ATE546730T1 - Verfahren zur kontrolle von stabilisatoradditiven in elektrolyten zur chemischen metall- und metalllegierungsabscheidung - Google Patents
Verfahren zur kontrolle von stabilisatoradditiven in elektrolyten zur chemischen metall- und metalllegierungsabscheidungInfo
- Publication number
- ATE546730T1 ATE546730T1 AT08075906T AT08075906T ATE546730T1 AT E546730 T1 ATE546730 T1 AT E546730T1 AT 08075906 T AT08075906 T AT 08075906T AT 08075906 T AT08075906 T AT 08075906T AT E546730 T1 ATE546730 T1 AT E546730T1
- Authority
- AT
- Austria
- Prior art keywords
- metal
- electrolytes
- metal alloy
- alloy deposition
- stabilizer additives
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 239000000654 additive Substances 0.000 title abstract 2
- 239000003792 electrolyte Substances 0.000 title abstract 2
- 229910001092 metal group alloy Inorganic materials 0.000 title abstract 2
- 239000003381 stabilizer Substances 0.000 title abstract 2
- 230000008021 deposition Effects 0.000 title 1
- 239000000126 substance Substances 0.000 title 1
- 238000005259 measurement Methods 0.000 abstract 3
- 230000000996 additive effect Effects 0.000 abstract 1
- 230000003750 conditioning effect Effects 0.000 abstract 1
- 230000003993 interaction Effects 0.000 abstract 1
- 239000000543 intermediate Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/416—Systems
- G01N27/48—Systems using polarography, i.e. measuring changes in current under a slowly-varying voltage
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Molecular Biology (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Chemically Coating (AREA)
- Control Of Non-Electrical Variables (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP08075906A EP2192405B1 (de) | 2008-11-26 | 2008-11-26 | Verfahren zur Kontrolle von Stabilisatoradditiven in Elektrolyten zur chemischen Metall- und Metalllegierungsabscheidung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE546730T1 true ATE546730T1 (de) | 2012-03-15 |
Family
ID=40414573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT08075906T ATE546730T1 (de) | 2008-11-26 | 2008-11-26 | Verfahren zur kontrolle von stabilisatoradditiven in elektrolyten zur chemischen metall- und metalllegierungsabscheidung |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8648601B2 (de) |
| EP (1) | EP2192405B1 (de) |
| JP (1) | JP5335096B2 (de) |
| KR (1) | KR101511408B1 (de) |
| CN (1) | CN102227628B (de) |
| AT (1) | ATE546730T1 (de) |
| TW (1) | TWI441953B (de) |
| WO (1) | WO2010060906A1 (de) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5443409B2 (ja) * | 2011-02-28 | 2014-03-19 | トヨタ自動車株式会社 | 硫黄系化合物の管理方法及びその管理システム |
| TWI717427B (zh) | 2015-12-03 | 2021-02-01 | 德商德國艾托特克公司 | 用於監測金屬鍍浴中含硫化合物之總量的方法 |
| CN108760821B (zh) * | 2018-06-04 | 2020-09-25 | 电子科技大学 | 一种电镀添加剂的定性和定量分析方法 |
| CN108754467B (zh) * | 2018-06-27 | 2021-01-12 | 深圳市贝加电子材料有限公司 | 钌钯合金化学镀液及其施镀方法和应用 |
| CN113143262B (zh) * | 2021-03-26 | 2023-09-22 | 中国刑事警察学院 | 一种潜手印的显现和固定方法 |
| KR102574198B1 (ko) * | 2021-08-23 | 2023-09-07 | 한국생산기술연구원 | 무전해 도금법을 이용한 혈액 전처리 분리막 일체형 표면증강 라만산란 기판 상 금 박막 도금방법 |
