EP4222379A1 - Dissipateur thermique actif - Google Patents

Dissipateur thermique actif

Info

Publication number
EP4222379A1
EP4222379A1 EP21876263.1A EP21876263A EP4222379A1 EP 4222379 A1 EP4222379 A1 EP 4222379A1 EP 21876263 A EP21876263 A EP 21876263A EP 4222379 A1 EP4222379 A1 EP 4222379A1
Authority
EP
European Patent Office
Prior art keywords
heat
cooling element
cooling
fluid
generating structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21876263.1A
Other languages
German (de)
English (en)
Inventor
Ananth Saran YALAMARTHY
Prabhu SATHYAMURTHY
Suryaprakash Ganti
Seshagiri Rao Madhavapeddy
Vikram MUKUNDAN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WISKA Hoppmann GmbH
Frore Systems Inc
Original Assignee
WISKA Hoppmann GmbH
Frore Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WISKA Hoppmann GmbH, Frore Systems Inc filed Critical WISKA Hoppmann GmbH
Publication of EP4222379A1 publication Critical patent/EP4222379A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/10—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by imparting a pulsating motion to the flow, e.g. by sonic vibration
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B45/00—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids
    • F04B45/04—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
    • F04B45/047—Pumps having electric drive
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D33/00—Non-positive-displacement pumps with other than pure rotation, e.g. of oscillating type
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Definitions

