CN110557924A - Cold plate and refrigerating system with same - Google Patents
Cold plate and refrigerating system with same Download PDFInfo
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- CN110557924A CN110557924A CN201810560311.1A CN201810560311A CN110557924A CN 110557924 A CN110557924 A CN 110557924A CN 201810560311 A CN201810560311 A CN 201810560311A CN 110557924 A CN110557924 A CN 110557924A
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- 239000003507 refrigerant Substances 0.000 claims abstract description 48
- 238000001704 evaporation Methods 0.000 claims abstract description 31
- 230000008020 evaporation Effects 0.000 claims abstract description 30
- 239000007788 liquid Substances 0.000 claims abstract description 30
- 238000005057 refrigeration Methods 0.000 claims abstract description 19
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- 238000003860 storage Methods 0.000 claims abstract description 15
- 239000007921 spray Substances 0.000 claims abstract description 5
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- 238000005219 brazing Methods 0.000 claims description 7
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- 238000005507 spraying Methods 0.000 claims description 4
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- 238000001816 cooling Methods 0.000 description 17
- 239000002826 coolant Substances 0.000 description 13
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- 239000007787 solid Substances 0.000 description 11
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- 238000010521 absorption reaction Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
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- 238000003825 pressing Methods 0.000 description 4
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- 230000017525 heat dissipation Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
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- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
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- 238000001259 photo etching Methods 0.000 description 2
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- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a cold plate and a refrigeration system. The cold plate comprises an inlet pipe, an outlet pipe and a multi-layer entity formed by combining the plates based on the multi-layer thin plates, wherein the multi-layer entity sequentially comprises at least 1 upper cover plate sheet, at least 1 upper chamber plate sheet, at least 1 middle plate sheet, at least 1 lower chamber plate sheet and at least 1 heat conduction plate sheet from top to bottom. Wherein the upper chamber plate forms a hollow flow storage chamber, the intermediate plate forms a slender throttling channel, and the lower chamber plate forms a hollow evaporation chamber. The refrigeration system comprises the cold plate, a compressor, a condenser, a condensing fan, a connecting pipeline, a refrigerant, a clamping device and the like. When the compressor works, high-pressure liquid refrigerant enters the liquid storage chamber through the inlet pipe, is throttled and depressurized through the throttling channel, generates spray jet in the evaporation chamber, impacts the heat-conducting plate sheet and takes away heat of the heating element contacted with the lower surface of the heat-conducting plate sheet. The invention has compact structure and high heat flux density, and can cool the heating element below the ambient temperature.
Description
Technical Field
The invention provides a cold plate and a vapor compression refrigeration system based on the same, belonging to the field of heat transfer and refrigeration.
background
The cold plate is a heat exchanger with only one fluid participating in heat exchange, and is generally used in the field of heat dissipation of electronic equipment. The cold plate is usually made of metal with better heat conduction, a cooling medium is communicated inside the cold plate, the surface of the cold plate is in direct contact with the surface of the heating element during use, the heating element transfers heat to the cold plate in a heat conduction mode, the cold plate transfers the heat to the cooling medium inside the cold plate in a convection mode, the temperature of the cooling medium after heat absorption is raised and flows out of the cold plate, the cooling medium is cooled outside the cold plate and then returns to the cold plate for recycling, so that the heat generated by the heating element is continuously taken away, and the temperature of the surface of the heating element is maintained within a certain range.
The existing cold plate is usually a single-phase cold plate, that is, a single-phase cooling medium, such as liquid water, circulates inside the cold plate, and at this time, the amount of heat taken away by the cold plate is equal to the change of sensible heat of a single-phase fluid, that is, the amount of heat absorbed during the temperature rise of the single-phase cooling medium. The single-phase cold plate has limited cooling capacity due to the restriction of the factors such as small specific heat of the single-phase fluid, limited temperature rise range and the like, and is difficult to adapt to the situation of high heat flow density of a heating element, so improvement is needed.
Evaporative phase change heat absorption is an efficient heat transfer means, for example, water evaporates with an absorption capacity 58 times that of liquid water with a temperature rise of 10 ℃. Therefore, if the cooling medium in the single-phase cold plate is changed into the phase-change medium, the heat-taking mode is changed from liquid temperature rise heat absorption into evaporation heat absorption of two-phase fluid, and the heat exchange capacity of the cold plate can be greatly improved.
