CN100353537C - Heat elimination / cooling set of ultrasonic spray - Google Patents
Heat elimination / cooling set of ultrasonic spray Download PDFInfo
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- CN100353537C CN100353537C CNB200410104165XA CN200410104165A CN100353537C CN 100353537 C CN100353537 C CN 100353537C CN B200410104165X A CNB200410104165X A CN B200410104165XA CN 200410104165 A CN200410104165 A CN 200410104165A CN 100353537 C CN100353537 C CN 100353537C
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
- B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
- B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
- B05B17/0615—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers spray being produced at the free surface of the liquid or other fluent material in a container and subjected to the vibrations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
The present invention discloses an ultrasonic atomization heat dispersion/cooling device which comprises a container used for containing working fluid, an ultrasonic oscillator, a heat changing chamber, a liquid drop molecular channel composed of a flexible pipe piece, and a vapor state molecular channel. The present invention causes the working fluid in the container to form tiny liquid drops because of shock in an ultrasonic shock mode, pressure difference can be generated inside the container and outside the container by the structural design to drive the tiny liquid drops to be sprayed in the heat changing chamber to react with a heating element along the liquid drop molecular channel, and the heating element can be atomized and cooled down. The spraying direction of the flexible pipe piece can be adjusted according to the position of the heating element, so that the use elasticity of the present invention can be increased.
Description
Technical field
The present invention relates to a kind of liquid cooling pattern heat radiation/cooling device, particularly relevant for a kind of ultrasonic atomization heat radiation/cooling device.
Background technology
When electronics, communication, opto-electronics are flourish, be accompanied by the diversity on the function, impel the running of dominant force types of functionality need hold more transistor unit with the chip of performance performance is inevasible in the confined space, its heat dissipation problem of deriving will cause the reduction of element, system dependability.With the optical communication spare part is example, excessive heat not only causes chip to damage, and may change the output of optical wavelength, portion is shown by the research that US military carried out, the ratio that electronic component causes the system failure because of heat institute is up to 55%, and the trend of this heating power growth is also as following hard on of following in sb's footsteps as the Moore's Law.
What at present each relevant product official educational circles of the world joined hands invariably proposes corresponding cooling technology at element enthusiasm gesture occurred frequently, and, two-phase flow single-phase such as thermoelectricity, thermal siphon two phase flow, microchannel, sub-cooled etc. are led, the passive type of cooling.The liquid cooling pattern then is regarded as the heat radiation settling mode that the most potential replacement air cooling of next stage pattern solves high heating problem.Recently the many direct contact coolings that focus on chip of the technology of Kai Fa liquid cooling chip pattern, comprise jet impact cooling (jet impingement cooling) and spraying cooling (spray cooling) isotype, its purpose wants that nothing but the formed fine droplet of assembly that sees through the micro-electromechanical technology making is sprayed on the chip upper end, utilize drop to absorb the heat that chip distributed, heat is taken away with the hot phase transformation pattern of two phase flow.Jet impact cooling (jet impingement cooling) and spraying cooling (spray cooling) are regarded as one of following potential liquid cooling refrigerating mode, it is comparatively loaded down with trivial details to assemble processing procedure when right its sees through micro electronmechanical makings, cost factor becomes one of commercial application development bottleneck, some designs needed higher pressure when fine droplet sprayed in addition, so that make the liquid that sprays can above chip, form even liquid film, reason fluid cohesive force and cause fluid accumulation not.
