JP4156805B2 - 工作物の表面から物質を除去するための方法および装置 - Google Patents

工作物の表面から物質を除去するための方法および装置 Download PDF

Info

Publication number
JP4156805B2
JP4156805B2 JP2000572045A JP2000572045A JP4156805B2 JP 4156805 B2 JP4156805 B2 JP 4156805B2 JP 2000572045 A JP2000572045 A JP 2000572045A JP 2000572045 A JP2000572045 A JP 2000572045A JP 4156805 B2 JP4156805 B2 JP 4156805B2
Authority
JP
Japan
Prior art keywords
workpiece
laser beam
area
machining
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000572045A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003517375A5 (enExample
JP2003517375A (ja
Inventor
ヴルバ、ペテル
ヒルデブランド、ペテル
クール、ミハエル
ライザヘル、マルチン
Original Assignee
レーザーテク ゲーエムベーハー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by レーザーテク ゲーエムベーハー filed Critical レーザーテク ゲーエムベーハー
Publication of JP2003517375A publication Critical patent/JP2003517375A/ja
Publication of JP2003517375A5 publication Critical patent/JP2003517375A5/ja
Application granted granted Critical
Publication of JP4156805B2 publication Critical patent/JP4156805B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2000572045A 1998-09-30 1998-09-30 工作物の表面から物質を除去するための方法および装置 Expired - Lifetime JP4156805B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP1998/006217 WO2000018535A1 (de) 1998-09-30 1998-09-30 Verfahren und vorrichtung zur materialabtragung aus einer fläche eines werkstücks

Publications (3)

Publication Number Publication Date
JP2003517375A JP2003517375A (ja) 2003-05-27
JP2003517375A5 JP2003517375A5 (enExample) 2005-12-22
JP4156805B2 true JP4156805B2 (ja) 2008-09-24

Family

ID=8167079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000572045A Expired - Lifetime JP4156805B2 (ja) 1998-09-30 1998-09-30 工作物の表面から物質を除去するための方法および装置

Country Status (6)

Country Link
US (1) US6670575B1 (enExample)
EP (1) EP1117503B1 (enExample)
JP (1) JP4156805B2 (enExample)
DE (1) DE59810296D1 (enExample)
ES (1) ES2212364T3 (enExample)
WO (1) WO2000018535A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10032981A1 (de) * 2000-07-10 2002-01-24 Alltec Angewandte Laser Licht Verfahren zur Materialbearbeitung mittels Laser
DE10228743B4 (de) * 2002-06-27 2005-05-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Glätten und Polieren von Oberflächen durch Bearbeitung mit Laserstrahlung
US7057134B2 (en) 2003-03-18 2006-06-06 Loma Linda University Medical Center Laser manipulation system for controllably moving a laser head for irradiation and removal of material from a surface of a structure
US7286223B2 (en) * 2003-03-18 2007-10-23 Loma Linda University Medical Center Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light
US7379483B2 (en) * 2003-03-18 2008-05-27 Loma Linda University Medical Center Method and apparatus for material processing
US7038166B2 (en) * 2003-03-18 2006-05-02 Loma Linda University Medical Center Containment plenum for laser irradiation and removal of material from a surface of a structure
US7060932B2 (en) * 2003-03-18 2006-06-13 Loma Linda University Medical Center Method and apparatus for material processing
US7880116B2 (en) * 2003-03-18 2011-02-01 Loma Linda University Medical Center Laser head for irradiation and removal of material from a surface of a structure
DE10317322B4 (de) * 2003-04-15 2007-01-25 Lasertec Gmbh Verfahren und Vorrichtung zur Ermittlung der Abtragsleistung eines Laserstrahls und zur Herstellung eines Gesenks in einem Werkstück
DE10317579B4 (de) * 2003-04-16 2016-04-14 Lasertec Gmbh Verfahren und Vorrichtung zur Herstellung eines Gesenks in einem Werkstück
DE10324439B4 (de) * 2003-05-28 2008-01-31 Lasertec Gmbh Verfahren und Vorrichtung zur Herstellung eines Gesenks
DE10352402B4 (de) * 2003-11-10 2015-12-17 Lasertec Gmbh Laserbearbeitungsmaschine und Laserbearbeitungsverfahren
DE102004013475B4 (de) * 2004-03-18 2007-01-25 Lasertec Gmbh Verfahren und Vorrichtung zum Abtragen von Material
US8008598B2 (en) * 2005-07-27 2011-08-30 Tyco Healthcare Group Lp Method for forming staple pockets of a surgical stapler
DE102007012816B4 (de) 2007-03-16 2009-12-03 Sauer Gmbh Lasertec Verfahren und Vorrichtung zur Werkstückbearbeitung
CN104275552A (zh) * 2013-07-10 2015-01-14 苏州矽微电子科技有限公司 激光器去除集成电路塑封膜的用途
DE102013217783A1 (de) 2013-09-05 2015-03-05 Sauer Gmbh Lasertec Verfahren zur Bearbeitung eines Werkstücks mittels eines Laserstrahls, Laserwerkzeug, Lasermaschine, Maschinensteuerung
CN103769749B (zh) * 2013-12-30 2016-10-19 德中（天津）技术发展有限公司 一种在覆金属箔绝缘基板上制作导电图案的方法
DE102014220525A1 (de) * 2014-10-09 2016-04-14 Siemens Aktiengesellschaft Abtragstrategie beim Lasern

