DE3585217D1 - Photoempfindliche keramische ueberzugszusammensetzung. - Google Patents
Photoempfindliche keramische ueberzugszusammensetzung.Info
- Publication number
- DE3585217D1 DE3585217D1 DE8585116391T DE3585217T DE3585217D1 DE 3585217 D1 DE3585217 D1 DE 3585217D1 DE 8585116391 T DE8585116391 T DE 8585116391T DE 3585217 T DE3585217 T DE 3585217T DE 3585217 D1 DE3585217 D1 DE 3585217D1
- Authority
- DE
- Germany
- Prior art keywords
- coating composition
- ceramic coating
- photo sensitive
- sensitive ceramic
- photo
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/025—Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds, e.g. acetylenic compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
- H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
- H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/111—Polymer of unsaturated acid or ester
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Ceramic Capacitors (AREA)
- Inorganic Insulating Materials (AREA)
- Paints Or Removers (AREA)
- Laminated Bodies (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/687,460 US4613560A (en) | 1984-12-28 | 1984-12-28 | Photosensitive ceramic coating composition |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3585217D1 true DE3585217D1 (de) | 1992-02-27 |
Family
ID=24760533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8585116391T Expired - Lifetime DE3585217D1 (de) | 1984-12-28 | 1985-12-20 | Photoempfindliche keramische ueberzugszusammensetzung. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4613560A (de) |
EP (1) | EP0186163B1 (de) |
JP (2) | JPS61158861A (de) |
KR (1) | KR890003265B1 (de) |
CA (1) | CA1259514A (de) |
DE (1) | DE3585217D1 (de) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60163419A (ja) * | 1984-02-06 | 1985-08-26 | 東レ株式会社 | コンデンサ−用蒸着積層フイルム |
US4948759A (en) * | 1986-07-15 | 1990-08-14 | E. I. Du Pont De Nemours And Company | Glass ceramic dielectric compositions |
CA1274430A (en) * | 1986-10-14 | 1990-09-25 | E. I. Du Pont De Nemours And Company | Controlled atmosphere firing process |
US4925771A (en) * | 1988-05-31 | 1990-05-15 | E. I. Dupont De Nemours And Company | Process of making photosensitive aqueous developable ceramic coating composition including freeze drying the ceramic solid particles |
US4912019A (en) * | 1988-05-31 | 1990-03-27 | E. I. Du Pont De Nemours And Company | Photosensitive aqueous developable ceramic coating composition |
US4908296A (en) * | 1988-05-31 | 1990-03-13 | E. I. Du Pont De Nemours And Company | Photosensitive semi-aqueous developable ceramic coating composition |
US4959295A (en) * | 1988-05-31 | 1990-09-25 | E. I. Du Pont De Nemours And Company | Process of making a photosensitive semi-aqueous developable ceramic coating composition |
EP0357063A3 (de) * | 1988-09-02 | 1991-05-02 | E.I. Du Pont De Nemours And Company | Keramische lichtempfindliche Beschichtungszusammensetzungen |
JP2775109B2 (ja) * | 1989-02-22 | 1998-07-16 | 株式会社住友金属エレクトロデバイス | プラズマディスプレイパネルとそのパネル用障壁の形成方法 |
JPH0687393B2 (ja) * | 1988-12-19 | 1994-11-02 | 株式会社住友金属セラミックス | プラズマディスプレイパネル障壁の製造方法 |
US5032490A (en) * | 1989-08-21 | 1991-07-16 | E. I. Du Pont De Nemours And Company | Photosensitive aqueous developable copper conductor composition |
US5032478A (en) * | 1989-08-21 | 1991-07-16 | E. I. Du Pont De Nemours And Company | Photosensitive aqueous developable gold conductor composition |
US5047313A (en) * | 1989-08-21 | 1991-09-10 | E. I. Du Pont De Nemours And Company | Photosensitive semi-aqueous developable copper conductor composition |
