BR8707517A - Controle de banhos de revestimento por deposicao nao eletrolitica - Google Patents

Controle de banhos de revestimento por deposicao nao eletrolitica

Info

Publication number
BR8707517A
BR8707517A BR8707517A BR8707517A BR8707517A BR 8707517 A BR8707517 A BR 8707517A BR 8707517 A BR8707517 A BR 8707517A BR 8707517 A BR8707517 A BR 8707517A BR 8707517 A BR8707517 A BR 8707517A
Authority
BR
Brazil
Prior art keywords
bathrooms
control
electrolytic coating
electrolytic
coating
Prior art date
Application number
BR8707517A
Other languages
English (en)
Inventor
John Duffy
Milan Paunovic
Steven M Christian
John F Mccormack
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of BR8707517A publication Critical patent/BR8707517A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
BR8707517A 1986-10-31 1987-10-30 Controle de banhos de revestimento por deposicao nao eletrolitica BR8707517A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/926,362 US4814197A (en) 1986-10-31 1986-10-31 Control of electroless plating baths
PCT/US1987/002854 WO1988003180A1 (en) 1986-10-31 1987-10-30 Control of electroless plating baths

Publications (1)

Publication Number Publication Date
BR8707517A true BR8707517A (pt) 1989-02-21

Family

ID=25453110

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8707517A BR8707517A (pt) 1986-10-31 1987-10-30 Controle de banhos de revestimento por deposicao nao eletrolitica

Country Status (14)

Country Link
US (1) US4814197A (pt)
EP (1) EP0265901B1 (pt)
JP (1) JP2759322B2 (pt)
KR (1) KR880701790A (pt)
AU (1) AU602041B2 (pt)
BR (1) BR8707517A (pt)
CA (1) CA1265710A (pt)
CH (1) CH674582A5 (pt)
DE (1) DE3736429C2 (pt)
ES (1) ES2038151T3 (pt)
FR (1) FR2609806B1 (pt)
GB (1) GB2207249B (pt)
NL (1) NL8702592A (pt)
WO (1) WO1988003180A1 (pt)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0265895B1 (en) * 1986-10-31 1993-02-10 AMP-AKZO CORPORATION (a Delaware corp.) Method for electrolessly depositing high quality copper
AU3304389A (en) * 1988-04-29 1989-11-02 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
JP2888001B2 (ja) * 1992-01-09 1999-05-10 日本電気株式会社 金属メッキ装置
US5352350A (en) * 1992-02-14 1994-10-04 International Business Machines Corporation Method for controlling chemical species concentration
US5484626A (en) * 1992-04-06 1996-01-16 Shipley Company L.L.C. Methods and apparatus for maintaining electroless plating solutions
AU6031694A (en) * 1993-01-19 1994-08-15 Pulsafeeder, Inc. Modular fluid characteristic sensor and additive controller
US5368715A (en) * 1993-02-23 1994-11-29 Enthone-Omi, Inc. Method and system for controlling plating bath parameters
DE19546206A1 (de) * 1994-12-19 1996-06-20 At & T Corp Verfahren zum Prüfen von Materialien zur Verwendung bei der chemischen oder außenstromlosen Beschichtung
US5631845A (en) * 1995-10-10 1997-05-20 Ford Motor Company Method and system for controlling phosphate bath constituents
KR100201377B1 (ko) * 1995-10-27 1999-06-15 김무 다성분 도금용액의 농도조절장치
US5993892A (en) * 1996-09-12 1999-11-30 Wasserman; Arthur Method of monitoring and controlling electroless plating in real time
US6565729B2 (en) * 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7020537B2 (en) * 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
WO2001090434A2 (en) * 2000-05-24 2001-11-29 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
PL342328A1 (en) * 2000-09-01 2002-03-11 Kghm Polska Miedz Sa Method fo measuring concentration of copper ions in industrial electrolytes
WO2006007533A1 (en) * 2004-07-01 2006-01-19 Tracedetect, Inc. Method for ultrasonic cleaning of a working electrode in electrochemical cell useful for automated trace metals measurement
JP2007051362A (ja) * 2005-07-19 2007-03-01 Ebara Corp めっき装置及びめっき液の管理方法
WO2008058250A1 (en) * 2006-11-08 2008-05-15 Surfect Technologies, Inc. System and method for controlling an electroless deposition process
EP2192405B1 (en) 2008-11-26 2012-02-22 ATOTECH Deutschland GmbH Method for control of stabilizer additives in electroless metal and metal alloy plating electrolytes
US8172627B2 (en) 2008-12-03 2012-05-08 Tyco Electronics Corporation Electrical connector with plated plug and receptacle
ES2684508T3 (es) * 2013-07-02 2018-10-03 Ancosys Gmbh Toma de huella in situ para deposición electroquímica y/o grabado electroquímico
MY191657A (en) 2015-12-03 2022-07-06 Atotech Deutschland Gmbh Method for monitoring the total amount of sulphur containing compounds in a metal plating bath

