ES2212364T3 - Procedimiento y dispositivo para la eliminacion de material de una superficie de una pieza. - Google Patents

Procedimiento y dispositivo para la eliminacion de material de una superficie de una pieza.

Info

Publication number
ES2212364T3
ES2212364T3 ES98952674T ES98952674T ES2212364T3 ES 2212364 T3 ES2212364 T3 ES 2212364T3 ES 98952674 T ES98952674 T ES 98952674T ES 98952674 T ES98952674 T ES 98952674T ES 2212364 T3 ES2212364 T3 ES 2212364T3
Authority
ES
Spain
Prior art keywords
machining
laser beam
field
positioning
relative position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES98952674T
Other languages
English (en)
Spanish (es)
Inventor
Peter Wrba
Peter Hildebrand
Michael Kuhl
Martin Reisacher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lasertec GmbH
Original Assignee
Lasertec GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lasertec GmbH filed Critical Lasertec GmbH
Application granted granted Critical
Publication of ES2212364T3 publication Critical patent/ES2212364T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
ES98952674T 1998-09-30 1998-09-30 Procedimiento y dispositivo para la eliminacion de material de una superficie de una pieza. Expired - Lifetime ES2212364T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP1998/006217 WO2000018535A1 (de) 1998-09-30 1998-09-30 Verfahren und vorrichtung zur materialabtragung aus einer fläche eines werkstücks

Publications (1)

Publication Number Publication Date
ES2212364T3 true ES2212364T3 (es) 2004-07-16

Family

ID=8167079

Family Applications (1)

Application Number Title Priority Date Filing Date
ES98952674T Expired - Lifetime ES2212364T3 (es) 1998-09-30 1998-09-30 Procedimiento y dispositivo para la eliminacion de material de una superficie de una pieza.

Country Status (6)

Country Link
US (1) US6670575B1 (enExample)
EP (1) EP1117503B1 (enExample)
JP (1) JP4156805B2 (enExample)
DE (1) DE59810296D1 (enExample)
ES (1) ES2212364T3 (enExample)
WO (1) WO2000018535A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10032981A1 (de) * 2000-07-10 2002-01-24 Alltec Angewandte Laser Licht Verfahren zur Materialbearbeitung mittels Laser
DE10228743B4 (de) * 2002-06-27 2005-05-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Glätten und Polieren von Oberflächen durch Bearbeitung mit Laserstrahlung
US7038166B2 (en) * 2003-03-18 2006-05-02 Loma Linda University Medical Center Containment plenum for laser irradiation and removal of material from a surface of a structure
US7057134B2 (en) * 2003-03-18 2006-06-06 Loma Linda University Medical Center Laser manipulation system for controllably moving a laser head for irradiation and removal of material from a surface of a structure
US7880116B2 (en) * 2003-03-18 2011-02-01 Loma Linda University Medical Center Laser head for irradiation and removal of material from a surface of a structure
US7379483B2 (en) * 2003-03-18 2008-05-27 Loma Linda University Medical Center Method and apparatus for material processing
US7060932B2 (en) * 2003-03-18 2006-06-13 Loma Linda University Medical Center Method and apparatus for material processing
US7286223B2 (en) * 2003-03-18 2007-10-23 Loma Linda University Medical Center Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light
DE10317322B4 (de) * 2003-04-15 2007-01-25 Lasertec Gmbh Verfahren und Vorrichtung zur Ermittlung der Abtragsleistung eines Laserstrahls und zur Herstellung eines Gesenks in einem Werkstück
DE10317579B4 (de) * 2003-04-16 2016-04-14 Lasertec Gmbh Verfahren und Vorrichtung zur Herstellung eines Gesenks in einem Werkstück
DE10324439B4 (de) * 2003-05-28 2008-01-31 Lasertec Gmbh Verfahren und Vorrichtung zur Herstellung eines Gesenks
DE10352402B4 (de) * 2003-11-10 2015-12-17 Lasertec Gmbh Laserbearbeitungsmaschine und Laserbearbeitungsverfahren
DE102004013475B4 (de) * 2004-03-18 2007-01-25 Lasertec Gmbh Verfahren und Vorrichtung zum Abtragen von Material
MX2008001323A (es) * 2005-07-27 2008-09-19 Power Med Interventions Inc Sistema y metodo para formar sobres de grapas en una engrapadora quirurgica.
DE102007012816B4 (de) 2007-03-16 2009-12-03 Sauer Gmbh Lasertec Verfahren und Vorrichtung zur Werkstückbearbeitung
CN104275552A (zh) * 2013-07-10 2015-01-14 苏州矽微电子科技有限公司 激光器去除集成电路塑封膜的用途
DE102013217783A1 (de) 2013-09-05 2015-03-05 Sauer Gmbh Lasertec Verfahren zur Bearbeitung eines Werkstücks mittels eines Laserstrahls, Laserwerkzeug, Lasermaschine, Maschinensteuerung
CN103769749B (zh) * 2013-12-30 2016-10-19 德中（天津）技术发展有限公司 一种在覆金属箔绝缘基板上制作导电图案的方法
DE102014220525A1 (de) * 2014-10-09 2016-04-14 Siemens Aktiengesellschaft Abtragstrategie beim Lasern

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4154530A (en) * 1977-12-22 1979-05-15 National Semiconductor Corporation Laser beam error correcting process
US5095190A (en) * 1987-03-03 1992-03-10 Canon Kabushiki Kaisha Exposure apparatus
US4914270A (en) 1988-11-08 1990-04-03 University Of Southern California Method and apparatus for shaping articles using a laser beam
EP0407969B1 (de) * 1989-07-14 1993-10-06 MAHO Aktiengesellschaft Verfahren und Vorrichtung zum Herstellen von Hohlräumen in Werkstücken mittels Laserstrahls
US5140128A (en) * 1990-05-03 1992-08-18 General Electric Company Method and system for providing elements of composite objects
JPH04100689A (ja) * 1990-08-14 1992-04-02 Tsubakimoto Chain Co レーザ加工機用５軸テーブル
JPH0487294U (enExample) * 1990-12-12 1992-07-29
JP2798530B2 (ja) * 1991-07-26 1998-09-17 三菱電機株式会社 レーザ加工機
DE4209933C2 (de) 1992-03-27 1994-08-11 Foba Formenbau Gmbh Verfahren für den Formabtrag an einem Werkstück durch Laserstrahlverdampfung des Werkstoffes mit einem cw-Nd:YAG-Laser
JPH06304769A (ja) * 1993-04-20 1994-11-01 Iida Kogyo Kk レーザ彫刻加工方法
JP3077539B2 (ja) * 1994-12-22 2000-08-14 松下電器産業株式会社 レーザ加工方法
JPH10242617A (ja) * 1997-02-28 1998-09-11 Murata Mfg Co Ltd セラミックグリーンシートの加工方法及びレーザ加工装置

Also Published As

Publication number Publication date
WO2000018535A1 (de) 2000-04-06
DE59810296D1 (de) 2004-01-08
JP4156805B2 (ja) 2008-09-24
JP2003517375A (ja) 2003-05-27
US6670575B1 (en) 2003-12-30
EP1117503A1 (de) 2001-07-25
EP1117503B1 (de) 2003-11-26

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