US5035980A (en) * | 1989-08-21 | 1991-07-30 | E. I. Du Pont De Nemours And Company | Photosensitive semi-aqueous developable gold conductor composition |
ES2071788T3 (es) * | 1989-11-22 | 1995-07-01 | Johnson Matthey Plc | Composiciones en pasta mejoradas. |
US5033666A (en) * | 1990-04-12 | 1991-07-23 | E. I. Du Pont De Nemours And Company | Process for brazing metallized components to ceramic substrates |
JPH04109536A (ja) * | 1990-08-29 | 1992-04-10 | Mitsubishi Electric Corp | プラズマデイスプレイの製造方法 |
US5204210A (en) * | 1990-12-07 | 1993-04-20 | Xerox Corporation | Method for the direct patterning of diamond films |
US5260163A (en) * | 1992-05-07 | 1993-11-09 | E. I. Du Pont De Nemours And Company | Photoenhanced diffusion patterning for organic polymer films |
US6479193B1 (en) * | 1992-06-30 | 2002-11-12 | Nippon Sheet Glass Co., Ltd. | Optical recording film and process for production thereof |
DE69324640T2 (de) * | 1992-09-23 | 1999-10-14 | Du Pont | Photoempfindliches dielektrisches Schichtmaterial und untereinander verbundene Mehrschichtschaltungen |
US5925444A (en) * | 1992-12-09 | 1999-07-20 | Hitachi, Ltd. | Organic binder for shaping ceramic, its production method and product employing the same |
TW262537B (de) * | 1993-07-01 | 1995-11-11 | Allied Signal Inc | |
US5481385A (en) * | 1993-07-01 | 1996-01-02 | Alliedsignal Inc. | Direct view display device with array of tapered waveguide on viewer side |
US5624782A (en) * | 1994-04-14 | 1997-04-29 | E. I. Du Pont De Nemours And Company | Method of manufacturing thick-film resistor elements |
EP0747911A1 (de) * | 1995-06-06 | 1996-12-11 | E.I. Du Pont De Nemours And Company | Verfahren zur Herstellung eines Dickschichtwiderstandes |
WO1996042035A1 (fr) † | 1995-06-12 | 1996-12-27 | Toray Industries, Inc. | Pate photosensible, afficheur a plasma et leurs procedes de fabrication |
US6197480B1 (en) | 1995-06-12 | 2001-03-06 | Toray Industries, Inc. | Photosensitive paste, a plasma display, and a method for the production thereof |
JP2835430B2 (ja) * | 1995-10-30 | 1998-12-14 | 株式会社住友金属エレクトロデバイス | プラズマディスプレイパネル障壁の製造方法 |
US5907000A (en) * | 1997-03-07 | 1999-05-25 | The Walman Optical Company | Adjustable refractive index coating composition |
JPH1184125A (ja) * | 1997-09-12 | 1999-03-26 | Tokyo Ohka Kogyo Co Ltd | 色フィルタ用光重合性組成物、および色フィルタの製造方法 |
US5874197A (en) * | 1997-09-18 | 1999-02-23 | E. I. Du Pont De Nemours And Company | Thermal assisted photosensitive composition and method thereof |
US6360562B1 (en) * | 1998-02-24 | 2002-03-26 | Superior Micropowders Llc | Methods for producing glass powders |
DE69910335T2 (de) | 1998-12-11 | 2004-07-01 | E.I. Du Pont De Nemours And Co., Wilmington | Zusammensetzung für ein Silber enthaltendes, lichtempfindliches, leitendes Band und das damit behandelte Band |
US6194124B1 (en) * | 1999-08-12 | 2001-02-27 | E. I. Du Pont De Nemours And Company | Photosensitive ceramic compositions containing polycarbonate polymers |
GB0121640D0 (en) * | 2001-09-07 | 2001-10-31 | Rolls Royce Plc | A temperature indicating paint |
EP1680806A4 (de) | 2003-10-28 | 2008-07-30 | Sachem Inc | Reinigungslösungen und ätzmittel und verfahren zu ihrer verwendung |
US20060027307A1 (en) * | 2004-08-03 | 2006-02-09 | Bidwell Larry A | Method of application of a dielectric sheet and photosensitive dielectric composition(s) and tape(s) used therein |
US7054137B1 (en) | 2004-11-29 | 2006-05-30 | Kemet Electronic Corporation | Refractory metal nickel electrodes for capacitors |