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4154530A (en) * 1977-12-22 1979-05-15 National Semiconductor Corporation Laser beam error correcting process
US5095190A (en) * 1987-03-03 1992-03-10 Canon Kabushiki Kaisha Exposure apparatus
US4914270A (en) 1988-11-08 1990-04-03 University Of Southern California Method and apparatus for shaping articles using a laser beam
DE59002985D1 (de) * 1989-07-14 1993-11-11 Maho Ag Verfahren und Vorrichtung zum Herstellen von Hohlräumen in Werkstücken mittels Laserstrahls.
US5140128A (en) * 1990-05-03 1992-08-18 General Electric Company Method and system for providing elements of composite objects
JPH04100689A (ja) * 1990-08-14 1992-04-02 Tsubakimoto Chain Co レーザ加工機用５軸テーブル
JPH0487294U (enExample) * 1990-12-12 1992-07-29
JP2798530B2 (ja) * 1991-07-26 1998-09-17 三菱電機株式会社 レーザ加工機
DE4209933C2 (de) 1992-03-27 1994-08-11 Foba Formenbau Gmbh Verfahren für den Formabtrag an einem Werkstück durch Laserstrahlverdampfung des Werkstoffes mit einem cw-Nd:YAG-Laser
JPH06304769A (ja) * 1993-04-20 1994-11-01 Iida Kogyo Kk レーザ彫刻加工方法
JP3077539B2 (ja) * 1994-12-22 2000-08-14 松下電器産業株式会社 レーザ加工方法
JPH10242617A (ja) * 1997-02-28 1998-09-11 Murata Mfg Co Ltd セラミックグリーンシートの加工方法及びレーザ加工装置

Also Published As

Publication number Publication date
US6670575B1 (en) 2003-12-30
ES2212364T3 (es) 2004-07-16
DE59810296D1 (de) 2004-01-08
WO2000018535A1 (de) 2000-04-06
JP2003517375A (ja) 2003-05-27
EP1117503A1 (de) 2001-07-25
EP1117503B1 (de) 2003-11-26

Similar Documents

Publication Publication Date Title
JP4156805B2 (ja) 工作物の表面から物質を除去するための方法および装置
JP6137767B2 (ja) 半完成品の表面形成用レーザ加工装置及び方法
JP5985834B2 (ja) 切替え可能なレーザシステムを有するレーザ加工装置及びレーザ加工方法
US8143552B2 (en) Laser beam machining system
CN100396424C (zh) 激光加工设备、加工方法及利用其制造电路板的方法
EP3511106B1 (en) Laser based machining of glass material
JP2004514053A (ja) 電磁放射線束によって焼結、物質除去および／またはラベリングを行う装置およびその装置を操作する方法
JP2004528991A (ja) レーザーによる部分加工
JP2001105164A (ja) レーザ穴あけ加工方法及び加工装置
KR20140029516A (ko) 피가공물 가공, 특히 절삭공구 제조 방법 및 장치
KR102410764B1 (ko) 프린트 기판의 레이저 가공 방법 및 프린트 기판의 레이저 가공기
KR101322845B1 (ko) 레이저 가공장치
JP2021115625A (ja) 積層造形装置、積層造形方法及び加工経路生成方法
CN111432976B (zh) 用于通过流体射流引导的激光束使工件3d成形的设备
JP4161178B2 (ja) 切断加工方法
US20240424608A1 (en) Laser Machining Method and Device
EP1525069B1 (en) System and method of laser drilling using a continuously optimized depth of focus
JPH09267187A (ja) レーザ加工方法
JP2623355B2 (ja) レーザ加工方法およびレーザ加工装置
JP2000263268A (ja) レーザ加工装置及びその装置を用いて加工する方法
KR100664573B1 (ko) 레이저 가공 장치 및 방법
JPH04237585A (ja) レーザ切断装置およびレーザ切断方法
JP2003251482A (ja) レーザ加工方法およびその装置
EP3685954B1 (en) Method for cutting a workpiece with a complex fluid-jet-guided laser beam
JPH07328879A (ja) 焼入れ機能付きマシニングセンタ

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040825

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040825

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20051124

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20051202

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20060302

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20060309

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060523

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060905

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061129

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070810

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080624

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080710

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110718

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110718

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120718

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120718

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130718

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term