In addition, United States Patent (USP) the 6th, 247, disclosing a kind of vibrations No. 525 brings out liquefier 30 (Vibration InducedAtomizers), provides a kind of with the mechanism of ultrasonic oscillation device with the integration of heat exchange reaction chamber.Fig. 1 shows that the vibrations of aforementioned patent bring out liquefier 30 schematic cross-sections, the reative cell 31 of liquefier 30 in conjunction with a filling gaseous fluid 38 brought out in these vibrations, its wall 32 is contacted with a heater 33, and cooling wall 34 contacts one have the cooling device 36 of a plurality of piezoelectric elements (piezoelectric disks) 39A-39D, aforementioned piezoelectric element 39A-39D is attached on the outer surface 35 of cooling wall 34, and the zone of the inner surface 40 relative piezoelectric element 39B-39C of cooling wall 34 forms the recessed district 46 of a plurality of condensations.Aforementioned piezoelectric element 39A-39D is connected to a driver 42 via lead 41.When the temperature of gaseous fluid 38 raise, it can begin to be condensed into liquid along the inner surface 40 of cooling wall 34, and accumulates in the recessed district 46 of condensation.See through the vibrations of piezoelectric element 39A-39D, the liquid that the recessed district 46 of condensation is gathered forms the fine droplet 44 that carries energy, this slightly droplet 44 promptly break away from cooling wall 34, be sprayed on the wall 32, and then absorption heater 33 passes to the heat of wall 32, be vaporized into gas, and the torrid zone of heater 33 is walked.Atomizer 30 is brought out in right this kind vibrations must yield to its structure on using, can't furnish the heater 33 in orientation in response to difference, chip for example, and its range of application is restricted.
Because the problems referred to above, so a kind of ultrasonic wave liquefaction cooling device generation applicable to difference ornaments orientation pyrotoxin.
Summary of the invention
Main purpose of the present invention is to provide a kind of ultrasonic atomization heat radiation/cooling device, sees through vibration of ultrasonic wave and forms fine droplet and then atomizing cooling down high-temperature heater element, to reach low-cost, high efficiency high temperature cooling mechanism.
Another object of the present invention is to provide a kind of ultrasonic atomization heat radiation/cooling device, it uses the pliability pipeline, can deal with the ornaments of each orientation pyrotoxin, improves the use elasticity of apparatus of the present invention.
Another purpose of the present invention is to provide a kind of ultrasonic atomization heat radiation/cooling device, and its each member is generally precision optical machinery cooked mode making all, and does not relate to complicated micro electronmechanical processing, can reduce manufacturing cost.
According to above-described purpose, the invention provides a kind of ultrasonic wave heat radiation/cooling device, it comprises: a container, be used for the splendid attire hydraulic fluid, the relative hydraulic fluid liquid level of aforementioned container top is provided with an opening; One ultrasonic oscillation device is positioned in the hydraulic fluid of aforementioned container, is used for making hydraulic fluid to produce the drop molecule; One heat-exchanging chamber, have first wall, second wall, the 3rd wall and wall face, the wall face is with respect to first wall, and second wall is with respect to the 3rd wall, wherein the wall face is contacted with a heater element, first wall is provided with drop molecule inlet, and second wall is provided with a steam-like and divides subexit and the 3rd wall to be provided with a drop to divide subexit; One drop molecular channel has a feeder connection and a channel outlet, and the aforementioned channels inlet is communicated in the opening of aforementioned container, and the aforementioned channels outlet is provided with the aforementioned drop molecule inlet that a nozzle passes first wall of aforementioned hot switch room; And a steam-like molecular channel, having one first inlet and one first outlet, the aforementioned steam-like that aforementioned first inlet is communicated in second wall of aforementioned hot switch room divides subexit, and aforementioned first outlet is communicated in the place, one first right position of aforementioned container.
Ultrasonic atomization heat radiation/cooling device of the present invention, seeing through aforementioned ultrasonic oscillation device shakes the hydraulic fluid in the aforementioned container and forms fine droplet, see through aforementioned structure of container design after being shaped and make the inside and outside build-up of pressure difference of container, drive the drop molecule by aforementioned drop molecular channel, via the wall face of its nozzles spray in the aforementioned hot switch room, to carry out heat exchange with aforementioned heater element, be phase-changed into the steam-like molecule and pass through aforementioned steam-like molecular channel, be condensed into drop and be back in the aforementioned container.Mat fine droplet of the present invention directly is sprayed on the contact-making surface of contact heating element, sees through the heat absorption of fine droplet creep, reaches the effect of cooling heating element.
