GB1256344A - Photographic manufacture of printed circuits - Google Patents

Photographic manufacture of printed circuits

Info

Publication number
GB1256344A
GB1256344A GB439570A GB439570A GB1256344A GB 1256344 A GB1256344 A GB 1256344A GB 439570 A GB439570 A GB 439570A GB 439570 A GB439570 A GB 439570A GB 1256344 A GB1256344 A GB 1256344A
Authority
GB
United Kingdom
Prior art keywords
pattern
composition
circuit
fusable
photosensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB439570A
Inventor
James John Licari
William Stewart Deforest
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Boeing North American Inc
Original Assignee
North American Rockwell Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by North American Rockwell Corp filed Critical North American Rockwell Corp
Publication of GB1256344A publication Critical patent/GB1256344A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Electric Cables (AREA)

Abstract

1,256,344. Printed circuits; resistors. NORTH AMERICAN ROCKWELL CORP. 29 Jan., 1970 [23 May, 1969], No. 4395/70. Headings H1R and H1S. A method of making an electrical circuit photographically comprises applying a composition of a photosensitive material, heat fusable material and electrically conductive material to a substrate 108 and exposing it to radiation through a mask which determines the circuit pattern, the exposed composition being developed to remove it and the unexposed composition then fired to remove at least some of the photosensitive material from the remaining circuit pattern and to fuse the fusable material with the metallic material to the substrate. Tables of suitable materials and combinations of materials are disclosed for particular uses, e.g. a resistor may be formed of a composition comprising a metallic material of palladious oxide and silver, or photosenstive material of a photopolymer such as polyisoprene plus a photosensitizer and a fusable material of a lead borosilicate glass, other materials also being disclosed for conductive paths etc. The composition may be dried prior to exposure to radiation. The produced circuit pattern may have electrically conductive material applied to it by such as electroplating or dip soldering means or may have semi-conductive material applied so as to cover at least part of the pattern. Various parts of the pattern may be electrically interconnected by wires or electronic components 125, 126, and 124. A further layer of the composition without the metallic material may be applied to such a circuit, suitably exposed and fired to form an insulating layer 127 which at least partially covers the previous pattern, possibly a further pattern 128 being similarly produced on this layer and may be electrically interconnected to the other pattern by such as a wire 130 through an aperture 131, a further insulating layer 132, not necessarily photosensitive then being applied.
GB439570A 1969-05-23 1970-01-29 Photographic manufacture of printed circuits Expired GB1256344A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82735369A 1969-05-23 1969-05-23

Publications (1)

Publication Number Publication Date
GB1256344A true GB1256344A (en) 1971-12-08

Family

ID=25249000

Family Applications (1)

Application Number Title Priority Date Filing Date
GB439570A Expired GB1256344A (en) 1969-05-23 1970-01-29 Photographic manufacture of printed circuits

Country Status (3)

Country Link
DE (1) DE2003983B2 (en)
FR (1) FR2046153A5 (en)
GB (1) GB1256344A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4828961A (en) * 1986-07-02 1989-05-09 W. R. Grace & Co.-Conn. Imaging process for forming ceramic electronic circuits
GB2246668A (en) * 1990-04-17 1992-02-05 Nippon Cmk Kk Forming carbon resistance in a printed wiring board by depositing a thermoset table carbon layer

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2574570A1 (en) * 1984-12-07 1986-06-13 Thomson Csf METHOD FOR PHOTOLITHOGRAPHY OF A THICK LAYER OF PULP DEPOSITED ON A SUBSTRATE
US4598037A (en) * 1984-12-21 1986-07-01 E. I. Du Pont De Nemours And Company Photosensitive conductive metal composition
US4613560A (en) * 1984-12-28 1986-09-23 E. I. Du Pont De Nemours And Company Photosensitive ceramic coating composition
FR2618573B1 (en) * 1987-07-22 1990-01-05 Bois Daniel PROCESS FOR MANUFACTURING MICROMECHANICAL PARTS
FR2666682B1 (en) * 1990-09-10 1994-06-17 Ramy Jean Pierre METHOD OF MANUFACTURING A NETWORK OF HIGH INTEGRATION RESISTIVE ELEMENTS AND NETWORK OBTAINED.

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4828961A (en) * 1986-07-02 1989-05-09 W. R. Grace & Co.-Conn. Imaging process for forming ceramic electronic circuits
GB2246668A (en) * 1990-04-17 1992-02-05 Nippon Cmk Kk Forming carbon resistance in a printed wiring board by depositing a thermoset table carbon layer
GB2246668B (en) * 1990-04-17 1994-01-05 Nippon Cmk Kk A method of forming a carbon resistance on a printed wiring board

Also Published As

Publication number Publication date
FR2046153A5 (en) 1971-03-05
DE2003983A1 (en) 1970-12-03
DE2003983B2 (en) 1971-04-15

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