IT8019097A0 - Lega di palladio e bagni per la sua deposizione senza elettrolisi. - Google Patents

Lega di palladio e bagni per la sua deposizione senza elettrolisi.

Info

Publication number
IT8019097A0
IT8019097A0 IT8019097A IT1909780A IT8019097A0 IT 8019097 A0 IT8019097 A0 IT 8019097A0 IT 8019097 A IT8019097 A IT 8019097A IT 1909780 A IT1909780 A IT 1909780A IT 8019097 A0 IT8019097 A0 IT 8019097A0
Authority
IT
Italy
Prior art keywords
electrolysis
bath
deposition
palladium alloy
palladium
Prior art date
Application number
IT8019097A
Other languages
English (en)
Other versions
IT1193885B (it
Inventor
Hough William Vernon
Little John Lee
Warheit Kevin Edward
Original Assignee
Mine Safety Appliances Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mine Safety Appliances Co filed Critical Mine Safety Appliances Co
Publication of IT8019097A0 publication Critical patent/IT8019097A0/it
Application granted granted Critical
Publication of IT1193885B publication Critical patent/IT1193885B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
IT19097/80A 1979-01-15 1980-01-09 Lega di palladio e bagni per la sua deposizione senza elettrolisi. IT1193885B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/003,351 US4255194A (en) 1979-01-15 1979-01-15 Palladium alloy baths for the electroless deposition

Publications (2)

Publication Number Publication Date
IT8019097A0 true IT8019097A0 (it) 1980-01-09
IT1193885B IT1193885B (it) 1988-08-31

Family

ID=21705442

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19097/80A IT1193885B (it) 1979-01-15 1980-01-09 Lega di palladio e bagni per la sua deposizione senza elettrolisi.

Country Status (6)

Country Link
US (1) US4255194A (it)
KR (1) KR840001725B1 (it)
CA (1) CA1122753A (it)
DE (1) DE3000526C2 (it)
GB (2) GB2040316B (it)
IT (1) IT1193885B (it)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4424241A (en) 1982-09-27 1984-01-03 Bell Telephone Laboratories, Incorporated Electroless palladium process
WO1987005338A1 (en) * 1986-03-04 1987-09-11 Ishihara Chemical Co., Ltd. Palladium-base electroless plating solution
US5264288A (en) * 1992-10-01 1993-11-23 Ppg Industries, Inc. Electroless process using silylated polyamine-noble metal complexes
US5882736A (en) * 1993-05-13 1999-03-16 Atotech Deutschland Gmbh palladium layers deposition process
JP3286744B2 (ja) * 1993-05-24 2002-05-27 奥野製薬工業株式会社 非導電性材料表面に電気めっき層を直接形成する方法
US6042889A (en) * 1994-02-28 2000-03-28 International Business Machines Corporation Method for electrolessly depositing a metal onto a substrate using mediator ions
KR960005765A (ko) * 1994-07-14 1996-02-23 모리시다 요이치 반도체 장치의 배선형성에 이용하는 무전해 도금욕 및 반도체 장치의 배선성형방법
EP0697805A1 (en) 1994-08-05 1996-02-21 LeaRonal, Inc. Printed circuit board manufacture utilizing electroless palladium
US5480477A (en) * 1995-06-02 1996-01-02 Surface Technology, Inc. Cobalt as a stabilizer in electroless plating formulations
US5900186A (en) * 1995-12-19 1999-05-04 Morton International, Inc. Composition and method for reducing copper oxide to metallic copper
US5721014A (en) * 1995-12-19 1998-02-24 Surface Tek Specialty Products, Inc. Composition and method for reducing copper oxide to metallic copper
US6156413A (en) * 1996-10-25 2000-12-05 Canon Kabushiki Kaisha Glass circuit substrate and fabrication method thereof
ATE256085T1 (de) * 1997-07-10 2003-12-15 Morton Int Inc Verfahren zur reduktion von kupferoxid zu metallischem kupfer
EP2469992B1 (en) 2010-12-23 2015-02-11 Atotech Deutschland GmbH Method for obtaining a palladium surface finish for copper wire bonding on printed circuit boards and IC-substrates
EP2535929A1 (en) 2011-06-14 2012-12-19 Atotech Deutschland GmbH Wire bondable surface for microelectronic devices
EP2887779A1 (en) 2013-12-20 2015-06-24 ATOTECH Deutschland GmbH Silver wire bonding on printed circuit boards and IC-substrates
CN106460182B (zh) * 2014-04-10 2019-07-09 安美特德国有限公司 镀浴组合物和用于钯的无电镀覆的方法
US9603258B2 (en) * 2015-08-05 2017-03-21 Uyemura International Corporation Composition and method for electroless plating of palladium phosphorus on copper, and a coated component therefrom
TWI707061B (zh) * 2015-11-27 2020-10-11 德商德國艾托特克公司 鈀之電鍍浴組合物及無電電鍍方法
TWI649449B (zh) * 2015-11-27 2019-02-01 德國艾托特克公司 鈀之電鍍浴組合物及無電電鍍方法
JP7530759B2 (ja) * 2020-07-28 2024-08-08 上村工業株式会社 無電解パラジウムめっき浴

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2915406A (en) * 1958-03-03 1959-12-01 Int Nickel Co Palladium plating by chemical reduction
GB861703A (en) 1958-11-26 1961-02-22 Du Pont Improvements in or relating to plating baths
US3274022A (en) * 1963-03-26 1966-09-20 Int Nickel Co Palladium deposition
US3406019A (en) * 1966-02-28 1968-10-15 Du Pont Salts of b11h112- and their preparation
US3418143A (en) * 1967-08-15 1968-12-24 Burroughs Corp Bath for the electroless deposition of palladium
CA933819A (en) 1969-02-28 1973-09-18 Farbenfabriken Bayer Aktiengesellschaft Pretreating plastics before currentless deposition of nickel-boron
US3754939A (en) * 1972-05-23 1973-08-28 Us Army Electroless deposition of palladium alloys
US3814696A (en) * 1972-06-19 1974-06-04 Eastman Kodak Co Colloidal metal in non-aqueous media
US4004051A (en) * 1974-02-15 1977-01-18 Crown City Plating Company Aqueous noble metal suspensions for one stage activation of nonconductors for electroless plating

Also Published As

Publication number Publication date
KR830001404A (ko) 1983-04-30
CA1122753A (en) 1982-05-04
GB2040316B (en) 1983-02-16
DE3000526A1 (de) 1980-07-17
IT1193885B (it) 1988-08-31
DE3000526C2 (de) 1982-12-02
KR840001725B1 (ko) 1984-10-17
GB2053284A (en) 1981-02-04
GB2040316A (en) 1980-08-28
US4255194A (en) 1981-03-10
GB2053284B (en) 1982-12-22

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