ES2383928T3 - Procedimiento y sistema para formar un lingote de silicio usando una materia prima de silicio de bajo grado - Google Patents
Procedimiento y sistema para formar un lingote de silicio usando una materia prima de silicio de bajo grado Download PDFInfo
- Publication number
- ES2383928T3 ES2383928T3 ES08796655T ES08796655T ES2383928T3 ES 2383928 T3 ES2383928 T3 ES 2383928T3 ES 08796655 T ES08796655 T ES 08796655T ES 08796655 T ES08796655 T ES 08796655T ES 2383928 T3 ES2383928 T3 ES 2383928T3
- Authority
- ES
- Spain
- Prior art keywords
- silicon
- molten
- generally
- amount
- volume
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 315
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 306
- 239000010703 silicon Substances 0.000 title claims abstract description 306
- 238000000034 method Methods 0.000 title claims abstract description 100
- 239000002994 raw material Substances 0.000 title claims abstract description 39
- 230000008569 process Effects 0.000 claims abstract description 69
- 238000007711 solidification Methods 0.000 claims abstract description 30
- 230000008023 solidification Effects 0.000 claims abstract description 30
- 239000012535 impurity Substances 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 18
- 239000007789 gas Substances 0.000 claims description 15
- 238000002425 crystallisation Methods 0.000 claims description 10
- 230000008025 crystallization Effects 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 7
- 230000006911 nucleation Effects 0.000 claims description 7
- 238000010899 nucleation Methods 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 230000007246 mechanism Effects 0.000 claims description 4
- 230000007847 structural defect Effects 0.000 claims description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 230000008030 elimination Effects 0.000 claims description 3
- 238000003379 elimination reaction Methods 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 230000009466 transformation Effects 0.000 claims description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims description 2
- 239000000460 chlorine Substances 0.000 claims description 2
- 229910052801 chlorine Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 claims 1
- 239000001569 carbon dioxide Substances 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 description 28
- 230000004927 fusion Effects 0.000 description 23
- 230000008018 melting Effects 0.000 description 22
- 238000002844 melting Methods 0.000 description 22
- 239000004065 semiconductor Substances 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 230000008901 benefit Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 150000003376 silicon Chemical class 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 8
- 238000001816 cooling Methods 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 7
- 230000009467 reduction Effects 0.000 description 6
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 230000006872 improvement Effects 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 229910052723 transition metal Inorganic materials 0.000 description 3
- 150000003624 transition metals Chemical class 0.000 description 3
- 206010001497 Agitation Diseases 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000013019 agitation Methods 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000007499 fusion processing Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 150000002843 nonmetals Chemical class 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000000135 prohibitive effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
Landscapes
- Silicon Compounds (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/828,734 US7955433B2 (en) | 2007-07-26 | 2007-07-26 | Method and system for forming a silicon ingot using a low-grade silicon feedstock |
| US828734 | 2007-07-26 | ||