Description of drawings
Fig. 1 is the schematic cross-section that atomizer is brought out in known vibrations;
Fig. 2 is the schematic cross-section that shows first specific embodiment of ultrasonic atomization heat radiation/cooling device of the present invention;
Fig. 2 A is that the part that shows second specific embodiment of ultrasonic atomization heat radiation/cooling device of the present invention is amplified schematic cross-section;
Fig. 3 is the schematic cross-section that shows the 3rd specific embodiment of ultrasonic atomization heat radiation/cooling device of the present invention;
Fig. 4 A to Fig. 4 C is the various schematic cross-sections that change example of container that are combined with the splendid attire hydraulic fluid of ultrasonic oscillation device;
Fig. 5 A to Fig. 5 C is the various left views that change example of nozzle of the present invention; And
Fig. 6 A to Fig. 6 C is the various schematic cross-sections that change example of nozzle of the present invention.
The drawing reference numeral explanation:
1 ultrasonic atomization heat radiation/cooling device, 10 containers 11,11a ultrasonic oscillation device
14 steam-like molecular channels, 12 heat-exchanging chambers, 13 drop molecular channels
15 drop molecule recovery approaches, 16 heater elements, 17 printed circuit board (PCB)s
18 thermal interfacial materials, 19 radiating fins, 20 fans
Atomizer 31 reative cells 32 walls are brought out in 30 vibrations
33 heaters, 34 cooling walls, 35 cooling wall outer surfaces
38 gaseous fluid 39A-39D piezoelectric elements, 41 leads
The recessed district of 42 driver 44 drops, 46 condensations
100 hydraulic fluids, 101 openings, 110 piezoelectric films
110a, 110b concussion 112,112a substrate 121 wall faces
122 first walls, 123 second walls 124 the 3rd wall
132,132a, 144 first outlets of 132b nozzle 142 first inlets
154 second outlets of 152 second inlets
Embodiment
The invention provides a kind of ultrasonic atomization heat radiation/cooling device, it is to make splendid attire form fine droplet in the working fluid of internal tank because of concussion with the ultrasonic oscillation pattern, see through the structure of container design after being shaped and make the inside and outside build-up of pressure difference of container, driving liquid microparticle drop is following pipeline and directly is being sprayed on heater element top, for example the chip top sees through the heat absorption of microparticle creep and reaches spraying cooling (spray cooling) effect.
Spraying cooling technology of the present invention mainly is to see through to change the high-frequency vibration that the piezoelectricity oscillator of surveying on the device (transducer) (pizeo-electric diaphragm) produces dipping and heaving, in this process, have moment vacuum formation, thereby make larger particles liquid surface molecule break away from formation particulate molecule.Fine droplet particle after the shaping sees through the structure of container design and makes the inside and outside build-up of pressure difference of container, makes it follow the pliability pipeline and sees through nozzles spray in the heater element top, reaches and the identical effectiveness of spraying cooling via the heat absorption of microparticle creep.Moreover, need not utilize micro electronmechanical processing when designs of nozzles of the present invention is made, and can reach with general traditional precision optical machinery processing, can reduce manufacturing cost.In addition, for strick precaution sprays the particle carburation by evaporation that can't absorb heat fully, also can below drop, heater element heat exchange reaction district, design a reclaim mechanism in addition and reclaim not the liquid molecule of heat exchange reaction fully.Steam-like molecule after the evaporation of heat absorption creep forms drop via condenser pipe condensation release heat, is back in the liquid storage groove, and finishes whole circulation mechanism.
Because ultrasonic atomization heat radiation/cooling device of the present invention adopts the pliability pipeline, can spray direction and adjust drop, so the application elasticity of cooling device of the present invention is greatly promoted in response to the heater element in various different ornaments orientation.
Purpose of the present invention and plurality of advantages be by the detailed description of following specific embodiment, and with reference to accompanying drawing, will be tending towards clear.