  • FIGS. 1A-1F depict embodiments of active cooling systems including active heat sinks.
  • FIGS. 2A-2G depict an indication of fluid temperature in active heat sinks.
  • FIGS. 3A-3D depict embodiments of actuators usable in active cooling systems including centrally anchored cooling elements.
  • FIG. 4 depicts an embodiment of an active cooling system including an active heat sink.
  • FIG. 5 depicts an embodiment of an active cooling system including an active heat sink.
  • FIG. 6 depicts an embodiment of an active cooling system including an active heat sink.
  • FIG. 7 depicts an embodiment of an active cooling system including an active heat sink.
  • FIG. 8 depicts an embodiment of an active cooling system including an active heat sink.
  • FIG. 9 depicts an embodiment of an active cooling system including an active heat sink.
  • FIGS. 10A-10B depict an embodiment of an active cooling system including multiple cooling cells configured as a tile and including active heat sinks.
  • FIG. 11 depicts an embodiment of an active cooling system including multiple cooling cells having active heat sinks.
  • FIG. 12 is a flow chart depicting an embodiment of a technique for driving an active heat sink.
  • the invention can be implemented in numerous ways, including as a process; an apparatus; a system; a composition of matter; a computer program product embodied on a computer readable storage medium; and/or a processor, such as a processor configured to execute instructions stored on and/or provided by a memory coupled to the processor.
  • these implementations, or any other form that the invention may take, may be referred to as techniques.
  • the order of the steps of disclosed processes may be altered within the scope of the invention.
  • a component such as a processor or a memory described as being configured to perform a task may be implemented as a general component that is temporarily configured to perform the task at a given time or a specific component that is manufactured to perform the task.
  • the term ‘processor’ refers to one or more devices, circuits, and/or processing cores configured to process data, such as computer program instructions.
  • processors for mobile devices such as smartphones, tablet computers, notebooks, and virtual reality devices can operate at high clock speeds, but produce a significant amount of heat. Because of the quantity of heat produced, processors may run at full speed only for a relatively short period of time. After this time expires, throttling (e.g. slowing of the processor’s clock speed) occurs. Although throttling can reduce heat generation, it also adversely affects processor speed and, therefore, the performance of devices using the processors. As technology moves to 5G and beyond, this issue is expected to be exacerbated.
  • Fan that have rotating blades.
  • the fan that can be energized in response to an increase in temperature of internal components.
  • the fans drive air through the larger devices to cool internal components.
  • Such fans are typically too large for mobile devices such as smartphones or for thinner devices such as tablet computers.
  • Fans also may have limited efficacy because of the boundary layer of air existing at the surface of the components, provide a limited airspeed for air flow across the hot surface desired to be cooled and may generate an excessive amount of noise.
  • Passive cooling solutions may include components such as a heat spreader and a heat pipe or vapor chamber to transfer heat to a heat exchanger. Although a heat spreader somewhat mitigates the temperature increase at hot spots, the amount of heat produced in current and future devices may not be adequately addressed.
  • a heat pipe or vapor chamber may provide an insufficient amount of heat transfer to remove excessive heat generated.
  • Varying configurations of computing devices further complicate heat management.
  • computing devices such as laptops are frequently open to the external environment while other computing devices, such as smartphones, are generally closed to the external environment.
  • active heat management solutions for open devices such as fans
  • a fan driving heated fluid from the inside of the computing device to the outside environment may be too large for closed computing devices such as smartphones and may provide limited fluid flow.
  • the closed computing device has no outlet for the heated fluid even if the fan can be incorporated into the closed computing device.
  • the thermal management provided by such an opendevice mechanism may have limited efficacy.
  • the location of the inlet and/or outlet may be configured differently for different devices.
  • an outlet for fan-driven fluid flow in a laptop may be desired to be located away from the user’s hands or other structures that may lie within the outflow of heated fluid.
  • Such a configuration not only prevents the user’s discomfort but also allows the fan to provide the desired cooling.
  • Another mobile device having a different configuration may require the inlets and/or outlets to be configured differently, may reduce the efficacy of such heat management systems and may prevent the use of such heat management systems.
  • mechanisms for improving cooling in computing devices are desired.
  • servers, batteries, automotive components, some mobile devices and other technologies that typically used for longer periods of time are desired to be cooled.
  • heat generated during steady state operation of the device may be a larger concern.
  • steady state cooling solutions are also desired.
  • a system including a cooling element and a support structure is described.
  • the cooling element has a first side and a second side opposite to the first side.
  • the cooling element is configured to undergo vibrational motion when actuated to drive a fluid from the first side to the second side.
  • the support structure thermally couples the cooling element to a heat-generating structure via thermal conduction.
  • the support structure further includes a bottom plate and sidewalls forming a chamber therein.
  • the cooling element is in the chamber.
  • the bottom plate and/or the sidewalls have orifices therein.
  • the cooling element is actuated to drive the fluid through the orifices.
  • the vibrational motion of the cooling element may drive the fluid such that the fluid exiting the orifices has a speed of at least thirty meters per second.
  • the support structure may also include a top plate having vent(s) therein.
  • the cooling element is between the top plate and the heat-generating structure.
  • a top chamber is formed between the cooling element and the top plate and a bottom chamber is formed between the cooling element and the bottom plate.
  • the cooling element may have a central region and a perimeter.
  • the support structure may further include an anchor configured to support the cooling element at the central region. At least a portion of the perimeter is flee to undergo the vibrational motion.
  • the system includes a heat spreader integrated with the support structure.
  • the heat spreader is thermally coupled to the support structure and the heat-generating structure via thermal conduction.
  • the support structure is configured such that the fluid exiting at least a portion of the orifices impinges on the heat spreader to extract heat from the heat spreader.
  • the heat spreader extracting heat from the heat-generating structure via thermal conduction.
  • the cooling element may be configured such that the fluid driven by the vibrational motion extracts heat from the cooling element.
  • the support structure includes a pedestal thermally conductively coupled to the heat-generating structure.
  • the heat-generating structure may be is selected from an integrated circuit, a battery, a heat spreader, and a vapor chamber.
  • the active heat sink includes multiple cooling cells and a support structure.
  • Each of the cooling cells includes a cooling element, a top plate having at least one vent therein, a bottom plate, sidewalls forming a chamber therein, and an anchor.
  • the cooling element is in the chamber between the top plate and the bottom plate.
  • the bottom plate and/or the sidewalls have orifices therein.
  • the cooling element is actuated to undergo vibrational motion to drive a fluid through the orifices.
  • the support structure is integrated with the cooling cells and thermally couples the cooling element to a heat-generating structure via thermal conduction.
  • the cooling element has a central region and a perimeter.
  • the support structure further includes an anchor for each of the cooling elements.
  • the anchor is configured to support the cooling element at the central region. At least a portion of the perimeter is free to undergo the vibrational motion.
  • the active heat sink includes a heat spreader integrated with the support structure.
  • the heat spreader is thermally coupled to the support structure and the heatgenerating structure via thermal conduction.
  • the cooling element may be configured such that the fluid driven by the vibrational motion extracts heat from the cooling element.
  • the support structure further includes a pedestal thermally conductively connecting the heat-generating structure.
  • the heat-generating structure is selected from an integrated circuit, a battery, a heat spreader, and a vapor chamber.
  • a method of cooling a heat-generating structure includes driving a cooling element to induce a vibrational motion at a frequency.
  • the cooling element has a first side and a second side opposite to the first side.
  • the cooling element is configured to undergo vibrational motion when actuated to drive a fluid from the first side to the second side.
  • the cooling element being thermally coupled by a support structure to the heat-generating structure.
  • the support structure thermally couples the cooling element to the heat-generating structure via thermal conduction.
  • the frequency corresponds to a structural resonance for the cooling element and to an acoustic resonance for at least a portion of a chamber in which the cooling element resides.
  • the cooling element is one of a plurality of cooling elements.
  • driving the cooling element further includes driving the plurality of cooling elements to induce the vibrational motion in each of the cooling elements.
  • Each of the cooling elements is thermally coupled to the heat-generating structure via thermal conduction.
  • a heat spreader is integrated with the support structure, the heat spreader being thermally coupled to the heat-generating structure.
  • FIGS. 1 A- IF are diagrams depicting exemplary embodiments of active cooling systems 100 and 100’ usable with heat-generating structure 102 and forming an active heat sink. For clarity, only certain components are shown. FIGS. 1 A-1F are not to scale. Although shown as symmetric, cooling system(s) 100 and/or 100’ need not be. FIGS. 1 A-1E depict various modes of one embodiment of a cooling system. FIG. IF depicts another embodiment of a cooling system 100’.
  • Cooling system 100 includes cooling element 120 and support structure 170.
  • support structure 170 includes top plate 110 having vent 112 therein, orifice plate 130 having orifices 132 therein, anchor 160, pedestal 172 and sidewalls 174.
  • Cooling element 120 divides the interior of support structure 170 into top chamber 140 and bottom chamber 150. Chambers 140 and 150 (collectively chamber 140/150) are formed within orifice, or bottom, plate 130, top plate 110 and sidewalls 174.
  • Support structure 170 is thermally coupled to heat-generating structure 102 via pedestal 172.
  • Pedestal 172 also provides a space for fluid to flow between orifice plate 130 and heatgenerating structure 102 (i.e. a jet channel).
  • heat-generating structure 102 is separate from cooling system 100.
  • heat-generating structure 102 may be integrated into support structure 170.
  • heat-generating structure 102 may be a heat spreader that is thermally and mechanically coupled to cooling element 120 via pedestal 172, orifice plate 130, and anchor 160.
  • heat-generating structure (i.e. heat spreader) 102 extracts heat from integrated circuit 103 (or other structure that generates heat) via conduction. This heat may be transferred to other portions of cooling system 100 through pedestal 172 via conduction.
  • Cooling element 120 is supported at its central region by anchor 160. Regions of cooling element 120 closer to and including portions of the cooling element’s perimeter (e.g. tip 123) vibrate when actuated.
  • tip 123 of cooling element 120 includes a portion of the perimeter furthest from anchor 160 and undergoes the largest deflection during actuation of cooling element 120. For clarity, only one tip 123 of cooling element 120 is labeled in FIG. 1A.
  • FIG. 1 A depicts cooling system 100 in a neutral position.
  • cooling element 120 is shown as substantially flat.
  • cooling element 120 is driven to vibrate between positions shown in FIGS. IB and 1C.
  • This vibrational motion draws fluid (e.g. air) into vent 112, through chambers 140 and 150 and out orifices 132 at high speed and/or flow rates.
  • the speed at which the fluid impinges on heatgenerating structure 102 may be at least thirty meters per second.
  • the fluid is driven by cooling element 120 toward heat-generating structure 102 at a speed of at least forty-five meters per second.
  • the fluid is driven toward heatgenerating structure 102 by cooling element 120 at speeds of at least sixty meters per second. Other speeds may be possible in some embodiments.
  • Cooling system 100 is also configured so that little or no fluid is drawn back into chamber 140/150 through orifices 132 by the vibrational motion of cooling element 120.
  • heat-generating structure 102 is a heat spreader or vapor chamber thermally connected to integrated circuit 103.
  • integrated circuit 103 generates heat, which is transferred to heat-generating structure (i.e. heat spreader) 102.
  • integrated circuit 103 may also be considered to be a heat-generating structure.
  • the heat is transferred between integrated circuit 103 and heat spreader 102 via conduction.
  • an additional structure may be interposed between heat-generating structure 102 and integrated circuit 103.
  • an additional heat spreader and/or a vapor chamber may be present. Because cooling system 100 is thermally coupled to and cools structure 102, structure 102 is described as a heat-generating structure.
  • cooling of heat-generating structure 102 is a mechanism for managing heat produced by integrated circuit 103.
  • heat-generating structure 102 generates heat.
  • heat-generating structure 102 may be an integrated circuit, such as integrated circuit 103. Such an embodiment may be viewed as omitting heatgenerating structure 102 or omitting integrated circuit 103.
  • heatgenerating structure 102 is desired to be cooled but does not generate heat itself.
  • Heatgenerating structure 102 may conduct heat (e.g. from a nearby object that generates heat such as integrated circuit 103).
  • heat-generating structure 102 might be a heat spreader or a vapor chamber as shown in FIGS. 1A-1F.
  • heat-generating structure 102 may be a thermally conductive part of a module containing cooling system 100.
  • cooling system 100 may be affixed to heat-generating structure 102, which may be coupled to another heat sink, vapor chamber, integrated circuit 103, or other separate structure desired to be cooled.
  • cooling system 100 may be used to cool another component or device.
  • heatgenerating structure 102 or integrated circuit 103 may include or be replaced by other semiconductor components(s) including individual integrated circuit components such as processors, other integrated circuit(s) and/or chip package(s); sensor(s); optical device(s); one or more batteries; other component(s) of an electronic device such as a computing device; heat spreaders; heat pipes; other electronic component(s) and/or other device(s) desired to be cooled.
  • semiconductor components including individual integrated circuit components such as processors, other integrated circuit(s) and/or chip package(s); sensor(s); optical device(s); one or more batteries; other component(s) of an electronic device such as a computing device; heat spreaders; heat pipes; other electronic component(s) and/or other device(s) desired to be cooled.
  • cooling system 100 may be used in computing devices.
  • Such computing devices may include but are not limited to smartphones, tablet computers, laptop computers, tablets, two-in-one laptops, hand held gaming systems, digital cameras, virtual reality headsets, augmented reality headsets, mixed reality headsets and other devices that are thin.
  • Cooling system 100 may be a micro-electro- mechanical system (MEMS) cooling system capable of residing within mobile computing devices and/or other devices having limited space in at least one dimension.
  • MEMS micro-electro- mechanical system
  • the total height of cooling system 100 (from the top of heat-generating structure 102 to the top of top plate 110) may be less than 2 millimeters.
  • the total height of cooling system 100 is not more than 1.5 millimeters. In some embodiments, this total height is not more than 1.1 millimeters. In some embodiments, the total height does not exceed one millimeter. In some embodiments, the total height does not exceed two hundred and fifty micrometers.
  • the distance between the bottom of orifice plate 130 and the top of heat-generating structure 102, y may be small. In some embodiments, y is at least two hundred micrometers and not more than one millimeter. In some embodiments, y is at least two hundred micrometers and not more than three hundred micrometers.
  • cooling system 100 is usable in computing devices and/or other devices having limited space in at least one dimension.
  • cooling system 100 in devices having fewer limitations on space and/or for purposes other than cooling.
  • one cooling system 100 e.g. one cooling cell
  • multiple cooling systems 100 might be used in connection with heat-generating structure 102.
  • a one or two- dimensional array of cooling cells might be utilized.
  • Cooling system 100 is in communication with a fluid used to cool heatgenerating structure 102.
  • the fluid may be a gas or a liquid.
  • the fluid may be air.
  • the fluid includes fluid from outside of the device in which cooling system 100 resides (e.g. provided through external vents in the device).
  • the fluid circulates within the device in which cooling system resides (e.g. in an enclosed device).
  • Cooling element 120 can be considered to divide the interior of active cooling system 100 into top chamber 140 and bottom chamber 150.
  • Top chamber 140 is formed by cooling element 120, the sides, and top plate 110.
  • Bottom chamber 150 is formed by orifice plate 130, the sides, cooling element 120 and anchor 160.
  • Top chamber 140 and bottom chamber 150 are connected at the periphery of cooling element 120 and together form chamber 140/150 (e.g. an interior chamber of cooling system 100).
  • top chamber 140 may be a function of the cell (cooling system 100) dimensions, cooling element 120 motion, and the frequency of operation.
  • Top chamber 140 has a height, hl .
  • the height of top chamber 140 may be selected to provide sufficient pressure to drive the fluid to bottom chamber 150 and through orifices 132 at the desired flow rate and/or speed.
  • Top chamber 140 is also sufficiently tall that cooling element 120 does not contact top plate 110 when actuated.
  • the height of top chamber 140 is at least fifty micrometers and not more than five hundred micrometers.
