EP3973595A1 - Baugruppe mit einem lötstift und einer lötstelle - Google Patents
Baugruppe mit einem lötstift und einer lötstelleInfo
- Publication number
- EP3973595A1 EP3973595A1 EP20728019.9A EP20728019A EP3973595A1 EP 3973595 A1 EP3973595 A1 EP 3973595A1 EP 20728019 A EP20728019 A EP 20728019A EP 3973595 A1 EP3973595 A1 EP 3973595A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- soldering
- opening
- walls
- pin
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
- H05K3/308—Adaptations of leads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10803—Tapered leads, i.e. leads having changing width or diameter
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the invention relates to an assembly according to the preamble of claim 1 and a method for producing such an assembly.
- Such an assembly comprises a component, a soldering pin arranged on the component, an electrical component and a soldering point arranged on the electrical component, which forms an opening into which the soldering pin can be inserted to produce a soldered connection along an insertion direction.
- Such an assembly can for example have a component to be fastened to an electrical assembly in the form of a printed circuit board, for example a plug connector for connecting electrical conductors to the electrical assembly.
- One or more soldering pins can be arranged on such a component, which are attached to the associated soldering points of the component in order to fasten and electrically contact the component with the electrical component, in order then to mechanically connect the soldering pins to the soldering points using a soldering process and to close them electrically to contact.
- TMR through-hole reflow technology
- Customary soldering pins in particular for using through-hole reflow technology for equipping electrical components in the form of printed circuit boards with electrical or electronic components to be attached, have a square or rectangular cross-section.
- the soldering pins are to be inserted into associated openings of soldering points, which usually have a round shape and are larger in their clear width than the soldering pins.
- the standard DIN EN 61760-3 stipulates a position tolerance of ⁇ 0.2 mm. From such a position tolerance it follows that a pin tip of the soldering pin can be positioned within a circle with a diameter of 0.4 mm in the opening of the soldering point and is only ideally arranged in the center of the opening of the soldering point. Due to the existing tolerances, there is usually a play between a soldering pin and an opening of a soldering point into which the soldering pin is to be inserted. Such play can under certain circumstances lead to a (slight) tilting of a component, for example on a circuit board, which can result in a component not being fixed on the circuit board parallel to a circuit board edge or offset altogether from an ideal nominal position.
- DE 10 2016 124 072 A1 describes a contact device which comprises a closure means and a plug contact for contacting a circuit carrier, the plug contact comprising a contact section and a connecting section.
- the contact section adjoins a tip of the plug contact and is designed for contacting a metallized socket contact of the circuit carrier, the connecting section adjoining the contact section on a side of the contact section facing away from the tip and being connected to the contact section.
- a centering pin is arranged next to a soldering pin, which is designed to lead and, before the soldering pin penetrates into an associated soldering point, engages with an associated centering opening.
- the object of the present invention is to provide an assembly and a method for manufacturing an assembly that enable a soldered connection to be made in a structurally simple manner for fastening a component to an electrical assembly, in particular a circuit board, while reducing tolerances in the positional deviation .
- the soldering pin has an insertion section which forms insertion walls on opposite sides of the soldering pin, which are arranged at an acute angle to one another in such a way that the insertion section tapers in the insertion direction, with a part of the soldering connection between the soldering pin and the soldering point being established
- the insertion section is arranged outside the opening such that the insertion walls extend in sections inside the opening and in sections outside the opening.
- the soldering pin has an insertion section.
- the insertion section has a shape that tapers in the insertion direction and is used to center the soldering pin in an associated opening of a soldering point.
- the soldering pin is inserted with its insertion section into the opening of the associated soldering point, the soldering pin being able to center itself automatically in the opening due to the tapering shape of the insertion section.
- the insertion section Because of the centering effect of the insertion section, tolerances in the position between the soldering pin and the soldering point can be reduced, so that the accuracy for the positioning of a component on an associated electrical component, for example a printed circuit board, can be improved.
- the insertion section with its insertion sections can run onto a surrounding edge of the opening of the soldering point, so that the soldering pin is automatically centered in the opening.
- the insertion section In the inserted position - with a soldered connection produced - the insertion section is not completely inserted into the opening of the soldering point, but only partially.
