 is formed by piling a doped poly Si in layer and providing a laser beam reflecting mask 5, such as W, etc. And then, a source and a drain are selectively annealed by injecting As ion to form an n<+>-type source 6 and a drain 7, and also by radiating laser beam appropriately. Then, it is finished by providing an insulation film, an electrode and a wiring in accordance with the usual manner. Because of the reflecting mask 5, the laser beam never reaches a channel forming region of the substrate, and therefore, the selective annealing can be achieved extremely satisfactorily.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9584079A JPS5621367A (en) | 1979-07-27 | 1979-07-27 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9584079A JPS5621367A (en) | 1979-07-27 | 1979-07-27 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5621367A true JPS5621367A (en) | 1981-02-27 |
Family
ID=14148567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9584079A Pending JPS5621367A (en) | 1979-07-27 | 1979-07-27 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5621367A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5842273A (en) * | 1981-09-07 | 1983-03-11 | Nec Corp | Manufacture of semiconductor device |
US4833097A (en) * | 1986-05-12 | 1989-05-23 | Butler Alan L | Fabrication of MOS-transistors |
EP1104934A2 (en) * | 1999-11-23 | 2001-06-06 | Lucent Technologies Inc. | Method to selectively heat semiconductor wafers |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55111170A (en) * | 1979-02-20 | 1980-08-27 | Nec Corp | Method of manufacturing semiconductor device |
-
1979
- 1979-07-27 JP JP9584079A patent/JPS5621367A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55111170A (en) * | 1979-02-20 | 1980-08-27 | Nec Corp | Method of manufacturing semiconductor device |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5842273A (en) * | 1981-09-07 | 1983-03-11 | Nec Corp | Manufacture of semiconductor device |
US4833097A (en) * | 1986-05-12 | 1989-05-23 | Butler Alan L | Fabrication of MOS-transistors |
EP1104934A2 (en) * | 1999-11-23 | 2001-06-06 | Lucent Technologies Inc. | Method to selectively heat semiconductor wafers |
EP1104934A3 (en) * | 1999-11-23 | 2001-10-17 | Lucent Technologies Inc. | Method to selectively heat semiconductor wafers |
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