ES2235540T3 - Suspension de oxido de cerio para pulir, procedimiento para perparar la suspension y procedimiento para pulir usando la suspension. - Google Patents

Suspension de oxido de cerio para pulir, procedimiento para perparar la suspension y procedimiento para pulir usando la suspension.

Info

Publication number
ES2235540T3
ES2235540T3 ES99959933T ES99959933T ES2235540T3 ES 2235540 T3 ES2235540 T3 ES 2235540T3 ES 99959933 T ES99959933 T ES 99959933T ES 99959933 T ES99959933 T ES 99959933T ES 2235540 T3 ES2235540 T3 ES 2235540T3
Authority
ES
Spain
Prior art keywords
suspension
cerium oxide
polishing
conductivity
cerium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES99959933T
Other languages
English (en)
Spanish (es)
Inventor
Takanori Showa Denko K. K. Shiojiri Works KIDO
Masayuki Sanbayashi
Fumio Showa Denko K. K. Shiojiri Works TSUJINO
Kagetaka Ichikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Application granted granted Critical
Publication of ES2235540T3 publication Critical patent/ES2235540T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
ES99959933T 1998-12-21 1999-12-21 Suspension de oxido de cerio para pulir, procedimiento para perparar la suspension y procedimiento para pulir usando la suspension. Expired - Lifetime ES2235540T3 (es)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP36270798 1998-12-21
JP36270798 1998-12-21
US13637199P 1999-05-26 1999-05-26
JP33110799 1999-11-22
JP33110799A JP3983949B2 (ja) 1998-12-21 1999-11-22 研磨用酸化セリウムスラリー、その製造法及び研磨方法

Publications (1)

Publication Number Publication Date
ES2235540T3 true ES2235540T3 (es) 2005-07-01

Family

ID=27340458

Family Applications (1)

Application Number Title Priority Date Filing Date
ES99959933T Expired - Lifetime ES2235540T3 (es) 1998-12-21 1999-12-21 Suspension de oxido de cerio para pulir, procedimiento para perparar la suspension y procedimiento para pulir usando la suspension.

Country Status (8)

Country Link
US (2) US6478836B1 (https=)
EP (1) EP1056816B1 (https=)
JP (1) JP3983949B2 (https=)
AT (1) ATE288949T1 (https=)
DE (1) DE69923666T2 (https=)
ES (1) ES2235540T3 (https=)
TW (1) TW531555B (https=)
WO (1) WO2000037578A1 (https=)

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KR100797218B1 (ko) * 1998-12-25 2008-01-23 히다치 가세고교 가부시끼가이샤 Ｃｍｐ 연마제, ｃｍｐ 연마제용 첨가액 및 기판의 연마방법
EP1201725A4 (en) * 1999-06-28 2007-09-12 Nissan Chemical Ind Ltd ABRASIVE COMPOUND FOR HARD DISK GLASS TRAY
KR100480760B1 (ko) 2000-10-02 2005-04-07 미쓰이 긴조꾸 고교 가부시키가이샤 세륨계 연마재 및 세륨계 연마재의 제조방법
US7037352B2 (en) * 2000-12-12 2006-05-02 Showa Denko Kabushiki Kaisha Polishing particle and method for producing polishing particle
EP1369906B1 (en) * 2001-02-20 2012-06-27 Hitachi Chemical Company, Ltd. Polishing compound and method for polishing substrate
TWI272249B (en) * 2001-02-27 2007-02-01 Nissan Chemical Ind Ltd Crystalline ceric oxide sol and process for producing the same
JP2002346912A (ja) * 2001-05-18 2002-12-04 Nippon Sheet Glass Co Ltd 情報記録媒体用ガラス基板及びその製造方法
KR100575442B1 (ko) * 2001-11-16 2006-05-03 쇼와 덴코 가부시키가이샤 세륨계 연마재 및 세륨계 연마재 슬러리
US7666239B2 (en) * 2001-11-16 2010-02-23 Ferro Corporation Hydrothermal synthesis of cerium-titanium oxide for use in CMP
KR100477939B1 (ko) * 2002-04-15 2005-03-18 주식회사 엘지화학 단결정 산화세륨 분말의 제조방법
JP2004066384A (ja) * 2002-08-06 2004-03-04 Kaoru Umeya ペースト状研磨工具及び研磨方法
KR100539983B1 (ko) * 2003-05-15 2006-01-10 학교법인 한양학원 Ｃｍｐ용 세리아 연마제 및 그 제조 방법
US20080219130A1 (en) * 2003-08-14 2008-09-11 Mempile Inc. C/O Phs Corporate Services, Inc. Methods and Apparatus for Formatting and Tracking Information for Three-Dimensional Storage Medium
US20070166216A1 (en) * 2003-09-12 2007-07-19 Hitachi Chemical Co., Ltd. Cerium salt, producing method thereof, cerium oxide and cerium based polishing slurry
JP2005138197A (ja) * 2003-11-04 2005-06-02 Fujimi Inc 研磨用組成物及び研磨方法
US20050108947A1 (en) * 2003-11-26 2005-05-26 Mueller Brian L. Compositions and methods for chemical mechanical polishing silica and silicon nitride
JP4974447B2 (ja) * 2003-11-26 2012-07-11 株式会社フジミインコーポレーテッド 研磨用組成物及び研磨方法
JP4546071B2 (ja) * 2003-12-10 2010-09-15 パナソニック株式会社 半導体装置の製造方法
CN1667026B (zh) 2004-03-12 2011-11-30 K.C.科技股份有限公司 抛光浆料及其制备方法和基板的抛光方法
TWI370843B (en) * 2004-03-16 2012-08-21 Samsung Corning Prec Mat Co Ceria slurry for polishing semiconductor thin layer
TWI283008B (en) * 2004-05-11 2007-06-21 K C Tech Co Ltd Slurry for CMP and method of producing the same
US20060021972A1 (en) * 2004-07-28 2006-02-02 Lane Sarah J Compositions and methods for chemical mechanical polishing silicon dioxide and silicon nitride
TWI273632B (en) * 2004-07-28 2007-02-11 K C Tech Co Ltd Polishing slurry, method of producing same, and method of polishing substrate
TWI323741B (en) * 2004-12-16 2010-04-21 K C Tech Co Ltd Abrasive particles, polishing slurry, and producing method thereof
JP5013671B2 (ja) * 2004-12-28 2012-08-29 日揮触媒化成株式会社 金属酸化物ゾルの製造方法および金属酸化物ゾル
KR100641348B1 (ko) * 2005-06-03 2006-11-03 주식회사 케이씨텍 Ｃｍｐ용 슬러리와 이의 제조 방법 및 기판의 연마 방법
AT502308B1 (de) * 2005-07-20 2010-03-15 Treibacher Ind Ag Glasschleifmittel auf ceroxidbasis und verfahren zu dessen herstellung
US7708904B2 (en) * 2005-09-09 2010-05-04 Saint-Gobain Ceramics & Plastics, Inc. Conductive hydrocarbon fluid
KR101103748B1 (ko) * 2005-09-27 2012-01-06 삼성코닝정밀소재 주식회사 반도체 박막 연마용 산화세륨 슬러리 및 이의 제조방법
WO2007069735A1 (ja) * 2005-12-15 2007-06-21 Mitsui Mining & Smelting Co., Ltd. 脱酸素剤及び脱酸素剤の製造方法
JP5237542B2 (ja) * 2006-10-03 2013-07-17 三井金属鉱業株式会社 酸化セリウム系研摩材
WO2009056153A1 (en) * 2007-10-30 2009-05-07 Pall Corporation Method and system for manufacturing wafer-like slices from a substrate material
JP5499556B2 (ja) * 2008-11-11 2014-05-21 日立化成株式会社 スラリ及び研磨液セット並びにこれらから得られるｃｍｐ研磨液を用いた基板の研磨方法及び基板
FI20095088L (fi) * 2009-02-02 2010-08-03 Lauri Ylikorpi Päällysteen poistoaine
US8859428B2 (en) 2012-10-19 2014-10-14 Air Products And Chemicals, Inc. Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof
CN104130714B (zh) * 2014-07-01 2015-10-28 蚌埠市高华电子有限公司 一种含有磨料的适用于金属的混合抛光液及其制备方法
EP3020689A1 (en) 2014-11-12 2016-05-18 Rhodia Operations Cerium oxide particles and method for production thereof

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JPS629739A (ja) * 1985-07-05 1987-01-17 Nissan Chem Ind Ltd 精密鋳型作製用結合剤
FR2604443A1 (fr) 1986-09-26 1988-04-01 Rhone Poulenc Chimie Composition de polissage a base de cerium destinee au polissage des verres organiques
US5266088A (en) * 1992-09-23 1993-11-30 Nicsand Water-based polish
JP3311203B2 (ja) * 1995-06-13 2002-08-05 株式会社東芝 半導体装置の製造方法及び半導体製造装置、半導体ウェーハの化学的機械的ポリッシング方法

Also Published As

Publication number Publication date
JP3983949B2 (ja) 2007-09-26
DE69923666T2 (de) 2005-11-17
JP2000239654A (ja) 2000-09-05
US6387139B1 (en) 2002-05-14
TW531555B (en) 2003-05-11
US20020032989A1 (en) 2002-03-21
EP1056816B1 (en) 2005-02-09
ATE288949T1 (de) 2005-02-15
EP1056816A1 (en) 2000-12-06
US6478836B1 (en) 2002-11-12
DE69923666D1 (de) 2005-03-17
WO2000037578A1 (en) 2000-06-29

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