IT8019097A0 - Lega di palladio e bagni per la sua deposizione senza elettrolisi. - Google Patents
Lega di palladio e bagni per la sua deposizione senza elettrolisi.Info
- Publication number
- IT8019097A0 IT8019097A0 IT8019097A IT1909780A IT8019097A0 IT 8019097 A0 IT8019097 A0 IT 8019097A0 IT 8019097 A IT8019097 A IT 8019097A IT 1909780 A IT1909780 A IT 1909780A IT 8019097 A0 IT8019097 A0 IT 8019097A0
- Authority
- IT
- Italy
- Prior art keywords
- electrolysis
- bath
- deposition
- palladium alloy
- palladium
- Prior art date
Links
- 229910001252 Pd alloy Inorganic materials 0.000 title 1
- 230000008021 deposition Effects 0.000 title 1
- 238000005868 electrolysis reaction Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/003,351 US4255194A (en) | 1979-01-15 | 1979-01-15 | Palladium alloy baths for the electroless deposition |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8019097A0 true IT8019097A0 (it) | 1980-01-09 |
IT1193885B IT1193885B (it) | 1988-08-31 |
Family
ID=21705442
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT19097/80A IT1193885B (it) | 1979-01-15 | 1980-01-09 | Lega di palladio e bagni per la sua deposizione senza elettrolisi. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4255194A (it) |
KR (1) | KR840001725B1 (it) |
CA (1) | CA1122753A (it) |
DE (1) | DE3000526C2 (it) |
GB (2) | GB2053284B (it) |
IT (1) | IT1193885B (it) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1987005338A1 (en) * | 1986-03-04 | 1987-09-11 | Ishihara Chemical Co., Ltd. | Palladium-base electroless plating solution |
US5264288A (en) * | 1992-10-01 | 1993-11-23 | Ppg Industries, Inc. | Electroless process using silylated polyamine-noble metal complexes |
US5882736A (en) * | 1993-05-13 | 1999-03-16 | Atotech Deutschland Gmbh | palladium layers deposition process |
JP3286744B2 (ja) * | 1993-05-24 | 2002-05-27 | 奥野製薬工業株式会社 | 非導電性材料表面に電気めっき層を直接形成する方法 |
US6042889A (en) * | 1994-02-28 | 2000-03-28 | International Business Machines Corporation | Method for electrolessly depositing a metal onto a substrate using mediator ions |
KR960005765A (ko) * | 1994-07-14 | 1996-02-23 | 모리시다 요이치 | 반도체 장치의 배선형성에 이용하는 무전해 도금욕 및 반도체 장치의 배선성형방법 |
EP0697805A1 (en) | 1994-08-05 | 1996-02-21 | LeaRonal, Inc. | Printed circuit board manufacture utilizing electroless palladium |
US5480477A (en) * | 1995-06-02 | 1996-01-02 | Surface Technology, Inc. | Cobalt as a stabilizer in electroless plating formulations |
US5900186A (en) * | 1995-12-19 | 1999-05-04 | Morton International, Inc. | Composition and method for reducing copper oxide to metallic copper |
US5721014A (en) * | 1995-12-19 | 1998-02-24 | Surface Tek Specialty Products, Inc. | Composition and method for reducing copper oxide to metallic copper |
EP0838980B1 (en) * | 1996-10-25 | 2006-03-08 | Canon Kabushiki Kaisha | Glass circuit substrate and fabrication method thereof |
ATE256085T1 (de) * | 1997-07-10 | 2003-12-15 | Morton Int Inc | Verfahren zur reduktion von kupferoxid zu metallischem kupfer |
EP2469992B1 (en) | 2010-12-23 | 2015-02-11 | Atotech Deutschland GmbH | Method for obtaining a palladium surface finish for copper wire bonding on printed circuit boards and IC-substrates |
EP2535929A1 (en) | 2011-06-14 | 2012-12-19 | Atotech Deutschland GmbH | Wire bondable surface for microelectronic devices |
EP2887779A1 (en) | 2013-12-20 | 2015-06-24 | ATOTECH Deutschland GmbH | Silver wire bonding on printed circuit boards and IC-substrates |
JP6347853B2 (ja) * | 2014-04-10 | 2018-06-27 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH | パラジウムの無電解めっきのためのめっき浴組成物及び方法 |
US9603258B2 (en) * | 2015-08-05 | 2017-03-21 | Uyemura International Corporation | Composition and method for electroless plating of palladium phosphorus on copper, and a coated component therefrom |
TWI707061B (zh) * | 2015-11-27 | 2020-10-11 | 德商德國艾托特克公司 | 鈀之電鍍浴組合物及無電電鍍方法 |
TWI692547B (zh) * | 2015-11-27 | 2020-05-01 | 德國艾托特克公司 | 鈀之電鍍浴組合物及無電電鍍方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2915406A (en) * | 1958-03-03 | 1959-12-01 | Int Nickel Co | Palladium plating by chemical reduction |
US3274022A (en) * | 1963-03-26 | 1966-09-20 | Int Nickel Co | Palladium deposition |
US3406019A (en) * | 1966-02-28 | 1968-10-15 | Du Pont | Salts of b11h112- and their preparation |
US3418143A (en) * | 1967-08-15 | 1968-12-24 | Burroughs Corp | Bath for the electroless deposition of palladium |
US3754939A (en) * | 1972-05-23 | 1973-08-28 | Us Army | Electroless deposition of palladium alloys |
US3814696A (en) * | 1972-06-19 | 1974-06-04 | Eastman Kodak Co | Colloidal metal in non-aqueous media |
US4004051A (en) * | 1974-02-15 | 1977-01-18 | Crown City Plating Company | Aqueous noble metal suspensions for one stage activation of nonconductors for electroless plating |
-
1979
- 1979-01-15 US US06/003,351 patent/US4255194A/en not_active Expired - Lifetime
- 1979-12-05 CA CA341,302A patent/CA1122753A/en not_active Expired
- 1979-12-11 GB GB8028808A patent/GB2053284B/en not_active Expired
- 1979-12-11 GB GB7942704A patent/GB2040316B/en not_active Expired
- 1979-12-29 KR KR7904680A patent/KR840001725B1/ko active
-
1980
- 1980-01-09 DE DE3000526A patent/DE3000526C2/de not_active Expired
- 1980-01-09 IT IT19097/80A patent/IT1193885B/it active
Also Published As
Publication number | Publication date |
---|---|
CA1122753A (en) | 1982-05-04 |
KR830001404A (ko) | 1983-04-30 |
DE3000526A1 (de) | 1980-07-17 |
IT1193885B (it) | 1988-08-31 |
GB2053284B (en) | 1982-12-22 |
DE3000526C2 (de) | 1982-12-02 |
US4255194A (en) | 1981-03-10 |
GB2053284A (en) | 1981-02-04 |
KR840001725B1 (ko) | 1984-10-17 |
GB2040316B (en) | 1983-02-16 |
GB2040316A (en) | 1980-08-28 |
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