KR860005256A - 감광성 세라믹 코팅 조성물 - Google Patents

감광성 세라믹 코팅 조성물

Info

Publication number
KR860005256A
KR860005256A KR1019850009901A KR850009901A KR860005256A KR 860005256 A KR860005256 A KR 860005256A KR 1019850009901 A KR1019850009901 A KR 1019850009901A KR 850009901 A KR850009901 A KR 850009901A KR 860005256 A KR860005256 A KR 860005256A
Authority
KR
South Korea
Prior art keywords
coating composition
ceramic coating
photosensitive ceramic
photosensitive
composition
Prior art date
Application number
KR1019850009901A
Other languages
English (en)
Other versions
KR890003265B1 (ko
Inventor
유진 듀버 토마스
히츠 샤이버 데이빗드
엔사인 시먼즈 3세 하워드
Original Assignee
이 아이 듀우판 디 네모아 앤드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이 아이 듀우판 디 네모아 앤드 캄파니 filed Critical 이 아이 듀우판 디 네모아 앤드 캄파니
Publication of KR860005256A publication Critical patent/KR860005256A/ko
Application granted granted Critical
Publication of KR890003265B1 publication Critical patent/KR890003265B1/ko

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/025—Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds, e.g. acetylenic compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/111—Polymer of unsaturated acid or ester
KR1019850009901A 1984-12-28 1985-12-27 감광성 세라믹 코팅 조성물 KR890003265B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US687460 1984-12-28
US06/687,460 US4613560A (en) 1984-12-28 1984-12-28 Photosensitive ceramic coating composition

Publications (2)

Publication Number Publication Date
KR860005256A true KR860005256A (ko) 1986-07-21
KR890003265B1 KR890003265B1 (ko) 1989-08-31

Family

ID=24760533

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850009901A KR890003265B1 (ko) 1984-12-28 1985-12-27 감광성 세라믹 코팅 조성물

Country Status (6)

Country Link
US (1) US4613560A (ko)
EP (1) EP0186163B1 (ko)
JP (2) JPS61158861A (ko)
KR (1) KR890003265B1 (ko)
CA (1) CA1259514A (ko)
DE (1) DE3585217D1 (ko)

Families Citing this family (46)