- the insertion section is designed in such a way that in the inserted position it protrudes from the soldering point with a part opposite to the insertion direction and is not inserted with this part into the opening of the soldering point, so that the insertion walls extending at an angle to one another are still partially outside the opening of the soldering point are located.
- the insertion walls can both be in contact with a surrounding edge of the opening of the soldering point, which enables the soldering pin to be centered completely within the opening of the soldering point when the soldered connection is made. It is also possible, however, that in the inserted position, corresponding to a predetermined target position of the component relative to the structural unit, the insertion walls are slightly spaced from a surrounding edge of the opening of the soldering point. A part of each insertion wall is opposite to the insertion direction from the opening outwards so that the insertion section is not completely inserted into the opening even in the inserted position.
- soldering pin in a nominal target position of the component relative to the structural unit, for example realized by a printed circuit board, there is no direct contact between the soldering pin and the soldering point, as the insertion walls on the insertion section of the soldering pin are not in contact with the soldering point .
- the soldering pin In a nominal target position, the soldering pin is thus inserted into the opening of the soldering point in a contact-free manner - before the soldered connection is made, and is only connected to the soldering point via the soldering connection without, however, the insertion walls directly resting against a wall of the soldering point (which can be designed, for example, as a plated through-hole extending through the structural unit in the form of the printed circuit board).
- soldering pin is not jammed with the soldering point, but the soldering pin is essentially force-free, i.e. with play, when the component is fitted with the component and the component's soldering pin is inserted into an associated opening of a soldering point on the component is inserted into the opening of the solder joint.
- This can be advantageous during assembly in order to prevent the component from being disengaged during assembly by an automatic assembly machine that grips the component with a gripping device in the form of a suction device under the effect of a vacuum and in this way places it on the structural unit.
- the force-free attachment of the component to the assembly by inserting the soldering pin into the associated soldering point of the assembly can prevent a force between the placement machine and the component, so that the component is prevented from becoming detached from the placement machine in an undesired manner.
- the soldering pin can automatically center itself in the opening of the soldering pin due to the interaction of the insertion walls of the insertion section with wall sections of the soldering point, although this takes place essentially without force and in particular not leads to jamming of the solder pin in the opening of the solder joint.
- the component has a housing and at least one attachment element which is arranged on the housing and which, in a position of the component attached to the structural unit, is in contact with a surface of the structural unit (for example a printed circuit board). is.
- the position of the component relative to the printed circuit board, in particular along the insertion direction, i.e. perpendicular to a plane of extent of the structural unit formed, for example, by a printed circuit board, is thus predetermined by the attachment element, so that the insertion depth of the solder pin in the soldering point is determined by the attachment element.
- the soldering pin engages with the insertion section in the opening of the associated soldering point, but in a nominal target position is not in contact with a wall section of the soldering point.
- the at least one attachment element can be formed by a section protruding from the housing.
- the at least one attachment element can, however, also be formed by a housing section of the housing itself, with one or more soldering pins being exposed, for example via a recess, from the attachment element.
- the acute angle at which the insertion walls of the insertion section extend to one another has a value between 5 ° and 30 °, for example 10 °.
- the insertion section thus tapers in the insertion direction and tapers to a point in the insertion direction, which enables the soldering pin to be centered - essentially without force - in the opening of the associated soldering point when the component is attached to the associated electrical assembly.
- the soldering pin has a head to which the insertion section adjoins in the insertion direction.
- the head can be made larger in its dimensions than the insertion section and thus protrude transversely to the insertion section, in particular along a transverse direction extending transversely to the insertion direction, along which the insertion walls are also spaced from one another.
- the soldering pin can, for example, be connected to the associated component via the head.
- the head has walls extending parallel to one another and transition bevels adjoining the walls in the insertion direction.
- the insertion walls adjoin the transition bevels, which extend obliquely to the direction of insertion, with the insertion walls being offset inward at their ends facing the head (with respect to the transverse direction) due to the transition bevels.
- the opening of the soldering point has a clear width that is smaller than a width of the head measured between the walls. Insertion of the head of the soldering pin into the opening of the associated soldering point is thus excluded.
- the transition bevels are arranged at an angle to one another which is greater than the acute angle between the insertion walls.