  • top chamber 140 has a height of at least two hundred and not more than three hundred micrometers.
  • Bottom chamber 150 has a height, h2. In some embodiments, the height of bottom chamber 150 is sufficient to accommodate the motion of cooling element 120. Thus, no portion of cooling element 120 contacts orifice plate 130 during normal operation. Bottom chamber 150 is generally smaller than top chamber 140 and may aid in reducing the backflow of fluid into orifices 132. In some embodiments, the height of bottom chamber 150 is the maximum deflection of cooling element 120 plus at least five micrometers and not more than ten micrometers. In some embodiments, the deflection of cooling element 120 (e.g. the deflection of tip 123), z, has an amplitude of at least ten micrometers and not more than one hundred micrometers.
  • the amplitude of deflection of cooling element 120 is at least ten micrometers and not more than sixty micrometers. However, the amplitude of deflection of cooling element 120 depends on factors such as the desired flow rate through cooling system 100 and the configuration of cooling system 100. Thus, the height of bottom chamber 150 generally depends on the flow rate through and other components of cooling system 100.
  • Top plate 110 includes vent 112 through which fluid may be drawn into cooling system 100.
  • Top vent 112 may have a size chosen based on the desired acoustic pressure in chamber 140.
  • the width, w, of vent 112 is at least five hundred micrometers and not more than one thousand micrometers.
  • the width of vent 112 is at least two hundred fifty micrometers and not more than two thousand micrometers.
  • vent 112 is a centrally located aperture in top plate 110. In other embodiments, vent 112 may be located elsewhere. For example, vent 112 may be closer to one of the edges of top plate 110. Vent 112 may have a circular, rectangular or other shaped footprint.
  • vent 112 may be offset toward the edges of top chamber 140 or be located on the side(s) of top chamber 140.
  • top plate 110 is shown as substantially flat, in some embodiments trenches and/or other structures may be provided in top plate 110 to modify the configuration of top chamber 140 and/or the region above top plate 110.
  • Cooling element 120 includes an anchored region 122 and cantilevered arms 121.
  • Anchored region 122 and cantilevered arms 121 are only labeled in FIGS. 1 A and IF.
  • Anchored region 122 is supported (e.g. held in place) in cooling system 100 by anchor 160.
  • Cantilevered arms 121 undergo vibrational motion in response to cooling element 120 being actuated.
  • anchored region 122 is centrally located along an axis of cooling elements 120 and 120’.
  • anchored region 122 may be at one edge of the actuator and outer region 128 at the opposing edge.
  • cooling element 120 is edge anchored.
  • cooling element 120 may have a varying thickness.
  • cooling element 120 may be replaced by cooling element 120’, discussed below.
  • Anchor 160 supports cooling element 120 at the central portion of cooling element 120. Thus, at least part of the perimeter of cooling element 120 is unpinned and free to vibrate. In some embodiments, anchor 160 extends along a central axis of cooling element 120 (e.g. perpendicular to the page in FIGS. 1A-1F). In such embodiments, portions of cooling element 120 that vibrate (e.g. cantilevered arms 121 including tip 123) move in a cantilevered fashion. Thus, cantilevered arms 121 of cooling element 120 may move in a manner analogous to the wings of a butterfly (i.e. in-phase) and/or analogous to a seesaw (i.e. out-of-phase).
  • anchor 160 does not extend along an axis of cooling element 120. In such embodiments, all portions of the perimeter of cooling element 120 are free to vibrate (e.g. analogous to a jellyfish).
  • anchor 160 supports cooling element 120 from the bottom of cooling element 120.
  • anchor 160 may support cooling element 120 in another manner. For example, anchor 160 may support cooling element 120 from the top (e.g. cooling element 120 hangs from anchor 160). Such an embodiment is shown and described in the context of FIG. IF.
  • the width, a, of anchor 160 is at least 0.5 millimeters and not more than four millimeters. In some embodiments, the width of anchor 160 is at least two millimeters and not more than 2.5 millimeters. Anchor 160 may occupy at least ten percent and not more than fifty percent of cooling element 120.
  • Cooling element 120 has a first side and a second side. In some embodiments, the first side is distal from heat-generating structure 102 and the second side is proximate to heat-generating structure 102. In the embodiment shown in FIGS. 1 A-1F, the first side of cooling element 120 is the top of cooling element 120 (closer to top plate 110) and the second side is the bottom of cooling element 120 (closer to orifice plate 130). Cooling element 120 is actuated to undergo vibrational motion as shown in FIGS. 1A-1F. The vibrational motion of cooling element 120 drives fluid from the first side of cooling element 120 (e.g. distal from heat-generating structure 102/from top chamber 140) to a second side of cooling element 120 (e.g.
  • cooling element 120 may be viewed as an actuator.
  • cooling element 120 may be formed by two (or more) cooling elements. Each of the cooling elements has one portion pinned (e.g. supported by anchor 160) and an opposite portion unpinned.
  • a single, centrally supported cooling element 120 may be formed by a combination of multiple cooling elements supported at an edge.
  • Cooling element 120 has a length, L, that depends upon the frequency at which cooling element 120 is desired to vibrate.
  • the length of cooling element 120 is at least four millimeters and not more than ten millimeters.
  • cooling element 120 has a length of at least six millimeters and not more than eight millimeters.
  • the depth of cooling element 120 (e.g. perpendicular to the plane shown in FIGS. 1 A-1F) may vary from one fourth of L through twice L.
  • cooling element 120 may have the same depth as length.
  • the thickness, t, of cooling element 120 may vary based upon the configuration of cooling element 120 and/or the frequency at which cooling element 120 is desired to be actuated.
  • the cooling element thickness is at least two hundred micrometers and not more than three hundred and fifty micrometers for cooling element 120 having a length of eight millimeters and driven at a frequency of at least twenty kilohertz and not more than twenty-five kilohertz.
  • the length, C of chamber 140/150 is close to the length, L, of cooling element 120.
  • the distance, d, between the edge of cooling element 120 and the wall of chamber 140/50 is at least one hundred micrometers and not more than five hundred micrometers. In some embodiments, d is at least two hundred micrometers and not more than three hundred micrometers.
  • Cooling element 120 may be driven at a frequency that is at or near both the resonant frequency for an acoustic resonance of a pressure wave of the fluid in top chamber 140 and the resonant frequency for a structural resonance of cooling element 120.
  • the portion of cooling element 120 undergoing vibrational motion is driven at or near resonance (the “structural resonance”) of cooling element 120.
  • This portion of cooling element 120 undergoing vibration may be cantilevered arm(s) 121 in some embodiments.
  • the frequency of vibration for structural resonance is termed the structural resonant frequency. Use of the structural resonant frequency in driving cooling element 120 reduces the power consumption of cooling system 100.
  • Cooling element 120 and top chamber 140 may also be configured such that this structural resonant frequency corresponds to a resonance in a pressure wave in the fluid being driven through top chamber 140 (the acoustic resonance of top chamber 140).
  • the frequency of such a pressure wave is termed the acoustic resonant frequency.
  • a node in pressure occurs near vent 112 and an antinode in pressure occurs near the periphery of cooling system 100 (e.g. near tip 123 of cooling element 120 and near the connection between top chamber 140 and bottom chamber 150).
  • the distance between these two regions is C/2.
  • C/2 nX/4, where X is the acoustic wavelength for the fluid and n is odd (e.g.
  • n 1, 3, 5, etc.).
  • C X/2.
  • L/2 nX/4, where X is the acoustic wavelength for the fluid and n is odd.
  • v the frequency at which cooling element 120 is driven
  • the frequency v is also at or near the acoustic resonant frequency for at least top chamber 140.
  • the acoustic resonant frequency of top chamber 140 generally varies less dramatically with parameters such as temperature and size than the structural resonant frequency of cooling element 120. Consequently, in some embodiments, cooling element 120 may be driven at (or closer to) a structural resonant frequency than to the acoustic resonant frequency.
  • Orifice plate 130 has orifices 132 therein. Although a particular number and distribution of orifices 132 are shown, another number, other location(s) and/or another distribution may be used.
  • a single orifice plate 130 is used for a single cooling system 100. In other embodiments, multiple cooling systems 100 may share an orifice plate. For example, multiple cells 100 may be provided together in a desired configuration. In such embodiments, the cells 100 may be the same size and configuration or different size(s) and/or configuration(s).
  • Orifices 132 are shown as having an axis oriented normal to a surface of heat-generating structure 102. In other embodiments, the axis of one or more orifices 132 may be at another angle.
  • the angle of the axis may be selected from substantially zero degrees and a nonzero acute angle.
  • Orifices 132 also have sidewalls that are substantially parallel to the normal to the surface of orifice plate 130. In some embodiments, orifices may have sidewalls at a nonzero angle to the normal to the surface of orifice plate 130.
  • orifices 132 may be cone-shaped.
  • trenches and/or other structures may be provided in orifice plate 130 to modify the configuration of bottom chamber 150 and/or the region between orifice plate 130 and heat-generating structure 102.
  • the size, distribution and locations of orifices 132 are chosen to control the flow rate of fluid driven to the surface of heat-generating structure 102.
  • the locations and configurations of orifices 132 may be configured to increase/maximize the fluid flow from bottom chamber 150 through orifices 132 to the jet channel (the region between the bottom of orifice plate 130 and the top of heat-generating structure 102).
  • the locations and configurations of orifices 132 may also be selected to reduce/minimize the suction flow (e.g. back flow) from the jet channel through orifices 132.
  • the locations of orifices are desired to be sufficiently far from tip 123 that suction in the upstroke of cooling element 120 (tip 123 moves away from orifice plate 13) that would pull fluid into bottom chamber 150 through orifices 132 is reduced.
  • the locations of orifices are also desired to be sufficiently close to tip 123 that suction in the upstroke of cooling element 120 also allows a higher pressure from top chamber 140 to push fluid from top chamber 140 into bottom chamber 150.
  • the ratio of the flow rate from top chamber 140 into bottom chamber 150 to the flow rate from the jet channel through orifices 132 in the upstroke is greater than 2: 1. In some embodiments, the net flow ratio is at least 85: 15.
  • the net flow ratio is at least 90: 10.
  • orifices 132 are desired to be at least a distance, rl, from tip 123 and not more than a distance, r2, from tip 123 of cooling element 120.
  • rl is at least one hundred micrometers (e.g. rl > 100 pm) and r2 is not more than one millimeter (e.g. r2 ⁇ 1000 pm).
  • orifices 132 are at least two hundred micrometers from tip 123 of cooling element 120 (e.g. rl > 200 pm).
  • orifices 132 are at least three hundred micrometers from tip 123 of cooling element 120 (e.g. rl > 300 pm). In some embodiments, orifices 132 have a width of at least one hundred micrometers and not more than five hundred micrometers. In some embodiments, orifices 132 have a width of at least two hundred micrometers and not more than three hundred micrometers. In some embodiments, the orifice separation, s, is at least one hundred micrometers and not more than one millimeter. In some such embodiments, the orifice separation is at least four hundred micrometers and not more than six hundred micrometers.
  • orifices 132 are also desired to occupy a particular fraction of the area of orifice plate 130.
  • orifices 132 may cover at least five percent and not more than fifteen percent of the footprint of orifice plate 130 in order to achieve a desired flow rate of fluid through orifices 132.
  • orifices 132 cover at least eight percent and not more than twelve percent of the footprint of orifice plate 130.
  • cooling element 120 is actuated using a piezoelectric.
  • cooling element 120 may be a piezoelectric cooling element.
  • Cooling element 120 may be driven by a piezoelectric that is mounted on or integrated into cooling element 120.
  • cooling element 120 is driven in another manner including but not limited to providing a piezoelectric on another structure in cooling system 100.
  • Cooling element 120 and analogous cooling elements are referred to hereinafter as piezoelectric cooling element though it is possible that a mechanism other than a piezoelectric might be used to drive the cooling element.
  • cooling element 120 includes a piezoelectric layer on substrate.
  • the substrate may include or consist of stainless steel, a Ni alloy, Hastelloy, Al (e.g.
  • piezoelectric layer includes multiple sublayers formed as thin films on the substrate.
  • the piezoelectric layer may be a bulk layer affixed to the substrate.
  • Such a piezoelectric cooling element 120 also includes electrodes used to activate the piezoelectric.
  • the substrate functions as an electrode in some embodiments.
  • a bottom electrode may be provided between the substrate and the piezoelectric layer.
  • Other layers including but not limited to seed, capping, passivation or other layers might be included in piezoelectric cooling element.
  • cooling element 120 may be actuated using a piezoelectric.
  • cooling system 100 includes chimneys (not shown) or other ducting. Such ducting provides a path for heated fluid to flow away from heatgenerating structure 102. In some embodiments, ducting returns fluid to the side of top plate 110 distal from heat-generating structure 102. In some embodiments, ducting may instead direct fluid away from heat-generating structure 102 in a direction parallel to heat-generating structure 102 or perpendicular to heat-generating structure 102 but in the opposite direction (e.g. toward the bottom of the page). For a device in which fluid external to the device is used in cooling system 100, the ducting may channel the heated fluid to a vent. In such embodiments, additional fluid may be provided from an inlet vent.
  • the ducting may provide a circuitous path back to the region near vent 112 and distal from heat-generating structure 102. Such a path allows for the fluid to dissipate heat before being reused to cool heat-generating structure 102.
  • ducting may be omitted or configured in another manner. Thus, the fluid is allowed to carry away heat from heat-generating structure 102.
  • FIGS. 1B-1C depict in-phase operation of cooling system 100.
  • cooling element 120 has been actuated so that cantilevered arms 121 and tip 123 move away from top plate 110.
  • FIG. IB can thus be considered to depict the end of a down stroke of cooling element 120.
  • gap 152 for bottom chamber 150 has decreased in size and is shown as gap 152B.
  • gap 142 for top chamber 140 has increased in size and is shown as gap 142B.
  • a lower (e.g. minimum) pressure is developed at the periphery when cooling element 120 is at the neutral position.
  • bottom chamber 150 decreases in size and top chamber 140 increases in size as shown in FIG. IB.
  • fluid is driven out of orifices 132 in a direction that is at or near perpendicular to the surface of orifice plate 130 and/or the top surface of heat-generating structure 102.
  • the fluid is driven from orifices 132 (toward heatgenerating structure 102) at a high speed, for example in excess of thirty-five meters per second.
  • the fluid then travels along the surface of heat-generating structure 102 and toward the periphery of heat-generating structure 102, where the pressure is lower than near orifices 132. Also in the down stroke, top chamber 140 increases in size and a lower pressure is present in top chamber 140. As a result, fluid is drawn into top chamber 140 through vent 112. The motion of the fluid into vent 112, through orifices 132, and along the surface of heat-generating structure 102 is shown by unlabeled arrows in FIG. IB.
  • Cooling element 120 is also actuated so that cantilevered arms 121 and thus tip 123 move away from heat-generating structure 102 and toward top plate 110.
  • FIG. 1C can thus be considered to depict the end of an up stroke of cooling element 120. Because of the motion of cooling element 120, gap 142 has decreased in size and is shown as gap 142C. Gap 152 has increased in size and is shown as gap 152C.
  • a higher (e.g. maximum) pressure is developed at the periphery when cooling element 120 is at the neutral position.
  • bottom chamber 150 increases in size and top chamber 140 decreases in size as shown in FIG. 1C.
  • the fluid is driven from top chamber 140 (e.g.
  • cooling system 100 is able to drive fluid from top chamber 140 to bottom chamber 150 without an undue amount of backflow of heated fluid from the jet channel entering bottom chamber 140.
  • cooling system 100 may operate such that fluid is drawn in through vent 112 and driven out through orifices 132 without cooling element 120 contacting top plate 110 or orifice plate 130.
  • pressures are developed within chambers 140 and 150 that effectively open and close vent 112 and orifices 132 such that fluid is driven through cooling system 100 as described herein.
  • cooling element 120 undergoes vibrational motion indicated in FIGS. 1 A-1C, drawing fluid through vent 112 from the distal side of top plate 110 into top chamber 140; transferring fluid from top chamber 140 to bottom chamber 150; and pushing the fluid through orifices 132 and toward heat-generating structure 102.
  • cooling element 120 is driven to vibrate at or near the structural resonant frequency of cooling element 120. In some embodiments, this corresponds to the structural resonance of cantilevered arms 121. Further, the structural resonant frequency of cooling element 120 is configured to align with the acoustic resonance of the chamber 140/150.
  • the structural and acoustic resonant frequencies are generally chosen to be in the ultrasonic range.
  • the vibrational motion of cooling element 120 may be at frequencies from 15 kHz through 30 kHz.
  • cooling element 120 vibrates at a frequency/frequencies of at least 20 kHz and not more than 30 kHz.
  • the structural resonant frequency of cooling element 120 is within ten percent of the acoustic resonant frequency of cooling system 100.
  • the structural resonant frequency of cooling element 120 is within five percent of the acoustic resonant frequency of cooling system 100.
  • the structural resonant frequency of cooling element 120 is within three percent of the acoustic resonant frequency of cooling system 100. Consequently, efficiency and flow rate may be enhanced. However, other frequencies may be used.