Fig. 2 demonstrates the schematic cross-section of one first specific embodiment of ultrasonic atomization heat radiation/cooling device of the present invention.In first specific embodiment, ultrasonic atomization heat radiation/cooling device 1 comprises: a container 10, be used for splendid attire hydraulic fluid 100, and aforementioned container 10 relative hydraulic fluid 100 liquid levels tops are provided with an opening 101; One ultrasonic oscillation device 11 is positioned in the hydraulic fluid 100 of aforementioned container 10, is used for making hydraulic fluid 100 to produce the drop molecule; One heat-exchanging chamber 12, have wall face 121, first wall 122, second wall 123 and the 3rd wall 124, wall face 121 with respect to first wall 122 and second wall 123 with respect to the 3rd wall 124, wherein wall face 121 is contacted with a heater element 16, and first wall 122 is provided with drop molecule inlet, and second wall 123 is provided with a steam-like and divides subexit and the 3rd wall 124 to be provided with a drop to divide subexit; One drop molecular channel 13 has a feeder connection and a channel outlet, and the aforementioned channels inlet is communicated in the opening 101 of aforementioned container 10, and the aforementioned channels outlet is provided with the aforementioned drop molecule inlet that a nozzle 1 32 passes first wall 122 of aforementioned hot switch room 12; One steam-like molecular channel 14, has 142 and 1 first outlet 144 of one first inlet, first inlet, the 142 aforementioned steam-likes that are communicated in second wall 123 of aforementioned hot switch room 12 divide subexit, and first outlet 44 is communicated in the place, one first right position of aforementioned container 10; An and drop molecule recovery approach 15, be used for collecting in the aforementioned hot switch room 12 the not drop molecule of phase transformation, it has 152 and 1 second outlet 154 of one second inlet, second inlet, the 152 aforementioned drops that are communicated in the 3rd wall 124 of aforementioned hot switch room 12 divide subexit, and second outlet 154 is communicated in the place, one second right position of aforementioned container 10.
Aforementioned drop molecular channel 13, steam-like molecular channel 14 and drop molecule recovery approach 15 all constitute with the pliability pipe fitting.Therefore, can be according to the ornaments orientation of heater element 16, and elasticity is adjusted the position of aforementioned hot switch room 12, make the surface that the wall face 121 of aforementioned hot switch room 12 can different azimuth contact heating element 16.Moreover, part steam-like molecule after the creep vaporization may pass through drop molecule recovery approach 15, and directly enter in the aforementioned container 10, therefore, can load in the aforementioned drop molecule recovery approach 15 and have the porous media properties material, for example sponge, sintering powder etc. are as embolism, preventing the steam-like molecule by aforementioned drop molecule recovery approach 15, and directly enter in the container 10.In addition, attached nano powder material can be draped over one's shoulders in 14 inside, steam-like molecular channel, changes the contact angle of itself and condensing droplet, perhaps 14 inside, steam-like molecular channel is made to have capillary structure, comes the auxiliary fluid of accelerating to flow.In addition, between the wall face 121 of heater element 16 and heat-exchanging chamber 12, be provided with a thermal interfacial material 18, to promote the heat conduction between heater element 16 and the heat-exchanging chamber 12.
The hydraulic fluids 100 of filling can be water, methyl alcohol, ethanol, refrigerant (refrigerants), dielectric fluid or other similar liquids in the aforementioned container 10, and the piezoelectricity oscillator that ultrasonic oscillation device 11 can be made up of the substrate 112 of piezoelectric film 110 and tool arcuation bottom thereof.Ginseng Fig. 4 A to Fig. 4 C, aforementioned container 10 and ultrasonic oscillation device 11 can also have different variation examples, and for example aforementioned container 10 interior shapes can be circle or rectangle etc. and can assist the atomized drop that does not flow out to reflux; Ultrasonic oscillation device 11 can also be the piezoelectricity oscillator 11a of the tool planar substrates 112a shown in Fig. 4 A and Fig. 4 B, reaches the piezoelectricity oscillator that a plurality of cantilever types are shaken sub-110a, 110b that has shown in Fig. 4 C.In addition, ultrasonic oscillation device 11 can utilize the control of piezoelectric film thickness and circuit to make to decide frequency or frequency conversion, and the drop molecular size is controlled in the feedback that sees through reative cell internal temperature feedback device.
The nozzle 132 of aforementioned drop molecular channel 13 channel outlet can be processed into by general traditional precision optical machinery, its nozzle form can be nozzle shape 132, honeycomb circle hole shape 132a, duckbill 132b or any shape that needs application, shown in Fig. 5 A to Fig. 5 C and Fig. 6 A to Fig. 6 C.