- the angle between the transition bevels can for example be in a range between 60 ° and 120 °, for example 90 °.
- the transition slopes represent a transition between the insertion walls extending at an acute angle to one another and the walls of the head extending parallel to one another.
- the soldering pin has a shank section which adjoins the insertion section in the insertion direction and has shank walls that adjoin the insertion walls of the insertion section and extend parallel to one another.
- the insertion section which tapers in the insertion direction is thus adjoined by a shaft section, which in turn forms shaft walls extending parallel to one another.
- the soldering pin can, for example in the inserted position, protrude out of the opening of the soldering point in the insertion direction on the side facing away from the head.
- the soldering pin also has an end section that adjoins the shaft section and tapers to a point in the insertion direction.
- Such a tapered end section can facilitate the insertion of the soldering pin into the opening of an associated soldering point, because the soldering pin can more easily be brought into engagement with the opening of the soldering point.
- the soldering pin can be shaped differently in a cross-sectional plane transverse to the insertion direction.
- the soldering pin can have a rectangular basic shape in cross section transverse to the insertion direction.
- the soldering pin can be formed, for example, as a stamped part from sheet metal.
- the soldering pin can be configured, for example, rotationally symmetrical in cross section transverse to the insertion direction and thus have a conical shape at its insertion section.
- the soldering pin is formed integrally from one piece.
- the soldering pin can, for example, have flanks which are spaced apart from one another along a depth direction and preferably extend parallel to one another.
- the depth direction is directed transversely to the insertion direction and transversely to the transverse direction, along which the insertion walls are spaced from one another.
- the soldering pin can have a thickness, measured along the depth direction, which is smaller than the width of the soldering pin, in particular in the area of the head, so that the soldering pin has a flat basic shape.
- the flanks can preferably extend over the entire height of the soldering pin and can be aligned parallel to one another over the entire height of the soldering pin.
- the insertion section has chamfers at the transition between the insertion walls spaced from one another along the transverse direction and the flanks spaced from one another along the depth direction, in the area of which edges are beveled at the transitions.
- the chamfers can extend, for example, along the entire height of the insertion section and also on the shaft section and the adjoining end section, so that edges of the soldering pin are beveled to facilitate insertion into the opening of an associated soldering point.
- the opening of the soldering point is round, for example circular, in cross section transverse to the insertion direction.
- the shape of the opening thus deviates from the shape of the soldering pin.
- the insertion walls can come into contact with an edge surrounding the opening, in particular an edge surrounding the opening at an entrance of the opening into which the soldering pin is inserted in the direction of insertion when inserted into the opening .
- the soldering pin is automatically centered in the opening, so that the soldering pin assumes a desired position within the opening of the soldering pin with small tolerances.
- soldering pin In a nominal target position, however, it can be provided that there is no contact between the soldering pin and surrounding wall sections of the soldering point, so that the soldering pin can be inserted into the opening of the soldering point in a powerless manner during assembly and a Connection between the soldering pin and the soldering point is only established through the soldering connection.
- the object is also achieved by a method for producing an assembly, comprising: equipping an electrical assembly with a component using an automatic assembly machine for gripping the component, with a soldering pin arranged on the component in an opening of a soldering point arranged on the electrical assembly during assembly is used along an insertion direction to produce a soldered connection.
- the soldering pin is inserted into the opening in such a way that when the soldered connection is made between the soldering pin and the soldering point, part of an insertion section of the soldering pin is arranged outside the opening, the insertion section forming insertion walls on opposite sides of the soldering pin, which in such a way are arranged at an acute angle to one another, that the insertion section tapers in the insertion direction, the insertion wall of the insertion section extending in sections inside the opening and in sections outside the opening.
- soldering pin when the assembly is fitted with the component, the soldering pin is inserted into the associated opening of the soldering point so that initially there is no contact between the soldering pin and the soldering point and the soldering pin is only connected to the soldering point through the soldering connection. In a nominal target position, the soldering pin can thus be inserted into the opening without force, without making contact with the soldering point during insertion.
- An insertion depth for the soldering pin can be specified via an attachment element on a housing of the component, which comes into contact with the component when the component is fitted with the component, for example realized by a printed circuit board, so that the position of the component relative to the component is set along the direction of insertion.