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JPS60163419A (ja) * 1984-02-06 1985-08-26 東レ株式会社 コンデンサ−用蒸着積層フイルム
US4948759A (en) * 1986-07-15 1990-08-14 E. I. Du Pont De Nemours And Company Glass ceramic dielectric compositions
CA1274430A (en) * 1986-10-14 1990-09-25 E. I. Du Pont De Nemours And Company Controlled atmosphere firing process
US4925771A (en) * 1988-05-31 1990-05-15 E. I. Dupont De Nemours And Company Process of making photosensitive aqueous developable ceramic coating composition including freeze drying the ceramic solid particles
US4908296A (en) * 1988-05-31 1990-03-13 E. I. Du Pont De Nemours And Company Photosensitive semi-aqueous developable ceramic coating composition
US4912019A (en) * 1988-05-31 1990-03-27 E. I. Du Pont De Nemours And Company Photosensitive aqueous developable ceramic coating composition
US4959295A (en) * 1988-05-31 1990-09-25 E. I. Du Pont De Nemours And Company Process of making a photosensitive semi-aqueous developable ceramic coating composition
EP0357063A3 (en) * 1988-09-02 1991-05-02 E.I. Du Pont De Nemours And Company Photosensitive ceramic coating composition
JP2775109B2 (ja) * 1989-02-22 1998-07-16 株式会社住友金属エレクトロデバイス プラズマディスプレイパネルとそのパネル用障壁の形成方法
JPH0687393B2 (ja) * 1988-12-19 1994-11-02 株式会社住友金属セラミックス プラズマディスプレイパネル障壁の製造方法
US5032478A (en) * 1989-08-21 1991-07-16 E. I. Du Pont De Nemours And Company Photosensitive aqueous developable gold conductor composition
US5032490A (en) * 1989-08-21 1991-07-16 E. I. Du Pont De Nemours And Company Photosensitive aqueous developable copper conductor composition
US5035980A (en) * 1989-08-21 1991-07-30 E. I. Du Pont De Nemours And Company Photosensitive semi-aqueous developable gold conductor composition
US5047313A (en) * 1989-08-21 1991-09-10 E. I. Du Pont De Nemours And Company Photosensitive semi-aqueous developable copper conductor composition
EP0432907B1 (en) * 1989-11-22 1995-05-17 Johnson Matthey Public Limited Company Improved paste compositions
US5033666A (en) * 1990-04-12 1991-07-23 E. I. Du Pont De Nemours And Company Process for brazing metallized components to ceramic substrates
JPH04109536A (ja) * 1990-08-29 1992-04-10 Mitsubishi Electric Corp プラズマデイスプレイの製造方法
US5204210A (en) * 1990-12-07 1993-04-20 Xerox Corporation Method for the direct patterning of diamond films
US5260163A (en) * 1992-05-07 1993-11-09 E. I. Du Pont De Nemours And Company Photoenhanced diffusion patterning for organic polymer films
US6479193B1 (en) * 1992-06-30 2002-11-12 Nippon Sheet Glass Co., Ltd. Optical recording film and process for production thereof
EP0589241B1 (en) * 1992-09-23 1999-04-28 E.I. Du Pont De Nemours And Company Photosensitive dielectric sheet composition and multilayer interconnect circuits
US5925444A (en) * 1992-12-09 1999-07-20 Hitachi, Ltd. Organic binder for shaping ceramic, its production method and product employing the same
US5481385A (en) * 1993-07-01 1996-01-02 Alliedsignal Inc. Direct view display device with array of tapered waveguide on viewer side
TW262537B (ko) * 1993-07-01 1995-11-11 Allied Signal Inc
US5624782A (en) * 1994-04-14 1997-04-29 E. I. Du Pont De Nemours And Company Method of manufacturing thick-film resistor elements
EP0747911A1 (en) * 1995-06-06 1996-12-11 E.I. Du Pont De Nemours And Company Method of manufacturing thick-film resistor
DE69607569T3 (de) † 1995-06-12 2004-11-04 Toray Industries, Inc. Benutzung einer fotoempfindlichen paste, verfahren zur herstellung einer plasmaanzeigetafel, sowie plasmaanzeigetafel, welche nach diesem verfahren herstellbar ist
US6197480B1 (en) 1995-06-12 2001-03-06 Toray Industries, Inc. Photosensitive paste, a plasma display, and a method for the production thereof
JP2835430B2 (ja) * 1995-10-30 1998-12-14 株式会社住友金属エレクトロデバイス プラズマディスプレイパネル障壁の製造方法
US5907000A (en) * 1997-03-07 1999-05-25 The Walman Optical Company Adjustable refractive index coating composition
JPH1184125A (ja) * 1997-09-12 1999-03-26 Tokyo Ohka Kogyo Co Ltd 色フィルタ用光重合性組成物、および色フィルタの製造方法
US5874197A (en) * 1997-09-18 1999-02-23 E. I. Du Pont De Nemours And Company Thermal assisted photosensitive composition and method thereof
US6360562B1 (en) * 1998-02-24 2002-03-26 Superior Micropowders Llc Methods for producing glass powders
DE69910335T2 (de) 1998-12-11 2004-07-01 E.I. Du Pont De Nemours And Co., Wilmington Zusammensetzung für ein Silber enthaltendes, lichtempfindliches, leitendes Band und das damit behandelte Band
US6194124B1 (en) * 1999-08-12 2001-02-27 E. I. Du Pont De Nemours And Company Photosensitive ceramic compositions containing polycarbonate polymers
GB0121640D0 (en) * 2001-09-07 2001-10-31 Rolls Royce Plc A temperature indicating paint
US7192910B2 (en) 2003-10-28 2007-03-20 Sachem, Inc. Cleaning solutions and etchants and methods for using same
US20060027307A1 (en) * 2004-08-03 2006-02-09 Bidwell Larry A Method of application of a dielectric sheet and photosensitive dielectric composition(s) and tape(s) used therein
US7277269B2 (en) * 2004-11-29 2007-10-02 Kemet Electronics Corporation Refractory metal nickel electrodes for capacitors
US7054137B1 (en) 2004-11-29 2006-05-30 Kemet Electronic Corporation Refractory metal nickel electrodes for capacitors
KR100658714B1 (ko) * 2004-11-30 2006-12-15 삼성에스디아이 주식회사 감광성 조성물, 이를 포함하는 격벽 형성용 감광성페이스트 조성물, 및 이를 이용한 플라즈마 디스플레이패널용 격벽의 제조방법.
US8329772B2 (en) 2010-05-20 2012-12-11 E I Du Pont De Nemours And Company UV-curable polymer thick film dielectric compositions with excellent adhesion to ITO
US9012555B2 (en) 2013-05-22 2015-04-21 E I Du Pont De Nemours And Company UV-curable thermoformable dielectric for thermoformable circuits
US9686862B2 (en) * 2014-09-23 2017-06-20 Finisar Corporation Capacitors for multilayer printed circuit boards
ES2733838T3 (es) * 2015-09-25 2019-12-03 Ivoclar Vivadent Ag Barbotina de cerámica y vitrocerámica para estereolitografía
EP3335687B1 (de) * 2016-12-15 2020-02-12 Ivoclar Vivadent AG Ausbrennbares dentales modelliermaterial

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US3355291A (en) * 1963-10-08 1967-11-28 Texas Instruments Inc Application of glass to semiconductor devices
US3443944A (en) * 1963-10-23 1969-05-13 United Aircraft Corp Method of depositing conductive patterns on a substrate
US3615457A (en) * 1969-04-02 1971-10-26 Du Pont Photopolymerizable compositions and processes of applying the same
GB1256344A (en) * 1969-05-23 1971-12-08 North American Rockwell Photographic manufacture of printed circuits
US3573908A (en) * 1969-06-06 1971-04-06 Bell Telephone Labor Inc Photographic technique for the selective deposition of a ceramic substrate glaze
US3958996A (en) * 1973-05-07 1976-05-25 E. I. Du Pont De Nemours And Company Photopolymerizable paste composition
US3982941A (en) * 1973-05-07 1976-09-28 E. I. Du Pont De Nemours & Company Photopolymerizable paste compositions and their use
US3914128A (en) * 1973-06-08 1975-10-21 Du Pont Photohardenable paste compositions having high resolution
US3877950A (en) * 1974-03-21 1975-04-15 Du Pont Photosensitive gold compositions
FR2451899A1 (fr) * 1979-03-23 1980-10-17 Labo Electronique Physique Composition dielectrique, encre serigraphiable comportant une telle composition, et produits obtenus
JPS58502079A (ja) * 1981-12-11 1983-12-01 ウエスタ−ン　エレクトリツク　カムパニ−　インコ−ポレ−テツド 容量を増大する回路板の製造

Also Published As

Publication number Publication date
CA1259514A (en) 1989-09-19
EP0186163A3 (en) 1989-02-08
KR890003265B1 (ko) 1989-08-31
JPS61158861A (ja) 1986-07-18
US4613560A (en) 1986-09-23
EP0186163A2 (en) 1986-07-02
JPH0323514B2 (ko) 1991-03-29
EP0186163B1 (en) 1992-01-15
JPH0316962A (ja) 1991-01-24
JPH0559066B2 (ko) 1993-08-30
DE3585217D1 (de) 1992-02-27

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