ES2078390T3 - Agente y metodo de eliminacion de fundentes de soldadura a base de colofonia. - Google Patents

Agente y metodo de eliminacion de fundentes de soldadura a base de colofonia.

Info

Publication number
ES2078390T3
ES2078390T3 ES91110600T ES91110600T ES2078390T3 ES 2078390 T3 ES2078390 T3 ES 2078390T3 ES 91110600 T ES91110600 T ES 91110600T ES 91110600 T ES91110600 T ES 91110600T ES 2078390 T3 ES2078390 T3 ES 2078390T3
Authority
ES
Spain
Prior art keywords
elevated
tin
colophony
elimination
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91110600T
Other languages
English (en)
Inventor
Machio Chihara
Jiro Mizuya
Tatsuya Okumura
Takashi Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arakawa Chemical Industries Ltd
Original Assignee
Arakawa Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arakawa Chemical Industries Ltd filed Critical Arakawa Chemical Industries Ltd
Application granted granted Critical
Publication of ES2078390T3 publication Critical patent/ES2078390T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/66—Non-ionic compounds
    • C11D1/83—Mixtures of non-ionic with anionic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/02—Anionic compounds
    • C11D1/34—Derivatives of acids of phosphorus
    • C11D1/345—Phosphates or phosphites
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2068—Ethers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/24—Cleaning or pickling metallic material with solutions or molten salts with neutral solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
    • C23G5/032—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing oxygen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/66—Non-ionic compounds
    • C11D1/72—Ethers of polyoxyalkylene glycols
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Detergent Compositions (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

ESTA INVENCION SUMINISTRA UN AGENTE LIMPIADOR PARA QUITAR FUNDENTE DE ESTAÑOSOLDAR DE BASE DE RESINA. EL AGENTE LIMPIADOR CONSTA DE UNA MEZCLA DE: (A) AL MENOS UN COMPUESTO DE ETER GLICOL DE FORMULA (1) DONDE R ELEVADO 1 ES UN ATOMO DE HIDROGENO O UN GRUPO ALQUILO CON DE 1 A 5 ATOMOS DE CARBONO; R ELEVADO 2 ES UN GRUPO ALQUILO CON DE 1 A 5 ATOMOS DE CARBONO; R ELEVADO 3 ES UN ATOMO DE HIDROGENO O UN GRUPO METILO, Y K ES UN NUMERO DE 2 A 4. (B) ES AL MENOS UN SURFACTANTE NO-IONICO, Y (C) ES AL MENOS UN SURFACTANTE ANIONICO DE FOSFATO. TAMBIEN SE SUMINISTRA UN METODO PARA LIMPIAR EL FUNDENTE DE ESTAÑOSOLDAR DE BASE DE RESINA, METODO QUE COMPRENDE LA MEZCLA DEL COMPONENTE ANTERIORMENTE DESCRITO CON EL FUNDENTE DE ESTAÑOSOLDAR DE BASE DE RESINA.
ES91110600T 1990-06-27 1991-06-26 Agente y metodo de eliminacion de fundentes de soldadura a base de colofonia. Expired - Lifetime ES2078390T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2170657A JPH0457899A (ja) 1990-06-27 1990-06-27 ロジン系ハンダフラックスの洗浄剤および該洗浄剤を用いてなるロジン系ハンダフラックスの洗浄方法

Publications (1)

Publication Number Publication Date
ES2078390T3 true ES2078390T3 (es) 1995-12-16

Family

ID=15908948

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91110600T Expired - Lifetime ES2078390T3 (es) 1990-06-27 1991-06-26 Agente y metodo de eliminacion de fundentes de soldadura a base de colofonia.

Country Status (7)