- FIG. 3 shows a schematic view of a conventional soldering pin in an opening of a soldering point after a soldered connection has been made
- FIG. 5 shows a view of an exemplary embodiment of a soldering pin before it is inserted into a
- Fig. 7 is a perspective partial sectional view of the solder pin before insertion into the
- FIG. 8 shows the view according to FIG. 7, with the soldering pin inserted
- FIG. 10 shows a view of an exemplary embodiment of a component on an associated structural unit in the form of a printed circuit board, with an arrangement of attachment elements on a housing of the component;
- FIG. 11 shows an enlarged view in detail A according to FIG. 10.
- FIG. 12 shows a schematic view when a structural unit is equipped with a
- FIGS. 1 and 2 show schematic views of an assembly which has a component 1, for example in the form of a plug connector, which is to be positioned and fixed on an electrical component 2, for example in the form of a printed circuit board.
- the component 1 has a housing 10 which encloses electrical or electronic functional components of the component 1.
- Solder pins 3 are connected to the electrical functional components of the component 1 and are used for the mechanical and electrical connection to the electrical component 2.
- the electrical assembly 2 has soldering points 4 which each form an opening 40 into which an associated soldering pin 3 of the component 1 is to be inserted along an insertion direction E in order to produce soldered connections between the soldering pins 3 and the soldering points 4.
- Fig. 1 shows the assembly before connecting the component 1 to the electrical assembly 2
- Fig. 2 shows the component 1 in a position attached to the assembly 2, in which the soldering pins 3 engage in the openings 40 of the soldering points 4 and via soldered connections can be connected to the soldering points 4.
- a soldering pin 3 conventionally has a rectangular, for example rectangular or square, basic shape.
- the opening 40 of a soldering point 4 is usually round in shape, the clear width of the opening 40 being greater than the maximum dimension of the soldering pin 3 (measured in cross section across the device E, corresponding to the diagonal of the square shape of the soldering pin 3).
- the overdimensioning of the opening 40 is necessary in order to enable the soldering pins 3 of a component 1 to be simply and forcelessly inserted into associated soldering points 4, in particular using an automatic placement machine.
- the deviations in the dimensions cause the soldering pins 3 to play in the openings 40 of the soldering points 4, which can result in positional deviations between a target position of the component 1 when a soldered connection 5 (shown schematically in FIG. 3) is made of the structural unit 2, so that the component 1 may not be arranged, for example, parallel to a circuit board edge of the structural unit 2 designed as a circuit board.
- FIGS. 5 to 9 In order to reduce tolerances in the positioning of a soldering pin 3 in an opening 40 of an associated soldering point 4 and thus to improve the accuracy of the positioning of a component 1 on an electrical assembly 2, for example in the form of a printed circuit board, a circuit shown in FIGS. 5 to 9 in One embodiment shown soldering pin 3 on an insertion portion 31 which are aligned at an acute angle a to each other Insertion walls 310 forms and tapers in the insertion direction E due to the oblique extension of the insertion walls 310.
- the insertion section 31 with its insertion walls 310 can interact with, in particular, an edge section 41 of the soldering point 4, so that the soldering pin 3 is automatically centered within the opening 40 when it is inserted in the direction of insertion E. assumes a desired, centered position in opening 40.
- the insertion walls 310 can run onto the edge section 41 of the soldering point 4, so that the soldering pin 3 is in the opening 40 along a plane spanned by a transverse direction Q and a depth direction T is offset and thus centered in the opening 40.
- the insertion section 331 is not completely inserted into the opening 40, but with a part still protrudes out of the opening 40 counter to the insertion direction E.
- the insertion section 31 with the insertion walls 310 is thus not completely inserted into the opening 40 when the soldering pin 3 is inserted into the opening 40, but only partially until a desired position in the opening 40 is reached.
- soldering pin 3 is inserted into the opening 40 of the associated soldering point 4 without contact in a nominal target position, so that no contact occurs between the soldering pin 3 and the soldering point 4 in an ideal, nominal assembly process. Only if there are tolerances and the soldering pin 3 is placed on the assigned soldering point 4 outside of its nominal target position, the insertion walls 310 of the insertion section 31 can come into contact with a circumferential edge 410 of the edge section 41, so that the soldering pin 3 is essentially can center itself in the opening 40 without power.