Multiple with reference to Fig. 2, heater element 16 can be the chip that is carried on the printed circuit board (PCB) 17.
Fig. 2 A shows the part amplification schematic cross-section of one second specific embodiment of ultrasonic atomization heat radiation/cooling device of the present invention, and the A of its corresponding diagram 2 partly.Second specific embodiment and first specific embodiment do not exist together and only are that heat-exchanging chamber 12 does not have former wall face 121, but directly contact between heater element 16 and the heat-exchanging chamber 12.That is to say that in the present invention, heat-exchanging chamber 12 can be directly or indirectly and heater element 16 haptoreactions.
Fig. 3 shows the schematic cross-section of one the 3rd specific embodiment of ultrasonic atomization heat radiation/cooling device of the present invention, and they are different with first specific embodiment to be in and to be combined with a cooling mechanism that comprises a multi-disc radiating fin 19 and a fan 20 in steam-like molecular channel 14.An additional condensation reclaim mechanism is in aforementioned steam-like molecular channel 14 by aforementioned cooling mechanism, and the steam-like molecule of more strengthening by aforementioned steam-like molecular channel 14 condenses into drop.Moreover, the relatively low pressure that the radiating fin 19 of aforementioned cooling mechanism and fan 20 are caused, the steam-like molecule that also helps in the aforementioned hot switch room 12 is inhaled in the steam-like molecular channel 14.Aforementioned condensation reclaim mechanism structure can be the shape that the cooling phase-change evaporative fluid forms any needs of fluid liquid.In addition, between the wall face 121 of heater element 16 and heat-exchanging chamber 12, be provided with a thermal interfacial material 18, to promote the heat conduction between heater element 16 and the heat-exchanging chamber 12.
The above is specific embodiments of the invention only, is not in order to limiting claim of the present invention, and all other do not break away from the equivalence of being finished under the disclosed spirit and change or modify, and all should be included in the claim.
Claims (17)
1. ultrasonic atomization heat radiation/cooling device, it comprises:
One container, in order to the splendid attire hydraulic fluid, this container this hydraulic fluid liquid level top relatively is provided with an opening;
One ultrasonic oscillation device is positioned in the hydraulic fluid of aforementioned container, is used for making this hydraulic fluid to produce the drop molecule;
One heat-exchanging chamber, this heat-exchanging chamber include first wall, second wall, the 3rd wall and wall face, and this wall face is with respect to this first wall, and this second wall is with respect to the 3rd wall; Wherein this wall face is contacted with a heater element, and this first wall is provided with drop molecule inlet, and this second wall is provided with a steam-like and divides subexit;
One drop molecular channel has a feeder connection and a channel outlet, and this feeder connection is communicated in this opening of aforementioned container, and this channel outlet is provided with this drop molecule inlet that a nozzle passes this first wall of aforementioned hot switch room;
One steam-like molecular channel has one first inlet and one first outlet, and this steam-like that this first inlet is communicated in this second wall of aforementioned hot switch room divides subexit, and this first outlet is communicated in the place, one first right position of this container; And
One cooling mechanism is incorporated into aforementioned steam-like molecular channel;
The drop molecule that produces in the wherein aforementioned container is by aforementioned drop molecular channel, via its aforementioned nozzles spray this wall face in the aforementioned hot switch room, carry out heat exchange with aforementioned heater element, and be phase-changed into the steam-like molecule and pass through aforementioned steam-like molecular channel, be condensed into drop and be back in the aforementioned container.
2. ultrasonic atomization heat radiation/cooling device as claimed in claim 1, it is characterized in that, more comprise a drop molecule recovery approach, be used for collecting in the aforementioned hot switch room the not drop molecule of phase transformation, it has one second inlet and one second outlet, the drop that this second inlet is communicated in the 3rd wall of aforementioned hot switch room divides subexit, and this second outlet is communicated in the place, one second right position of aforementioned container.