  • Fluid driven toward heat-generating structure 102 may move substantially normal (perpendicular) to the top surface of heat-generating structure 102.
  • the fluid motion may have a nonzero acute angle with respect to the normal to the top surface of heat-generating structure 102.
  • the fluid impinges on heatgenerating structure 102 and may thin and/or form apertures in the boundary layer of fluid at heat-generating structure 102.
  • transfer of heat from heat-generating structure 102 may be improved.
  • the fluid deflects off of heat-generating structure 102, traveling along the surface of heat-generating structure 102. In some embodiments, the fluid moves in a direction substantially parallel to the top of heat-generating structure 102.
  • heat from heatgenerating structure 102 may be extracted by the fluid.
  • the fluid may exit the region between orifice plate 130 and heat-generating structure 102 at the edges of cooling system 100. Chimneys or other ducting (not shown) at the edges of cooling system 100 allow fluid to be carried away from heat-generating structure 102.
  • heated fluid may be transferred further from heat-generating structure 102 in another manner.
  • the fluid may exchange the heat transferred from heat-generating structure 102 to another structure or to the ambient environment.
  • fluid at the distal side of top plate 110 may remain relatively cool, allowing for the additional extraction of heat.
  • fluid is circulated, returning to distal side of top plate 110 after cooling.
  • heated fluid is carried away and replaced by new fluid at the distal side of cooling element 120. As a result, heat-generating structure 102 may be cooled.
  • FIGS. ID- IE depict an embodiment of active cooling system 100 including centrally anchored cooling element 120 in which the cooling element is driven out-of-phase. More specifically, cantilevered arms 121 of cooling element 120 on opposite sides of anchor 160 (and thus on opposite sides of the central, anchored region 122 of cooling element 120 that is supported by anchor 160) are driven to vibrate out-of-phase. In some embodiments, cantilevered arms 121 of cooling element 120 on opposite sides of anchor 160 are driven at or near one hundred and eighty degrees out-of-phase. Thus, one cantilevered arm 121 of cooling element 120 vibrates toward top plate 110, while the other cantilevered arm 121 of cooling element 120 vibrates toward orifice plate 130/heat-generating structure 102.
  • cooling element 120 undergoes vibrational motion indicated in FIGS. 1 A, ID, and IE, alternately drawing fluid through vent 112 from the distal side of top plate 110 into top chamber 140 for each side of cooling element 120; transferring fluid from each side of top chamber 140 to the corresponding side of bottom chamber 150; and pushing the fluid through orifices 132 on each side of anchor 160 and toward heat-generating structure 102.
  • cooling element 120 is driven to vibrate at or near the structural resonant frequency of cooling element 120.
  • the structural resonant frequency of cooling element 120 is configured to align with the acoustic resonance of the chamber 140/150.
  • the structural and acoustic resonant frequencies are generally chosen to be in the ultrasonic range.
  • the vibrational motion of cooling element 120 may be at the frequencies described for in-phase vibration.
  • the structural resonant frequency of cooling element 120 is within ten percent of the acoustic resonant frequency of cooling system 100.
  • the structural resonant frequency of cooling element 120 is within five percent of the acoustic resonant frequency of cooling system 100.
  • the structural resonant frequency of cooling element 120 is within three percent of the acoustic resonant frequency of cooling system 100. Consequently, efficiency and flow rate may be enhanced.
  • other frequencies may be used.
  • Fluid driven toward heat-generating structure 102 for out-of-phase vibration may move substantially normal (perpendicular) to the top surface of heat-generating structure 102, in a manner analogous to that described above for in-phase operation.
  • chimneys or other ducting (not shown) at the edges of cooling system 100 allow fluid to be carried away from heat-generating structure 102.
  • heated fluid may be transferred further from heat-generating structure 102 in another manner.
  • the fluid may exchange the heat transferred from heat-generating structure 102 to another structure or to the ambient environment.
  • fluid at the distal side of top plate 110 may remain relatively cool, allowing for the additional extraction of heat.
  • fluid is circulated, returning to distal side of top plate 110 after cooling.
  • heated fluid is carried away and replaced by new fluid at the distal side of cooling element 120. As a result, heat-generating structure 102 may be cooled.
  • fluid drawn in through vent 112 and driven through orifices 132 may efficiently dissipate heat from heat-generating structure 102. Because fluid impinges upon the heatgenerating structure with sufficient speed (e.g. at least thirty meters per second) and in some embodiments substantially normal to the heat-generating structure, the boundary layer of fluid at the heat-generating structure may be thinned and/or partially removed. Consequently, heat transfer between heat-generating structure 102 and the moving fluid is improved. Because the heat-generating structure is more efficiently cooled, the corresponding integrated circuit may be run at higher speed and/or power for longer times.
  • cooling system 100 may be a MEMS device. Consequently, cooling systems 100 may be suitable for use in smaller and/or mobile devices, such as smart phones, other mobile phones, virtual reality headsets, tablets, two-in-one computers, wearables and handheld games, in which limited space is available. Performance of such devices may thus be improved. Because cooling element 120 may be vibrated at frequencies of 15 kHz or more, users may not hear any noise associated with actuation of cooling elements.
  • Cooling element 120 does not physically contact top plate 110 or orifice plate 130 during vibration. Thus, resonance of cooling element 120 may be more readily maintained. More specifically, physical contact between cooling element 120 and other structures disturbs the resonance conditions for cooling element 120. Disturbing these conditions may drive cooling element 120 out of resonance. Thus, additional power would need to be used to maintain actuation of cooling element 120. Further, the flow of fluid driven by cooling element 120 may decrease. These, issues are avoided through the use of pressure differentials and fluid flow as discussed above. The benefits of improved, quiet cooling may be achieved with limited additional power.
  • out-of-phase vibration of cooling element 120 allows the position of the center of mass of cooling element 100 to remain more stable. Although a torque is exerted on cooling element 120, the force due to the motion of the center of mass is reduced or eliminated. As a result, vibrations due to the motion of cooling element 120 may be reduced. Moreover, efficiency of cooling system 100 may be improved through the use of out-of-phase vibrational motion for the two sides of cooling element 120. For out-of-phase vibration of cantilevered arms 121, vibrations through cooling system 100 may also be reduced. Consequently, performance of devices incorporating the cooling system 100 may be improved. Further, cooling system 100 may be usable in other applications (e.g. with or without heat-generating structure 102) in which high fluid flows and/or velocities are desired.
  • FIG. IF depicts and embodiment of active cooling system 100’ including a top centrally anchored cooling element.
  • Cooling system 100’ is analogous to cooling system 100. Consequently, analogous components have similar labels.
  • cooling system 100’ is used in conjunction with heat-generating structure 102 and integrated circuit 103, which are analogous to heat-generating structure 102 and integrated circuit 103.
  • Cooling system 100’ includes support structure 170’, top plate 110’ having vents 112’, cooling element 120’, orifice plate 130 including orifices 132, top chamber 140’ having a gap, bottom chamber 150 having a gap and anchor 160 that are analogous to support structure 170, top plate 110 having vent 112, cooling element 120’, orifice plate 130 including orifices 132, top chamber 140 having gap 142, bottom chamber 150 having gap 152 and anchor 160, respectively, of FIGS. 1A-1E.
  • cooling element 120’ is centrally supported by anchor 160 such that at least a portion of the perimeter of cooling element 120’ is free to vibrate.
  • anchor 160 extends along the axis of cooling element 120’ (e.g. in a manner analogous to anchor 360A and/or 360B). In other embodiments, anchor 160 is only near the center portion of cooling element 120’ (e.g. analogous to anchor 360C and/or 360D).
  • Anchor 160 supports cooling element 120’ from above. Thus, cooling element 120’ is suspended from anchor 160. Anchor 160 is suspended from top plate 110’. Top plate 110’ includes vent 113. Vents 112’ on the sides of anchor 160 provide a path for fluid to flow into sides of chamber 140’.
  • Engineered cooling element 120’ has a tailored geometry and is usable in a cooling system such as cooling system 100 and/or 100’.
  • Cooling element 120’ includes an anchored region 122 and cantilevered arms 121’.
  • Anchored region 122 is supported (e.g. held in place) in cooling system 100 by anchor 160.
  • Cantilevered arms 121 ’ undergo vibrational motion in response to cooling element 120’ being actuated.
  • cooling element 120’ operates in an analogous manner to cooling element 120 and can be used in cooling system 100.
  • Each cantilevered arm 121 ’ includes step region 124, extension region 126 and outer region 128.
  • anchored region 122 is centrally located.
  • Step region 124 extends outward from anchored region 122.
  • Extension region 126 extends outward from step region 124.
  • Outer region 128 extends outward from extension region 126.
  • anchored region 122 may be at one edge of the actuator and outer region 128 at the opposing edge. In such embodiments, the actuator is edge anchored.
  • Extension region 126 has a thickness (extension thickness) that is less than the thickness of step region 124 (step thickness) and less than the thickness of outer region 128 (outer thickness). Thus, extension region 126 may be viewed as recessed. Extension region 126 may also be seen as providing a larger bottom chamber 150.
  • the outer thickness of outer region 128 is the same as the step thickness of step region 124. In some embodiments, the outer thickness of outer region 128 is different from the step thickness of step region 124. Outer region 128 and step region 124 may each have a thickness of at least three hundred twenty micrometers and not more than three hundred and sixty micrometers.
  • the outer thickness is at least fifty micrometers and not more than two hundred micrometers greater than the extension thickness.
  • the step is at least fifty micrometers and not more than two hundred micrometers.
  • the outer step is at least fifty micrometers and not more than two hundred micrometers.
  • Outer region 128 may have a width (from tip 123 to extension region 126) of at least one hundred micrometers and not more than three hundred micrometers.
  • Extension 126 region has a length from the step region 124 to outer region 128 of at least 0.5 millimeter and not more than 1.5 millimeters in some embodiments.
  • outer region 128 has a higher mass per unit length in the direction from anchored region 122 than extension region 126. This difference in mass may be due to the larger size of outer region 128, a difference in density between portions of cooling element 120’, and/or another mechanism.
  • cooling element 120’ may be driven to vibrate at or near the structural resonant frequency of cooling element 120’.
  • the structural resonant frequency of cooling element 120’ may be configured to align with the acoustic resonance of the chamber 1407150.
  • the structural and acoustic resonant frequencies are generally chosen to be in the ultrasonic range.
  • the vibrational motion of cooling element 120’ may be at the frequencies described with respect to cooling system 100. Consequently, efficiency and flow rate may be enhanced. However, other frequencies may be used.
  • Cooling system 100’ operates in an analogous manner to cooling system 100. Cooling system 100’ thus shares the benefits of cooling system 100. Thus, performance of a device employing cooling system 100’ may be improved.
  • the use of cooling element 120’ configured in a manner analogous to cooling element 120’ may improve efficiency and reliability.
  • vibrations in cooling system 100’ that may affect other cooling cells (not shown), may be reduced. For example, less vibration may be induced in top plate 110’ due to the motion of cooling element 120’. Consequently, cross talk between cooling system 100’ and other cooling systems (e.g. other cells) or other portions of the device incorporating cooling system 100’ may be reduced. Thus, performance may be enhanced.
  • engineered cooling element 120’ may further improve efficiency of cooling system 100 and/or 100’.
  • Extension region 126 is thinner than step region 124 and outer region 128. This results in a cavity in the bottom of cooling element 120’ corresponding to extension region 126. The presence of this cavity aids in improving the efficiency of cooling system 100’.
  • Each cantilevered arm 121’ vibrates towards top plate 110 in an upstroke and away from top plate 110 in a downstroke. When cantilevered arm 121 ’ moves toward top plate 110, higher pressure fluid in top chamber 140 resists the motion of cantilevered arm 121 ’. Furthermore, suction in bottom chamber 150 also resists the upward motion of cantilevered arm 121 ’ during the upstroke.
  • cantilevered arm 121 ’ In the downstroke of cantilevered arm 121 ’, increased pressure in the bottom chamber 150 and suction in top chamber 140 resist the downward motion of cantilevered arm 121 ’. However, the presence of the cavity in cantilevered arm 121 ’ corresponding to extension region 126 mitigates the suction in bottom chamber 150 during an upstroke. The cavity also reduces the increase in pressure in bottom chamber 150 during a downstroke. Because the suction and pressure increase are reduced in magnitude, cantilevered arms 121 ’ may more readily move through the fluid. This may be achieved while substantially maintaining a higher pressure in top chamber 140, which drives the fluid flow through cooling system 100 and/or 100’.
  • outer region 128 may improve the ability of cantilevered arm 121 ’ to move through the fluid being driven through cooling system 100.
  • Outer region 128 has a higher mass per unit length and thus a higher momentum. Consequently, outer region 128 may improve the ability of cantilevered arms 121 ’ to move through the fluid being driven through cooling system 100.
  • the magnitude of the deflection of cantilevered arm 121’ may also be increased. These benefits may be achieved while maintaining the stiffness of cantilevered arms 121 ’ through the use of thicker step region 124. Further, the larger thickness of outer region 128 may aid in pinching off flow at the bottom of a downstroke.
  • the ability of cooling element 120’ to provide a valve preventing backflow through orifices 132 may be improved.
  • performance of cooling system 100’ employing cooling element 120’ may be improved.
  • cooling systems 100 and 100’ may cool heat-generating structure 102 (and thus integrated circuit 103) using jets of fluid exiting orifices 132 and impinging on heat-generating structure (i.e. heat spreader) 102 or integrated circuit 103 (or another component that is a source of heat).
  • cooling systems 100 and/or 100’ may have an additional mechanism for cooling heat-generating structure.
  • Cooling systems 100 and/or 100’ are thermally coupled to heat-generating structure 102 via support structure 170 such that heat may be transferred from heat-generating structure 102 to cooling system 100 via conduction.
  • pedestal 172 may be made from thermally conductive materials.
  • Pedestal 172 may also be joined to heat-generating structure 102 using a highly thermally conductive mechanism, such as a thermally conductive epoxy. Similarly, pedestal 172 may have a thermal mass that is relatively large (e.g. a significant traction of or greater than) compared to the thermal mass of heat-generating structure 102. For example, pedestal 172 may include or consist of high thermal capacity material(s) (e.g. steels and aluminum alloys) and/or high thermal conductivity materials (e.g. copper and aluminum). Pedestal 172 may also contact heat-generating structure 102 over a wide area. Pedestal 172 may range in size from approximately the size of anchor 160 to across the cooling cell 100 and/or 100’ or across an entire tile formed of multiple cooling cells.
  • a highly thermally conductive mechanism such as a thermally conductive epoxy.
  • pedestal 172 may have a thermal mass that is relatively large (e.g. a significant traction of or greater than) compared to the thermal mass of heat-generating structure 102.
  • pedestal 172 may extend out of the plane of the page across the entire cooling system 100 or across multiple cooling systems.
  • cooling element 120/120’ is thermally coupled to support structure 170 and/or 170’ via anchor 160 and/or top plate 110’, respectively.
  • heat may be conducted from heat-generating structure 102 to cooling element 120/120’ and the remainder of support structure 170 and/or 170’, respectively.
  • cooling system(s) 100 and/or 100’ may act as heat sinks for heat-generating structure 102 and integrated circuit 103.
  • cooling element 120’ may function as a fin.
  • cooling system(s) 100 and/or 100’ are active cooling systems. Consequently, cooling system(s) 100 and/or 100’ may be considered active heat sinks in some embodiments. More specifically, cooling element 120/120’ undergoes vibrational motion. In addition to driving fluid through orifices 132, the vibrational motion drives fluid into chambers 140/150 and 1407150, through chambers 140/150 and 1407150, and past cooling elements 120’. Because fluid is driven past cooling element 120/120’ and through support structure(s) 170 and/or 170’, heat in cooling element 120’ and support structure(s) 170 and/or 170’ is transferred to the fluid. Consequently, in addition to or instead of transferring fluid directly from heat-generating structure 102, fluid can remove heat from cooling element 120/120’ and/or support structure 110/170’.
  • cooling systems 100 and 100’ drive fluid such that fluid exiting orifices 132 has a high speed of at least thirty meters per second. In some embodiments, the fluid exiting orifices 132 has a speed of at least forty-five meters per second. In some embodiments, the fluid exits orifices 132 at speeds of at least sixty meters per second. Other speeds may be possible in some embodiments. Fluid exiting orifices 132 has a high speed in part because the fluid traveling through chambers 140/150 has a high flow rate. In some embodiments, for example, the flow rate through chambers 140/150 may be at least 0.05 cubic feet per minute (cfin). In some embodiments, the flow rate through chambers 140/150 is at least 0.1 cfin.
  • cooling system(s) 100 and/or 100’ efficiently remove heat from cooling elements 120/120’ and support structure(s) 170 and/or 170’.
  • transfer of heat to the fluid via convection may be used to manage heat.