The jet technology is the combination of evaporation phase change and a cooling circulation system, the technology is that a liquid cooling medium is pressurized by a high-pressure pump, then the cooling medium is atomized by a micro-nozzle and sprayed to a cooling object, and the cooling medium is vaporized (evaporation phase change) after being heated to take away heat. The heat absorption capacity of jet cooling is much larger than that of liquid convection cooling and also larger than that of conventional phase-change evaporative cooling. However, the existing jet cooling technology can only maintain the temperature of the cooled element above the ambient temperature, and is not good for some occasions that the temperature of the cooled element needs to be lower than the ambient temperature. In addition, the higher the pressure in front of the micro-nozzle is, the better the atomization effect of the jet flow is, the existing jet flow cooling schemes all use a pump to pressurize the cooling medium, and the pressurizing capacity of the pump is very limited compared with that of a compressor, so that the further improvement of the jet flow cooling effect is limited.
Disclosure of Invention
The invention provides a cold plate which has high heat flow density and can finish throttling, spraying and evaporating of a refrigerant in a single device, wherein the cold plate adopts the refrigerant to perform two-phase evaporation heat exchange, has higher efficiency compared with a cold plate which adopts a single-phase fluid to perform heat exchange, has extremely compact structure, is easy to realize miniaturization and microminiaturization, and can be widely applied to the field of heat dissipation of high-power optoelectronic elements.
The invention comprehensively utilizes the layered entity manufacturing technology (the inter-plate combination technology based on multilayer flaky materials), the jet cooling technology and the refrigeration technology.
The layered solid fabrication technique is relative to conventional solid subtractive fabrication techniques. It is difficult to manufacture a hollow flow passage in a solid material by material reduction processing, and a part with a hollow inner part can be manufactured by adopting a layered solid manufacturing technology, and a complicated flow passage design can be realized. The layered solid manufacturing technology is that a plurality of layers of thin plates or foil materials are adopted, each thin plate is respectively designed and processed (usually by photoetching, etching or mechanical processing) into different hollowed-out shapes according to the required fluid shape, then the hollowed-out thin plates are stacked together in a certain sequence, and then the plurality of layers of thin plates are tightly connected together by utilizing a certain inter-plate combination method, so that the multilayer solid with the internal cavity as the required geometric flow channel is formed.
A typical method of bonding the plates is vacuum diffusion welding. Vacuum diffusion welding is to put the multi-layer plates to be welded between two press plates under vacuum condition, apply high pressure on the press plates, heat the plates to a temperature lower than the melting temperature of the material, and keep the temperature for a certain time, and weld the workpieces together by the diffusion of molecules or atoms on the surfaces of the workpieces in contact with each other. The advantage of vacuum diffusion welding is that no brazing solder or flux is needed, the two plates become a solid body after vacuum diffusion welding, and the contact place of the two plates has no obvious material interface and no oxidation phenomenon. The vacuum diffusion welding can realize the inter-plate combination between the plates made of the same material, and also can realize the inter-plate combination between the plates made of different materials, such as the inter-plate combination between a metal sheet and a ceramic sheet.
The method comprises the following concrete implementation steps:
Firstly, 5 thin plates with different surface shapes are constructed by photoetching, etching or machining and the like, and the 5 plates are respectively: the heat exchanger comprises an upper cover plate, an upper chamber plate, an intermediate plate, a lower chamber plate and a heat-conducting plate. Wherein, the upper chamber plate and the lower chamber plate are provided with large-area hollowed-out areas, the middle plate is provided with a plurality of small holes with small diameters, and the upper cover plate and the heat conducting plate are not provided with any hollowed-out.
Then 5 kinds of plates are stacked together in sequence, and the plates with the same shape can be stacked in multiple layers, wherein the uppermost layer is an upper cover plate, the lowermost layer is a heat-conducting plate, and an upper chamber plate, an intermediate plate and a lower chamber plate are arranged between the upper cover plate and the heat-conducting plate from top to bottom in sequence.