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2851655A (en) * 1956-09-25 1958-09-09 Foxboro Co Amperometric continuous measurement system
US3401065A (en) * 1964-08-18 1968-09-10 Amchem Prod Automatic control of nitrite addition in acid phosphate coating solutions
US3532519A (en) * 1967-11-28 1970-10-06 Matsushita Electric Ind Co Ltd Electroless copper plating process
JPS5036197B1 (pt) * 1968-12-24 1975-11-21
US3959108A (en) * 1971-12-27 1976-05-25 Plumpe Jr William H System for automatically measuring and controlling the sulfate content of a chromium plating solution
US4096301A (en) * 1976-02-19 1978-06-20 Macdermid Incorporated Apparatus and method for automatically maintaining an electroless copper plating bath
GB1585057A (en) * 1976-06-28 1981-02-25 Ici Ltd Sensing concentration of coating solution
JPS539234A (en) * 1976-07-14 1978-01-27 Tokyo Shibaura Electric Co Method of adjusting concentration of reducing agent for nonnelectrolytic plating solution
JPS539233A (en) * 1976-07-14 1978-01-27 Tokyo Shibaura Electric Co Method of adjusting concentration of nonnelectrolytic copper plating solution
JPS539235A (en) * 1976-07-14 1978-01-27 Tokyo Shibaura Electric Co Method of adjusting concentration of nonnelectrolytic plating solution
US4132605A (en) * 1976-12-27 1979-01-02 Rockwell International Corporation Method for evaluating the quality of electroplating baths
DE2711989C2 (de) * 1977-03-18 1980-04-30 Siemens Ag, 1000 Berlin Und 8000 Muenchen Elektrochemische Bestimmung von SchwermetaUen in Wasser
US4209331A (en) * 1978-05-25 1980-06-24 Macdermid Incorporated Electroless copper composition solution using a hypophosphite reducing agent
IT1112649B (it) * 1978-07-28 1986-01-20 Oxon Italia Spa Composto chimico eterociclio 6-fenil-(1,2,3)-oxadiazolo-(4,5 d)-piridazin-7(6h)-one e procedimento per la sua produzione
US4336111A (en) * 1978-11-02 1982-06-22 The Boeing Company Method for determining the strength of a metal processing solution
JPS5926660B2 (ja) * 1979-03-07 1984-06-29 株式会社東芝 無電解メツキ反応の測定方法
JPS55158554A (en) * 1979-05-28 1980-12-10 Nissan Eng Kk Apparatus for measuring concentration of oxidating and reducing substance
US4353933A (en) * 1979-11-14 1982-10-12 C. Uyemura & Co., Ltd. Method for controlling electroless plating bath
JPS6016517B2 (ja) * 1979-12-29 1985-04-25 上村工業株式会社 無電解めつき制御方法
JPS56120943A (en) * 1980-02-29 1981-09-22 Hitachi Ltd Manufacture of ph-detecting electrode
JPS5841344A (ja) * 1981-09-07 1983-03-10 Baionikusu Kiki Kk ボルタンメトリ−分析法
EP0132594B1 (en) * 1983-07-25 1988-09-07 Hitachi, Ltd. Electroless copper plating solution
JPS60104246A (ja) * 1983-11-11 1985-06-08 C Uyemura & Co Ltd 化学銅めつき浴中のホルムアルデヒドの分析方法
US4565575A (en) * 1984-11-02 1986-01-21 Shiplay Company Inc. Apparatus and method for automatically maintaining an electroless plating bath
US4623554A (en) * 1985-03-08 1986-11-18 International Business Machines Corp. Method for controlling plating rate in an electroless plating system
US4631116A (en) * 1985-06-05 1986-12-23 Hughes Aircraft Company Method of monitoring trace constituents in plating baths
US4654126A (en) * 1985-10-07 1987-03-31 International Business Machines Corporation Process for determining the plating activity of an electroless plating bath

Also Published As

Publication number Publication date
CA1265710A (en) 1990-02-13
JPH01501324A (ja) 1989-05-11
AU602041B2 (en) 1990-09-27
JP2759322B2 (ja) 1998-05-28
EP0265901B1 (en) 1993-01-27
GB2207249B (en) 1991-03-27
CH674582A5 (pt) 1990-06-15
DE3736429C2 (de) 1988-12-01
KR880701790A (ko) 1988-11-05
DE3736429A1 (de) 1988-05-19
NL8702592A (nl) 1988-05-16
FR2609806A1 (fr) 1988-07-22
US4814197A (en) 1989-03-21
ES2038151T3 (es) 1993-07-16
AU8326987A (en) 1988-05-25
EP0265901A2 (en) 1988-05-04
FR2609806B1 (fr) 1993-09-10
WO1988003180A1 (en) 1988-05-05
GB2207249A (en) 1989-01-25
EP0265901A3 (en) 1989-05-10
GB8725399D0 (en) 1987-12-02

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Legal Events

Date Code Title Description
FB19 Grant procedure suspended (art. 19)
FF Decision: intention to grant
FG9A Patent or certificate of addition granted
B21A Expiry acc. art. 78, item i of ipl- expiry of the term of protection

Free format text: PATENTE EXTINTA EM 29/09/2008