  • FIGS. 2A-2G indicate the change in temperature of fluid driven using cooling system(s) 100 and/or 100’.
  • FIG. 2A is a graph 200 depicting example of performance for cooling system(s) 100 and/or 100’.
  • Graph 200 is for explanatory purposes only and not intended to represent performance of all embodiments of cooling element 120 and/or cooling system(s) 100 and/or 100’. More specifically, graph 200 depicts the temperature of the fluid at various locations in cooling system(s) 100 and/or 100’.
  • Location “Vent” indicates the fluid temperature at the entry vent 112 and/or 113 to cooling system(s) 100 and/or 100’, respectively.
  • Location “Orifice Exit” indicates the fluid temperature after exiting orifices 132 for cooling system(s) 100 and/or 100’, respectively.
  • Location “Impingement” indicates the fluid temperature after impinging on heat-generating structure 102 for cooling system(s) 100 and/or 100’, respectively.
  • Location “Exit” indicates the fluid temperature upon exiting the region shown for cooling system(s) 100 and/or 100’, respectively.
  • Cap Temp.” indicates the temperature at which heat-generating structure 102 or integrated circuit 103 is desired to remain below.
  • Graph 200 includes plot 210 that may be considered to describe high flow behavior, while plot 220 can be considered to describe low flow behavior.
  • Plot 210 (high flow) may be for flows on the order of 0.1 cfin in some embodiments.
  • Plot 220 (low flow) may be for flows on the order of 0.01 cfin. Other flow rates are possible. More generally, plot 210 may occur where the flow of fluid driven by cooling element 120 and/or 120’ through cooling systems 100 and/or 100’ is sufficient to cool portions of cooling systems 100/100’ such that their temperatures are significantly less than that of heat-generating structure 102.
  • Plot 220 may occur where the flow of fluid driven by cooling element 120 and/or 120’ through cooling systems 100 and/or 100’ is insufficient to cool portions of cooling systems 100/100’, such that their temperatures are close to that of heat-generating structure 102. More specifically, plot 210 indicates the behavior for cooling system(s) 100 and/or 100’ when the temperature of cooling system 100 and/or 100’ (e.g. the temperature of cooling element 120 and support structure 170/170’) is well below the temperature of heat-generating structure 102. For example, plot 210 may describe the temperatures when cooling system(s) 100 and/or 100’ are at or near room temperature (e.g. twenty-five degrees Celsius) while heat-generating structure 102 and/or integrated circuit 103 are at or near the cap temperature (e.g.
  • Plot 220 indicates the behavior for cooling system(s) 100 and/or 100’ when the temperature of cooling system 100 and/or 100’ (e.g. the temperature of cooling element 120 and support structure 170/170’) is at or near the temperature of heat-generating structure 102.
  • plot 220 may describe the temperatures when cooling system(s) 100 and/or 100’ are at or near eighty through eighty-eight degrees Celsius while heatgenerating structure 102 and/or integrated circuit are at or near the ninety degrees Celsius.
  • Cooling system(s) 100 and/or 100’ are being heated by heat thermally conducted from heat-generating structure 102.
  • fluid entering cooling system(s) 100 and/or 100’ at vent 112 and/or 113 is at or near room temperature.
  • the rate of fluid flow is high (e.g. 0.05 cfin-0.1 cfm or more).
  • the fluid flow is sufficiently high that enough heat is removed from cooling system(s) 100 and/or 100’ to ensure that the temperature(s) of portions of cooling system(s) 100 and/or 100’ distal from heat-generating structure are low.
  • the fluid travels through chambers 140/150 and/or 1407150 due to vibrational motion of cooling element 120 some heat is transferred to the fluid.
  • sufficient heat is transferred (removed from cooling system(s) 100 and/or 100’) to reduce the temperature of sections of cooling systems(s) 100 and/or 100’ that are distal from heat-generating structure 102.
  • Fluid continues to remove heat from cooling system(s) 100 and/or 100’ as the fluid transits the cooling system.
  • the fluid increases gradually in temperature as the fluid passes through chambers 140 and 150.
  • the fluid impinging on heat-generating structure 102 transfers a significant amount of heat from heatgenerating structure 102 to the fluid.
  • the temperature of the fluid has increased greatly at the “Impingement” location. Only a small amount of additional heat might be removed as the fluid continues to travel along the surface of heat-generating structure 102 to the exit.
  • a significant amount of heat is transferred for the plot 210, partly by removing heat from cooling system(s) 100 and;or 100’ and partly by the fluid impinging on heat-generating structure 102.
  • room temperature fluid entering vent 112/113 may exit at a temperature of at least seventy degrees Celsius.
  • room temperature fluid entering vent 112/113 may exit at a temperature of at least seventy-five to eighty degrees Celsius in some such embodiments.
  • fluid entering cooling system(s) 100 and/or 100’ at vent 112 and/or 113 is at or near room temperature.
  • the rate of fluid flow is low.
  • the fluid flow is sufficiently low that not enough heat is removed from cooling system(s) 100 and/or 100’ to ensure that the temperature(s) of portions of cooling system(s) 100 and/or 100’ distal from heat-generating structure are low.
  • Heat from heat-generating structure 102 and/or integrated circuit 103 (or other heat source) has been transferred to cooling system 100 via thermal conduction. Heat from cooling system(s) 100 and/or 100’ (e.g.
  • cooling element 120 and/or support structure 170/170’ is transferred to the fluid as the fluid travels through chambers 140/150 and/or 1407150 due to vibrational motion of cooling element 120.
  • the temperature of the fluid has increased greatly at the “Orifice Exit” location.
  • the fluid impinging on heat-generating structure 102 may transfer a small amount of additional heat from heat-generating structure 102 to the fluid. Only a limited amount of additional heat might be removed as the fluid continues to travel to the exit.
  • heat is transferred to the fluid primarily by the fluid passing through cooling system(s) 100 and/or 100’.
  • room temperature fluid entering vent 112/113 may exit at a temperature of at least seventy degrees Celsius.
  • room temperature fluid entering vent 112/113 may exit at a temperature of at least seventy-five to eighty degrees Celsius in some such embodiments.
  • cooling system(s) 100 and/or 100’ As can be seen in plots 210 and 220 for cooling system(s) 100 and/or 100’ at low temperature with respect to heat-generating structure 102 (high flow) or for cooling system(s) 100 and/or 100’ at or near the temperature of heat-generating structure 102 (low flow), a significant amount of heat may be transferred efficiently to the fluid. In addition, a significant amount of heat generated by integrated circuit 103 is removed by the fluid. Thus, cooling system(s) 100 and/or 100’ efficiently remove heat for both low and high flows. However, higher fluid flows may remove more heat per unit time and result in portions of cooling system(s) 100 and/or 100’ being at a lower temperature.
  • the efficiency of cooling system(s) 100 and/or 100’ may also be seen mathematically.
  • the amount of heat per unit time (H) transferred to a fluid (which is then removed s the fluid exits the system) may be given by:
  • the change in temperature of the fluid can be broken down to: embodiments of cooling system(s) 100 and/or 100’ indicates that a significantly larger amount of heat may be removed using cooling system(s) 100 and/or 100’.
  • FIGS. 2B-2G depict cooling system 100 under various conditions. For simplicity, only top plate 110, cooling element 120, orifice plate 130, pedestal 172, and heat-generating structure 102 are labeled. In FIGS. 2B-2G, heat-generating structure has the highest temperature.
  • FIG. 2B depicts a heat map 230 for an embodiment of a cooling system which is not thermally coupled via conduction to heat-generating structure 102 at low flow (e.g. 0.015 cfin).
  • pedestal 172 connecting orifice plate 130 to heat-generating structure 102 may be thermally insulating.
  • FIG. 2C depicts a heat map 240 for an embodiment of a cooling system which is not thermally coupled via conduction to heat-generating structure 102 at higher flow (e.g. 0.1 cfin).
  • heat map 230 of FIG. 2B some heat is transferred to cooling system 100, while the fluid well above top plate 110 remains cool. Thus, for low flow, some heat is transferred to cooling system 100, but is not significantly removed by the low fluid flow.
  • Heat map 240 of FIG. 2C indicates that the higher fluid flow more efficiently removes heat from cooling system 100. Thus, cooling system 100 is cooler. Fluid above cooling system 100 is more consistently cool, including closer to cooling system 100.
  • FIG. 2D depicts heat map 250 for an embodiment of cooling system 100 which is thermally coupled via conduction (e.g. through pedestal 172 having a high thermal conductivity) to a heat-generating structure at low flow (e.g. 0.015 cfin).
  • FIG. 2E depicts a heat map 260 for an embodiment of a cooling system which is thermally coupled via conduction (e.g. through pedestal 172 having a high thermal conductivity) to a heatgenerating structure at higher flow (e.g. 0.1 cfin).
  • a significant amount of heat is transferred to cooling system 100 via thermal conduction through pedestal 172.
  • FIGS. 2F and 2G depict heat maps 270 and 280, respectively, for an embodiment of a cooling system that is thermally coupled via conduction to a heat-generating structure.
  • FIG. 2F depicts a heat map 270 for an embodiment of a cooling system which is thermally coupled via conduction (e.g. through pedestal 172 having a high thermal conductivity) to a heat-generating structure at lower flow (e.g. 0.05 cfm).
  • FIG. 2G depicts a heat map 260 for an embodiment of a cooling system which is thermally coupled via conduction (e.g. through pedestal 172 having a high thermal conductivity) to a heatgenerating structure at higher flow (e.g. 0.1 cfin).
  • FIGS. 1 depicts a heat map 270 for an embodiment of a cooling system which is thermally coupled via conduction (e.g. through pedestal 172 having a high thermal conductivity) to a heatgenerating structure at higher flow (e.g. 0.1 cfin).
  • heat map 270 indicates that the highest temperature for cooling system 100 occur near pedestal 172, which is thermally connected to heat-generating structure 102.
  • Heat map 280 also indicates that the highest temperature for cooling system 100 occur near pedestal 172, which is thermally connected to heat-generating structure 102.
  • portions of top plate 110, cooling element 120, and orifice plate 130 have been cooled by the higher flow. The lowest temperatures of structures 110, 120, and 130 are in proximity to the higher flow. A flow through the cooling system, driven by vibrational motion of the cooling element, can effectively remove heat from the cooling system and, therefore, from the heat-generating structure.
  • cooling system 100 and/or 100’ may efficiently remove significant amounts of heat generated while having a small size, having low profile and/or being low noise. Thus, performance of a variety of systems employing cooling system(s) 100 and/or 100’ may be improved.
  • FIGS. 3A-3D depict plan views of embodiments of cooling systems 300A, 300B, 300C and 300D analogous to active cooling systems such as cooling system 100.
  • FIGS. 3A-3D are not to scale. For simplicity, only portions of cooling elements 320A, 320B, 320C and 320D and anchors 360A, 360B, 360C and 360D, respectively, are shown.
  • Cooling elements 320A, 320B, 320C and 320D are analogous to cooling element 120.
  • the sizes and/or materials used for cooling elements 320A, 320B, 320C and/or 320D may be analogous to those for cooling element 120.
  • Anchors 360A, 360B, 360C and 360D are analogous to anchor 160 and are indicated by dashed lines.
  • cooling elements 320A and 320B anchors 360A and 360B are centrally located and extend along a central axis of cooling elements 320A and 320B, respectively.
  • the cantilevered portions i.e. cantilevered arms
  • cooling element(s) 320A and/or 320B are continuous structures, two portions of which are actuated (e.g. the cantilevered portions outside of anchors 360A and 360B).
  • cooling element(s) 320A and/or 320B include separate cantilevered portions each of which is attached to the anchors 360A and 360B, respectively, and actuated.
  • Cantilevered portions of cooling elements 320A and 320B may thus be configured to vibrate in a manner analogous to the wings of a butterfly (in-phase) or to a seesaw (out-of-phase).
  • L is the length of the cooling element, analogous to that depicted in FIGS. 1 A- IF. Also in FIGS. 3A and 3B, the depth, P, of cooling elements 320A and 320B is indicated.
  • piezoelectric 323 is used to actuate cooling elements 320A and 320B. Although described in the context of a piezoelectric, another mechanism for actuating cooling elements 360A and 360B can be utilized. Such other mechanisms may be at the locations of piezoelectric 323 or may be located elsewhere. In cooling element 360A, piezoelectric 323 may be affixed to cantilevered portions or may be integrated into cooling element 320A. Further, although piezoelectric 323 is shown as having particular shapes and sizes in FIG. 3 A and 3B, other configurations may be used.
  • anchor 360A extends the entire depth of cooling element 320A.
  • a portion of the perimeter of cooling element 360A is pinned.
  • the unpinned portions of the perimeter of cooling element 360A are part of the cantilevered sections that undergo vibrational motion.
  • anchor need not extend the entire length of the central axis.
  • the entire perimeter of the cooling element is unpinned.
  • such a cooling element still has cantilevered sections configured to vibrate in a manner described herein.
  • anchor 360B does not extend to the perimeter of cooling element 320B.
  • the perimeter of cooling element 320B is unpinned.
  • anchor 360B still extends along the central axis of cooling element 320B. Cooling element 320B is still actuated such that cantilevered portions vibrate (e.g. analogous to the wings of a butterfly).
  • cooling element 320 A is depicted as rectangular, cooling elements may have another shape. In some embodiments, comers of cooling element 320A may be rounded. Cooling element 320B of FIG. 3B has rounded cantilevered sections. Other shapes are possible.
  • anchor 360B is hollow and includes apertures 363.
  • cooling element 320B has aperture(s) in the region of anchor 360B. In some embodiments, cooling element 320B includes multiple portions such that aperture(s) exist in the region of anchor 360B. As a result, fluid may be drawn through cooling element 320B and through anchor 360B. Thus, cooling element 320B may be used in place of a top plate, such as top plate 110.
  • cooling element 320B and apertures 363 may function in an analogous manner to vent 112.
  • cooling elements 300A and 300B are depicted as being supported in a central region, in some embodiments, one cantilevered section of the cooling element 320A and/or 320B might be omitted.
  • cooling element 320A and/or 320B may be considered to be supported, or anchored, at or near one edge, while at least part of at least the opposing edge is free to undergo vibrational motion.
  • the cooling element 320A and/or 320B may include a single cantilevered section that undergoes vibrational motion.
  • FIGS. 3C-3D depict plan views of embodiments of cooling systems 300C and 300D analogous to active cooling systems such as cooling system 100.
  • cooling elements 320C and 320D and anchors 360C and 360D are shown.
  • Cooling elements 320C and 320D are analogous to cooling element 120.
  • Anchors 360A and 360D are analogous to anchor 160 and are indicated by dashed lines.
  • cooling elements 320C and 320D anchors 360C and 360D, respectively, are limited to a central region of cooling elements 320C and 320D, respectively.
  • the regions surrounding anchors 360C and 360D undergo vibrational motion.
  • Cooling elements 320C and 320D may thus be configured to vibrate in a manner analogous to a jellyfish or similar to the opening/closing of an umbrella.
  • the entire perimeter of cooling elements 320C and 320D vibrate in phase (e.g. all move up or down together).
  • portions of the perimeter of cooling elements 320C and 320D vibrate out of phase.
  • L is the length (e.g.
  • cooling element 320C and 320D are depicted as circular, cooling elements may have another shape. Further, a piezoelectric (not shown in FIGS. 3C-3D) and/or other mechanism may be used to drive the vibrational motion of cooling elements 320C and 320D.
  • the anchor 360D is hollow and has apertures 363.
  • cooling element 320D has aperture(s) in the region of anchor D.
  • cooling element 320D includes multiple portions such that aperture(s) exist in the region of anchor 360D.
  • fluid may be drawn through cooling element 320D and through anchor 360D. The fluid may exit through apertures 363.
  • cooling element 320D may be used in place of a top plate, such as top plate 110.
  • apertures in cooling element 320D and apertures 363 may function in an analogous manner to vent 112.
  • Cooling systems such as cooling system 100 and/or 100’ can utilize cooling elements) 320A, 320B, 320C, 320D and/or analogous cooling elements. Such cooling systems may also share the benefits of cooling system 100100 and/or. Cooling systems using cooling elements) 320A, 320B, 320C, 320D and/or analogous cooling elements may more efficiently drive fluid toward heat-generating structures at high speeds. Consequently, heat transfer between the heat-generating structure and the moving fluid is improved. Because the heat-generating structure is more efficiently cooled, the corresponding device may exhibit improved operation, such as running at higher speed and/or power for longer times.
  • Cooling systems employing cooling element(s) 320A, 320B, 320C, 320D and/or analogous cooling elements may be suitable for use in smaller and/or mobile devices in which limited space is available. Performance of such devices may thus be improved. Because cooling element(s) 320A, 320B, 320C, 320D and/or analogous cooling elements may be vibrated at frequencies of 15 kHz or more, users may not hear any noise associated with actuation of cooling elements. If driven at or near the acoustic and/or structural resonance frequencies for the cooling element(s) 320A, 320B, 320C, 320D and/or analogous cooling elements, the power used in operating cooling systems may be significantly reduced.
  • Cooling element(s) S20A, 320B, 320C, 320D and/or analogous cooling elements may not physically contact the plates during use, allowing resonance to be more readily maintained.
  • the benefits of improved, quiet cooling may be achieved with limited additional power. Consequently, performance of devices incorporating the cooling element(s) 320A, 320B, 320C, 320D and/or analogous cooling elements may be improved.
  • FIG. 4 depicts an embodiment of active cooling systems 400 usable as an active heat sink.
  • FIG. 4 is not to scale. For simplicity, only portions of cooling system 400 are shown. Cooling system 400 is analogous to cooling systems 100. Consequently, analogous components have similar labels. For example, cooling system 400 is used in conjunction with integrated circuit 503, which is analogous to integrated circuit 103.
  • Cooling system 400 includes cooling element 420 and support structure 470 analogous to cooling element 120 and support structure 170, respectively.