And combining the laminated plate groups between plates. For example, when the bonding mode between the plates adopts vacuum diffusion welding, the stacked plates are placed between an upper pressing plate and a lower pressing plate of a vacuum diffusion welding furnace, air in the furnace is pumped out, the temperature is raised to a high temperature, and high pressure is applied between the upper pressing plate and the lower pressing plate, so that molecules or atoms which are contacted with each other by the layers of the plates are mutually bonded through diffusion under the action of high temperature and high pressure, and all the plates are bonded into a hollow multi-layer heat exchanger entity. At the moment, the large-area hollow-out area on the upper chamber plates forms a liquid storage chamber of the cold plate, the small holes with small diameters on the middle chamber plates form a slender throttling channel, and the large-area hollow-out area in the middle of the lower chamber plates forms an evaporation chamber of the cold plate.
And finally, constructing an inlet channel and an outlet channel of the refrigerant on the multilayer entity, and installing an inlet pipe and an outlet pipe, thereby finally forming the cold plate.
Still further, the present invention provides a vapor compression refrigeration system including the cold plate. The vapor compression refrigeration system is formed by adding a compressor, a condenser, a connecting pipeline, a condensing fan and other components on the basis of the cold plate and filling proper refrigerant. When the compressor works, the refrigerant gas is compressed, the pressure is increased, the high-pressure gaseous refrigerant is condensed into high-pressure liquid refrigerant in the condenser, the high-pressure gaseous refrigerant enters the liquid storage chamber of the cold plate through the inlet pipe and then flows into the evaporation chamber of the cold plate through the throttling channel on the intermediate plate, the flow speed is increased when the high-pressure liquid refrigerant passes through the elongated throttling channel, and the pressure is reduced, so that the refrigerant is atomized when flowing out of the elongated throttling channel, and a high-speed jet flow is formed in the evaporation chamber. The mist jet impacts the upper surface of the heat-conducting plate sheet at the bottom of the cold plate, and violent evaporation phase change heat exchange is generated on the upper surface of the heat-conducting plate sheet, so that the heat of the heating element contacted with the lower surface of the heat-conducting plate sheet can be absorbed in a large amount. Because the jet heat exchange has high heat exchange coefficient, the heating element with high heat flow density can be effectively cooled. The refrigerant after absorbing heat is evaporated into gas, flows out of the outlet pipe of the cold plate and returns to the suction port of the compressor, and is compressed into high-pressure refrigerant gas again in the compressor. The operation is repeated in a circulating way.
The invention has the following beneficial effects:
Firstly, in the invention, because the heat-carrying way of the cold plate does not depend on the temperature rise of a single-phase fluid, but depends on the two-phase evaporation of a refrigerant, and the latent heat of evaporation of the two-phase fluid is far greater than the enthalpy difference generated by the temperature change of the single-phase fluid, the cold plate has much greater heat exchange capacity than the conventional single-phase cold plate.
Secondly, because the cold plate of the invention adopts refrigerant rather than single-phase fluid as cooling medium, the saturation temperature after the injection evaporation can be lower than the ambient temperature, and the temperature of the cooled element can be kept below the ambient temperature, namely, the cold plate not only has heat dissipation capacity, but also has refrigeration effect, which is not achieved by the conventional cold plate.
And the throttling small holes on the intermediate plate of the cold plate not only play a role of throttling the refrigerant, but also play a role similar to a micro-nozzle, the functions of the throttling small holes and the micro-nozzle are combined into a whole, the structure is more compact, and simultaneously, the number of the throttling small holes is large, so that the total surface area of the refrigerant after throttling and atomizing is very large, and the surface evaporation heat exchange capacity is further enhanced.
And fourthly, different from the circulating element and the pressurizing element which adopt a pump as a cooling medium in the conventional injection cooling technology and the single-phase cold plate technology, the pressurizing element in the invention is a compressor. Because the pressure boosting capacity of the compressor is much larger than that of the pump, larger pressure difference can be generated in front of and behind a throttling small hole of the system, the larger the pressure difference is, the larger the initial kinetic energy of jet flow is, and the better the heat exchange effect of jet flow impact is.
