1259053 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種電子元件冷却模組；特別是有關 於一種電子元件喷霧冷却模組。 【先前技術】 近年來電子元件的發熱量隨著半導體製程的精進而不 k/f的快速升南。如何誕升電子元件的散熱能力’維漢元件 之正常運作，遂成為一項非常重要的工程課題。目前大量 • 使用的空氣冷却技術已經無法滿足許多高熱通量電子元件 散熱的需求，而使用液體冷却或流體相變化的冷奸技術則 可以提高電子元件的散熱能力。喷霧冷却的基本原理是將 冷却流體（例如水）喷流過一個具有微細噴嘴的喷霧器，將 流體以尺寸極小的顆粒狀態喷射到高溫的物體表面。小顆 粒狀態的流體與高溫物體表面間將具有較大的總熱傳導面 積，同時在吸熱後能迅速汽化。藉由流體在相變化時的潛 熱改變，吸收物體上大量的熱能’而達到使物體迅速冷却 的目的。這項技術原先多使用在金屬冶鍊等咼溫冷却領 ⑩域。近年來，包括HP、Intel及IBM等公司則使用不同的 方法，將這種冷却技術運用在半導體電子元件冷却上。但 先前的喷霧冷却設計，主要利用外部的流體加壓裝置(例如 幫浦）來驅動冷却流體，使流體經過喷嘴後形成噴霧。這種 設計會使散熱模組的體積與成本增加。HP的相關設計則是 使用類似噴墨頭噴墨的原理，將流體加熱後產生液滴，而 這種设什會消耗較高的電源功率。另種先别的喷霧冷却 技術係喷霧直接與發熱電子元件接觸，其雖可維持較低的 表面溫度，但是需要額外的密封裝置，缺乏使用彈性，增 1259053 加系統複雜度。 eft ’亟待提供—種可以克服上述缺失且具有高散敎 效率的笔子元件喷霧冷却模組，以因應現今的需求。， 【發明内容】 本卷明之主要目的係提供一種電子元件 入 ί : ί!:用環狀壓電片與具有眾多微細孔徑的噴孔ί組合 成'^務$，以產生流體喷霧，具有低 、 ς 使用幫浦，可降低系統複雜性。 亚且热而 本發明之另-目的係藉由導熱黏著劑 件使冷卻模_喷霧艙與發埶元件 十的扣 緊致及裝卸容易的目的。件相…達到系統設計 本發明之又一目的係利用微機電技術 效率的電子元件噴霧冷却模組。 作具有回政熱 冷却= = 發明Ϊ供-種電子元件喷霧 包含至少-致動器’及至少一流體入口 二：：為 頂部表面。前述致動器包含一環狀壓電片及」==之 嘴結構係設於前迷環‘ 中央&域，刖述流體入口係供一Α 屯々的 致動器上方’而前述致動器迫使:;二逑 :狀的中空槽狀•空間。前述嘴霧艙本體設4述1259053 IX. Description of the Invention: [Technical Field] The present invention relates to an electronic component cooling module; and more particularly to an electronic component spray cooling module. [Prior Art] In recent years, the heat generation amount of electronic components has risen rapidly with the precision of the semiconductor process and not k/f. How to Elevate the Heat Dissipation Capability of Electronic Components The normal operation of Weihan components has become a very important engineering issue. At present, a large number of air cooling technologies are used to meet the heat dissipation requirements of many high heat flux electronic components, while the cold cooling technology using liquid cooling or fluid phase change can improve the heat dissipation capability of electronic components. The basic principle of spray cooling is to spray a cooling fluid (such as water) through a sprayer with a fine nozzle to spray the fluid onto the surface of a high temperature object in a very small particle state. The fluid in the small particle state will have a large total heat transfer area between the surface of the high temperature object and the rapid vaporization after the heat absorption. By the latent heat change of the fluid during phase change, a large amount of thermal energy on the object is absorbed to achieve the purpose of rapidly cooling the object. This technology was originally used in the 10 fields of the metal cooling chain. In recent years, companies including HP, Intel, and IBM have used different methods to apply this cooling technology to the cooling of semiconductor electronic components. However, previous spray-cooling designs used an external fluid pressurization device (such as a pump) to drive the cooling fluid, allowing the fluid to pass through the nozzle to form a spray. This design increases the size and cost of the thermal module. HP's design is based on the principle of inkjet inkjet, which heats the fluid to produce droplets, which consumes a higher power supply. Another spray-cooling technique is that the spray is in direct contact with the hot electronic components. Although it maintains a low surface temperature, it requires additional sealing and lacks flexibility, increasing 1259053 plus system complexity. Eft's need to provide a pen element spray cooling module that overcomes these shortcomings and has high divergence efficiency to meet today's needs. [Description