  • support structure 470 includes top plate 410 having vent 412, orifice plate 430 including orifices 432, top chamber 440 having a gap, bottom chamber 450 having a gap, anchor 460, and sidewalls 474 that are analogous to top plate 110 having vent 112, cooling element 120, orifice plate 130 including orifices 132, top chamber 140 having gap 142, bottom chamber 150 having gap 152, anchor 160, and sidewalls 174, respectively.
  • Cooling element 420 is centrally supported by anchor 460 such that at least a portion of the perimeter of cooling element 420 is free to vibrate.
  • anchor 460 extends along the axis of cooling element 420 (e.g. in a manner analogous to anchor 360A and/or 360B). In other embodiments, anchor 460 is only near the center portion of cooling element 420 (e.g. analogous to anchor 360C and/or 360D).
  • Cooling element 420 includes cantilevered arms 421, anchored region 422, and tip 423 that are analogous to cantilevered arms 121, anchored region 122, and tip 123, respectively. In some embodiments, cooling element 420 may be analogous to cooling element 120’.
  • Support structure 470 also includes pedestal 472 analogous to pedestal 172.
  • pedestal 572 is integrated into a heat spreader or vapor chamber that is analogous to heat-generating structure 102.
  • Sidewalls 474 also include apertures 476.
  • sidewalls 474 include apertures 476 and orifice plate 430 includes orifices 432.
  • orifice plate 430 is tree of orifices or vice .
  • orifices 476 are shown as oriented parallel to the surface of orifice plate 430, in some embodiments, apertures 476 may have a different orientation. Apertures 476 allow for flow of fluid around cooling element 420, but not past heat-generating structure 402. In cooling system 400, therefore, heat may be transferred from heat-generating structure 402 to pedestal 472, cooling element 420 and other components of cooling system 400.
  • FIG. 4 Also shown in FIG. 4 is an additional heat spreader 405 between heatgenerating structure 402 and integrated circuit 403.
  • cooling system need not be mounted directly to the component 403 that is the source of heat.
  • heat spreader 405 may be omitted.
  • Cooling system 400 operates in an analogous manner to cooling system 100. Cooling system 400 thus shares the benefits of cooling system 100. Thus, performance of a device employing cooling system 400 may be improved. Because pedestal 472 has an integrated heat spreader, heat may be more efficiently transferred from integrated circuit 403 to system 400. Heat may then be removed by fluid driven through system 400 by cooling element 42O.Thus, performance may be enhanced.
  • FIG. 5 depicts an embodiment of active cooling systems 500 usable as an active heat sink.
  • FIG. 5 is not to scale. For simplicity, only portions of cooling system 500 are shown. Cooling system 500 is analogous to cooling systems 100. Consequently, analogous components have similar labels. For example, cooling system 500 is used in conjunction with integrated circuit 503, which is analogous to integrated circuit 103.
  • Cooling system 500 includes cooling element 520 and support structure 570 analogous to cooling element 120 and support structure 170, respectively.
  • support structure 570 includes top plate 510 having vent 512, orifice plate 530 including orifices 532, top chamber 540 having a gap, bottom chamber 550 having a gap, anchor 460, and sidewalls 574 that are analogous to top plate 110 having vent 112, cooling element 120, orifice plate 130 including orifices 132, top chamber 140 having gap 142, bottom chamber 150 having gap 152, anchor 160, and sidewalls 174, respectively.
  • Cooling element 520 is centrally supported by anchor 560 such that at least a portion of the perimeter of cooling element 520 is free to vibrate.
  • anchor 560 extends along the axis of cooling element 520 (e.g. in a manner analogous to anchor 360A and/or 360B). In other embodiments, anchor 560 is only near the center portion of cooling element 520 (e.g. analogous to anchor 360C and/or 360D).
  • Support structure 570 also includes pedestal 572 analogous to pedestal 172. However, in the embodiment shown, pedestal 572 is integrated into a heat spreader or vapor chamber that is analogous to heat-generating structure 102.
  • Cooling system 500 operates in an analogous manner to cooling system 100. Cooling system 500 thus shares the benefits of cooling system 100. Thus, performance of a device employing cooling system 500 may be improved. Because pedestal 572 has an integrated heat spreader, heat may be more efficiently transferred from integrated circuit 503 to system 500. Heat may then be removed by fluid driven through system 500 by cooling element 52O.Thus, performance may be enhanced.
  • FIG. 6 depicts an embodiment of active cooling systems 600 usable as an active heat sink.
  • FIG. 6 is not to scale. For simplicity, only portions of cooling system 600 are shown. Cooling system 600 is analogous to cooling systems 100 and/or 500. Consequently, analogous components have similar labels. For example, cooling system 600 is used in conjunction with integrated circuit 603, which is analogous to integrated circuit 103.
  • Cooling system 600 includes cooling element 620 and support structure 670 analogous to cooling element 120 and support structure 170, respectively.
  • support structure 670 includes top plate 610 having vent 612, orifice plate 630 including orifices 632, top chamber 640 having a gap, bottom chamber 650 having a gap, anchor 660, and sidewalls 674 that are analogous to top plate 110 having vent 112, cooling element 120, orifice plate 130 including orifices 132, top chamber 140 having gap 142, bottom chamber 150 having gap 152, anchor 160, and sidewalls 174, respectively.
  • Cooling element 620 is centrally supported by anchor 660 such that at least a portion of the perimeter of cooling element 620 is free to vibrate.
  • anchor 660 extends along the axis of cooling element 620 (e.g. in a manner analogous to anchor 360A and/or 360B). In other embodiments, anchor 660 is only near the center portion of cooling element 620 (e.g. analogous to anchor 360C and/or 360D).
  • Support structure 670 also includes pedestal 672 analogous to pedestal 172. However, in the embodiment shown, pedestal 672 is thermally coupled via conduction directly to integrated circuit 103.
  • Cooling system 600 operates in an analogous manner to cooling system 100. Cooling system 600 thus shares the benefits of cooling system 100. Thus, performance of a device employing cooling system 600 may be improved. Because pedestal 672 is directly thermally connected to integrated circuit 603, heat may be more efficiently transferred from integrated circuit 603 to system 600 via conduction. Heat may then be removed by fluid driven through cooling system 600 by cooling element 620. Thus, performance may be enhanced.
  • FIG. 7 depicts an embodiment of active cooling systems 700 usable as an active heat sink.
  • FIG. 7 is not to scale. For simplicity, only portions of cooling system 700 are shown. Cooling system 700 is analogous to cooling systems 100, 500 and/or 600.
  • cooling system 700 is used in conjunction with integrated circuit 703, which is analogous to integrated circuit 103.
  • Cooling system 700 includes cooling element 720 and support structure 770 analogous to cooling element 120 and support structure 170, respectively.
  • support structure 770 includes top plate 710 having vent 712, bottom plate 730, top chamber 740 having a gap, bottom chamber 750 having a gap, anchor 760, pedestal 772, and sidewalls 774 that are analogous to top plate 110 having vent 112, cooling element 120, orifice plate 130, top chamber 140 having gap 142, bottom chamber 150 having gap 152, anchor 160, pedestal 172, and sidewalls 174, respectively.
  • Cooling element 720 is centrally supported by anchor 760 such that at least a portion of the perimeter of cooling element 720 is free to vibrate.
  • anchor 760 extends along the axis of cooling element 720 (e.g. in a manner analogous to anchor 360A and/or 360B). In other embodiments, anchor 760 is only near the center portion of cooling element 720 (e.g. analogous to anchor 360C and/or 360D).
  • Bottom plate 730 is analogous to orifice plate 130, but has no orifices therein. Instead, orifices 732 in sidewalls 774 are shown. Thus, fluid is ejected in another direction than toward heat generating structure 702. Therefore, cooling system 700 may not cool heat- generating structure 702 via impingement. However, cooling system 700 may still cool heatgenerating structure 702 and component 703. Thus, heat from heat-generating structure 702 is transferred to cooling system 700 via conduction through pedestal 722 and removed by the fluid in cooling system 700 driven by vibrational motion of cooling element 720.
  • Cooling system 700 operates in an analogous manner to cooling system 100. Cooling system 700 thus shares the benefits of cooling system 100. Thus, performance of a device employing cooling system 700 may be improved. For example, heat may be efficiently transferred at steady-state behavior. Thus, performance may be enhanced.
  • FIG. 8 depicts an embodiment of active cooling systems 800 usable as an active heat sink.
  • FIG. 8 is not to scale. For simplicity, only portions of cooling system 800 are shown. Cooling system 800 is analogous to cooling systems 100, 500, 600 and/or 700. Consequently, analogous components have similar labels. For example, cooling system 800 is used in conjunction with integrated circuit 803, which is analogous to integrated circuit 803.
  • Cooling system 800 includes cooling element 820 and support structure 870 analogous to cooling element 120 and support structure 170, respectively.
  • support structure 870 includes top plate 810 having vent 812, bottom plate 830, top chamber 840 having a gap, bottom chamber 850 having a gap, anchor 860, and sidewalls 874 that are analogous to top plate 110 having vent 112, cooling element 120, orifice plate 130, top chamber 140 having gap 142, bottom chamber 150 having gap 152, anchor 160, and sidewalls 174, respectively.
  • Cooling element 820 is centrally supported by anchor 860 such that at least a portion of the perimeter of cooling element 820 is free to vibrate.
  • anchor 860 extends along the axis of cooling element 820 (e.g. in a manner analogous to anchor 360A and/or 360B). In other embodiments, anchor 860 is only near the center portion of cooling element 820 (e.g. analogous to anchor 360C and/or 360D).
  • Cooling system 800 is most analogous to cooling system 700.
  • bottom plate 830 is analogous to orifice plate 130, but has no orifices therein. Instead, orifices 832 in sidewalls 874 are shown.
  • fluid is ejected in another direction than toward heat generating structure 802. Therefore, cooling system 800 may not cool heat-generating structure 802 via impingement. Further, the pedestal has been removed.
  • bottom plate 830 is directly connected to heat-generating structure 802. In some embodiments, heatgenerating structure might be removed, allowing bottom plate 830 to be directly coupled to integrated circuit.
  • heat from heat-generating structure 802 is transferred to cooling system 800 via conduction through bottom plate 830 and removed by the fluid in cooling system 800 driven by vibrational motion of cooling element 820.
  • FIG. 9 depicts an embodiment of active cooling systems 900 usable as an active heat sink.
  • FIG. 9 is not to scale. For simplicity, only portions of cooling system 900 are shown. Cooling system 900 is analogous to cooling systems 100, 500, 600, 700 and/or 800. Consequently, analogous components have similar labels. For example, cooling system 900 is used in conjunction with integrated circuit 803, which is analogous to integrated circuit 903.
  • Cooling system 900 includes cooling element 920 and support structure 970 analogous to cooling element 120 and support structure 170, respectively.
  • support structure 970 includes top plate 910 having vent 912, orifice plate 930 having orifices 932 therein, top chamber 940 having a gap, bottom chamber 950 having a gap, anchor 960, pedestal 972, and sidewalls 974 that are analogous to top plate 110 having vent 112, cooling element 120, orifice plate 130 having orifices 132, top chamber 140 having gap 142, bottom chamber 150 having gap 152, anchor 160, pedestal 172 and sidewalls 174, respectively.
  • Cooling element 920 is centrally supported by anchor 960 such that at least a portion of the perimeter of cooling element 920 is free to vibrate.
  • anchor 960 extends along the axis of cooling element 920 (e.g. in a manner analogous to anchor 360A and/or 360B). In other embodiments, anchor 960 is only near the center portion of cooling element 920 (e.g. analogous to anchor 360C and/or 360D).
  • Orifice plate 930 does include orifices 932 (shown as dotted lines in FIG. 9). However, orifices 932 do not direct fluid to impinge on heat-generating structure 902. Thus, fluid is ejected in another direction than toward heat generating structure 902. In the embodiment shown, fluid may be driven out of bottom chamber 950 in a direction substantially perpendicular to the plane of the page. Therefore, cooling system 900 may not cool heat-generating structure 902 via impingement. However, cooling system 900 may still cool heat-generating structure 902 and component 903.
  • cooling systems 100, 100’, 400, 500, 600, 700, 800, and/or 900 have been described and particular features highlighted.
  • Various characteristics of cooling systems 100, 100’, 400, 500, 600, 700, 800, and/or 900 can be combined in manners not explicitly depicted herein.
  • FIGS. 10A-10B depict an embodiment of active cooling system 1000 including multiple cooling cells configured as a tile.
  • FIG. 10A depicts a top view
  • FIG. 10B depicts a side view.
  • FIGS. 10A-10B are not to scale.
  • Cooling system 1000 includes four cooling cells 1001, which are analogous to one or more of cooling systems described herein, such as cooling systems 100 and/or 400. Although four cooling cells 1001 in a 2x2 configuration are shown, in some embodiments another number and/or another configuration of cooling cells 1001 might be employed.
  • cooling cells 1001 include shared top plate 1010 having apertures 1012, cooling elements 1020, shared orifice plate 1030 including orifices 1032, top chambers 1040, bottom chambers 1050, pedestals 1072, sidewalls 1074, and anchors 1060 that are analogous to top plate 110 having apertures 112, cooling element 120, orifice plate 130 having orifices 132, top chamber 140, bottom chamber 150, pedestal 172, sidewalls 174 and anchor 160.
  • bottom anchors 1060 are shown, in other embodiments top anchors may be used.
  • cooling elements 1020 are driven out-of-phase (i.e. in a manner analogous to a seesaw). Further, cooling element 1020 in one cell is driven out-of-phase with cooling element(s) in adjacent cell(s).
  • Cooling cells 1001 of cooling system 1000 function in an analogous manner to cooling system(s) 100 and/or 400. Consequently, the benefits described herein may be shared by cooling system 1000. Because cooling elements in nearby cells are driven out-of-phase, vibrations in cooling system 1000 may be reduced. Because multiple cooling cells 1001 are used, cooling system 1000 may enjoy enhanced cooling capabilities.
  • FIG. 11 depicts a top view of an embodiment of cooling system 1600 including multiple cooling cells 1101.
  • FIG. 11 is not to scale.
  • Cooling cells 1101 are analogous one or more of the cooling systems described herein, such as cooling systems 100 and/or 100’.
  • cooling cells 1101 may be arranged in a two-dimensional array of the desired size and configuration.
  • cooling system 1100 may be viewed as made up of multiple tiles 160. Thus, the desired cooling power and configuration may be achieved.
  • FIG. 12 is a flow chart depicting an exemplary embodiment of method 1200 for operating a cooling system.
  • Method 1200 may include steps that are not depicted for simplicity.
  • Method 1200 is described in the context of piezoelectric cooling system 100. However, method 1200 may be used with other cooling systems including but not limited to systems and cells described herein.
  • One or more of the cooling element(s) in a cooling system is actuated to vibrate, at 1202.
  • an electrical signal having the desired frequency is used to drive the cooling element(s).
  • the cooling elements are driven at or near structural and/or acoustic resonant frequencies at 1202. The driving frequency may be 15 kHz or higher. If multiple cooling elements are driven at 1202, the cooling elements may be driven out-of-phase. In some embodiments, the cooling elements are driven substantially at one hundred and eighty degrees out of phase. Further, in some embodiments, individual cooling elements are driven out-of-phase. For example, different portions of a cooling element may be driven to vibrate in opposite directions (i.e. analogous to a seesaw).
  • individual cooling elements may be driven in-phase (i.e. analogous to a butterfly).
  • the drive signal may be provided to the anchor(s), the cooling element(s), or both the anchor(s) and the cooling elements).
  • the anchor may be driven to bend and/or translate.
  • Feedback from the piezoelectric cooling element(s) is used to adjust the driving current, at 1204.
  • the adjustment is used to maintain the frequency at or near the acoustic and/or structural resonant frequency/frequencies of the cooling element(s) and/or cooling system.
  • Resonant frequency of a particular cooling element may drift, for example due to changes in temperature. Adjustments made at 1204 allow the drift in resonant frequency to be accounted for.
  • piezoelectric cooling element 120 may be driven at its structural resonant frequency/frequencies, at 1202. This resonant frequency may also be at or near the acoustic resonant frequency for top chamber 140. This may be achieved by driving piezoelectric layer(s) in anchor 160 (not shown in FIGS. 1A-1F) and/or piezoelectric layer(s) in cooling element 120. At 1204, feedback is used to maintain cooling element 120 at resonance and, in some embodiments in which multiple cooling elements are driven, one hundred and eighty degrees out of phase. Thus, the efficiency of cooling element 120 in driving fluid flow through cooling system 100 and onto heat-generating structure 102 may be maintained. In some embodiments, 1204 includes sampling the current through cooling element 120 and/or the current through anchor 160 and adjusting the current to maintain resonance and low input power.
  • cooling systems such as cooling system(s) 100, 100’, 400, 500, 600, 700 800, and/or 900 may operate as described above.
  • Method 1200 thus provides for use of piezoelectric cooling systems described herein.
  • piezoelectric cooling systems may more efficiently and quietly cool semiconductor devices at lower power.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un système comprenant un élément de refroidissement et une structure de support. L'élément de refroidissement comporte un premier côté et un second côté opposé au premier côté. L'élément de refroidissement est conçu pour subir un mouvement vibratoire lorsqu'il est actionné pour entraîner le fluide du premier côté au second côté. La structure de support couple thermiquement l'élément de refroidissement à une structure de génération de chaleur par conduction thermique.
EP21876263.1A 2020-10-02 2021-09-27 Dissipateur thermique actif Pending EP4222379A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202063087002P 2020-10-02 2020-10-02
PCT/US2021/052240 WO2022072286A1 (fr) 2020-10-02 2021-09-27 Dissipateur thermique actif

