ES2038151T3 - Control de banos de metalizacion sin electricidad. - Google Patents

Control de banos de metalizacion sin electricidad.

Info

Publication number
ES2038151T3
ES2038151T3 ES198787115717T ES87115717T ES2038151T3 ES 2038151 T3 ES2038151 T3 ES 2038151T3 ES 198787115717 T ES198787115717 T ES 198787115717T ES 87115717 T ES87115717 T ES 87115717T ES 2038151 T3 ES2038151 T3 ES 2038151T3
Authority
ES
Spain
Prior art keywords
control
electricity
solution
metalization
baths
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES198787115717T
Other languages
English (en)
Inventor
John K. Duffy
Milan Paunovic
Stephen M. Christian
John F. Mccormack
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AMP Akzo Corp
Original Assignee
AMP Akzo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Akzo Corp filed Critical AMP Akzo Corp
Application granted granted Critical
Publication of ES2038151T3 publication Critical patent/ES2038151T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

SE PRESENTA UN METODO PARA ANALIZAR Y CONTROLAR UNA SOLUCION DE BAÑO PARA DEPOSITOS METALICOS NO ELECTROLITICOS. DICHO METODO PERMITE EL ANALISIS Y CONTROL DE LOS CONSTITUYENTES DEL BAÑO SIN TOMAR MUESTRAS, DIRECTAMENTE DENTRO DE LA SOLUCION EN FUNCIONAMIENTO Y SIN RETRASOS. EL ANALISIS Y EL CONTROL SE HACEN DE FORMA TOTALMENTE AUTOMATICA. LEYENDA DE LA FIGURA 1)FUENTE DE ENERGIA VARIABLE 2)VELOCIDAD DE DEPOSITO 3)CALIDAD DE COBRE 4)ORDENADOR 5)VOLTIMETRO DIGITAL 6)SOLUCION PARA DEPOSITO METALICO SIN ELECTRICIDAD. 7)SULFATO E COBRE 8)FORMALDEHIDO 9)HIDROXIDO 10)ESTABILIZADOR.
ES198787115717T 1986-10-31 1987-10-27 Control de banos de metalizacion sin electricidad. Expired - Lifetime ES2038151T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/926,362 US4814197A (en) 1986-10-31 1986-10-31 Control of electroless plating baths

Publications (1)

Publication Number Publication Date
ES2038151T3 true ES2038151T3 (es) 1993-07-16

Family

ID=25453110

Family Applications (1)

Application Number Title Priority Date Filing Date
ES198787115717T Expired - Lifetime ES2038151T3 (es) 1986-10-31 1987-10-27 Control de banos de metalizacion sin electricidad.

Country Status (14)