Country Link
US (1) US5256209A (es)
EP (1) EP0464652B1 (es)
JP (1) JPH0457899A (es)
KR (1) KR100241565B1 (es)
DE (1) DE69113139T2 (es)
ES (1) ES2078390T3 (es)
PT (1) PT98099A (es)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2610552B2 (ja) * 1991-10-04 1997-05-14 花王株式会社 洗浄方法
JPH0625878A (ja) * 1992-03-27 1994-02-01 Sanyo Chem Ind Ltd 金属表面用洗浄剤組成物
JP2652298B2 (ja) * 1992-04-30 1997-09-10 花王株式会社 精密部品又は治工具類用洗浄剤組成物
JP2893497B2 (ja) * 1992-04-30 1999-05-24 花王株式会社 精密部品又は治工具類用洗浄剤組成物
US5547601A (en) * 1992-09-09 1996-08-20 Jnj Industries, Inc. CFC-free solvent for solvating solder flux
KR970007329B1 (ko) * 1993-09-17 1997-05-07 마쯔시다덴기산교 가부시기가이샤 납땜플럭스제거용 세정제조성물
DE4411677C1 (de) * 1994-04-05 1995-10-26 Mtu Muenchen Gmbh Verfahren zum Entfernen organischer Materialien von Triebwerkskomponenten
JP2813862B2 (ja) * 1994-07-05 1998-10-22 荒川化学工業株式会社 洗浄剤組成物
MXPA01005351A (es) * 1998-11-25 2003-03-27 Petroferm Inc Composicion acuosa de limpieza.
US7238653B2 (en) * 2003-03-10 2007-07-03 Hynix Semiconductor Inc. Cleaning solution for photoresist and method for forming pattern using the same
US8372792B2 (en) 2007-08-08 2013-02-12 Arakawa Chemical Industries, Ltd. Cleaner composition for removing lead-free soldering flux, and method for removing lead-free soldering flux
JP5556658B2 (ja) 2008-08-27 2014-07-23 荒川化学工業株式会社 鉛フリーはんだフラックス除去用洗浄剤組成物および鉛フリーはんだフラックス除去システム
JP5857740B2 (ja) 2009-09-03 2016-02-10 荒川化学工業株式会社 鉛フリーハンダ水溶性フラックス除去用洗浄剤、除去方法及び洗浄方法
US8070045B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Curable amine flux composition and method of soldering
US8070046B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Amine flux composition and method of soldering
JP5696981B2 (ja) * 2011-09-02 2015-04-08 荒川化学工業株式会社 はんだ付けフラックス用洗浄剤組成物
US9051507B2 (en) * 2012-03-23 2015-06-09 Intevep, S.A. Completion fluid
US9277638B2 (en) * 2013-03-14 2016-03-01 Raytheon Company Gum rosin protective coating and methods of use
CN104294297A (zh) * 2014-09-30 2015-01-21 苏州长盛机电有限公司 一种水基金属清洗剂及其制备方法
CN108929808B (zh) 2017-05-26 2020-11-27 荒川化学工业株式会社 无铅软钎料焊剂用清洗剂组合物、无铅软钎料焊剂的清洗方法
WO2020116534A1 (ja) * 2018-12-05 2020-06-11 花王株式会社 フラックス残渣の洗浄

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE858485C (de) * 1943-03-18 1952-12-08 American Chem Paint Co Reinigungsmittel fuer Metalloberflaechen
DE3161446D1 (en) * 1980-02-05 1983-12-29 Kao Corp Creamy cleansing compositions
US4493782A (en) * 1983-07-07 1985-01-15 Amchem Products, Inc. Cleansing compositions comprising ethoxylated alcohol monoesters of phosphoric acid
US4640719A (en) * 1985-07-01 1987-02-03 Petroleum Fermentations N.V. Method for printed circuit board and/or printed wiring board cleaning
DE3541535A1 (de) * 1985-11-25 1987-05-27 Henkel Kgaa Verwendung von polyglykoldialkylethern als viskositaetsregler fuer waessrige aniontensidloesungen
EP0294574A3 (de) * 1987-06-06 1989-04-26 Degussa Aktiengesellschaft Wässrige stabile Suspension wasserunlöslicher zum Binden von Calciumionen befähigter Silikate und deren Verwendung zur Herstellung von Wasch- und Reinigungsmitteln
US4983224A (en) * 1988-10-28 1991-01-08 Rd Chemical Company Cleaning compositions and methods for removing soldering flux
ES2059890T3 (es) * 1989-11-08 1994-11-16 Arakawa Chem Ind Agente y metodo para eliminar fundentes a base de colofonia para soldeo por estañado.

Also Published As

Publication number Publication date
PT98099A (pt) 1992-05-29
KR920000973A (ko) 1992-01-29
EP0464652B1 (en) 1995-09-20
KR100241565B1 (ko) 2000-03-02
US5256209A (en) 1993-10-26
DE69113139T2 (de) 1996-05-02
DE69113139D1 (de) 1995-10-26
JPH0457899A (ja) 1992-02-25
EP0464652A1 (en) 1992-01-08

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