ES2002851A6 - Circuito integrado protector - Google Patents
Circuito integrado protectorInfo
- Publication number
- ES2002851A6 ES2002851A6 ES8602596A ES8602596A ES2002851A6 ES 2002851 A6 ES2002851 A6 ES 2002851A6 ES 8602596 A ES8602596 A ES 8602596A ES 8602596 A ES8602596 A ES 8602596A ES 2002851 A6 ES2002851 A6 ES 2002851A6
- Authority
- ES
- Spain
- Prior art keywords
- metal gate
- protection
- integrated circuits
- electrostatic discharge
- transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 abstract 4
- 230000005669 field effect Effects 0.000 abstract 2
- 238000010420 art technique Methods 0.000 abstract 1
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 230000003071 parasitic effect Effects 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0642—Isolation within the component, i.e. internal isolation
- H01L29/0646—PN junctions
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
LOS CIRCUITOS INTEGRADOS REALIZADOS CON LA TECNOLOGIA DE PUERTA AISLADA (V.G., CMOS) SE HAN PROTEGIDO CONTRA LA DESCARGA ELECTROSTATICA (ESD) MEDIANTE UN TRANSISTOR DE EFECTO DE CAMPO DE PUERTA METALICA. SORPRENDENTEMENTE, SE OBTIENE UNA PROTECCION SUPERIOR OMITIENDO LA PUERTA METALICA, BASANDOSE DE ESTE MODO TAN SOLO EN LA DESCARGA EN ALUD DEL DISPOSITIVO BIPOLAR PARA LA PROTECCION DE POLARIDAD OPUESTA. SE POSTULA QUE EL EFECTO DE CAMPO DEL DISPOSITIVO DE PUERTA METALICA RESTRINGE INDESEABLEMENTE EL FLUJO DE CORRIENTE EN EL DISPOSITIVO DE LA TECNOLOGIA ANTERIOR. LA TECNICA DE LA INVENCION SE PUEDE REALIZAR CONVENIENTEMENTE EMPLEANDO UN DIODO EN LUGAR DE UN TRANSISTOR COMO ELEMENTO PROTECTOR.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US78776485A | 1985-10-15 | 1985-10-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2002851A6 true ES2002851A6 (es) | 1988-10-01 |
Family
ID=25142455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES8602596A Expired ES2002851A6 (es) | 1985-10-15 | 1986-10-14 | Circuito integrado protector |
Country Status (8)
Country | Link |
---|---|
US (1) | US4821089A (es) |
EP (1) | EP0242383B1 (es) |
JP (1) | JPH0828426B2 (es) |
KR (1) | KR900004727B1 (es) |
CA (1) | CA1253631A (es) |
DE (1) | DE3681160D1 (es) |
ES (1) | ES2002851A6 (es) |
WO (1) | WO1987002511A1 (es) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2575333B1 (fr) * | 1984-12-21 | 1987-01-23 | Radiotechnique Compelec | Dispositif de protection d'un circuit integre contre les decharges electrostatiques |
FR2623018B1 (fr) * | 1987-11-06 | 1990-02-09 | Thomson Semiconducteurs | Circuit integre protege contre les decharges electrostatiques avec seuil de protection variable |
USRE37477E1 (en) * | 1987-11-06 | 2001-12-18 | Sgs-Thomson Microelectronics, Inc. | Integrated circuit protected against electrostatic discharges, with variable protection threshold |
US5182621A (en) * | 1988-06-14 | 1993-01-26 | Nec Corporation | Input protection circuit for analog/digital converting semiconductor |
JP2513010B2 (ja) * | 1988-12-27 | 1996-07-03 | 日本電気株式会社 | 半導体集積回路の入力保護装置 |
US5124877A (en) * | 1989-07-18 | 1992-06-23 | Gazelle Microcircuits, Inc. | Structure for providing electrostatic discharge protection |
US5304839A (en) * | 1990-12-04 | 1994-04-19 | At&T Bell Laboratories | Bipolar ESD protection for integrated circuits |
US5272586A (en) * | 1991-01-29 | 1993-12-21 | National Semiconductor Corporation | Technique for improving ESD immunity |
EP0517391A1 (en) * | 1991-06-05 | 1992-12-09 | STMicroelectronics, Inc. | ESD protection circuit |
US5264723A (en) * | 1992-04-09 | 1993-11-23 | At&T Bell Laboratories | Integrated circuit with MOS capacitor for improved ESD protection |
US5838033A (en) * | 1993-09-08 | 1998-11-17 | Lucent Technologies Inc. | Integrated circuit with gate conductor defined resistor |