of the Invention] The main purpose of the present disclosure is to provide an electronic component into the ί: ί!: a ring-shaped piezoelectric piece and a nozzle hole having a plurality of micro-apertures are combined to form a fluid spray, having Low, ς Use the pump to reduce system complexity. The present invention is also directed to the purpose of facilitating the attachment and detachment of the cooling mold _ spray chamber and the hair unit 10 by means of a heat-conductive adhesive. Component Phase...Achieve System Design Another object of the present invention is an electronic component spray cooling module that utilizes MEMS technology efficiency. Having a tempering heat Cooling = = Invention - - Electronic component spray Contains at least - an actuator ' and at least one fluid inlet 2:: is the top surface. The actuator includes a ring-shaped piezoelectric piece and a nozzle structure of "==" is disposed in the front center of the front ring, and the fluid inlet is provided above the actuator of the first one. The device forces:; two turns: a hollow trough-shaped space. The above-mentioned mouth mist cabin body is set to 4
方，以使前述致動器位於复頂如 从么、嘴務态T 粒噴射至前述中空槽狀空間内。。寸二微小的流體帮 至少一接觸平面對應前述致動哭别本體底部具有 電子元件發熱面接觸。前述接觸平面係可輿 、貝務艙本體的一側壁具有至少 1259053 一出口’以供汽化的冷却流體排出。 進入St冷却流體:ΪΪ前述噴霧器上方的流體入口 進入刖述致動器上方，而§丽述環狀壓電 歇性振動時，冷却流體會流過前述喷嘴結構並^成=二 流體顆粒。這些微小流體顆粒將噴射到前述喷霧艙底部： 並在吸收前述噴霧艙底部的熱量後迅速汽化，再婉由^ m壁的出口排出，進而將電子元件所散發：的埶； f走’達到迅速冷却發熱電子元件的效果。 【實施方式】 本發明提供的一種電子元件喷霧冷却模組，係利用一 ^具高熱傳導特性的材料形成具有中空結構的獨立本體與 電子元件發熱表面接觸，前述本體再與一噴霧器結合，开^ 成一個密閉的噴霧艙空間。前述喷霧器係整合一環狀壓‘ 片與-具有多個微小喷孔的噴嘴結構，利用前述=狀y ㈡:續，間歇振動’使前述喷嘴結構上方的冷却流= 並霧化銳滴。冷却流體在噴霧化後愈噴 =艙本體底座的内表面接觸，而不直接與電子元件接觸。、 刖述喷霧艙本體可以一體成型或由數個零件組合而:寸 述噴霧艙本體底部接觸冷却流體的表面，可以利用精密^ =加工或微機電蝕刻技術形成許多細微突起結構，二^少 冷却流體顆粒與前述喷霧艙本體表面的接觸角度，增加& ，效率。吸熱、;气化之後的冷却流體再經由外部管路‘行二 凝與回收處理。再者，前述喷霧艙本體可藉由導熱黏著^ 或特殊設計的扣件與發熱的電子元件相結合，以達 攻計緊致與裝卸容易的目的。 〃、、 本發明之目的及諸多優點藉由以下具體實施例之詳 1259053 細說明，並參照所附圖式，將趨於明瞭。 第一圖係本發明之電子元件喷霧冷却模組之第一具 體實施例的剖面示意圖，其中前述電子元件喷霧冷却模組 1的底部係與電子元件2發熱面相結合，電子元件2係為 一般電路基板3上的元件，例如中央處理器上整合的熱擴 散片（IHS，Integrated Heat Spreader)。在第一具體實施例 中’前述電子元件喷霧冷却模組1係包括一噴霧器10及_ 噴務艙本體20。也就是說，前述電子元件喷霧冷却模組1 係利用噴霧艙本體20與喷霧器10結合，形成一個封閉的 冷却流體喷霧空間。 前述喷霧器10係包含一致動器100,及一流體入口 104 形成於前述喷霧器1〇之頂部表面105。前述致動器1〇〇包 含一環狀壓電片101及一具有複數個微細喷孔103的喷嘴 結構102。前述喷嘴結構102可以利用精密加工、微機電 或其他加工技術製作，其係設於前述環狀壓電片101的中 央區域，與前述環狀壓電片101形成一個平面結構。前述 流體入口 104係供一冷却流體通入以到達前述致動器1 〇〇 φ 上方，而前述致動器1〇〇迫使冷却流體通過前述微細喷孔 103，以形成噴霧狀微小的流體顆粒106。 觔述育霧搶本體2〇係為一頂部王開口狀的中空槽狀 空間201，前述喷霧艙本體20設於前述噴霧器ι〇下方， 以使前述致動器100位於其頂部，使前述微小的流體顆粒 106噴射至前述中空槽狀空間201内。前述噴霧艙本體2〇 底部具有至少一接觸平面202對應前述致動器1〇〇，前述 接觸平面202係與電子元件2的發熱面接觸，而前述喷霧 艙本體20的一側壁具有至少一出口 203，以供汽化的冷却 流體排出。 7 1259053 前述喷霧艙本體20可以用鍛造、衝壓及電腦妻 制（CNC，Computer Numerical Control)等加工方值控 型，或是以各類加工方式製作成個別的底座與外殼:體成 再加以組合，其中底座可以是一種高熱傳導材料。後 再者，利用‘熱黏著劑（未示出）使前述噴 可以與電子元件2表面緊密相連，使電子元件2戶本體20 熱量能傳遞到前述噴霧艙本體20的底座。 所產生的 前述電子元件噴霧冷却模組1的運作方式如 流體經由前述噴霧器10上方的流體入口 104進:.冷却 器100上方，當前述環狀壓電片101進行連續=述玖動 動時，冷却流體會流過前述噴嘴結構1〇2，、、j次9歇性振 流體顆粒106。這些微小的流體顆粒1〇6將成微小的 霧艙本體20底部，並在吸收前述噴霧艙、η到前述噴 量後迅速汽化，錢再㈣前述噴霧搶本體 ^部的熱 203排出。 1則壁的出〇 前述電子元件噴霧冷却模組利 有眾多微細孔徑的噴孔片Μ合成前述 ^片吻與具 小的流體顆粒106,而不需要例如，二，以產生微 具有低耗電特性，並可降低系統性’ 加壓裝置， 第二圖係本發明電子元件噴二 實施例的剖面示意圖，其與第」且二J，組1的第二具體 前述喷霧艙本體2〇底部與冷却流體僅在於 多細微的突狀結構2G5，以減少接觸表面2G4形成許 接觸表面204的接觸角度，二机體顆粒1〇6與前述 汽化效率。 & 了協助冷却流體喊化，增加 第三圖係本發明之電子元杜兩 體實施例的剖面示意圖，其鱼第一、^冷却模組1的第三具 、一弟具體實施例不同處僅在 10 1259053 於使用特殊設計的扣件4使前述電子元件喷霧冷却模組1 與發熱的電子元件2緊密結合，達到系統設計緊致與裝卸 容易的目的。另外，扣件4亦可使用於第二具體實施例中。 前述電子元件喷霧冷却模組1可進一步加以延伸，第 四圖係本發明的第四具體實施例的剖面示意圖，係整合一 個儲存槽5，來提供冷却流體予前述喷霧器10 ;加裝一熱 交換器6，將前述喷霧艙本體20排出的汽化冷却流體凝 結，並將熱量排至外界環境中；加裝一冷却流體回收系統， 例如具毛細作用之管路結構203a及203b，或是幫浦及管 ® 路所構成之結構，使冷却流體能由前述熱交換器6流到前 述儲存槽5。 前述電子元件喷霧冷却模組1也可以應用在協助多個 發熱電子元件2的冷却上。此時前述喷霧艙本體20底部具 有多個接觸平面與電子元件接觸，而前述喷霧器10具有多 組致動器分別對應個別的前述接觸平面。 以上所述僅為本發明之具體實4施例而已，並非用以限 定本發明之申請專利範圍；凡其它未脫離本發明所揭示之 精神下所完成之等效改變或修飾，均應包含在下述之申請 專利範圍内。 1259053 【圖式簡單說明】 第一圖係本發明電子元件噴霧冷却模組之第一具體 實施例的剖面示意圖； 第二圖係本發明電子元件喷霧冷却模組之第二具體實 施例的剖面示意圖； 第三圖係本發明電子元件喷霧冷却模組之第三具體實 施例的剖面示意圖；及 第四圖係本發明電子元件噴霧冷却模組之第四具體實 施例的剖面示意圖。 主要部份之代表符號： 1 —電子元件喷霧冷却模組 2—電子元件 3----電路基板 5-…儲存槽 10-…喷霧器 100—致動器 102-…喷嘴結構 104…-流體入口 106—流體顆粒 202-…接觸平面 4—扣件 6——熱交換器 20-…喷霧艙本體 101 —壞狀壓電片 103 — 孑 L 105 —頂部表面 201--—中空槽狀空間 203 —出口 203a，203b…-管路結構 204…-接觸表面 205…-突狀結構 12In order to cause the aforementioned actuator to be sprayed into the hollow groove-like space, such as from the top of the nozzle. . Insulation of a small fluid helps at least one contact plane corresponding to the aforementioned actuation of the bottom of the body to have an electronic component heating surface contact. The contact plane is 、, and a side wall of the cabin body has at least 1259053 an outlet for discharging the vaporized cooling fluid. Entering the St cooling fluid: 流体 The fluid inlet above the sprayer enters above the actuator, and when the ring is intermittently vibrating, the cooling fluid flows through the nozzle structure and becomes a two-fluid particle. These tiny fluid particles will be sprayed to the bottom of the spray tank: and quickly vaporized after absorbing the heat from the bottom of the spray tank, and then discharged from the outlet of the wall, thereby dissipating the electronic components: Quickly cool the effects of heat-generating electronic components. Embodiments of the present invention provide an electronic component spray cooling module in which a separate body having a hollow structure is formed by contacting a heating surface of an electronic component with a material having high heat conduction characteristics, and the body is combined with a sprayer to open ^ Become a sealed spray cabin space. The sprayer integrates an annular pressure piece and a nozzle structure having a plurality of minute orifices, using the aforementioned shape y (2): continuous, intermittent vibration 'to make the cooling flow above the nozzle structure = and atomize the sharp drop . The cooling fluid is sprayed after the atomization = the inner surface of the base of the cabin body is in contact without directly contacting the electronic components. The spray capsule body can be integrally formed or assembled by several parts: the bottom of the spray chamber body is in contact with the surface of the cooling fluid, and many fine protrusion structures can be formed by using precision machining or microelectromechanical etching techniques. The angle of contact of the cooling fluid particles with the surface of the spray capsule body described above increases & efficiency. Endothermic; the cooling fluid after gasification is then condensed and recycled via an external line. Furthermore, the spray capsule body can be combined with heat-generating electronic components by a heat-conductive adhesive or a specially designed fastener to achieve the purpose of tightness and easy loading and unloading. The objects and many advantages of the present invention will be apparent from the following detailed description of the appended claims. The first figure is a schematic cross-sectional view of a first embodiment of the electronic component spray cooling module of the present invention, wherein the bottom of the electronic component spray cooling module 1 is combined with the heat generating surface of the electronic component 2, and the electronic component 2 is Generally, an element on the circuit substrate 3, such as an integrated heat spreader (IHS) integrated on a central processing unit. In the first embodiment, the aforementioned electronic component spray cooling module 1 includes a sprayer 10 and a spray booth body 20. That is, the aforementioned electronic component spray cooling module 1 is combined with the sprayer 10 by means of the spray capsule body 20 to form a closed cooling fluid spray space. The aforesaid sprayer 10 includes an actuator 100, and a fluid inlet 104 is formed in the top surface 105 of the aforementioned sprayer 1〇. The actuator 1 includes an annular piezoelectric sheet 101 and a nozzle structure 102 having a plurality of fine orifices 103. The nozzle structure 102 can be fabricated by precision machining, microelectromechanical or other processing techniques, and is disposed in a central region of the annular piezoelectric sheet 101 to form a planar structure with the annular piezoelectric sheet 101. The fluid inlet 104 is for supplying a cooling fluid to reach above the actuator 1 〇〇φ, and the actuator 1 〇〇 forces the cooling fluid to pass through the micro-injection 103 to form a spray-like minute fluid particle 106. . The fascinating body 2 is a hollow trough-like space 201 of a top open shape, and the spray capsule body 20 is disposed under the sprayer 〇 so that the actuator 100 is located at the top thereof to make the aforementioned micro The fluid particles 106 are ejected into the aforementioned hollow groove-like space 201. The bottom of the spray booth body 2 has at least one contact plane 202 corresponding to the actuator 1 , the contact plane 202 is in contact with the heat generating surface of the electronic component 2, and a side wall of the spray capsule body 20 has at least one outlet. 203, discharging the cooling fluid for vaporization. 7 1259053 The spray booth body 20 can be controlled by forging, stamping, and computer numerical control (CNC, Computer Numerical Control), or by various processing methods to form individual bases and outer casings: The combination wherein the base can be a highly thermally conductive material. Further, the above-mentioned spray can be closely connected to the surface of the electronic component 2 by means of a 'heat adhesive (not shown), so that the heat of the electronic component 2 can be transferred to the base of the spray booth body 20. The generated electronic component spray cooling module 1 is operated in such a manner that fluid passes through the fluid inlet 104 above the atomizer 10: above the cooler 100, when the annular piezoelectric sheet 101 is continuously rotated. The cooling fluid flows through the nozzle structure 1〇2, j times, and the 9-time vibrating fluid particles 106. These tiny fluid particles 1〇6 will become the bottom of the tiny mist chamber body 20, and will rapidly vaporize after absorbing the spray chamber, η to the aforementioned spray amount, and then discharging the heat 203 of the body portion of the spray. 