And because a layered entity manufacturing technology is adopted, liquid storage, throttling (jetting), evaporation and heat conduction are completed in the same entity part, the cold plate and the refrigerating system have very compact structures, miniaturization and microminiaturization are easy to realize, and the cooling device is particularly suitable for cooling heating devices with small volume and large power density of a microprocessor and a laser.
Drawings
FIG. 1 is an external view of an embodiment of the cold plate.
Fig. 2 is a schematic view (exploded view) of the assembly relationship or stacking sequence of the sheets of the multi-layer entity that make up the cold plate.
Fig. 3 is a schematic view of the shape of the uppermost upper lid sheet of the cold plate.
Fig. 4 is a schematic view of the shape of the upper chamber plate of the cold plate below the upper cover plate and above the intermediate plate.
FIG. 5 is a schematic view of the shape of the intermediate plate of the cold plate below the upper chamber plate and above the lower chamber plate.
fig. 6 is a schematic view of the shape of the lower chamber plate of the cold plate below the intermediate plate and above the thermally conductive plate.
Fig. 7 is a schematic view of the shape of the lowest layer of the cold plate.
Fig. 8 is a schematic view (sectional view) of the internal structure of the cold plate.
Fig. 9 is a flow diagram of a vapor compression refrigeration system including the cold plate.
Detailed Description
In a first aspect embodiment of the invention, a cold plate is provided, as shown in FIG. 1 ~ FIG. 8.
As shown in fig. 1, is the external appearance of the cold plate 100. The cold plate 100 is a multi-layer solid 101 formed by stacking 5 plates (typically, metal sheets with a thickness of less than 1 mm) with different hollow shapes in a certain order and number, and then bonding the plates together, and then mounting an inlet pipe 6 and an outlet pipe 7 on the multi-layer solid 101.
As shown in fig. 2, the 5 sheets of the cold plate and the fluid inlet and outlet pipes are schematically shown in the stacking sequence and the position relationship of the sheets and the assembly relationship with the fluid inlet and outlet connectors before being combined into a whole (explosion diagram).
the 5 plates constituting the multi-layer entity 101 are an upper cover plate 1, an upper chamber plate 2, an intermediate plate 3, a lower chamber plate 4 and a heat conducting plate 5, which are respectively shown in fig. 3 ~ and fig. 7, each plate can be repeatedly arranged in the multi-layer entity 101, namely, the number of each plate is at least 1, but one type of plate can only be continuously arranged with the same type of plate, and one type of plate can not be staggered with other types of plates.
As shown in fig. 3 and 2, 1 or several cover sheets 1 are positioned at the uppermost side of the cold plate 100. The upper cover plate 1 is a complete thin plate without any hollow part thereon, and the upper cover plate 1 plays a role of sealing the liquid storage chamber 2m below the upper cover plate.
As shown in fig. 4 and 2, 1 or several upper chamber sheets 2 are located below the upper cover sheet 1 and above the intermediate sheet 3. The upper chamber plate 2 is provided with a large-area first hollow-out area 2a, and when the upper chamber plates 2 are overlapped together, the first hollow-out area 2a on each upper chamber plate is combined to form a hollow liquid storage chamber 2m for storing a liquid high-pressure refrigerant.
As shown in fig. 5 and 2, 1 or several intermediate sheets 3 are located below the upper chamber sheet 2 and above the lower chamber sheet 4. The intermediate plate 3 plays a role of separating the liquid storage chamber 2m and the evaporation chamber 4m, and plays a role of throttling the refrigerant and a function of a micro-nozzle. A plurality of small throttling small holes 3a with small diameters are evenly distributed on the middle plate 3. When a plurality of intermediate plates 3 are overlapped, the throttling small holes 3a on each intermediate plate 3 are overlapped together to form a slender throttling channel 3h (see fig. 8). The greater the number of intermediate plates 3, the longer the length of the throttle channel 3h, the more pronounced the throttling effect. The number of the intermediate plates 3 and the diameter of the throttling small hole 3a are changed, so that the pressure difference of the refrigerant flowing through the intermediate plates 3 can be adjusted, and the jet length and the diffusion angle of jet flow can be adjusted; by varying the number of orifices 3a, the area covered by each jet can be adjusted.
As shown in fig. 6 and 2, 1 or several lower chamber plates 4 are located below the intermediate plate 3 and above the heat conducting plate 5. A large-area second hollow-out area 4a is processed on the lower chamber plate 4, and the second hollow-out area 4a is completely visible for the throttling small hole 3a on the upper layer. The lower chamber plates 4 are overlapped to form an evaporation chamber 4m of the cold plate 100, and the evaporation chamber 4m is used for providing a space in which the refrigerant is evaporated.
as shown in fig. 7 and 2, 1 or several sheets 5 of the heat conducting sheet are located at the lowermost part of the cold plate 100. The heat-conducting plate 5 is a complete thin plate without any hollowed-out portions thereon. The heat conducting plate 5 plays a role of sealing the evaporation chamber 4m above the heat conducting plate and is used as a heat exchange surface for spray cooling; the lower surface of the heat conductive sheet 5 is a flat surface as a surface directly contacting the surface of the cooled member. Preferably, the heat conducting plate 5 has only 1 layer to reduce the heat conducting resistance.
the plate-to-plate bonding method for constructing the multi-layer plate into a multi-layer solid 101 includes, but is not limited to, vacuum hot pressing, vacuum diffusion welding, vacuum brazing, resistance welding, etc. After the multiple layers of plates are connected by the inter-plate combination method, the plates are physically inseparable and integrated, and the plates are completely sealed and can bear certain pressure resistance without leakage. It should be noted that the multi-layer plate is a single entity after the bonding between the plates is completed, and no obvious material interface exists between the layers, and the multi-layer plate is referred to as a "multi-layer entity" only to help understand the technical scheme of the invention.
After the sheets are combined into a multi-layer solid body 101, a small hole is drilled in the side walls of the liquid storage chamber 2m and the evaporation chamber 4m, and an inlet pipe 6 and an outlet pipe 7 are installed, respectively, so that the inlet pipe 6 communicates with the inside of the liquid storage chamber 2m and the outlet pipe 7 communicates with the inside of the evaporation chamber 4 m. The inlet pipe 6 and the outlet pipe 7 are tubular members made of the same or similar material (typically, a metal material such as stainless steel) as the multi-layer solid body 101, and are installed by methods including, but not limited to, arc welding, laser welding, ultrasonic welding, friction welding, brazing, and the like.
Fig. 8 is a schematic view (cross-sectional view) of the internal structure of the cold plate, which is useful for understanding the working principle of the cold plate of the present invention. High-pressure refrigerant enters a liquid storage chamber 2m formed by the multilayer upper chamber plate 2 from an inlet pipe 6 and then flows into an evaporation chamber 4m through a throttling channel 3h formed by throttling small holes 3a in the multilayer middle plate 3. When high pressure refrigerant flows through throttle channel 3h, because the throttle step-down effect of long and thin runner, make refrigerant pressure reduce rapidly, the velocity of flow increases rapidly simultaneously, when flowing out throttle channel 3h, the pressure energy of refrigerant turns into kinetic energy, the refrigerant atomizes and forms the efflux, this atomizing efflux sprays the upper surface to heat conduction plate 5 downwards, produce violent convection current and evaporation heat transfer at the upper surface of heat-conducting plate 5, have very big coefficient of heat transfer, can take away a large amount of heats of conducting the upper surface of heat conduction plate 5 via the lower surface of heat conduction plate 5. The refrigerant absorbs heat and evaporates to become low-temperature and low-pressure refrigerant gas, and the refrigerant gas flows out of the cold plate 100 through the outlet pipe 7.
In a second embodiment of the present invention, a vapor compression refrigeration system 1000 for performing surface contact type cooling on a high-power heating element is provided, and is shown in fig. 9. The vapor compression refrigeration system 1000 includes the cold plate 100, the compressor 200, the condenser 300, the condensing fan 400, the connecting line 500, and the clamping device 700 for fixing the cold plate 100 to the surface of the heat generating element 600. The surface of the heat generating element 600 is in close contact with the lower surface of the cold plate 100, and the clamping device 700 clamps the cold plate 100 and the heat generating element 600 to reduce the contact thermal resistance between the cold plate 100 and the upper surface of the heat generating element 600. A refrigerant is charged into a pipe of the vapor compression refrigeration system. The heating element 600 includes, but is not limited to, a Central Processing Unit (CPU), a microprocessor unit (MPU), a Graphic Processing Unit (GPU), an Insulated Gate Bipolar Transistor (IGBT), a semiconductor cooling plate, a laser, and the like.
According to the second aspect of the embodiment, a vapor compression refrigeration system is formed only by connecting the compressor 200 and the condenser 300 to the outside of the cold plate 100 and filling the cold plate with a suitable refrigerant. The connection method comprises the following steps: the outlet of the condenser 300 is connected to the inlet pipe 6 of the cold plate 100, the suction port of the compressor 200 is connected to the outlet pipe 7 of the cold plate 100, and the discharge port of the compressor 200 is connected to the inlet of the condenser 300. The high-pressure gaseous refrigerant discharged from the compressor 200 enters the condenser 300, where it is condensed to release heat, and the released heat is taken away by the air forced to flow by the condensing fan 400. The high-pressure gaseous refrigerant is condensed in the condenser 300 and then changed into a high-pressure liquid refrigerant, and the high-pressure liquid refrigerant enters the liquid storage chamber 2m inside the cold plate 100 through the inlet pipe 6. When the liquid refrigerant in the liquid storage chamber 2m enters the evaporation chamber 4m through the micro throttling channel 3h on the intermediate plate 3, the pressure is reduced, the volume is expanded, the liquid refrigerant is changed into a low-temperature and low-pressure gas-liquid mixture, the gas-liquid mixture is sprayed downwards and impacts the upper surface of the heat conducting plate 5 positioned at the lowest layer of the cold plate 100. The jet flow generates a violent heat exchange on the upper surface of the heat conductive plate 5, absorbing heat generated from the heat generating element 600 and transferred to the upper surface of the heat conductive plate 5 through the lower surface of the heat conductive plate 5, thereby maintaining the temperature of the heat generating element 600 in a lower temperature range. The refrigerant after the evaporation is completely changed into a gaseous state, and flows out of the cold plate 100 through the outlet pipe 7 and returns to the suction port of the compressor 200. The refrigerant gas is compressed in the compressor 200 and then turned into a high-pressure refrigerant gas again, thereby forming a complete vapor compression refrigeration cycle. When the refrigerant is evaporated in the evaporation chamber 4m, the saturation temperature may be lower than the ambient temperature, so that the heating element may be cooled below the ambient temperature, thereby generating a cooling effect.
According to a simplified embodiment of the invention, the cold plate 100 can also be provided without the inlet and outlet tubes 6, 7, but directly in the form of a multilayer body 101.
According to an alternative embodiment of the invention, the cold plate 100 can also be provided with a plurality of inlet tubes 6, and a plurality of outlet tubes 7.
In the embodiment of the present invention, the machining method for hollowing out the plate includes, but is not limited to, etching, photolithography, machining, laser cutting, and the like.
In the embodiment of the present invention, the upper cover plate 1, the upper chamber plate 2, the middle plate 3, the lower chamber plate 4 and the heat conducting plate 5 generally have the same material thickness and the same contour (in the embodiment, the contour is rectangular) to achieve standardization and cost reduction in the production process of the product as much as possible, but the present invention is not limited thereto, and the five plates may also have different material thicknesses and different contours.
The method for forming the tight bonding between the plates of the multi-layer plate adopted by the invention comprises but is not limited to methods such as vacuum hot pressing, vacuum diffusion welding, vacuum brazing, resistance welding and the like, and preferably adopts a vacuum diffusion welding method, and the welding method has the advantage of no need of brazing flux, so the material is not limited to metal plates or alloy plates such as stainless steel, titanium alloy, aluminum alloy and the like, and can also be non-metal plates such as ceramic and the like. It is within the scope of the present invention to provide a similar cold plate made of multiple sheet materials that can be welded together by means of vacuum diffusion welding or vacuum brazing.
In the description of the present invention, terms indicating orientation or positional relationship such as "upper", "lower", "above", "below", "side", "top", "bottom", etc. are relative to each other based on the orientation or positional relationship shown in the drawings, and are only simplified for the convenience of describing the present invention, and do not indicate or imply that the structure or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and do not limit the scope of the present invention in any way.
Claims (12)
1. A cold plate which can complete throttling, spray jet and phase change evaporation heat exchange of refrigerant in a single entity, and can cool a heating element contacted with the cold plate in a heat conduction mode to reduce the temperature of the cooled element to be below the ambient temperature, and is characterized by comprising an inlet pipe, an outlet pipe and a multi-layer entity constructed based on connection among plates of a plurality of layers of thin plates, wherein the multi-layer entity sequentially comprises the following 5 different types of plates from top to bottom:
1 or more upper cover plate pieces;
1 or more upper chamber plates;
1 or more intermediate sheets;
1 or more lower chamber plates;
1 or more heat-conducting plate sheets,
High-pressure liquid refrigerant enters the multilayer entity from the inlet pipe, generates spray jet after throttling in the multilayer entity, impacts the upper surface of the heat-conducting plate sheet at the bottommost layer of the multilayer entity, absorbs heat conducted to the upper surface of the heat-conducting plate sheet by the heating element contacted with the lower surface of the heat-conducting plate sheet, evaporates, becomes low-temperature and low-pressure gaseous refrigerant, and finally flows out of the multilayer entity from the outlet pipe.
2. The upper lid panel according to claim 1, wherein: the upper cover plate is positioned at the uppermost part of the multilayer entity, and the upper cover plate is a complete thin plate without any hollow part.
3. An upper chamber plate according to claim 1, wherein: the upper chamber plate is positioned below the upper cover plate and above the middle plate in the multilayer entity; a first hollow-out area is processed on the upper chamber plate; the first hollow-out areas on the multilayer upper chamber plate are overlapped together to form a hollow liquid storage chamber.
4. The intermediate plate according to claim 1, characterized in that: the intermediate plate is positioned below the upper chamber plate and above the lower chamber plate in the multilayer entity; a plurality of small throttling small holes with small diameters are uniformly distributed on the middle plate; the throttling small holes on the multiple layers of intermediate plates are overlapped to form an elongated throttling channel.
5. The lower chamber sheet of claim 1, wherein: the lower chamber plate is positioned below the middle plate and above the heat conducting plate in the multi-layer entity; a second hollow-out area is processed on the lower chamber plate, is positioned below the throttling small hole of the middle plate and is completely visible to the throttling small hole; the multiple lower chamber plates are stacked together to form a hollow evaporation chamber.
6. a heat conducting plate sheet according to claim 1, wherein: the heat conducting plate sheet is positioned at the lowest part of the multilayer entity; the heat conducting plate is a complete thin plate without any hollow part, the upper surface of the heat conducting plate is used as a spraying surface of the spraying jet flow, and the lower surface of the heat conducting plate is used as a surface which is directly contacted with the cooled element.
7. 5 different types of panels according to claim 6, according to claim 1 ~, wherein each type of panel is repeated in the multilayer entity, i.e. the number of each type of panel is at least 1, and when more than 1 panel of the same type is present, they must be arranged consecutively, and a panel of one type cannot be staggered with another.
8. The method for bonding the multiple thin plates between the plates according to claim 1, including but not limited to vacuum diffusion welding, vacuum hot pressing, vacuum brazing, resistance welding, etc., wherein the multiple thin plates are connected by the bonding method between the plates, so that the plates become an integral body physically inseparable, and a complete seal is achieved between the surfaces, and the multiple thin plates can bear a certain pressure without leakage.
9. The inlet tube of claim 1, wherein: it is a tubular part; which vertically penetrates through the side wall formed by overlapping the multiple layers of upper chamber plates and is communicated with the interior of the hollow liquid storage chamber formed by overlapping the multiple layers of upper chamber plates.
10. The outlet tube of claim 1, wherein: it is a tubular part; which vertically penetrates through the side wall formed by overlapping the multiple layers of lower chamber plates and is communicated with the interior of the hollow evaporation chamber formed by overlapping the multiple layers of lower chamber plates.
11. A vapor compression refrigeration system comprising the cold plate of claim 1, further comprising a compressor, a condenser, a condensing fan, a connecting line, a refrigerant, and a clamping device for bringing a surface of the cold plate and a surface of a heat generating element into close contact.
12. The vapor compression refrigeration system of claim 11, wherein: the suction port of the compressor is connected with the outlet pipe of the cold plate through a connecting pipeline, the exhaust port of the compressor is connected with the inlet of the condenser through a connecting pipeline, the outlet of the condenser is connected with the inlet pipe of the cold plate through a connecting pipeline, the condensing fan is used for taking away the condensing heat released by the condenser, the refrigerant is filled in the vapor compression refrigeration system, the clamping device fixes the cold plate in the vapor compression refrigeration system on the surface of a heating element, and when the compressor and the condensing fan operate, the refrigerant is in the internal circulation of the cold plate and generates throttling, spraying jet flow and evaporation refrigeration effects, and the heat on the surface of the heating element contacted with the cold plate is taken away, so that the temperature on the surface of the heating element is maintained within a certain range.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810560311.1A CN110557924A (en) | 2018-06-03 | 2018-06-03 | Cold plate and refrigerating system with same |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810560311.1A CN110557924A (en) | 2018-06-03 | 2018-06-03 | Cold plate and refrigerating system with same |
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| CN110557924A true CN110557924A (en) | 2019-12-10 |
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| CN201810560311.1A Pending CN110557924A (en) | 2018-06-03 | 2018-06-03 | Cold plate and refrigerating system with same |
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| CN (1) | CN110557924A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110557923A (en) * | 2018-06-03 | 2019-12-10 | 武汉麦丘科技有限公司 | cold plate and refrigerating system with same |
| CN111146544A (en) * | 2019-12-30 | 2020-05-12 | 电子科技大学 | Efficient cooling structure for small high-power millimeter wave device |
| CN112404634A (en) * | 2020-10-27 | 2021-02-26 | 吴彦君 | Flip-chip LED chip welding protection architecture |
| CN113677161A (en) * | 2021-08-23 | 2021-11-19 | 北京无线电测量研究所 | Electronic device structure and contain its electron plug-in components |
| CN114554791A (en) * | 2022-01-26 | 2022-05-27 | 华南理工大学 | Air-assisted double-sided spray heat dissipation high-power blade server and control method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB489286A (en) * | 1937-01-22 | 1938-07-22 | Peerless Ice Machine Company | Improvements in or relating to refrigerant evaporators and method of operating said evaporators |
| CN101005745A (en) * | 2006-01-20 | 2007-07-25 | 刘胜 | Micro jet flow cooling system for electronic device |
| CN103415190A (en) * | 2013-08-20 | 2013-11-27 | 南京理工大学 | Abnormal channel array jet flow impact cold plate |
-
2018
- 2018-06-03 CN CN201810560311.1A patent/CN110557924A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB489286A (en) * | 1937-01-22 | 1938-07-22 | Peerless Ice Machine Company | Improvements in or relating to refrigerant evaporators and method of operating said evaporators |
| CN101005745A (en) * | 2006-01-20 | 2007-07-25 | 刘胜 | Micro jet flow cooling system for electronic device |
| CN103415190A (en) * | 2013-08-20 | 2013-11-27 | 南京理工大学 | Abnormal channel array jet flow impact cold plate |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110557923A (en) * | 2018-06-03 | 2019-12-10 | 武汉麦丘科技有限公司 | cold plate and refrigerating system with same |
| CN111146544A (en) * | 2019-12-30 | 2020-05-12 | 电子科技大学 | Efficient cooling structure for small high-power millimeter wave device |
| CN112404634A (en) * | 2020-10-27 | 2021-02-26 | 吴彦君 | Flip-chip LED chip welding protection architecture |
| CN113677161A (en) * | 2021-08-23 | 2021-11-19 | 北京无线电测量研究所 | Electronic device structure and contain its electron plug-in components |
| CN113677161B (en) * | 2021-08-23 | 2024-10-08 | 北京无线电测量研究所 | Electronic device structure and electronic plug-in unit containing same |
| CN114554791A (en) * | 2022-01-26 | 2022-05-27 | 华南理工大学 | Air-assisted double-sided spray heat dissipation high-power blade server and control method |
| CN114554791B (en) * | 2022-01-26 | 2022-10-25 | 华南理工大学 | Air-assisted double-sided spray heat dissipation high-power blade server and control method |
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