DE102014112672B4 - Abdeckung für ein Bauelement und Verfahren zur Herstellung einer Abdeckung für ein Bauelement - Google Patents

Abdeckung für ein Bauelement und Verfahren zur Herstellung einer Abdeckung für ein Bauelement Download PDF

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Publication number
DE102014112672B4
DE102014112672B4 DE102014112672.6A DE102014112672A DE102014112672B4 DE 102014112672 B4 DE102014112672 B4 DE 102014112672B4 DE 102014112672 A DE102014112672 A DE 102014112672A DE 102014112672 B4 DE102014112672 B4 DE 102014112672B4
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DE
Germany
Prior art keywords
structuring
cover
layer
component
elevations
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102014112672.6A
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German (de)
English (en)
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DE102014112672A1 (de
Inventor
Ansgar Schäufele
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SnapTrack Inc
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SnapTrack Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE102014112672.6A priority Critical patent/DE102014112672B4/de
Application filed by SnapTrack Inc filed Critical SnapTrack Inc
Priority to BR112017004373A priority patent/BR112017004373A2/pt
Priority to EP15756148.1A priority patent/EP3189589B1/de
Priority to MX2017002903A priority patent/MX2017002903A/es
Priority to HUE15756148A priority patent/HUE052699T2/hu
Priority to KR1020177008767A priority patent/KR102493250B1/ko
Priority to CN201580053522.0A priority patent/CN106715326B/zh
Priority to ES15756148T priority patent/ES2851385T3/es
Priority to PCT/EP2015/069453 priority patent/WO2016034456A1/de
Priority to US15/508,820 priority patent/US11180364B2/en
Priority to JP2017512713A priority patent/JP6704902B2/ja
Publication of DE102014112672A1 publication Critical patent/DE102014112672A1/de
Application granted granted Critical
Publication of DE102014112672B4 publication Critical patent/DE102014112672B4/de
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Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/105—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the BAW device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/263—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer having non-uniform thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/28—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer comprising a deformed thin sheet, i.e. the layer having its entire thickness deformed out of the plane, e.g. corrugated, crumpled
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0271—Resonators; ultrasonic resonators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0136—Growing or depositing of a covering layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0163—Reinforcing a cap, e.g. with ribs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H2003/0071—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of bulk acoustic wave and surface acoustic wave elements in the same process

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Acoustics & Sound (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Micromachines (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Physical Vapour Deposition (AREA)
DE102014112672.6A 2014-09-03 2014-09-03 Abdeckung für ein Bauelement und Verfahren zur Herstellung einer Abdeckung für ein Bauelement Active DE102014112672B4 (de)

Priority Applications (11)

Application Number Priority Date Filing Date Title
DE102014112672.6A DE102014112672B4 (de) 2014-09-03 2014-09-03 Abdeckung für ein Bauelement und Verfahren zur Herstellung einer Abdeckung für ein Bauelement
PCT/EP2015/069453 WO2016034456A1 (de) 2014-09-03 2015-08-25 Abdeckung für ein bauelement und verfahren zur herstellung einer abdeckung für ein bauelement
MX2017002903A MX2017002903A (es) 2014-09-03 2015-08-25 Cubierta para un componente y método para producir una cubierta para un componente.
HUE15756148A HUE052699T2 (hu) 2014-09-03 2015-08-25 Burkolat egy alkatrészhez, és eljárás burkolat elõállítására egy alkatrészhez
KR1020177008767A KR102493250B1 (ko) 2014-09-03 2015-08-25 컴포넌트를 위한 커버 및 컴포넌트를 위한 커버를 제조하기 위한 방법
CN201580053522.0A CN106715326B (zh) 2014-09-03 2015-08-25 用于器件的覆盖物及用于制造用于器件的覆盖物的方法
BR112017004373A BR112017004373A2 (pt) 2014-09-03 2015-08-25 cobertura para um componente e método para produzir uma cobertura para um componente
EP15756148.1A EP3189589B1 (de) 2014-09-03 2015-08-25 Abdeckung für ein bauelement und verfahren zur herstellung einer abdeckung für ein bauelement
US15/508,820 US11180364B2 (en) 2014-09-03 2015-08-25 Covering for a component and method for producing a covering for a component
JP2017512713A JP6704902B2 (ja) 2014-09-03 2015-08-25 コンポーネント用カバー及びコンポーネント用カバーの製造方法
ES15756148T ES2851385T3 (es) 2014-09-03 2015-08-25 Cubierta para un componente y procedimiento para la fabricación de una cubierta para un componente

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102014112672.6A DE102014112672B4 (de) 2014-09-03 2014-09-03 Abdeckung für ein Bauelement und Verfahren zur Herstellung einer Abdeckung für ein Bauelement

Publications (2)

Publication Number Publication Date
DE102014112672A1 DE102014112672A1 (de) 2016-03-03
DE102014112672B4 true DE102014112672B4 (de) 2018-05-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE102014112672.6A Active DE102014112672B4 (de) 2014-09-03 2014-09-03 Abdeckung für ein Bauelement und Verfahren zur Herstellung einer Abdeckung für ein Bauelement

Country Status (11)

Country Link
US (1) US11180364B2 (enExample)
EP (1) EP3189589B1 (enExample)
JP (1) JP6704902B2 (enExample)
KR (1) KR102493250B1 (enExample)
CN (1) CN106715326B (enExample)
BR (1) BR112017004373A2 (enExample)
DE (1) DE102014112672B4 (enExample)
ES (1) ES2851385T3 (enExample)
HU (1) HUE052699T2 (enExample)
MX (1) MX2017002903A (enExample)
WO (1) WO2016034456A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013102223B4 (de) * 2013-03-06 2014-09-18 Epcos Ag Miniaturisiertes Mehrkomponentenbauelement und Verfahren zur Herstellung
US10442683B2 (en) * 2016-04-14 2019-10-15 Akustica, Inc. Corrugated package for microelectromechanical system (MEMS) device
DE102022205075A1 (de) 2022-05-20 2023-11-23 Robert Bosch Gesellschaft mit beschränkter Haftung Mikromechanisches Bauteil für eine Sensor-, Mikrofon- und/oder Mikrolautsprechervorrichtung

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DE10006035A1 (de) 2000-02-10 2001-08-16 Bosch Gmbh Robert Verfahren zur Herstellung eines mikromechanischen Bauelements sowie ein nach dem Verfahren hergestelltes Bauelement
WO2003085448A1 (en) 2002-04-04 2003-10-16 Samsung Electronics Co., Ltd. Method for manufacturing thin film transistor array panel for display device
US20060076648A1 (en) 2004-09-27 2006-04-13 Brian Gally System and method for protecting microelectromechanical systems array using structurally reinforced back-plate
US20080280398A1 (en) 2005-07-29 2008-11-13 Haluzak Charles C System And Method For Direct Bonding Of Substrates
US20090179287A1 (en) 2008-01-11 2009-07-16 Seiko Epson Corporation Functional device and manufacturing method thereof
US20090194309A1 (en) 2006-05-22 2009-08-06 Commissariat A Le-Energie Atomique Microcomponent Provided with a Cavity Delimited by a Cap with Enhanced Mechanical Resistance
WO2010049837A2 (en) 2008-10-29 2010-05-06 Nxp B.V. An integrated component and a method of manufacturing an integrated component
US20120049390A1 (en) 2010-08-25 2012-03-01 Kabushiki Kaisha Toshiba Electrical component and method of manufacturing the same
US20120248553A1 (en) 2009-11-19 2012-10-04 Dai Nippon Printing Co., Ltd. Sensor device and manufacturing method thereof
DE102011103516A1 (de) 2011-06-03 2012-12-06 Epcos Ag Verfahren zum Befüllen eines Hohlraums mit einer Atmosphäre

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US6087638A (en) * 1997-07-15 2000-07-11 Silverbrook Research Pty Ltd Corrugated MEMS heater structure
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Publication number Priority date Publication date Assignee Title
DE10006035A1 (de) 2000-02-10 2001-08-16 Bosch Gmbh Robert Verfahren zur Herstellung eines mikromechanischen Bauelements sowie ein nach dem Verfahren hergestelltes Bauelement
WO2003085448A1 (en) 2002-04-04 2003-10-16 Samsung Electronics Co., Ltd. Method for manufacturing thin film transistor array panel for display device
US20060076648A1 (en) 2004-09-27 2006-04-13 Brian Gally System and method for protecting microelectromechanical systems array using structurally reinforced back-plate
US20080280398A1 (en) 2005-07-29 2008-11-13 Haluzak Charles C System And Method For Direct Bonding Of Substrates
US20090194309A1 (en) 2006-05-22 2009-08-06 Commissariat A Le-Energie Atomique Microcomponent Provided with a Cavity Delimited by a Cap with Enhanced Mechanical Resistance
US20090179287A1 (en) 2008-01-11 2009-07-16 Seiko Epson Corporation Functional device and manufacturing method thereof
WO2010049837A2 (en) 2008-10-29 2010-05-06 Nxp B.V. An integrated component and a method of manufacturing an integrated component
US20120248553A1 (en) 2009-11-19 2012-10-04 Dai Nippon Printing Co., Ltd. Sensor device and manufacturing method thereof
US20120049390A1 (en) 2010-08-25 2012-03-01 Kabushiki Kaisha Toshiba Electrical component and method of manufacturing the same
DE102011103516A1 (de) 2011-06-03 2012-12-06 Epcos Ag Verfahren zum Befüllen eines Hohlraums mit einer Atmosphäre

Also Published As

Publication number Publication date
DE102014112672A1 (de) 2016-03-03
JP2017527448A (ja) 2017-09-21
MX2017002903A (es) 2018-03-27
CN106715326A (zh) 2017-05-24
EP3189589A1 (de) 2017-07-12
US11180364B2 (en) 2021-11-23
US20170267519A1 (en) 2017-09-21
KR20170046780A (ko) 2017-05-02
EP3189589B1 (de) 2020-11-11
KR102493250B1 (ko) 2023-01-27
ES2851385T3 (es) 2021-09-06
WO2016034456A1 (de) 2016-03-10
BR112017004373A2 (pt) 2017-12-05
JP6704902B2 (ja) 2020-06-03
HUE052699T2 (hu) 2021-05-28
CN106715326B (zh) 2021-02-02

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