Country Link
US (1) US4814197A (es)
EP (1) EP0265901B1 (es)
JP (1) JP2759322B2 (es)
KR (1) KR880701790A (es)
AU (1) AU602041B2 (es)
BR (1) BR8707517A (es)
CA (1) CA1265710A (es)
CH (1) CH674582A5 (es)
DE (1) DE3736429C2 (es)
ES (1) ES2038151T3 (es)
FR (1) FR2609806B1 (es)
GB (1) GB2207249B (es)
NL (1) NL8702592A (es)
WO (1) WO1988003180A1 (es)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2039403T3 (es) * 1986-10-31 1993-10-01 Amp-Akzo Corporation (A Delaware Corp.) Metodo para depositar sin electricidad cobre de alta calidad.
AU3304389A (en) * 1988-04-29 1989-11-02 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
JP2888001B2 (ja) * 1992-01-09 1999-05-10 日本電気株式会社 金属メッキ装置
US5352350A (en) * 1992-02-14 1994-10-04 International Business Machines Corporation Method for controlling chemical species concentration
US5484626A (en) * 1992-04-06 1996-01-16 Shipley Company L.L.C. Methods and apparatus for maintaining electroless plating solutions
WO1994017464A1 (en) * 1993-01-19 1994-08-04 Pulsafeeder, Inc. Modular fluid characteristic sensor and additive controller
US5368715A (en) * 1993-02-23 1994-11-29 Enthone-Omi, Inc. Method and system for controlling plating bath parameters
DE19546206A1 (de) * 1994-12-19 1996-06-20 At & T Corp Verfahren zum Prüfen von Materialien zur Verwendung bei der chemischen oder außenstromlosen Beschichtung
US5631845A (en) * 1995-10-10 1997-05-20 Ford Motor Company Method and system for controlling phosphate bath constituents
KR100201377B1 (ko) * 1995-10-27 1999-06-15 김무 다성분 도금용액의 농도조절장치
US5993892A (en) * 1996-09-12 1999-11-30 Wasserman; Arthur Method of monitoring and controlling electroless plating in real time
US6565729B2 (en) * 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7020537B2 (en) * 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
WO2001090434A2 (en) * 2000-05-24 2001-11-29 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
PL342328A1 (en) * 2000-09-01 2002-03-11 Kghm Polska Miedz Sa Method fo measuring concentration of copper ions in industrial electrolytes
WO2006007533A1 (en) * 2004-07-01 2006-01-19 Tracedetect, Inc. Method for ultrasonic cleaning of a working electrode in electrochemical cell useful for automated trace metals measurement
JP2007051362A (ja) * 2005-07-19 2007-03-01 Ebara Corp めっき装置及びめっき液の管理方法
WO2008058250A1 (en) * 2006-11-08 2008-05-15 Surfect Technologies, Inc. System and method for controlling an electroless deposition process
ATE546730T1 (de) * 2008-11-26 2012-03-15 Atotech Deutschland Gmbh Verfahren zur kontrolle von stabilisatoradditiven in elektrolyten zur chemischen metall- und metalllegierungsabscheidung
US8172627B2 (en) 2008-12-03 2012-05-08 Tyco Electronics Corporation Electrical connector with plated plug and receptacle
PL2821780T3 (pl) * 2013-07-02 2018-11-30 Ancosys Gmbh Uzyskiwanie sygnatury in situ dla elektrochemicznego powlekania i/albo elektrochemicznego wytrawiania
TWI717427B (zh) 2015-12-03 2021-02-01 德商德國艾托特克公司 用於監測金屬鍍浴中含硫化合物之總量的方法
CN116219413B (zh) * 2023-02-23 2024-10-22 江西景旺精密电路有限公司 一种金缸mto防呆的方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2851655A (en) * 1956-09-25 1958-09-09 Foxboro Co Amperometric continuous measurement system
US3401065A (en) * 1964-08-18 1968-09-10 Amchem Prod Automatic control of nitrite addition in acid phosphate coating solutions
US3532519A (en) * 1967-11-28 1970-10-06 Matsushita Electric Industrial Co Ltd Electroless copper plating process
JPS5036197B1 (es) * 1968-12-24 1975-11-21
US3959108A (en) * 1971-12-27 1976-05-25 Plumpe Jr William H System for automatically measuring and controlling the sulfate content of a chromium plating solution
US4096301A (en) * 1976-02-19 1978-06-20 Macdermid Incorporated Apparatus and method for automatically maintaining an electroless copper plating bath
GB1585057A (en) * 1976-06-28 1981-02-25 Ici Ltd Sensing concentration of coating solution
JPS539233A (en) * 1976-07-14 1978-01-27 Tokyo Shibaura Electric Co Method of adjusting concentration of nonnelectrolytic copper plating solution
JPS539234A (en) * 1976-07-14 1978-01-27 Tokyo Shibaura Electric Co Method of adjusting concentration of reducing agent for nonnelectrolytic plating solution
JPS539235A (en) * 1976-07-14 1978-01-27 Tokyo Shibaura Electric Co Method of adjusting concentration of nonnelectrolytic plating solution
US4132605A (en) * 1976-12-27 1979-01-02 Rockwell International Corporation Method for evaluating the quality of electroplating baths
DE2711989C2 (de) * 1977-03-18 1980-04-30 Siemens Ag, 1000 Berlin Und 8000 Muenchen Elektrochemische Bestimmung von SchwermetaUen in Wasser
US4209331A (en) * 1978-05-25 1980-06-24 Macdermid Incorporated Electroless copper composition solution using a hypophosphite reducing agent
IT1112649B (it) * 1978-07-28 1986-01-20 Oxon Italia Spa Composto chimico eterociclio 6-fenil-(1,2,3)-oxadiazolo-(4,5 d)-piridazin-7(6h)-one e procedimento per la sua produzione
US4336111A (en) * 1978-11-02 1982-06-22 The Boeing Company Method for determining the strength of a metal processing solution
JPS5926660B2 (ja) * 1979-03-07 1984-06-29 株式会社東芝 無電解メツキ反応の測定方法
JPS55158554A (en) * 1979-05-28 1980-12-10 Nissan Eng Kk Apparatus for measuring concentration of oxidating and reducing substance
US4353933A (en) * 1979-11-14 1982-10-12 C. Uyemura & Co., Ltd. Method for controlling electroless plating bath
JPS6016517B2 (ja) * 1979-12-29 1985-04-25 上村工業株式会社 無電解めつき制御方法
JPS56120943A (en) * 1980-02-29 1981-09-22 Hitachi Ltd Manufacture of ph-detecting electrode
JPS5841344A (ja) * 1981-09-07 1983-03-10 Baionikusu Kiki Kk ボルタンメトリ−分析法
EP0132594B1 (en) * 1983-07-25 1988-09-07 Hitachi, Ltd. Electroless copper plating solution
JPS60104246A (ja) * 1983-11-11 1985-06-08 C Uyemura & Co Ltd 化学銅めつき浴中のホルムアルデヒドの分析方法
US4565575A (en) * 1984-11-02 1986-01-21 Shiplay Company Inc. Apparatus and method for automatically maintaining an electroless plating bath
US4623554A (en) * 1985-03-08 1986-11-18 International Business Machines Corp. Method for controlling plating rate in an electroless plating system
US4631116A (en) * 1985-06-05 1986-12-23 Hughes Aircraft Company Method of monitoring trace constituents in plating baths
US4654126A (en) * 1985-10-07 1987-03-31 International Business Machines Corporation Process for determining the plating activity of an electroless plating bath

Also Published As

Publication number Publication date
EP0265901A3 (en) 1989-05-10
US4814197A (en) 1989-03-21
CA1265710A (en) 1990-02-13
AU8326987A (en) 1988-05-25
FR2609806A1 (fr) 1988-07-22
DE3736429C2 (de) 1988-12-01
FR2609806B1 (fr) 1993-09-10
KR880701790A (ko) 1988-11-05
GB8725399D0 (en) 1987-12-02
AU602041B2 (en) 1990-09-27
GB2207249B (en) 1991-03-27
CH674582A5 (es) 1990-06-15
JPH01501324A (ja) 1989-05-11
EP0265901A2 (en) 1988-05-04
GB2207249A (en) 1989-01-25
NL8702592A (nl) 1988-05-16
JP2759322B2 (ja) 1998-05-28
DE3736429A1 (de) 1988-05-19
BR8707517A (pt) 1989-02-21
WO1988003180A1 (en) 1988-05-05
EP0265901B1 (en) 1993-01-27

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