3. ultrasonic atomization heat radiation/cooling device as claimed in claim 1, it is characterized in that, above-mentioned cooling mechanism comprises a fan and multi-disc radiating fin, and aforementioned steam-like molecular channel one side is located at by wherein aforementioned fan and aforementioned radiating fin is incorporated into outside, aforementioned steam-like molecular channel.
4. ultrasonic atomization heat radiation/cooling device as claimed in claim 1 is characterized in that, more comprises a thermal interfacial material, is located between this wall face and this heater element of aforementioned hot switch room.
5. ultrasonic atomization heat radiation/cooling device as claimed in claim 1 is characterized in that, above-mentioned drop molecular channel and steam-like molecular channel are the pliability pipe fitting.
6. ultrasonic atomization heat radiation/cooling device as claimed in claim 2 is characterized in that, above-mentioned drop molecule recovery approach is the pliability pipe fitting.
7. ultrasonic atomization heat radiation/cooling device as claimed in claim 1 is characterized in that, above-mentioned ultrasonic oscillation device comprises a piezoelectricity oscillator.
8. ultrasonic atomization heat radiation/cooling device as claimed in claim 7 is characterized in that, above-mentioned ultrasonic oscillation device comprises a plurality of cantilever type concussion.
9. ultrasonic atomization heat radiation/cooling device as claimed in claim 1 is characterized in that, above-mentioned ultrasonic oscillation device more comprises a piezoelectricity oscillator temperature feedback device with control drop molecular size.
10. ultrasonic atomization heat radiation/cooling device as claimed in claim 1 is characterized in that, above-mentioned drop molecular channel entrance area more comprises a pump.
11. ultrasonic atomization heat radiation/cooling device as claimed in claim 1 is characterized in that, above-mentioned internal tank shape is selected from circle or rectangle.
12. ultrasonic atomization heat radiation/cooling device as claimed in claim 1 is characterized in that, above-mentioned nozzle mouth type be selected from following any one: nozzle shape, honeycomb circle hole shape or duckbill.
13. ultrasonic atomization heat radiation/cooling device as claimed in claim 2 is characterized in that, above-mentioned drop molecule recovery approach inside is filled with porous material.
14. ultrasonic atomization heat radiation/cooling device as claimed in claim 1 is characterized in that, the inwall of above-mentioned steam-like molecular channel after in conjunction with cooling mechanism drapes over one's shoulders with the nano powder material.
15. ultrasonic atomization heat radiation/cooling device as claimed in claim 1 is characterized in that, above-mentioned steam-like molecular channel has capillary structure in conjunction with the inwall of cooling mechanism rear end.
16. ultrasonic atomization heat radiation/cooling device as claimed in claim 1 is characterized in that, above-mentioned working fluid be selected from following any one: water, methyl alcohol, ethanol, refrigerant or dielectric fluid.
17. a ultrasonic atomization heat radiation/cooling device, it comprises:
One container is used for the splendid attire hydraulic fluid, and this container this hydraulic fluid liquid level top relatively is provided with an opening;
One ultrasonic oscillation device is positioned in the hydraulic fluid of aforementioned container, is used for making this hydraulic fluid to produce the drop molecule;
One heat-exchanging chamber, this heat-exchanging chamber include first wall, second wall and the 3rd wall, and this second wall is with respect to the 3rd wall; Wherein a side of relative this first wall of this heat-exchanging chamber directly is contacted with a heater element, and this first wall is provided with drop molecule inlet, and this second wall is provided with a steam-like and divides subexit;
One drop molecular channel has a feeder connection and a channel outlet, and this feeder connection is communicated in this opening of aforementioned container, and this channel outlet is provided with this drop molecule inlet that a nozzle passes this first wall of aforementioned hot switch room;
One steam-like molecular channel has one first inlet and one first outlet, and this steam-like that this first inlet is communicated in this second wall of aforementioned hot switch room divides subexit, and this first outlet is communicated in the place, one first right position of this container; And
One cooling mechanism is incorporated into aforementioned steam-like molecular channel;
The drop molecule that produces in the wherein aforementioned container is by aforementioned drop molecular channel, via its aforementioned nozzles spray on aforementioned heater element, carry out heat exchange with aforementioned heater element, and be phase-changed into the steam-like molecule and pass through aforementioned steam-like molecular channel, be condensed into drop and be back in the aforementioned container.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200410104165XA CN100353537C (en) | 2004-12-30 | 2004-12-30 | Heat elimination / cooling set of ultrasonic spray |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200410104165XA CN100353537C (en) | 2004-12-30 | 2004-12-30 | Heat elimination / cooling set of ultrasonic spray |
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| Publication Number | Publication Date |
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| CN1797755A CN1797755A (en) | 2006-07-05 |
| CN100353537C true CN100353537C (en) | 2007-12-05 |
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| CNB200410104165XA Expired - Fee Related CN100353537C (en) | 2004-12-30 | 2004-12-30 | Heat elimination / cooling set of ultrasonic spray |
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Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101580794B (en) * | 2008-05-14 | 2012-05-30 | 中国石油化工股份有限公司 | Biomass fermentation-separation coupling device and ethanol preparation method |
| CN102051329B (en) * | 2009-10-27 | 2013-05-01 | 中国石油化工股份有限公司 | Biomass ferment-separation coupling device and method for preparing ethanol |
| US20110303403A1 (en) * | 2010-06-11 | 2011-12-15 | International Business Machines Corporation | Flexible Heat Exchanger |
| CN102029551A (en) * | 2010-11-18 | 2011-04-27 | 长沙理工大学 | Lubricating and cooling method for cutting process and device thereof |
| CN102506598A (en) * | 2011-11-01 | 2012-06-20 | 浙江建设职业技术学院 | Gravity-assisted loop heat pipe with ultrasonic vibration atomizing device |
| CN104174835B (en) * | 2014-06-25 | 2016-02-24 | 华南理工大学 | A kind of method and device thereof improving fluid and mold hot exchange efficiency |
| CN104851857B (en) * | 2015-04-28 | 2017-06-27 | 西安交通大学 | A kind of chip-cooling system |
| CN108093601A (en) * | 2016-11-22 | 2018-05-29 | 英业达科技有限公司 | Radiator and apply its thin client |
| JP6771407B2 (en) * | 2017-03-07 | 2020-10-21 | 株式会社フェザーグラス | Heat removal method and heat removal system |
| CN110911367B (en) * | 2019-12-06 | 2021-09-07 | 西安交通大学 | Electronic chip radiator with liquid supplement in vertical direction based on thin film evaporation and heat radiation method |
| CN112191433B (en) * | 2020-10-15 | 2022-10-11 | 深圳市合一精密泵业科技有限公司 | Atomizing nozzle and atomizing hand cleaning and disinfecting device |
| CN117482340B (en) * | 2023-12-29 | 2024-03-01 | 南方医科大学南方医院 | Ultrasonic atomizer |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06318656A (en) * | 1993-05-06 | 1994-11-15 | Hitachi Ltd | Cooling apparatus for integrated circuit element |
| JPH10185377A (en) * | 1996-12-27 | 1998-07-14 | Tokyo Gas Co Ltd | Ice making device |
| US6247525B1 (en) * | 1997-03-20 | 2001-06-19 | Georgia Tech Research Corporation | Vibration induced atomizers |
| JP2003148146A (en) * | 2001-11-06 | 2003-05-21 | Nikkari Co Ltd | Purifying system of water-cooled engine cooling system |
-
2004
- 2004-12-30 CN CNB200410104165XA patent/CN100353537C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06318656A (en) * | 1993-05-06 | 1994-11-15 | Hitachi Ltd | Cooling apparatus for integrated circuit element |
| JPH10185377A (en) * | 1996-12-27 | 1998-07-14 | Tokyo Gas Co Ltd | Ice making device |
| US6247525B1 (en) * | 1997-03-20 | 2001-06-19 | Georgia Tech Research Corporation | Vibration induced atomizers |
| JP2003148146A (en) * | 2001-11-06 | 2003-05-21 | Nikkari Co Ltd | Purifying system of water-cooled engine cooling system |
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| CN1797755A (en) | 2006-07-05 |
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