Publications (1)

Publication Number Publication Date
EP4222379A1 true EP4222379A1 (fr) 2023-08-09

Family

ID=80931897

Family Applications (1)

Application Number Title Priority Date Filing Date
EP21876263.1A Pending EP4222379A1 (fr) 2020-10-02 2021-09-27 Dissipateur thermique actif

Country Status (7)

Country Link
US (2) US11765863B2 (fr)
EP (1) EP4222379A1 (fr)
JP (1) JP2023544160A (fr)
KR (1) KR20230075503A (fr)
CN (1) CN116325139A (fr)
TW (1) TWI835005B (fr)
WO (1) WO2022072286A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI747076B (zh) * 2019-11-08 2021-11-21 研能科技股份有限公司 行動裝置散熱組件

Family Cites Families (201)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3051905A (en) 1960-03-01 1962-08-28 Gen Dynamics Corp Phase locked trigger generator
GB2029270B (en) 1978-07-11 1982-11-03 Plessey Co Ltd Vibratory atomiser
US4450505A (en) 1982-06-09 1984-05-22 Sperry Corporation Apparatus for cooling integrated circuit chips
JPS59152793A (ja) 1983-02-18 1984-08-31 Matsushita Electric Ind Co Ltd マイクロホン
US4595338A (en) 1983-11-17 1986-06-17 Piezo Electric Products, Inc. Non-vibrational oscillating blade piezoelectric blower
US4667877A (en) 1985-08-15 1987-05-26 Carnegie-Mellon University Multi-orifice impulsed spray generator
US4780062A (en) 1985-10-09 1988-10-25 Murata Manufacturing Co., Ltd. Piezoelectric fan
US4751713A (en) 1987-07-31 1988-06-14 Hughes Aircraft Company Gas laser having a piezoelectric fan
US4834619A (en) 1987-11-10 1989-05-30 The Boeing Company Ducted oscillatory blade fan
US5008582A (en) 1988-01-29 1991-04-16 Kabushiki Kaisha Toshiba Electronic device having a cooling element
US4923000A (en) 1989-03-03 1990-05-08 Microelectronics And Computer Technology Corporation Heat exchanger having piezoelectric fan means
US5821962A (en) 1995-06-02 1998-10-13 Canon Kabushiki Kaisha Liquid ejection apparatus and method
US5758823A (en) 1995-06-12 1998-06-02 Georgia Tech Research Corporation Synthetic jet actuator and applications thereof
US5673171A (en) 1995-12-05 1997-09-30 Compaq Computer Corporation Hard disc drive support tray apparatus with built-in handling shock reduction, EMI shielding and mounting alignment structures
JPH09246766A (ja) 1996-03-13 1997-09-19 Fanuc Ltd 密閉型電子機器ケース
US5796152A (en) 1997-01-24 1998-08-18 Roxburgh Ltd. Cantilevered microstructure
US5861703A (en) 1997-05-30 1999-01-19 Motorola Inc. Low-profile axial-flow single-blade piezoelectric fan
US6648453B2 (en) 1997-07-15 2003-11-18 Silverbrook Research Pty Ltd Ink jet printhead chip with predetermined micro-electromechanical systems height
US7337532B2 (en) 1997-07-15 2008-03-04 Silverbrook Research Pty Ltd Method of manufacturing micro-electromechanical device having motion-transmitting structure
US6471336B2 (en) 1997-07-15 2002-10-29 Silverbrook Research Pty Ltd. Nozzle arrangement that incorporates a reversible actuating mechanism
EP0995908A1 (fr) 1998-10-20 2000-04-26 vanden Brande, Pierre Pompe moléculaire
US6776707B2 (en) 1998-12-30 2004-08-17 Engineering Equipment And Services, Inc. Computer cabinet
KR20000050679A (ko) * 1999-01-13 2000-08-05 윤종용 전자기기용 방열장치
JP2000323882A (ja) 1999-05-12 2000-11-24 Sony Corp ファン装置及びその駆動方法
US6211598B1 (en) 1999-09-13 2001-04-03 Jds Uniphase Inc. In-plane MEMS thermal actuator and associated fabrication methods
JP3852253B2 (ja) 1999-10-21 2006-11-29 富士通株式会社 電子部品の冷却装置及び電子機器
US6570750B1 (en) 2000-04-19 2003-05-27 The United States Of America As Represented By The Secretary Of The Air Force Shunted multiple throw MEMS RF switch
SG105459A1 (en) 2000-07-24 2004-08-27 Micron Technology Inc Mems heat pumps for integrated circuit heat dissipation
US6483419B1 (en) 2000-09-12 2002-11-19 3M Innovative Properties Company Combination horizontal and vertical thermal actuator
US6531947B1 (en) 2000-09-12 2003-03-11 3M Innovative Properties Company Direct acting vertical thermal actuator with controlled bending
JP2002130198A (ja) 2000-10-19 2002-05-09 Sony Corp 圧電ファン
WO2002084754A2 (fr) 2000-10-25 2002-10-24 Washington State University Research Foundation Microtransducteurs piezo-electriques, procedes d'utilisation et procedes de fabrication correspondants
US6450773B1 (en) 2001-03-13 2002-09-17 Terabeam Corporation Piezoelectric vacuum pump and method
US6498725B2 (en) 2001-05-01 2002-12-24 Mainstream Engineering Corporation Method and two-phase spray cooling apparatus
US6713942B2 (en) 2001-05-23 2004-03-30 Purdue Research Foundation Piezoelectric device with feedback sensor
TW542326U (en) 2001-09-12 2003-07-11 Mei Wang Electric Corp Improved supporting rack structure for electric fan
AU2002359369A1 (en) 2001-11-09 2003-05-26 Coventor, Incorporated Trilayered beam mems device and related methods
US7061161B2 (en) 2002-02-15 2006-06-13 Siemens Technology-To-Business Center Llc Small piezoelectric air pumps with unobstructed airflow
US6996441B1 (en) 2002-03-11 2006-02-07 Advanced Micro Devices, Inc. Forward-looking fan control using system operation information
US6588497B1 (en) 2002-04-19 2003-07-08 Georgia Tech Research Corporation System and method for thermal management by synthetic jet ejector channel cooling techniques
US6853068B1 (en) 2002-05-22 2005-02-08 Volterra Semiconductor Corporation Heatsinking and packaging of integrated circuit chips
JP3878512B2 (ja) 2002-05-23 2007-02-07 本田技研工業株式会社 燃料電池スタック
US6598960B1 (en) 2002-05-23 2003-07-29 Eastman Kodak Company Multi-layer thermal actuator with optimized heater length and method of operating same
TW593125B (en) 2002-08-09 2004-06-21 Ind Tech Res Inst MEMS type differential actuator
US7420807B2 (en) 2002-08-16 2008-09-02 Nec Corporation Cooling device for electronic apparatus
KR100483079B1 (ko) 2002-10-23 2005-04-14 재단법인서울대학교산학협력재단 능동형 마이크로 냉각기
US20050211418A1 (en) 2002-11-01 2005-09-29 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US7258464B2 (en) 2002-12-18 2007-08-21 General Electric Company Integral ballast lamp thermal management method and apparatus
US6650542B1 (en) 2003-01-06 2003-11-18 Intel Corporation Piezoelectric actuated jet impingement cooling
US7031155B2 (en) 2003-01-06 2006-04-18 Intel Corporation Electronic thermal management
TW200500838A (en) 2003-02-19 2005-01-01 Nisvara Inc System and apparatus for heat removal
CN100399556C (zh) 2003-02-20 2008-07-02 皇家飞利浦电子股份有限公司 包括微喷射器的冷却组件
US6903929B2 (en) 2003-03-31 2005-06-07 Intel Corporation Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink
US7081699B2 (en) 2003-03-31 2006-07-25 The Penn State Research Foundation Thermoacoustic piezoelectric generator
KR100526599B1 (ko) * 2003-04-01 2005-11-08 삼성전자주식회사 스피커장치
US6801430B1 (en) 2003-05-09 2004-10-05 Intel Corporation Actuation membrane to reduce an ambient temperature of heat generating device
CN100427759C (zh) 2003-09-12 2008-10-22 清华大学 双压电梁驱动的膜片气泵
EP1515043B1 (fr) 2003-09-12 2006-11-22 Samsung Electronics Co., Ltd. Pompe à membrane pour air de refroidissement
KR100519970B1 (ko) 2003-10-07 2005-10-13 삼성전자주식회사 밸브리스 마이크로 공기공급장치
WO2005060593A2 (fr) 2003-12-10 2005-07-07 Purdue Research Foundation Micro-pompe de refroidissement d'appareils electroniques
JP3778910B2 (ja) 2003-12-15 2006-05-24 株式会社ソニー・コンピュータエンタテインメント 電子デバイス冷却装置、電子デバイス冷却方法および電子デバイス冷却制御プログラム
JP2005229047A (ja) 2004-02-16 2005-08-25 Hitachi Ltd 電子機器の冷却システム、及び、それを使用した電子機器
US7141447B2 (en) 2004-10-07 2006-11-28 Mks Instruments, Inc. Method of forming a seal between a housing and a diaphragm of a capacitance sensor
JP3949135B2 (ja) 2004-11-17 2007-07-25 シャープ株式会社 圧電ポンプおよびスターリング冷却庫
US20080304979A1 (en) 2004-12-23 2008-12-11 Submachine Corp. Reaction Drive Energy Transfer Device
US7258533B2 (en) 2004-12-30 2007-08-21 Adaptivenergy, Llc Method and apparatus for scavenging energy during pump operation
US7324323B2 (en) 2005-01-13 2008-01-29 Lucent Technologies Inc. Photo-sensitive MEMS structure
US20060181848A1 (en) 2005-02-14 2006-08-17 Kiley Richard F Heat sink and heat sink assembly
TWI259053B (en) 2005-03-31 2006-07-21 Ind Tech Res Inst Spray cooling module for electronic device
WO2006113341A2 (fr) 2005-04-13 2006-10-26 Par Technologies, Llc. Membrane piezo-electrique a orifice(s)
US7277283B2 (en) 2005-05-06 2007-10-02 International Business Machines Corporation Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated coolant inlet and outlet manifold
US7233494B2 (en) 2005-05-06 2007-06-19 International Business Machines Corporation Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins
US7516776B2 (en) 2005-05-19 2009-04-14 International Business Machines Corporation Microjet module assembly
US7248475B2 (en) 2005-05-31 2007-07-24 Intel Corporation Wireless device enclosure using piezoelectric cooling structures
US20090120621A1 (en) 2005-07-15 2009-05-14 Pulsacool Ltd. Method and apparatus for cooling electronic or other devices
US7321184B2 (en) 2005-08-09 2008-01-22 Intel Corporation Rake shaped fan
US7823403B2 (en) 2005-08-26 2010-11-02 Itzhak Sapir MEMS cooling device
US7336486B2 (en) 2005-09-30 2008-02-26 Intel Corporation Synthetic jet-based heat dissipation device
JP2009529119A (ja) * 2006-03-07 2009-08-13 インフルーエント コーポレイション 流体エネルギー伝達装置
CN101032718B (zh) 2006-03-10 2010-08-25 财团法人工业技术研究院 复合模式换能器及具有复合模式换能器的冷却装置
US7870893B2 (en) 2006-04-06 2011-01-18 Oracle America, Inc. Multichannel cooling system with magnetohydrodynamic pump
US7511957B2 (en) 2006-05-25 2009-03-31 International Business Machines Corporation Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled
JP2008027374A (ja) 2006-07-25 2008-02-07 Fujitsu Ltd 液冷ユニット用受熱器および液冷ユニット並びに電子機器
US8051905B2 (en) 2006-08-15 2011-11-08 General Electric Company Cooling systems employing fluidic jets, methods for their use and methods for cooling
US20080137289A1 (en) 2006-12-08 2008-06-12 General Electric Company Thermal management system for embedded environment and method for making same
KR101088943B1 (ko) * 2006-12-09 2011-12-01 가부시키가이샤 무라타 세이사쿠쇼 압전 마이크로 블로어
JP4735528B2 (ja) 2006-12-21 2011-07-27 株式会社デンソー 車載用の電子機器の冷却構造
US7492076B2 (en) 2006-12-29 2009-02-17 Artificial Muscle, Inc. Electroactive polymer transducers biased for increased output
US8308453B2 (en) 2007-01-23 2012-11-13 Nec Corporation Diaphragm pump
US20080218972A1 (en) 2007-03-06 2008-09-11 Ioan Sauciuc Cooling device, system containing same, and cooling method
US7714433B2 (en) 2007-03-09 2010-05-11 Intel Corporation Piezoelectric cooling of a semiconductor package
EP2123913A1 (fr) 2007-03-12 2009-11-25 Murata Manufacturing Co. Ltd. Dispositif de transport de liquide
JP2008263830A (ja) 2007-04-18 2008-11-06 Sansyu Sangyo Co Ltd 葉たばこ作業台の湿式集塵装置
US7692922B2 (en) 2007-06-30 2010-04-06 Intel Corporation Heatsink, method of manufacturing same, and microelectronic package containing same
DK2165362T3 (da) 2007-07-05 2012-05-29 Aaac Microtec Ab Through-wafer-via ved lav modstand
US7903409B2 (en) 2007-07-18 2011-03-08 Hewlett-Packard Development Company, L.P. System and method for cooling an electronic device
US8739856B2 (en) 2007-08-20 2014-06-03 Georgia Tech Research Corporation Evaporation-enhanced thermal management devices, systems, and methods of heat management
US7633753B2 (en) 2007-09-27 2009-12-15 Intel Corporation Piezoelectric air jet augmented cooling for electronic devices
CN101568728A (zh) * 2007-10-16 2009-10-28 株式会社村田制作所 压电微型鼓风器
US7863866B2 (en) 2007-10-23 2011-01-04 Sony Ericsson Mobile Communications Ab Activating batteries based on environmental conditions
JP5205957B2 (ja) 2007-12-27 2013-06-05 ソニー株式会社 圧電ポンプ、冷却装置及び電子機器
US7742299B2 (en) 2008-05-09 2010-06-22 Intel Corporation Piezo fans for cooling an electronic device
WO2009148005A1 (fr) 2008-06-05 2009-12-10 株式会社村田製作所 Microsoufflante piézoélectrique
JP2010029759A (ja) 2008-07-28 2010-02-12 Fujikura Ltd 圧電ファン装置
US20110304240A1 (en) 2008-12-21 2011-12-15 Sirius Implantable Systems Ltd. High efficiency piezoelectric micro-generator and energy storage system
US8297947B2 (en) 2009-06-03 2012-10-30 The Technology Partnership Plc Fluid disc pump
KR101414639B1 (ko) 2009-09-14 2014-07-03 엘지전자 주식회사 방열 장치
EP2484906B1 (fr) * 2009-10-01 2019-08-28 Murata Manufacturing Co., Ltd. Microventilateur piézoélectrique
CN101718235A (zh) 2009-11-19 2010-06-02 西北工业大学 双膜单腔单喷口合成射流致动器
KR101414642B1 (ko) 2009-11-20 2014-07-03 엘지전자 주식회사 방열 장치
KR101363554B1 (ko) 2009-12-04 2014-02-18 가부시키가이샤 무라타 세이사쿠쇼 압전 마이크로 블로어
JP2011144743A (ja) 2010-01-14 2011-07-28 Murata Mfg Co Ltd 冷却装置
TW201128154A (en) 2010-02-12 2011-08-16 Micro Base Technology Corp Cooling and heat-dissipation system, and cooling device thereof
TWI487838B (zh) 2010-04-26 2015-06-11 鴻準精密工業股份有限公司 散熱裝置及其氣流產生器
JP5494801B2 (ja) 2010-05-21 2014-05-21 株式会社村田製作所 流体ポンプ
KR101158200B1 (ko) 2010-06-04 2012-06-19 삼성전기주식회사 광학식 손 떨림 보정장치 및 이의 제조 방법
US9523367B2 (en) 2010-08-25 2016-12-20 Aavid Thermalloy, Llc Cantilever fan
US9252069B2 (en) 2010-08-31 2016-02-02 Teledyne Scientific & Imaging, Llc High power module cooling system
US8659896B2 (en) 2010-09-13 2014-02-25 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules
KR101275361B1 (ko) 2011-05-26 2013-06-17 삼성전기주식회사 압전 방식의 냉각 장치
KR102005808B1 (ko) 2011-09-02 2019-07-31 카벤디시 키네틱스, 인크. Ｍｅｍｓ 장치용으로 병합된 레그 및 반가요성 고정장치
JP5682513B2 (ja) * 2011-09-06 2015-03-11 株式会社村田製作所 流体制御装置
US9743357B2 (en) 2011-12-16 2017-08-22 Joseph Akwo Tabe Energy harvesting computer device in association with a communication device configured with apparatus for boosting signal reception
KR20130099688A (ko) 2012-02-29 2013-09-06 주식회사 팬택 이동 통신 단말기 및 이동 통신 단말기의 열 배출 방법
US9219022B2 (en) 2012-03-08 2015-12-22 International Business Machines Corporation Cold plate with combined inclined impingement and ribbed channels
US9179575B1 (en) 2012-03-13 2015-11-03 Rockwell Collins, Inc. MEMS based device for phase-change autonomous transport of heat (PATH)
TWI524840B (zh) 2012-03-30 2016-03-01 台達電子工業股份有限公司 散熱模組
JP2013223818A (ja) 2012-04-20 2013-10-31 Murata Mfg Co Ltd 圧電アクチュエータ、電子機器
JP5692468B2 (ja) 2012-08-10 2015-04-01 株式会社村田製作所 ブロア
US9215520B2 (en) 2012-08-15 2015-12-15 General Electric Company Multi-function synthetic jet and method of manufacturing same
US20140052429A1 (en) 2012-08-20 2014-02-20 International Business Machines Corporation Proactive data center cooling
US8643173B1 (en) 2013-01-04 2014-02-04 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features
US20140216696A1 (en) 2013-02-01 2014-08-07 Alcatel Lucent Cooling device and a cooling assembly comprising the cooling device
CN103987234B (zh) 2013-02-08 2017-08-29 台达电子工业股份有限公司 散热装置
TW201447217A (zh) * 2013-03-15 2014-12-16 Bayer Materialscience Ag 電活性聚合物致動的氣流熱管理模組
US9803938B2 (en) 2013-07-05 2017-10-31 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling assemblies having porous three dimensional surfaces
US9257365B2 (en) 2013-07-05 2016-02-09 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling assemblies and power electronics modules having multiple-porosity structures
US9131631B2 (en) 2013-08-08 2015-09-08 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having enhanced heat transfer assemblies
US9867312B2 (en) 2013-12-17 2018-01-09 Htc Corporation Electronic module and heat dissipation module
EP3604810B1 (fr) * 2014-02-21 2023-06-28 Murata Manufacturing Co., Ltd. Dispositif de commande de fluides et pompe
WO2015125608A1 (fr) 2014-02-21 2015-08-27 株式会社村田製作所 Soufflante
GB2538413B (en) 2014-03-07 2020-08-05 Murata Manufacturing Co Blower
US9371799B2 (en) 2014-04-24 2016-06-21 The Boeing Company Thrust-reverser assemblies that utilize active flow-control and systems and methods including the same
WO2016032429A1 (fr) 2014-08-25 2016-03-03 Ge Aviation Systems Llc Générateur d'écoulement d'air et réseau de générateurs d'écoulement d'air
TWI553230B (zh) * 2014-09-15 2016-10-11 研能科技股份有限公司 微型氣壓動力裝置
US10045461B1 (en) * 2014-09-30 2018-08-07 Apple Inc. Electronic device with diaphragm cooling
CN204436756U (zh) 2014-12-18 2015-07-01 浙江师范大学 一种基于惯性驱动的谐振型压电泵
CN104832407A (zh) 2015-03-20 2015-08-12 长春隆美科技发展有限公司 一种双振子压电驱动式微型风机
US9466452B1 (en) 2015-03-31 2016-10-11 Stmicroelectronics, Inc. Integrated cantilever switch
TW201638469A (zh) 2015-04-28 2016-11-01 yu-jie Luo 微型壓電風扇散熱模組
US9955244B2 (en) * 2015-05-27 2018-04-24 Apple Inc. Electronic device with speaker enclosure sensor
US9559037B2 (en) 2015-06-02 2017-01-31 Intel Corporation Package integrated synthetic jet device
TWI557321B (zh) 2015-06-25 2016-11-11 科際精密股份有限公司 壓電泵及其操作方法
CA2992105C (fr) 2015-07-13 2020-08-11 Intrepid Visions Inc. Systemes et procedes pour actionnement de micro-levier par excitation de base
GB2557088B (en) 2015-08-31 2021-05-19 Murata Manufacturing Co Blower
CN106733310B (zh) 2015-11-20 2019-03-22 英业达科技有限公司 合成射流器
WO2017099677A1 (fr) 2015-12-09 2017-06-15 Ozyegin Universitesi Refroidissement de dissipateur de chaleur avec des dispositifs de refroidissement à jet synthétique préférés
US10388850B2 (en) * 2016-01-29 2019-08-20 Microjet Technology Co., Ltd. Piezoelectric actuator
EP3429957B1 (fr) 2016-03-14 2020-06-24 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Porte-composant à structure de paroi intégrée destinée à l'assemblage subséquent d'un composant électronique
US20170292537A1 (en) 2016-04-06 2017-10-12 Menashe Barak Mems-based active cooling system
US10442680B2 (en) 2016-06-14 2019-10-15 Mems Drive, Inc. Electric connection flexures
US10563642B2 (en) 2016-06-20 2020-02-18 The Regents Of The University Of Michigan Modular stacked variable-compression micropump and method of making same
CN106206490B (zh) 2016-07-01 2018-07-06 浙江大学 被动式mems流致振动强化传热装置及其传热方法
CN107642483A (zh) 2016-07-20 2018-01-30 杨杰 一种压电陶瓷风机
JP6678608B2 (ja) 2016-07-26 2020-04-08 三菱電機株式会社 電子機器冷却装置
TWI683959B (zh) * 2016-09-05 2020-02-01 研能科技股份有限公司 壓電致動器及其所適用之微型流體控制裝置
TWI606936B (zh) 2016-09-05 2017-12-01 研能科技股份有限公司 流體控制裝置
CN116190216A (zh) 2016-10-03 2023-05-30 应用材料公司 多通道流量比例控制器与处理腔室
US10566265B2 (en) 2016-11-18 2020-02-18 Toyota Motor Engineering & Manufacturing North America, Inc. Electronic assemblies having a cooling chip layer with impingement channels and through substrate vias
TWI599309B (zh) 2016-11-24 2017-09-11 研能科技股份有限公司 氣冷散熱裝置
TWI614857B (zh) 2016-11-24 2018-02-11 研能科技股份有限公司 氣冷散熱裝置
TWI686538B (zh) 2016-11-24 2020-03-01 研能科技股份有限公司 氣冷散熱裝置
TWI687151B (zh) 2016-11-24 2020-03-01 研能科技股份有限公司 氣冷散熱裝置及系統
IT201600131844A1 (it) 2016-12-28 2018-06-28 St Microelectronics Srl Trasduttore ultrasonico piezoelettrico microlavorato (pmut) e metodo di fabbricazione del pmut
TWM542326U (zh) 2017-01-05 2017-05-21 研能科技股份有限公司 三維晶片積體電路冷卻系統
US10438868B2 (en) * 2017-02-20 2019-10-08 Microjet Technology Co., Ltd. Air-cooling heat dissipation device
CN106849747A (zh) 2017-02-28 2017-06-13 厦门大学 一种mems压电超声泵
TWI626775B (zh) 2017-08-22 2018-06-11 研能科技股份有限公司 致動器
TWI683960B (zh) * 2017-09-15 2020-02-01 研能科技股份有限公司 氣體輸送裝置
TWI653393B (zh) 2017-09-29 2019-03-11 研能科技股份有限公司 流體系統
CN109899327B (zh) * 2017-12-07 2021-09-21 昆山纬绩资通有限公司 气流产生装置
TWI663507B (zh) 2018-04-09 2019-06-21 中原大學 微型散熱系統
US11464140B2 (en) * 2019-12-06 2022-10-04 Frore Systems Inc. Centrally anchored MEMS-based active cooling systems
US12089374B2 (en) * 2018-08-10 2024-09-10 Frore Systems Inc. MEMS-based active cooling systems
US10788034B2 (en) * 2018-08-10 2020-09-29 Frore Systems Inc. Mobile phone and other compute device cooling architecture
US11536260B2 (en) * 2018-09-17 2022-12-27 Microjet Technology Co., Ltd. Micro-electromechanical system pump
US11540416B2 (en) 2019-01-11 2022-12-27 Microjet Technology Co., Ltd. Actuating breathable material structure
US11802554B2 (en) * 2019-10-30 2023-10-31 Frore Systems Inc. MEMS-based airflow system having a vibrating fan element arrangement
TWI747076B (zh) 2019-11-08 2021-11-21 研能科技股份有限公司 行動裝置散熱組件
US11510341B2 (en) 2019-12-06 2022-11-22 Frore Systems Inc. Engineered actuators usable in MEMs active cooling devices
US20210180723A1 (en) 2019-12-16 2021-06-17 Frore Systems Inc. Virtual valve in a mems-based cooling system
US11533823B2 (en) * 2019-12-16 2022-12-20 Frore Systems Inc. Mobile device case including an active cooling system
EP4078671A4 (fr) * 2019-12-17 2024-01-10 Frore Systems Inc. Systèmes de refroidissement à base de mems pour dispositifs fermés et ouverts
US12033917B2 (en) 2019-12-17 2024-07-09 Frore Systems Inc. Airflow control in active cooling systems
US20220081284A1 (en) * 2020-09-16 2022-03-17 Frore Systems Inc. Tiles having multiple cooling cells for mems-based cooling
US20220087064A1 (en) * 2020-09-16 2022-03-17 Frore Systems Inc. Method and system for fabricating mems-based cooling systems
US11785739B2 (en) * 2020-09-17 2023-10-10 Frore Systems Inc. System level control of mems-based cooling systems
US11356542B2 (en) * 2020-11-11 2022-06-07 Frore Systems Inc. Mobile device having a high coefficient of thermal spreading
WO2022132976A1 (fr) * 2020-12-16 2022-06-23 Frore Systems Inc. Verrouillage de fréquence dans des systèmes de refroidissement mems actifs
WO2022187158A1 (fr) * 2021-03-02 2022-09-09 Frore Systems Inc. Montage et utilisation de systèmes de refroidissement piézoélectriques dans des dispositifs
CN113898563B (zh) 2021-10-09 2022-04-15 中国电子科技集团公司第二十六研究所 压电微泵阵列、微系统及微系统的热管理方法