JPH07176693A (ja) * | 1993-12-17 | 1995-07-14 | Fujitsu Ltd | 入力保護回路 |
JP2643904B2 (ja) * | 1995-04-20 | 1997-08-25 | 日本電気株式会社 | 静電保護素子 |
US5773338A (en) * | 1995-11-21 | 1998-06-30 | Lucent Technologies Inc. | Bipolar transistor with MOS-controlled protection for reverse-biased emitter-based junction |
KR100449180B1 (ko) * | 1997-12-31 | 2005-01-05 | 주식회사 하이닉스반도체 | 반도체소자의정전기방지회로용트랜지스터구조 |
US7251250B2 (en) * | 2000-02-08 | 2007-07-31 | Cingular Wireless Ii, Llc | Method and apparatus for efficient sharing of communication system resources |
US6489232B1 (en) * | 2000-05-31 | 2002-12-03 | Agere Systems, Inc. | ESD resistant device |
US6426263B1 (en) | 2000-08-11 | 2002-07-30 | Agere Systems Guardian Corp. | Method for making a merged contact window in a transistor to electrically connect the gate to either the source or the drain |
US6724601B2 (en) | 2001-03-16 | 2004-04-20 | Integrated Device Technology, Inc. | ESD protection circuit |
US7329926B2 (en) * | 2003-04-01 | 2008-02-12 | Agere Systems Inc. | Semiconductor device with constricted current passage |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1209271A (en) * | 1967-02-27 | 1970-10-21 | Hitachi Ltd | Improvements in semiconductor devices |
US3555374A (en) * | 1967-03-03 | 1971-01-12 | Hitachi Ltd | Field effect semiconductor device having a protective diode |
US3673427A (en) * | 1970-02-02 | 1972-06-27 | Electronic Arrays | Input circuit structure for mos integrated circuits |
US3676742A (en) * | 1971-05-24 | 1972-07-11 | Signetics Corp | Means including a spark gap for protecting an integrated circuit from electrical discharge |
DE2531846C2 (de) * | 1974-07-16 | 1989-12-14 | Nippon Electric Co., Ltd., Tokyo | Schutzschaltungsanordnung für einen Isolierschicht-Feldeffekttransistor |
FR2289051A1 (fr) * | 1974-10-22 | 1976-05-21 | Ibm | Dispositifs a semi-conducteur du genre transistors a effet de champ et a porte isolee et circuits de protection cotre les surtensions |
US4295176A (en) * | 1979-09-04 | 1981-10-13 | Bell Telephone Laboratories, Incorporated | Semiconductor integrated circuit protection arrangement |
JPS57164571A (en) * | 1981-04-02 | 1982-10-09 | Mitsubishi Electric Corp | Semiconductro integrated circuit device |
US4435896A (en) * | 1981-12-07 | 1984-03-13 | Bell Telephone Laboratories, Incorporated | Method for fabricating complementary field effect transistor devices |
JPS58202573A (ja) * | 1982-05-21 | 1983-11-25 | Fujitsu Ltd | 半導体集積回路装置 |
JPS6074677A (ja) * | 1983-09-30 | 1985-04-26 | Toshiba Corp | 複合型サイリスタ |
JPS61237472A (ja) * | 1985-04-15 | 1986-10-22 | Nec Corp | 半導体装置 |
JPH05263075A (ja) * | 1992-03-17 | 1993-10-12 | Toshiba Corp | 熱蛍光体 |
-
1986
- 1986-09-22 JP JP61505026A patent/JPH0828426B2/ja not_active Expired - Lifetime
- 1986-09-22 DE DE8686906135T patent/DE3681160D1/de not_active Expired - Lifetime
- 1986-09-22 EP EP86906135A patent/EP0242383B1/en not_active Expired - Lifetime
- 1986-09-22 WO PCT/US1986/001974 patent/WO1987002511A1/en active IP Right Grant
- 1986-10-14 CA CA000520428A patent/CA1253631A/en not_active Expired
- 1986-10-14 ES ES8602596A patent/ES2002851A6/es not_active Expired
-
1987
- 1987-06-04 US US07/059,194 patent/US4821089A/en not_active Expired - Lifetime
- 1987-06-12 KR KR8770500A patent/KR900004727B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0242383A1 (en) | 1987-10-28 |
JPS63501112A (ja) | 1988-04-21 |
KR900004727B1 (en) | 1990-07-05 |
KR880700466A (ko) | 1988-03-15 |
EP0242383B1 (en) | 1991-08-28 |
JPH0828426B2 (ja) | 1996-03-21 |
DE3681160D1 (de) | 1991-10-02 |
WO1987002511A1 (en) | 1987-04-23 |
US4821089A (en) | 1989-04-11 |
CA1253631A (en) | 1989-05-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
SA6 | Expiration date (snapshot 920101) |
Free format text: 2006-10-14 |