| CN114892235A (zh) * | 2022-04-06 | 2022-08-12 | 北京石油化工学院 | 一种使用电化学手段筛选微弧氧化工艺电解液的方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5345592A (en) * | 1976-10-06 | 1978-04-24 | Toshiba Corp | Concentration measuring method, of non-electrolysis plating liquid |
| US4814197A (en) * | 1986-10-31 | 1989-03-21 | Kollmorgen Corporation | Control of electroless plating baths |
| US5320724A (en) * | 1992-11-17 | 1994-06-14 | Hughes Aircraft Company | Method of monitoring constituents in plating baths |
| JPH0798296A (ja) * | 1993-09-30 | 1995-04-11 | Hitachi Chem Co Ltd | 無電解銅めっき液中の添加剤の濃度測定法 |
| US5755954A (en) * | 1996-01-17 | 1998-05-26 | Technic, Inc. | Method of monitoring constituents in electroless plating baths |
| JP2002506531A (ja) * | 1998-05-01 | 2002-02-26 | セミトウール・インコーポレーテツド | 電気メッキ浴中の添加物の測定法 |
| US20030201191A1 (en) * | 2002-04-29 | 2003-10-30 | Applied Materials, Inc. | Electrochemical method for direct organic additives analysis in copper baths |
| JP2005534012A (ja) * | 2002-07-19 | 2005-11-10 | テクニツク・インコーポレーテツド | 工業電解液をリアルタイムモニターする方法と装置 |
| EP1445609B1 (de) * | 2002-08-23 | 2006-11-22 | Kabushiki Kaisha Toshiba | Basensequenzierungselektroden, Basensequenzierungsvorrichtung und Basensequenzierungsverfahren |
| US7140229B2 (en) * | 2004-06-29 | 2006-11-28 | Mst Technology Gmbh | Gas-monitoring assembly comprising one or more gas sensors and one or more getters, and method of using same |
| JP2008537782A (ja) * | 2005-04-08 | 2008-09-25 | ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク | めっき浴およびエッチング浴を監視する方法 |
| US8747960B2 (en) * | 2005-08-31 | 2014-06-10 | Lam Research Corporation | Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide |
| JP4325684B2 (ja) * | 2007-02-20 | 2009-09-02 | 株式会社デンソー | センサ制御装置、及び印加電圧特性の調整方法 |
| EP2176653B1 (de) * | 2007-07-26 | 2011-09-07 | Nipro Diagnostics, Inc. | System und verfahren zur bestimmung der analytkonzentration mittels zeitaufgelöster amperometrie |
-
2008
- 2008-11-26 AT AT08075906T patent/ATE546730T1/de active
- 2008-11-26 EP EP08075906A patent/EP2192405B1/de not_active Not-in-force
-
2009
- 2009-11-19 TW TW098139386A patent/TWI441953B/zh not_active IP Right Cessation
- 2009-11-24 CN CN200980148092.5A patent/CN102227628B/zh not_active Expired - Fee Related
- 2009-11-24 JP JP2011537955A patent/JP5335096B2/ja not_active Expired - Fee Related
- 2009-11-24 US US13/130,315 patent/US8648601B2/en not_active Expired - Fee Related
- 2009-11-24 KR KR1020117011902A patent/KR101511408B1/ko not_active Expired - Fee Related
- 2009-11-24 WO PCT/EP2009/065742 patent/WO2010060906A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012510068A (ja) | 2012-04-26 |
| JP5335096B2 (ja) | 2013-11-06 |
| TWI441953B (zh) | 2014-06-21 |
| KR20110088531A (ko) | 2011-08-03 |
| KR101511408B1 (ko) | 2015-04-15 |
| CN102227628A (zh) | 2011-10-26 |
| EP2192405A1 (de) | 2010-06-02 |
| EP2192405B1 (de) | 2012-02-22 |
| TW201026905A (en) | 2010-07-16 |
| WO2010060906A1 (en) | 2010-06-03 |
| US20110221445A1 (en) | 2011-09-15 |
| US8648601B2 (en) | 2014-02-11 |
| CN102227628B (zh) | 2015-01-28 |
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