1 The exit wall of the electronic component spray cooling module has a plurality of micro-aperture orifice sheets, and the above-mentioned sheet kisses and small fluid particles 106 are synthesized, without requiring, for example, two, to generate micro-low power consumption. Characteristics, and can reduce the systemic 'pressurizing device, the second figure is a schematic cross-sectional view of the second embodiment of the electronic component spray of the present invention, and the second and second J, the second specific spray chamber body 2 of the group 1 The cooling fluid is only in the fine-grained protruding structure 2G5 to reduce the contact angle of the contact surface 2G4 to form the contact surface 204, the two-body particles 1〇6 and the aforementioned vaporization efficiency. & assisting the cooling fluid shouting, adding a third section of the electronic unit Du body embodiment of the present invention, a cross-sectional view of the fish first, ^ cooling module 1 third, a younger embodiment different The above-mentioned electronic component spray cooling module 1 is tightly coupled with the heat-generating electronic component 2 only by using the specially designed fastener 4 at 10 1259053, so that the system design is compact and easy to handle. In addition, the fastener 4 can also be used in the second embodiment. The electronic component spray cooling module 1 can be further extended. The fourth drawing is a cross-sectional view of a fourth embodiment of the present invention, which integrates a storage tank 5 to provide a cooling fluid to the sprayer 10; a heat exchanger 6, condensing the vaporized cooling fluid discharged from the spray booth body 20, and discharging the heat to the external environment; and adding a cooling fluid recovery system, such as capillary structure 203a and 203b, or It is a structure composed of a pump and a pipe, so that a cooling fluid can flow from the aforementioned heat exchanger 6 to the aforementioned storage tank 5. The electronic component spray cooling module 1 described above can also be applied to assist in cooling the plurality of heat-generating electronic components 2. At this time, the bottom of the spray booth body 20 has a plurality of contact planes in contact with the electronic components, and the sprayer 10 has a plurality of sets of actuators corresponding to the respective aforementioned contact planes. The above is only the specific embodiment of the present invention, and is not intended to limit the scope of the present invention; all other equivalent changes or modifications which are not departing from the spirit of the present invention should be included. Within the scope of the patent application. 1259053 [Simplified description of the drawings] The first figure is a schematic cross-sectional view of a first embodiment of the electronic component spray cooling module of the present invention; the second figure is a cross section of the second embodiment of the electronic component spray cooling module of the present invention BRIEF DESCRIPTION OF THE DRAWINGS The third drawing is a schematic cross-sectional view of a third embodiment of the electronic component spray cooling module of the present invention; and the fourth drawing is a schematic cross-sectional view of a fourth embodiment of the electronic component spray cooling module of the present invention. Representative symbols of the main parts: 1 - Electronic component spray cooling module 2 - Electronic components 3 - Circuit board 5 - Storage tank 10 - Sprayer 100 - Actuator 102 - ... Nozzle structure 104... - fluid inlet 106 - fluid particles 202 - ... contact plane 4 - fastener 6 - heat exchanger 20 - ... spray capsule body 101 - bad piezoelectric sheet 103 - 孑 L 105 - top surface 201 - hollow slot Space 203 - outlet 203a, 203b... - pipe structure 204... - contact surface 205... - projecting structure 12