Also Published As

Publication number Publication date
US20220110220A1 (en) 2022-04-07
WO2022072286A1 (fr) 2022-04-07
US20230380110A1 (en) 2023-11-23
US11765863B2 (en) 2023-09-19
TW202224549A (zh) 2022-06-16
KR20230075503A (ko) 2023-05-31
TWI835005B (zh) 2024-03-11
JP2023544160A (ja) 2023-10-20
CN116325139A (zh) 2023-06-23

Similar Documents

Publication Publication Date Title
US11510341B2 (en) Engineered actuators usable in MEMs active cooling devices
US12029005B2 (en) MEMS-based cooling systems for closed and open devices
US11432433B2 (en) Centrally anchored MEMS-based active cooling systems
US11692776B2 (en) Mounting and use of piezoelectric cooling systems in devices
US11356542B2 (en) Mobile device having a high coefficient of thermal spreading
US20220189852A1 (en) Mems-based active cooling systems
US20220081284A1 (en) Tiles having multiple cooling cells for mems-based cooling
US20230380110A1 (en) Active heat sink
US20240179868A1 (en) Integration of active mems cooling systems into thin computing devices
US20230016991A1 (en) Exit channel configuration for mems-based actuator systems
US20230012794A1 (en) Driving of piezoelectrics for mems-based cooling systems
US20230200011A1 (en) Mems-based system for cooling a vapor chamber
US20230200000A1 (en) Method and system for tailoring fluidic resonant frequency in a mems-based cooling system
US11696421B1 (en) Method and system for driving and balancing actuators usable in MEMS-based cooling systems
US20240256013A1 (en) Integration of active mems cooling systems into smart phones
US20220287201A1 (en) Exhaust blending for piezoelectric cooling systems
WO2023283448A2 (fr) Configuration en ancrage et cavité pour systèmes de refroidissement à base de mems

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20230329

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230913

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)