| PCT/US2008/071234 WO2009015356A1 (en) | 2007-07-26 | 2008-07-25 | Method and system for forming a silicon ingot using a low-grade silicon feedstock |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2383928T3 true ES2383928T3 (es) | 2012-06-27 |
Family
ID=40281853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES08796655T Active ES2383928T3 (es) | 2007-07-26 | 2008-07-25 | Procedimiento y sistema para formar un lingote de silicio usando una materia prima de silicio de bajo grado |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7955433B2 (Direct) |
| EP (1) | EP2179078B1 (Direct) |
| JP (1) | JP5462988B2 (Direct) |
| CN (1) | CN102037163B (Direct) |
| AT (1) | ATE548487T1 (Direct) |
| ES (1) | ES2383928T3 (Direct) |
| WO (1) | WO2009015356A1 (Direct) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7955433B2 (en) * | 2007-07-26 | 2011-06-07 | Calisolar, Inc. | Method and system for forming a silicon ingot using a low-grade silicon feedstock |
| CN102123945B (zh) * | 2008-08-15 | 2013-08-07 | 株式会社爱发科 | 硅精制方法 |
| WO2010036807A1 (en) * | 2008-09-24 | 2010-04-01 | The Board Of Trustees Of The University Of Illinois | Arrays of ultrathin silicon solar microcells |
| US20100213643A1 (en) * | 2009-02-26 | 2010-08-26 | Gadgil Prasad N | Rapid synthesis of polycrystalline silicon sheets for photo-voltaic solar cell manufacturing |
| TWI379430B (en) * | 2009-04-16 | 2012-12-11 | Atomic Energy Council | A method of fabricating a thin interface for internal light reflection and impurities isolation |
| CN101575733B (zh) * | 2009-05-22 | 2011-07-27 | 北京航空航天大学 | 一种工业化生产太阳能级多晶硅的方法 |
| CN101775650B (zh) * | 2010-03-12 | 2013-01-30 | 厦门大学 | 一种太阳能多晶硅铸锭的制备方法 |
| CN102021650B (zh) * | 2010-12-31 | 2012-06-06 | 常州天合光能有限公司 | 一种大型多晶锭的生产方法 |
| KR20140017604A (ko) * | 2011-03-15 | 2014-02-11 | 지티에이티 코포레이션 | 결정성장 장치용 자동 비전 시스템 |
| JP5512647B2 (ja) * | 2011-12-22 | 2014-06-04 | シャープ株式会社 | シリコンの精製方法、吸収ユニット、およびシリコン精製装置 |
| CN103266351B (zh) * | 2013-05-31 | 2015-08-12 | 大连理工大学 | 多晶硅铸锭硅固液分离方法及设备 |
| US10402360B2 (en) * | 2016-06-10 | 2019-09-03 | Johnson Controls Technology Company | Building management system with automatic equipment discovery and equipment model distribution |
| JP7052645B2 (ja) * | 2018-08-29 | 2022-04-12 | 信越半導体株式会社 | 単結晶育成方法 |
| JP6919633B2 (ja) | 2018-08-29 | 2021-08-18 | 信越半導体株式会社 | 単結晶育成方法 |
| US20220212937A1 (en) * | 2019-04-30 | 2022-07-07 | Wacker Chemie Ag | Method for refining crude silicon melts using a particulate mediator |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3012865A (en) * | 1957-11-25 | 1961-12-12 | Du Pont | Silicon purification process |
| DE2143112A1 (de) * | 1971-08-27 | 1973-03-01 | Siemens Ag | Verfahren zur erzielung eines gleichmaessigen radialen widerstandsverlaufs beim herstellen eines halbleiter-einkristallstabes durch tiegelfreies zonenschmelzen |
| SU661966A1 (ru) * | 1976-11-23 | 1980-04-05 | Всесоюзный Научно-Исследовательский Институт Монокристаллов И Особо Чистых Химических Веществ "Вниимонокристалл" | Устройство дл выт гивани монокристаллов из расплава |
| FR2430917A1 (fr) * | 1978-07-11 | 1980-02-08 | Comp Generale Electricite | Procede et dispositif d'elaboration de silicium polycristallin |
| JPS5933554B2 (ja) * | 1982-08-19 | 1984-08-16 | 株式会社東芝 | 結晶成長装置 |
| US4565671A (en) * | 1983-08-05 | 1986-01-21 | Kabushiki Kaisha Toshiba | Single crystal manufacturing apparatus |
| DE3411955A1 (de) | 1984-03-30 | 1985-10-10 | Siemens AG, 1000 Berlin und 8000 München | Verfahren und vorrichtung zum abtrennen fester bestandteile aus fluessigem silicium |
| EP0221051A1 (en) * | 1985-04-16 | 1987-05-13 | Energy Materials Corporation | Method and apparatus for growing single crystal bodies |
| JPS62291977A (ja) * | 1986-06-06 | 1987-12-18 | シ−メンス、アクチエンゲゼルシヤフト | 太陽電池用シリコン盤の切り出し方法と装置 |
| US5314667A (en) * | 1991-03-04 | 1994-05-24 | Lim John C | Method and apparatus for single crystal silicon production |
| US5580171A (en) * | 1995-07-24 | 1996-12-03 | Lim; John C. | Solids mixing, storing and conveying system for use with a furnace for single crystal silicon production |
| EP0796820B1 (en) * | 1996-03-19 | 2000-07-19 | Kawasaki Steel Corporation | Process and apparatus for refining silicon |
| JP3325900B2 (ja) * | 1996-10-14 | 2002-09-17 | 川崎製鉄株式会社 | 多結晶シリコンの製造方法及び装置、並びに太陽電池用シリコン基板の製造方法 |
| CA2232777C (en) | 1997-03-24 | 2001-05-15 | Hiroyuki Baba | Method for producing silicon for use in solar cells |
| JP3520957B2 (ja) * | 1997-06-23 | 2004-04-19 | シャープ株式会社 | 多結晶半導体インゴットの製造方法および装置 |
| DE60140507D1 (de) * | 2000-03-03 | 2009-12-31 | Shinetsu Handotai Kk | Schmelzenauffangschale in einem apparat zum herausziehen von einkristallen |
| FR2808809B1 (fr) | 2000-05-11 | 2003-06-27 | Emix | Installation de fabrication en continu de barreau de silicium multicristallin |
| JP3698080B2 (ja) * | 2001-09-11 | 2005-09-21 | 三菱住友シリコン株式会社 | 単結晶引上げ方法 |
| WO2003066523A1 (fr) * | 2002-02-04 | 2003-08-14 | Sharp Kabushiki Kaisha | Procede de purification du silicium, scories pour purifier le silicium et silicium purifie |
| US20060048698A1 (en) * | 2002-09-27 | 2006-03-09 | Ge Energy (Usa) Llc | Methods and systems for purifying elements |
| JP2004161575A (ja) * | 2002-11-15 | 2004-06-10 | Sumitomo Titanium Corp | 多結晶シリコンインゴット及び部材の製造方法 |
| US20050066881A1 (en) * | 2003-09-25 | 2005-03-31 | Canon Kabushiki Kaisha | Continuous production method for crystalline silicon and production apparatus for the same |
| US7635414B2 (en) * | 2003-11-03 | 2009-12-22 | Solaicx, Inc. | System for continuous growing of monocrystalline silicon |
| JP4947455B2 (ja) * | 2005-08-16 | 2012-06-06 | 則近 山内 | 電子ビームを用いたシリコンの精錬方法及び装置 |
| JP4817761B2 (ja) * | 2005-08-30 | 2011-11-16 | 京セラ株式会社 | 半導体インゴット及び太陽電池素子の製造方法 |
| US8262797B1 (en) * | 2007-03-13 | 2012-09-11 | Solaicx, Inc. | Weir design providing optimal purge gas flow, melt control, and temperature stabilization for improved single crystal growth in a continuous Czochralski process |
| US7955433B2 (en) | 2007-07-26 | 2011-06-07 | Calisolar, Inc. | Method and system for forming a silicon ingot using a low-grade silicon feedstock |
| US8475591B2 (en) * | 2008-08-15 | 2013-07-02 | Varian Semiconductor Equipment Associates, Inc. | Method of controlling a thickness of a sheet formed from a melt |
| US7998224B2 (en) * | 2008-10-21 | 2011-08-16 | Varian Semiconductor Equipment Associates, Inc. | Removal of a sheet from a production apparatus |
| US8652257B2 (en) * | 2010-02-22 | 2014-02-18 | Lev George Eidelman | Controlled gravity feeding czochralski apparatus with on the way melting raw material |
-
2007
- 2007-07-26 US US11/828,734 patent/US7955433B2/en not_active Expired - Fee Related
-
2008
- 2008-07-25 AT AT08796655T patent/ATE548487T1/de active
- 2008-07-25 WO PCT/US2008/071234 patent/WO2009015356A1/en not_active Ceased
- 2008-07-25 CN CN2008801096076A patent/CN102037163B/zh not_active Expired - Fee Related
- 2008-07-25 EP EP08796655A patent/EP2179078B1/en not_active Not-in-force
- 2008-07-25 ES ES08796655T patent/ES2383928T3/es active Active
- 2008-07-25 JP JP2010518420A patent/JP5462988B2/ja not_active Expired - Fee Related
-
2011
- 2011-02-25 US US13/034,956 patent/US8882912B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN102037163B (zh) | 2013-01-30 |
| US8882912B2 (en) | 2014-11-11 |
| EP2179078A1 (en) | 2010-04-28 |
| US7955433B2 (en) | 2011-06-07 |
| US20110211995A1 (en) | 2011-09-01 |
| EP2179078B1 (en) | 2012-03-07 |
| US20090028773A1 (en) | 2009-01-29 |
| ATE548487T1 (de) | 2012-03-15 |
| JP5462988B2 (ja) | 2014-04-02 |
| CN102037163A (zh) | 2011-04-27 |
| WO2009015356A1 (en) | 2009-01-29 |
| EP2179078A4 (en) | 2010-08-04 |
| JP2010534614A (ja) | 2010-11-11 |
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