US7277269B2 (en) * | 2004-11-29 | 2007-10-02 | Kemet Electronics Corporation | Refractory metal nickel electrodes for capacitors |
KR100658714B1 (ko) * | 2004-11-30 | 2006-12-15 | 삼성에스디아이 주식회사 | 감광성 조성물, 이를 포함하는 격벽 형성용 감광성페이스트 조성물, 및 이를 이용한 플라즈마 디스플레이패널용 격벽의 제조방법. |
US8329772B2 (en) | 2010-05-20 | 2012-12-11 | E I Du Pont De Nemours And Company | UV-curable polymer thick film dielectric compositions with excellent adhesion to ITO |
US9012555B2 (en) | 2013-05-22 | 2015-04-21 | E I Du Pont De Nemours And Company | UV-curable thermoformable dielectric for thermoformable circuits |
US9686862B2 (en) * | 2014-09-23 | 2017-06-20 | Finisar Corporation | Capacitors for multilayer printed circuit boards |
ES2733838T3 (es) * | 2015-09-25 | 2019-12-03 | Ivoclar Vivadent Ag | Barbotina de cerámica y vitrocerámica para estereolitografía |
EP3335687B1 (de) * | 2016-12-15 | 2020-02-12 | Ivoclar Vivadent AG | Ausbrennbares dentales modelliermaterial |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3355291A (en) * | 1963-10-08 | 1967-11-28 | Texas Instruments Inc | Application of glass to semiconductor devices |
US3443944A (en) * | 1963-10-23 | 1969-05-13 | United Aircraft Corp | Method of depositing conductive patterns on a substrate |
US3615457A (en) * | 1969-04-02 | 1971-10-26 | Du Pont | Photopolymerizable compositions and processes of applying the same |
DE2003983B2 (de) * | 1969-05-23 | 1971-04-15 | North American Rockwell Corp , El Segundo, Calif (V St A ) | Photographisches verfahren zur herstellung elektrischer schaltungen |
US3573908A (en) * | 1969-06-06 | 1971-04-06 | Bell Telephone Labor Inc | Photographic technique for the selective deposition of a ceramic substrate glaze |
US3982941A (en) * | 1973-05-07 | 1976-09-28 | E. I. Du Pont De Nemours & Company | Photopolymerizable paste compositions and their use |
US3958996A (en) * | 1973-05-07 | 1976-05-25 | E. I. Du Pont De Nemours And Company | Photopolymerizable paste composition |
US3914128A (en) * | 1973-06-08 | 1975-10-21 | Du Pont | Photohardenable paste compositions having high resolution |
US3877950A (en) * | 1974-03-21 | 1975-04-15 | Du Pont | Photosensitive gold compositions |
FR2451899A1 (fr) * | 1979-03-23 | 1980-10-17 | Labo Electronique Physique | Composition dielectrique, encre serigraphiable comportant une telle composition, et produits obtenus |
EP0096701B1 (de) * | 1981-12-11 | 1989-08-30 | Western Electric Company, Incorporated | Zu vergrössertem aufnahmevermögen führende leiterplattenherstellung |
-
1984
- 1984-12-28 US US06/687,460 patent/US4613560A/en not_active Expired - Fee Related
-
1985
- 1985-12-19 CA CA000498138A patent/CA1259514A/en not_active Expired
- 1985-12-20 EP EP85116391A patent/EP0186163B1/de not_active Expired - Lifetime
- 1985-12-20 DE DE8585116391T patent/DE3585217D1/de not_active Expired - Lifetime
- 1985-12-27 JP JP60293395A patent/JPS61158861A/ja active Granted
- 1985-12-27 KR KR1019850009901A patent/KR890003265B1/ko not_active IP Right Cessation
-
1990
- 1990-05-24 JP JP2132787A patent/JPH0316962A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0316962A (ja) | 1991-01-24 |
KR890003265B1 (ko) | 1989-08-31 |
JPH0559066B2 (de) | 1993-08-30 |
EP0186163A3 (en) | 1989-02-08 |
EP0186163B1 (de) | 1992-01-15 |
JPH0323514B2 (de) | 1991-03-29 |
KR860005256A (ko) | 1986-07-21 |
US4613560A (en) | 1986-09-23 |
CA1259514A (en) | 1989-09-19 |
EP0186163A2 (de) | 1986-07-02 |
JPS61158861A (ja) | 1986-07-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |