CN208523115U - Cold plate and refrigeration system with it - Google Patents
Cold plate and refrigeration system with it Download PDFInfo
- Publication number
- CN208523115U CN208523115U CN201820847456.5U CN201820847456U CN208523115U CN 208523115 U CN208523115 U CN 208523115U CN 201820847456 U CN201820847456 U CN 201820847456U CN 208523115 U CN208523115 U CN 208523115U
- Authority
- CN
- China
- Prior art keywords
- plate
- cold plate
- cold
- layer body
- thermally conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The utility model provides a kind of cold plate and a kind of refrigeration system.Cold plate include between inlet tube, outlet and plate based on multi-layered sheet in conjunction with and the multi-layer body that constitutes, multi-layer body successively includes at least 1 upper cover plate piece, at least 1 upper chamber plate, at least 1 intermediate plate, at least 1 lower room plate and at least 1 thermally conductive plate from top to bottom.Wherein upper chamber plate forms hollow storage flow chamber, and intermediate plate forms elongated throttling conduit, and lower room plate forms hollow vaporization chamber.Refrigeration system includes the cold plate, compressor, condenser, condenser fan, connecting line, refrigerant, clamping device etc..When compressor operating, high pressure liquid refrigerant enters fluid reservoir by inlet tube, by the conduit reducing pressure by regulating flow that throttles, spraying jet is generated in vaporization chamber, impacts thermally conductive plate, takes away the heat for the heater element being in contact with thermally conductive plate lower surface.The utility model is compact-sized, and heat flow density is big, and heater element can be cooled to environment temperature or less.
Description
Technical field
The utility model provides a kind of cold plate and the refrigeration system based on the cold plate, belongs to heat transfer and refrigerating field.
Background technique
Cold plate refers to that only a kind of fluid participates in the heat exchanger of heat exchange, is commonly used in electronic equipment dissipating heat field.Cold plate is logical
It is often made of thermally conductive preferable metal, passes to cooling medium inside it, cold plate surface and heater element surface are direct when use
Contact, after heater element transfers heat to cold plate by thermally conductive mode, heat is passed to it in the form of convection current again by cold plate
Internal cooling medium, the coolant temperature after heat absorption increase and flow out cold plate, and cooling medium is returned again after cooling down outside cold plate
It returns cold plate to be recycled, so that the heat that heater element generates continuously be taken away, maintains the temperature on heater element surface
In a certain range.
Existing cold plate is usually single-phase cold plate, i.e., cold plate internal circulation is single-phase cooling medium, such as liquid water etc.,
The heat that cold plate is taken away at this time is equal to the variation of monophasic fluid sensible heat, that is, absorbed in single-phase cooling medium temperature rise process
Heat.By monophasic fluid specific heat is small, limit of temperature rise is limited etc., factors are restricted, and the cooling capacity of single-phase cold plate is limited, it is difficult to suitable
The occasion for answering the heat flow density of heater element very big, therefore urgently improve.
Evaporative phase-change heat absorption is a kind of efficient heat transfer type, for example, the caloric receptivity of water evaporation is the liquid that temperature rise is 10 DEG C
58 times of body water caloric receptivity.So if the cooling medium in single-phase cold plate is changed to phase change medium, the mode of heat will be taken away
It is changed to the evaporation endothermic of two-phase fluid by liquid temperature rise heat absorption, the exchange capability of heat of cold plate can be substantially improved.
Fluidics is the combination of evaporative phase-change and cooling recirculation system, and this technology is by high-pressure pump by liquid cooled
Medium pressurization sprays to cooling object after then cooling medium is atomized by micro-nozzle, vaporization (evaporation phase after cooling medium is heated
Become) take away heat.The cooling caloric receptivity of jet stream is cooling much larger than liquid convection, evaporates cooling also greater than conventional phase transformation.But it is existing
Some Jet Coolings are typically only capable to the temperature of cooled element to maintain environment temperature or more, make in certain needs cold
But the temperature of element just seems unable to do what one wishes lower than the occasion of environment temperature.In addition, the pressure before micro-nozzle is higher, then jet stream
Atomizing effect is better, and existing jet stream cooling scheme is all the pressurization energy for being pressurized, and being pumped to cooling medium using pump
Power is very limited compared to for the boosting capability of compressor, to limit further increasing for jet stream cooling effect.
Summary of the invention
The utility model, which provides one kind, has high heat flux density, and throttling, the injection of refrigerant can be completed in single device
With the cold plate of evaporation, the cold plate carries out two-phase evaporation and heat-exchange using refrigerant, compared to what is exchanged heat using monophasic fluid
Cold plate is more efficient, and extremely compact, it is easy to accomplish miniaturization and micromation can be widely applied to high-power photoelectron member
Part field of radiating, to be cooled down to powerful heater element.
The specific implementation step of the utility model is:
First by the methods of photoetching, etching or machining, the thickness that 5 kinds of centres have certain shapes conduit is constructed
Very thin plate.Plate can be divided into upper cover plate, upper chamber plate, intermediate plate, lower room plate and thermally conductive plate by shape
Deng.
Then it by 5 kinds of different types of plates, is stacked together in order, wherein be topmost upper cover plate, it is bottom
It is thermally conductive plate, from upper cover plate to being successively upper chamber plate, intermediate plate, lower room plate from top to bottom thermally conductive plate.
When plate stacks, the plate of same type can repeat, i.e., each type of No. of plates is at least 1.
When the plate of same type be more than 1 when, they must continuous arrangement, certain type of plate cannot be with other types of plate
It is staggered.
Inlet hole and outlet opening are machined in upper cover plate on piece.The first vacancy section is machined on upper chamber plate and with first
Hollow hole, the first vacancy section are located at the lower section of the inlet hole of upper cover plate on piece, and the first vacancy section is complete to the inlet hole of layer thereon
Entirely as it can be seen that the first hollow hole is located at the lower section of the outlet opening of upper cover plate on piece and is aligned with outlet opening, on multilayer upper chamber plate
First vacancy section, which overlaps, constitutes hollow fluid reservoir.The diameter being much evenly distributed is machined in intermediate plate very
Small throttling pore and the second hollow hole, the second hollow hole are located at the lower section of the first hollow hole on upper chamber plate and engrave with first
The diameter of emptying aperture alignment, the diameter of the second hollow hole and the first hollow hole is identical, the throttling pore overlapping in multilayer intermediate plate
Elongated throttling conduit is constituted together.The second vacancy section is machined on lower room plate, the second vacancy section is located at intermediate plate
Below the throttling pore of piece and the second hollow hole, and it is fully visible to throttling pore and the second hollow hole, under multilayer on the plate of room
The second vacancy section overlap and constitute hollow vaporization chamber.Thermally conductive plate is one piece of complete thin plate, in thermally conductive plate
Upper no any hollow out, jeting surface of the upper surface of thermally conductive plate as spraying jet, the lower surface of thermally conductive plate as with
The surface that cooled element directly contacts.
Again the above-mentioned multilayer plate for folding sequence combine between plate, includes but is not limited to diffusion in vacuum in conjunction with method
Weldering, vacuum hotpressing, vacuum brazing, electric resistance welding etc..Multilayer plate utilizes combine method connection between the plate after, plate and plate it
Between physically become inseparable from, while hollowed out area on plate formed fluid reservoir, throttling conduit, vaporization chamber shape
Also it is fixed, to constitute a hollow multi-layer body.It is between the plate and plate of this hollow multi-layer body
It is fully sealed, therefore certain resistance to pressure pressure can be born inside it and leaked without causing.
Inlet tube, outlet are finally installed on multi-layer body, wherein inlet tube is mounted on the upper cover of the multi-layer body
At the inlet hole of plate, the outlet is mounted at the outlet opening of upper cover plate of the multi-layer body, to finally constitute
The cold plate.
Further, the utility model additionally provides a kind of refrigeration system with cold plate.The refrigeration with cold plate
System is in addition compressor, condenser, condenser fan, connecting line, refrigerant, and to make institute on the basis of the cold plate
It states the clamping device that cold plate surface and heater element surface are in close contact and constitutes.The air entry of the compressor passes through
Connecting line is connected with the outlet of the cold plate, the exhaust outlet of the compressor by connecting line and the condenser into
Mouth is connected, and the outlet of the condenser is connected by connecting line with the inlet tube of the cold plate, and the condenser fan is used for band
The condensation heat of the condenser release is walked, for the refrigerant charging inside the refrigeration system, the clamping device will be described
Cold plate in refrigeration system is fixed on the surface of heater element.When the compressor is operated, compress refrigerant gas, pressure liter
Height, the gaseous refrigerant of high pressure enter condenser and heat release, and the heat of releasing is taken away by the air by condenser fan forced convection,
High-pressure gaseous refrigerant after heat release is condensed into high pressure liquid refrigerant, the fluid reservoir of the cold plate is entered by inlet tube, then
The vaporization chamber that the cold plate is flowed by the throttling conduit in intermediate plate passes through elongated throttling channel in high pressure liquid refrigerant
When road, flow velocity is increased, and pressure reduction, so that refrigerant be made to generate atomization when flowing out elongated throttling conduit, and is being evaporated
The very high jet stream of speed is formed in room.This mist jet impacts the upper surface of the thermally conductive plate below the cold plate, in heat-conducting plate
The upper surface of piece generates violent evaporative phase-change heat exchange, so as to largely absorb the fever being in contact with the lower surface of thermally conductive plate
The heat of element.Since jet stream heat exchange has the very high coefficient of heat transfer, the heater element with high heat flux density can be made to obtain
To effective cooling.Refrigerant after absorbing heat flashes to gas, is flowed out by the outlet of the cold plate, and return to compressor
Air entry, be compressed into the refrigerant gas of high pressure again within the compressor.It loops back and forth like this.
The beneficial effects of the utility model are mainly reflected in:
One, the mode that in the present invention, cold plate takes away heat does not rely on the temperature rise of monophasic fluid, but by refrigeration
The two-phase of agent is evaporated, since the evaporation latent heat of two-phase fluid is much larger than enthalpy difference caused by monophasic fluid temperature change, sheet
Cold plate described in utility model has much bigger exchange capability of heat than conventional single-phase cold plate.
Two, due to cold plate described in the utility model using refrigerant rather than monophasic fluid is as cooling medium,
Saturation temperature after injection evaporation can be lower than environment temperature, and the temperature of cooled element can be made to be maintained at environment temperature hereinafter, i.e.
The cold plate not only has heat-sinking capability, also has refrigeration effect, this is that conventional cold plate is not accomplished.
Three, the throttling pore in the intermediate plate of the cold plate not only acts as the effect of refrigerant throttling, also acts as similar
The function of the two is combined into one by the effect of micro-nozzle, and structure is more compact, simultaneously because throttling pore is large number of, because
Total surface area is very big after the throttling atomization of this refrigerant, to further enhance surface evaporation exchange capability of heat.
Four, circulating element of the pump as cooling medium and in conventional spray cooling technology and single-phase cold plate cooling technology is used
Different with pressurizing elements, the pressurizing elements in the utility model are compressor.Since the boost capability of compressor is than pumping big obtain
It is more, thus bigger pressure difference can be generated before and after the throttling pore of system, and pressure difference is bigger, the initial kinetic energy of jet stream is also got over
Greatly, the heat transfer effect of jet impulse is also better.
Five, due to liquid storage, throttling (injection), evaporation, it is thermally conductive all completed in the same physical components, cold plate and refrigeration be
The structure of system is all very compact, it is easy to accomplish miniaturization and micromation, it is isometric particularly suitable for cooling microprocessor, laser
Heating device small, power density is big.
Detailed description of the invention
Fig. 1 is the appearance diagram of a specific embodiment of the cold plate.
Fig. 2 is assembly relation or the (explosion of laminated layer sequence schematic diagram for forming each laminate piece of multi-layer body of the cold plate
View).
Fig. 3 is the schematic shapes of the upper cover plate of the top of the cold plate.
Fig. 4 is the schematic shapes of the upper chamber plate in the cold plate under upper cover plate, on intermediate plate.
Fig. 5 is the schematic shapes of the intermediate plate in the cold plate under upper chamber plate, on lower room plate.
Fig. 6 is the schematic shapes of the lower room plate in the cold plate under intermediate plate, on thermally conductive plate.
Fig. 7 is in the cold plate positioned at the schematic shapes of the thermally conductive plate of bottom.
Fig. 8 is the schematic diagram of internal structure (cross section view) of the cold plate.
Fig. 9 is the flow chart of the refrigeration system with cold plate.
Specific embodiment
The first aspect embodiment of the utility model, provides a kind of cold plate, as shown in FIG. 1 to FIG. 8.
As shown in Figure 1, being the appearance of the cold plate 100.The cold plate 100 is that have different hollow out shapes by 5 kinds
Plate (typically thickness be less than 1mm sheet metal) in certain sequence and after the piece number lamination, then through between certain plate combine side
Method and the multi-layer body 101 formed, are then equipped with inlet tube 6 and outlet 7 on multi-layer body 101.
As shown in Fig. 2, be the cold plate 5 kinds of plates before being not associated with into an entity, the lamination of each plate is suitable
Sequence and positional relationship, and the assembly relation schematic diagram (explosive view) with inlet tube 6, outlet 7.
5 kinds of plates for constituting multi-layer body 101 are respectively: upper cover plate 1, upper chamber plate 2, intermediate plate 3, lower room plate
4 and thermally conductive plate 5, respectively as shown in Fig. 3~Fig. 7.Every kind of plate equal re arranged in multi-layer body 101, i.e. every kind of plate
The quantity of piece is at least 1 layer, but the plate of a certain type can only be with the plate continuous arrangement of same type, the plate of a certain type
It cannot be staggered with other types of plate.
As shown in Fig. 3 and Fig. 2,1 or several upper cover plate pieces 1 are located at the top of the multi-layer body 101.In upper cover
2 apertures flowed in or out for refrigerant: inlet hole 1a, outlet opening 1b are machined on plate 1.Several 1 weights of upper cover plate piece
It stacks, constitutes the mounting hole of inlet tube 6 and outlet 7, wherein inlet tube 6 is mounted in inlet hole 1a, and outlet 7 is pacified
In outlet opening 1b.
As shown in fig. 4 and fig. 2,1 or several upper chamber plates 2 be located at upper cover plate 1 lower section and intermediate plate 3 it is upper
Side.The first vacancy section 2a of large area and the first hollow hole 2b compared with small area are machined on upper chamber plate 2, wherein first engraves
Dead zone 2a is located at the lower section of the inlet hole 1a on upper cover plate 1, and the first vacancy section 2a is fully visible for inlet hole 1a;First engraves
Emptying aperture 2b is located at the lower section of the outlet opening 1b of upper cover plate 1 and is aligned with outlet opening 1b, the diameter of the first hollow hole 2b and outlet
The diameter of hole 1b is identical.The first vacancy section 2a group when several upper chamber plates 2 overlap, on each upper chamber plate 2
Conjunction forms hollow fluid reservoir 2m, the high-pressure refrigerant for storing liquid.
As shown in Fig. 5 and Fig. 2, if 1 or dry plate intermediate plate 3 are located at the lower section of upper chamber plate 2, lower room plate 4 it is upper
Side.Intermediate plate 3 plays a part of to separate fluid reservoir 2m and vaporization chamber 4m, and plays refrigerant throttling and micro-nozzle.In centre
The throttling pore 3a for the diameter very little being much evenly distributed, and the second of gas supply cryogen outflow are machined on plate 3
Hollow hole 3b.Second hollow hole 3b be located at the lower section of the first hollow hole 2b on upper chamber plate 2 and with 2b pairs of the first hollow hole
Together, the diameter of the diameter of the second hollow hole 3b and the second hollow hole 3b are identical.If dry plate intermediate plate 3 overlaps, often
Throttling pore 3a in a piece of intermediate plate 3 is superimposed, and forms elongated throttling conduit 3h (see Fig. 8).Intermediate plate 3
Quantity it is more, throttle conduit 3h length it is longer, then throttle effect is more obvious.Change the quantity and section of the intermediate plate 3
Flow the diameter of aperture 3a, the pressure difference of the adjustable refrigerant for flowing through intermediate plate 3, to adjust spray penetration and the expansion of jet stream
Dissipate angle;Change the quantity of throttling pore 3a, the area that adjustable per share jet stream is covered.
As shown in Fig. 6 and Fig. 2, if room plate 4 is located at the lower section of intermediate plate 3 under 1 or dry plate, thermally conductive plate 5 it is upper
Side.The second vacancy section 4a of large area, throttling pore 3a of the second vacancy section 4a to layer thereon are machined on lower room plate 4
It is fully visible with the second hollow hole 3b.The second vacancy section 4a if room plate 4 overlaps under dry plate, on lower room plate 4
Combination constitutes hollow vaporization chamber 4m, and vaporization chamber 4m is for providing refrigerant in the space wherein evaporated.
As shown in Fig. 7 and Fig. 2, if 1 or dry plate heat-conducting plate piece 5 are located at the bottom of cold plate 100.Thermally conductive plate 5 is one
The complete thin plate of block, on it without any hollow-out part.Thermally conductive plate 5 plays a part of to seal the vaporization chamber 4m above it, and
Heat-transfer surface as spray cooling;The lower surface of thermally conductive plate 5 is even curface, is directly connect as with cooled element surface
The face of touching.Preferably, thermally conductive plate 5 only has 1 layer, to reduce thermal conduction resistance.
Between so that multilayer plate is constructed to the plate of a multi-layer body 101 combine method include but is not limited to vacuum hotpressing,
Vacuum diffusion welding, vacuum brazing, electric resistance welding etc..Multilayer plate after combining method connection between the plate, plate and plate it
Between physically become indivisible entirety, reach between plate and plate and be fully sealed, certain pressure resistance pressure can be born
Power is without leaking.And inlet tube 6, outlet 7 are to use and material (typically stainless steel that multi-layer body 101 is same or similar
Equal metal materials) made of tubular member, and welded by the methods of arc welding, Laser Welding, supersonic welding, friction welding (FW), soldering
On the multi-layer body 101 that 5 kinds of plates are constituted, welding position is respectively in the inlet hole 1a of upper cover plate 1 and outlet opening 1b
Place.It should be pointed out that multilayer plate is a single entity after combining between completing the plate, do not deposit between layers
At the interface of apparent material, it is referred to here as " multi-layer body " and is intended merely to help to understand technology described in the utility model
Scheme.
It as shown in Figure 8, is the schematic diagram of internal structure (cross section view) of the cold plate 100, which helps to understand this reality
With the working principle of the novel cold plate.High-pressure refrigerant enters the fluid reservoir being made of multilayer upper chamber plate 2 from inlet tube 6
Then 2m flows into vaporization chamber 4m by the throttling conduit 3h being made of the throttling pore 3a in multilayer intermediate plate 3.High-pressure refrigeration
When throttling conduit 3h is flowed through in agent, since the reducing pressure by regulating flow of elongated runner acts on, so that refrigerant pressure is reduced rapidly, while flow velocity
It increasing sharply, when throttling conduit 3h to outflow, the pressure energy of refrigerant is converted into kinetic energy, and refrigerant is atomized and is formed jet stream, this
Dispersed jet is sprayed down into the upper surface of thermally conductive plate 5, generates violent convection current and evaporation in the upper surface of thermally conductive plate 5 and changes
Heat has the great coefficient of heat transfer, can take away the upper table for being largely transmitted to thermally conductive plate 5 via the lower surface of thermally conductive plate 5
The heat in face.Become the refrigerant gas of low-temp low-pressure after refrigerant heat absorption evaporation, this refrigerant gas is pooled to vaporization chamber 4m
Middle part, most afterwards through the second hollow hole 3b, the first hollow hole 2b, outlet opening 1b and outlet 7 flow out cold plate 100.
The second aspect embodiment of the utility model provides a kind of tool for cooling down to high-power heater element
There is the refrigeration system 1000 of cold plate, as shown in Figure 9.The refrigeration system 1000 with cold plate includes the cold plate 100, compression
Machine 200, condenser 300, condenser fan 400, connecting line 500, and for cold plate 100 to be fixed to heater element 600
The clamping device 700 that surface is got on.The surface of heater element 600 and the lower surface of cold plate 100 are in close contact, clamping device 700
Cold plate 100 and heater element 600 are clamped, to reduce the thermal contact resistance between 600 upper surface of heater element of cold plate 100.
In the inside of the refrigeration system 1000 with cold plate filled with refrigerant.The heater element 600 includes but is not limited to
Central processing unit (CPU), microprocessor (MPU), graphics processor (GPU), insulated gate bipolar transistor (IGBT), semiconductor system
Cold, laser etc..
According to the embodiment of second aspect, need to only be pressed in the external connection of the cold plate 100 by connecting line 500
Contracting machine 200, condenser 300, and after filling suitable refrigerant, that is, constitute a complete refrigeration system.Connection method is: cold
The outlet of condenser 300 is connected with the inlet tube 6 of the cold plate 100, the outlet of the air entry of compressor 200 and the cold plate 100
Pipe 7 is connected, and the exhaust outlet of compressor 200 is connected with the import of condenser 300.The high-pressure gaseous refrigeration being discharged by compressor 200
Agent enters condenser 300, condensation heat release is carried out in condenser 300, the heat of releasing is by by 400 forced convections of condenser fan
Air take away.High-pressure gaseous refrigerant becomes the liquid refrigerant of high pressure after condensing in condenser 300, through inlet tube 6 into
Enter the fluid reservoir 2m inside cold plate 100.Liquid refrigerant in fluid reservoir 2m is via the micro-throttling conduit 3h in intermediate plate 3
Pressure reduction, volume expansion when into vaporization chamber 4m, become the gas-liquid mixture of low-temp low-pressure, are in the downward jet stream of spray form, punching
Hit the upper surface of the thermally conductive plate 5 positioned at 100 bottom of cold plate.Jet stream generates violent heat on the upper surface of thermally conductive plate 5
Exchange absorbs the heat that heater element 600 the generates, lower surface through thermally conductive plate 5 is transmitted to the upper surface of thermally conductive plate 5,
To maintain the temperature of heater element 600 in lower temperature range.Refrigerant after the completion of evaporation then all becomes gaseous state, warp
Cold plate 100 is flowed out by the second hollow hole 3b, the first hollow hole 2b, outlet opening 1b and outlet 7, and returns to compressor 200
Air entry.After refrigerant gas is compressed in compressor 200, become the refrigerant gas of high pressure, again so as to form one
A complete refrigeration cycle.When refrigerant evaporates in vaporization chamber 4m, saturation temperature can be lower than environment temperature, can make heater element
It is cooled to environment temperature or less.
In the above-described embodiments, outlet 7 is disposed in the position positioned at plate center, and inlet tube 6 is disposed in and connects
The position at nearly plate center, but the position of outer tube and mounting means do not constitute any limit to the embodiments of the present invention
System.Alternatively it is also possible to inlet tube 6 is disposed in the position at plate center, and outlet 7 is placed close to plate center
Position, as long as the vacancy section of multilayer plate and the position of hollow hole inside cold plate 100 are changed accordingly.
A simplified embodiment according to the present utility model, the cold plate 100 can also not have inlet tube 6, outlet 7,
But directly occur in the form of multi-layer body 101.
Multiple inlet tubes 6 also can be set in an alternative embodiment according to the present utility model, the cold plate 100, and
Multiple outlets 7.
In embodiment described in the utility model, making the processing method of plate hollow out includes but is not limited to etching, photoetching, machine
Tool processing, and laser cutting etc..
In embodiment described in the utility model, upper cover plate 1, upper chamber plate 2, intermediate plate 3, lower 4 and of room plate
The usual material thickness having the same of thermally conductive plate 5 and identical external form contour line (in the diagram of the present embodiment external form profile
Line is rectangle), to reach the standardization in process of producing product as far as possible and reduce cost, but the utility model is not intended to limit this
A bit, this five kinds of plates can also use not exactly the same material thickness and not quite identical external form profile.
Multilayer plate is set to form the method combined closely between plate, including but not limited to Vacuum Heat used by the utility model
The methods of pressure, vacuum diffusion welding, vacuum brazing, electric resistance welding, preferably use vacuum diffusion welding method, this welding method due to
With the advantage for being not required to soldering flux, therefore material is not limited to the metal sheets such as stainless steel, titanium alloy, aluminium alloy or alloy plate,
It is also possible to the nonmetallic plate such as ceramics.As long as being belonged to by means of the similar cold plate connected and composed between the plate of multi-layered sheet
The protection scope of the utility model.
"upper", "lower", " top ", " lower section ", " side ", " top ", " bottom " etc. refer in the description of the present invention,
Show orientation term or positional relationship be based on the orientation or positional relationship shown in the drawings, be it is opposite, be merely for convenience of retouching
It states and simplifies description made by the utility model, rather than the structure of indication or suggestion meaning or element must have specific side
Position is constructed and operated in a specific orientation, and is not limited in any way to the protection scope of the utility model.
Claims (10)
1. a kind of cold plate, can complete throttling, spraying jet and the phase transformation evaporation and heat-exchange of refrigerant inside single entities, and pass through
Heat-conducting mode cools down the heater element contacted, the temperature of cooled element can be down to environment temperature hereinafter, its
Be characterized in that, including between inlet tube, outlet and plate based on multi-layered sheet in conjunction with and the multi-layer body that constructs, the multilayer are real
Body successively includes following 5 kinds of different types of plates from top to bottom:
The upper cover plate of 1 or multi-disc;
The upper chamber plate of 1 or multi-disc;
The intermediate plate of 1 or multi-disc;
The lower room plate of 1 or multi-disc;
The thermally conductive plate of 1 or multi-disc,
High pressure liquid refrigerant enters the multi-layer body by the inlet tube, generates after throttling in the multi-layer body spraying
Jet stream, impact are located at the upper surface of the thermally conductive plate of multi-layer body bottom, absorb the hair being in contact with thermally conductive plate lower surface
Thermal element is transmitted to the heat of heat-conducting plate piece upper surface and evaporation, becomes the gaseous refrigerant of low-temp low-pressure, finally by it is described go out
Mouth pipe flows out the multi-layer body.
2. cold plate according to claim 1, it is characterised in that: the upper cover plate is located at the most upper of the multi-layer body
Side;It is machined with inlet hole and outlet opening in the upper cover plate on piece, the inlet tube is mounted in the inlet hole, the outlet
Pipe is mounted in the outlet opening.
3. cold plate according to claim 1, it is characterised in that: the upper chamber plate is located at upper cover plate in multi-layer body
Lower section, intermediate plate top;The first vacancy section and the first hollow hole, the first vacancy section are machined on the upper chamber plate
Positioned at the lower section of the inlet hole of upper cover plate on piece, the first vacancy section is fully visible to the inlet hole of layer thereon, the first hollow hole
Positioned at the outlet opening of upper cover plate on piece lower section and be aligned with outlet opening;The first vacancy section on multilayer upper chamber plate overlaps one
It rises and constitutes hollow fluid reservoir.
4. cold plate according to claim 1, it is characterised in that: the intermediate plate is located at upper chamber plate in multi-layer body
Lower section, lower room plate top;The throttling that the diameter very little being much evenly distributed is machined in the intermediate plate is small
Hole and the second hollow hole, the second hollow hole are located at the lower section of the first hollow hole on upper chamber plate and are aligned with the first hollow hole,
The diameter of the diameter of second hollow hole and the first hollow hole is identical;Throttling pore in multilayer intermediate plate overlaps composition
Elongated throttling conduit.
5. cold plate according to claim 1, it is characterised in that: the lower room plate is located at intermediate plate in multi-layer body
Lower section, thermally conductive plate top;The second vacancy section is machined on the lower room plate, the second vacancy section is located at intermediate plate
Throttling pore and the second hollow hole below, and it is fully visible to throttling pore and the second hollow hole;Under multilayer on the plate of room
Second vacancy section, which overlaps, constitutes hollow vaporization chamber.
6. cold plate according to claim 1, it is characterised in that: the thermally conductive plate is located at the most lower of the multi-layer body
Side;The thermally conductive plate is one piece of complete thin plate, and on it without any hollow-out part, upper surface is as spraying jet
Jeting surface, lower surface is as the surface directly contacted with cooled element.
7. cold plate according to claim 1, it is characterised in that: 5 kinds of different types of plates are equal in the multi-layer body
Repeatable to occur, i.e., the quantity of every kind plate is at least 1;When the plate of same type is more than 1, they must continuously be arranged
Column, certain type of plate cannot be staggered with other types of plate.
8. cold plate according to claim 1, it is characterised in that: combine method between the plate of the multi-layered sheet, including but not
Be limited to vacuum diffusion welding, vacuum hotpressing, vacuum brazing, electric resistance welding etc., multi-layered sheet after combining method connection between the plate,
Physically become indivisible entirety between plate and plate, reach between face and face and be fully sealed, can bear certain
Resistance to pressure pressure without leak.
9. a kind of refrigeration system with cold plate, it is characterized in that: it includes cold plate described in claim 1, it additionally include pressure
Contracting machine, condenser, condenser fan, connecting line, refrigerant, and carry out the cold plate surface and heater element surface closely
The clamping device of contact.
10. the refrigeration system according to claim 9 with cold plate, it is characterized in that: the air entry of the compressor passes through
Connecting line is connected with the outlet of the cold plate, the exhaust outlet of the compressor by connecting line and the condenser into
Mouth is connected, and the outlet of the condenser is connected by connecting line with the inlet tube of the cold plate, and the condenser fan is used for band
The condensation heat of the condenser release is walked, the refrigerant charging is inside the refrigeration system with cold plate, the clamping
Cold plate in the refrigeration system with cold plate is fixed on the surface of heater element by device, when the compressor and described
When condenser fan operates, the refrigerant recycles and generates throttling, spraying jet and sweat cooling effect in the inside of the cold plate
It answers, takes away the heat on the heater element surface contacted with the cold plate, to maintain the temperature on heater element surface in certain model
In enclosing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820847456.5U CN208523115U (en) | 2018-06-03 | 2018-06-03 | Cold plate and refrigeration system with it |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820847456.5U CN208523115U (en) | 2018-06-03 | 2018-06-03 | Cold plate and refrigeration system with it |
Publications (1)
Publication Number | Publication Date |
---|---|
CN208523115U true CN208523115U (en) | 2019-02-19 |
Family
ID=65339771
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201820847456.5U Active CN208523115U (en) | 2018-06-03 | 2018-06-03 | Cold plate and refrigeration system with it |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN208523115U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110173411A (en) * | 2019-06-21 | 2019-08-27 | 北京北方华创微电子装备有限公司 | Cold pump closure and reaction chamber |
CN110557923A (en) * | 2018-06-03 | 2019-12-10 | 武汉麦丘科技有限公司 | cold plate and refrigerating system with same |
-
2018
- 2018-06-03 CN CN201820847456.5U patent/CN208523115U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110557923A (en) * | 2018-06-03 | 2019-12-10 | 武汉麦丘科技有限公司 | cold plate and refrigerating system with same |
CN110173411A (en) * | 2019-06-21 | 2019-08-27 | 北京北方华创微电子装备有限公司 | Cold pump closure and reaction chamber |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN111642103B (en) | High heat flux porous heat sink flow cooling device | |
CN208523113U (en) | Cold plate and refrigeration system with it | |
US7921664B2 (en) | Method and apparatus for high heat flux heat transfer | |
CN105627609A (en) | Refrigerating device for cylinder clustered printed circuit board type micro-channels | |
CN101534627A (en) | High-effective integral spray cooling system | |
US20160033204A1 (en) | High Efficiency Thermal Management System | |
US20070119568A1 (en) | System and method of enhanced boiling heat transfer using pin fins | |
CN110557924A (en) | Cold plate and refrigerating system with same | |
CN208523115U (en) | Cold plate and refrigeration system with it | |
CN208523114U (en) | Cold plate and refrigeration system with it | |
CN106785822A (en) | A kind of system and method for cooling down superelevation heat flow density thermal source | |
CN101089520A (en) | Falling-film heat exchanger of two use refrigeration heat pump | |
CN110557923A (en) | cold plate and refrigerating system with same | |
JP4826314B2 (en) | Evaporation / absorption unit for absorption refrigerator | |
CN210718197U (en) | Liquid-cooled semiconductor refrigeration module | |
CN105828575B (en) | Jet flow two-phase heat exchange cold plate and cooling system for rail transit | |
CN112696961B (en) | Three-stage phase change heat exchanger | |
JPH03233265A (en) | Absorbing type heat pump | |
JPH08204075A (en) | Plate-fin type element cooler | |
JP2006162154A (en) | Laminated plate type absorber, absorption heat pump and absorption refrigerator | |
CN106643242B (en) | The vertical thermal conductive surface heat-pipe radiator of liquid-cooled | |
US5007251A (en) | Installation for air-conditioning by absorption | |
CN217822771U (en) | Integrated radiator of little fog soaking plate | |
JPS61147062A (en) | Absorption water chiller | |
JP3292663B2 (en) | Plate heat exchanger |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |