ES2851385T3 - Cubierta para un componente y procedimiento para la fabricación de una cubierta para un componente - Google Patents

Cubierta para un componente y procedimiento para la fabricación de una cubierta para un componente Download PDF

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Publication number
ES2851385T3
ES2851385T3 ES15756148T ES15756148T ES2851385T3 ES 2851385 T3 ES2851385 T3 ES 2851385T3 ES 15756148 T ES15756148 T ES 15756148T ES 15756148 T ES15756148 T ES 15756148T ES 2851385 T3 ES2851385 T3 ES 2851385T3
Authority
ES
Spain
Prior art keywords
cover
layer
structuring
elevations
depressions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES15756148T
Other languages
English (en)
Spanish (es)
Inventor
Ansgar Schäufele
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SnapTrack Inc
Original Assignee
SnapTrack Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SnapTrack Inc filed Critical SnapTrack Inc
Application granted granted Critical
Publication of ES2851385T3 publication Critical patent/ES2851385T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/105—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the BAW device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/263—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer having non-uniform thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/28—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer comprising a deformed thin sheet, i.e. the layer having its entire thickness deformed out of the plane, e.g. corrugated, crumpled
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0271—Resonators; ultrasonic resonators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0136—Growing or depositing of a covering layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0163—Reinforcing a cap, e.g. with ribs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H2003/0071—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of bulk acoustic wave and surface acoustic wave elements in the same process

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Acoustics & Sound (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Micromachines (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Physical Vapour Deposition (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
ES15756148T 2014-09-03 2015-08-25 Cubierta para un componente y procedimiento para la fabricación de una cubierta para un componente Active ES2851385T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014112672.6A DE102014112672B4 (de) 2014-09-03 2014-09-03 Abdeckung für ein Bauelement und Verfahren zur Herstellung einer Abdeckung für ein Bauelement
PCT/EP2015/069453 WO2016034456A1 (de) 2014-09-03 2015-08-25 Abdeckung für ein bauelement und verfahren zur herstellung einer abdeckung für ein bauelement

Publications (1)

Publication Number Publication Date
ES2851385T3 true ES2851385T3 (es) 2021-09-06

Family

ID=54011027

Family Applications (1)

Application Number Title Priority Date Filing Date
ES15756148T Active ES2851385T3 (es) 2014-09-03 2015-08-25 Cubierta para un componente y procedimiento para la fabricación de una cubierta para un componente

Country Status (11)

Country Link
US (1) US11180364B2 (enExample)
EP (1) EP3189589B1 (enExample)
JP (1) JP6704902B2 (enExample)
KR (1) KR102493250B1 (enExample)
CN (1) CN106715326B (enExample)
BR (1) BR112017004373A2 (enExample)
DE (1) DE102014112672B4 (enExample)
ES (1) ES2851385T3 (enExample)
HU (1) HUE052699T2 (enExample)
MX (1) MX2017002903A (enExample)
WO (1) WO2016034456A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013102223B4 (de) * 2013-03-06 2014-09-18 Epcos Ag Miniaturisiertes Mehrkomponentenbauelement und Verfahren zur Herstellung
US10442683B2 (en) 2016-04-14 2019-10-15 Akustica, Inc. Corrugated package for microelectromechanical system (MEMS) device
DE102022205075A1 (de) 2022-05-20 2023-11-23 Robert Bosch Gesellschaft mit beschränkter Haftung Mikromechanisches Bauteil für eine Sensor-, Mikrofon- und/oder Mikrolautsprechervorrichtung

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2418794A1 (de) * 1974-04-19 1975-11-06 Rag Domenico Tinaro Bauelement in form einer stahlbetonplatte
US4931346A (en) * 1988-12-19 1990-06-05 Book Covers Inc. Lightweight laminated paperboard
CA2092061C (en) * 1992-03-30 2001-12-25 Wolf-Henning Laves A corrugated board
DE4424775A1 (de) * 1994-07-05 1996-01-11 Grace Gmbh Antiblockingmittel und Verfahren zu dessen Herstellung
EP0867701A1 (en) 1997-03-28 1998-09-30 Interuniversitair Microelektronica Centrum Vzw Method of fabrication of an infrared radiation detector and more particularly an infrared sensitive bolometer
US6087638A (en) * 1997-07-15 2000-07-11 Silverbrook Research Pty Ltd Corrugated MEMS heater structure
CN1265678A (zh) * 1997-08-15 2000-09-06 陶氏化学公司 高内相乳液和由其制备的多孔材料
DE10006035A1 (de) * 2000-02-10 2001-08-16 Bosch Gmbh Robert Verfahren zur Herstellung eines mikromechanischen Bauelements sowie ein nach dem Verfahren hergestelltes Bauelement
EP1251099A3 (en) 2000-03-24 2004-07-21 Interuniversitair Microelektronica Centrum Vzw Method of improving mechanical strength in micro electro mechanical systems and devices produced thereof
US20020141712A1 (en) * 2001-03-29 2002-10-03 O'connor Lawrence Coated steel tape
CA2398033C (en) * 2002-03-19 2005-06-14 Carlo Fascio Corrugated packaging and insulation material
KR100853220B1 (ko) * 2002-04-04 2008-08-20 삼성전자주식회사 표시 장치용 박막 트랜지스터 어레이 기판의 제조 방법
US6806557B2 (en) * 2002-09-30 2004-10-19 Motorola, Inc. Hermetically sealed microdevices having a single crystalline silicon getter for maintaining vacuum
US7405924B2 (en) 2004-09-27 2008-07-29 Idc, Llc System and method for protecting microelectromechanical systems array using structurally reinforced back-plate
US7417307B2 (en) * 2005-07-29 2008-08-26 Hewlett-Packard Development Company, L.P. System and method for direct-bonding of substrates
FR2901264B1 (fr) 2006-05-22 2008-10-10 Commissariat Energie Atomique Microcomposant muni d'une cavite delimitee par un capot a resistance mecanique amelioree
JP5435199B2 (ja) 2008-01-11 2014-03-05 セイコーエプソン株式会社 機能デバイス及びその製造方法
US8592925B2 (en) 2008-01-11 2013-11-26 Seiko Epson Corporation Functional device with functional structure of a microelectromechanical system disposed in a cavity of a substrate, and manufacturing method thereof
US8554579B2 (en) 2008-10-13 2013-10-08 Fht, Inc. Management, reporting and benchmarking of medication preparation
EP2349914A2 (en) 2008-10-29 2011-08-03 Nxp B.V. An integrated component and a method of manufacturing an integrated component
JP5073772B2 (ja) * 2009-09-16 2012-11-14 日本電波工業株式会社 圧電デバイス
JP2011128140A (ja) * 2009-11-19 2011-06-30 Dainippon Printing Co Ltd センサデバイス及びその製造方法
JP5204171B2 (ja) * 2010-08-25 2013-06-05 株式会社東芝 電気部品およびその製造方法
DE102011103516B4 (de) 2011-06-03 2015-01-22 Epcos Ag Verfahren zum Befüllen eines Hohlraums mit einer Atmosphäre
JP2014155980A (ja) * 2013-02-15 2014-08-28 Toshiba Corp 電気部品およびその製造方法
US10442683B2 (en) * 2016-04-14 2019-10-15 Akustica, Inc. Corrugated package for microelectromechanical system (MEMS) device

Also Published As

Publication number Publication date
BR112017004373A2 (pt) 2017-12-05
KR20170046780A (ko) 2017-05-02
US11180364B2 (en) 2021-11-23
HUE052699T2 (hu) 2021-05-28
CN106715326A (zh) 2017-05-24
JP6704902B2 (ja) 2020-06-03
DE102014112672B4 (de) 2018-05-09
DE102014112672A1 (de) 2016-03-03
EP3189589B1 (de) 2020-11-11
KR102493250B1 (ko) 2023-01-27
CN106715326B (zh) 2021-02-02
EP3189589A1 (de) 2017-07-12
WO2016034456A1 (de) 2016-03-10
US20170267519A1 (en) 2017-09-21
MX2017002903A (es) 2018-03-27
JP2017527448A (ja) 2017-09-21

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