- the soldering pin 3 has a head 30 which adjoins the insertion section 31 counter to the insertion direction E. In contrast, in the insertion direction E, the insertion section 31 merges into a shaft section 32, which is in turn adjoined by a tapering end section 33.
- the soldering pin 3 has flanks 312 which are spaced apart from one another and extend parallel to one another along the depth direction T and extend over the entire height of the soldering pin 3.
- the soldering pin 3 can, for example, be a stamped and bent part from sheet metal be manufactured and has a flat basic shape, with dimensions that are smaller in the depth direction T than in the transverse direction Q.
- the head 30 has walls 300 spaced apart from one another along the transverse direction Q and extending parallel to one another. At the transition between the head 30 and the insertion section 31, transition bevels 31 are formed which extend at an angle ⁇ to one another which is (significantly) greater than the angle ⁇ between the insertion walls 310.
- angle ⁇ at which the insertion walls 310 extend to one another can for example have a value between 5 ° and 30 °, for example 10 °, the angle ⁇ can for example have a value between 60 ° and 120 °, for example 90 °.
- the insertion walls 310 are offset inwardly at their ends facing the head 30 along the transverse direction Q with respect to the walls 300 of the head 30, as can be seen in particular from FIG.
- the shaft section 32 adjoining the insertion section 31 has shaft walls 320 that extend parallel to one another and are spaced apart along the transverse direction Q.
- the end section 33 tapers in turn with respect to the shaft walls 320 of the shaft section 32.
- Chamfers 311 are formed at the transition between the insertion walls 310 and the shaft walls 320 and the walls of the end section 33 on the sides of the soldering pin 3 facing away from one another along the transverse direction Q and the flanks 312 on the sides of the soldering pin 3 facing away from one another along the depth direction T of which the soldering pin 3 is beveled at the transitions between the different sides, as can be seen from FIGS. 7 and 8 in conjunction with FIG.
- the soldering pin 3 thus does not form any sharp edges in the area of the insertion section 31, the shaft section 32 and the end section 33, but is in the area of the edges beveled, which further facilitates the insertion and centering of the soldering pin 3 in the opening 40 of the associated soldering point 4.
- the opening 40 of the soldering point 4 has a clear width D1 which is smaller than the width D2 of the head 30, measured between the walls 300 extending parallel to one another along the transverse direction Q.
- the width D3 of the shaft section 32 measured between the shaft walls 320, is, in contrast, significantly smaller than the clear width D1 of the opening 40, so that the soldering pin 3 with the shaft section 32 can be easily inserted into the opening 40 of an associated soldering point 4 in order to then be inserted via the insertion section 31 to be centered in the opening 40.
- soldering point 4 can have a metal sleeve in the manner of a plated-through hole, with which the soldering pin 3 can be mechanically and electrically connected via the soldering connection 5.
- a soldering pin 3 of the type described is particularly suitable for using the THR technology.
- a solder paste is introduced into the openings 40 of the soldering points 4 before the soldering pins 3 are inserted into the openings 40. After inserting the soldering pins 3, the solder paste is melted in a reflow oven, so that the soldering pins 3 are soldered to the soldering points 4.
- a soldering pin 3 which is functionally similar to the soldering pin 3 described above with reference to FIGS. 5 to 9, is arranged on a housing 10 of a component 1, which is an electrical or electronic functional component a unit 2 is to be arranged in the form of a circuit board.
- attachment elements 11 are formed on the housing 10, which serve as spacers for defining a height position relative to the structural unit 2 in the form of the circuit board and for this purpose along the insertion direction E from the housing 10 in the direction the unit 2 protrude.
- the attachment elements 1 1 with attachment surfaces 110 on sides of the attachment elements 1 1 facing away from the housing 10 are in contact with a surface 20 of the structural unit 2, so that the insertion depth of the soldering pin 3 in the opening 40 the assigned solder joint 4 is defined.
- the attachment elements 11 can be designed as projection elements formed on the housing. However, it is also conceivable and possible to form one or more attachment elements 11 through a flat housing section, i.e.
- soldering pin 3 is, for example, a groove in a recess or a depression is arranged in the area of the underside of the housing 10 and is thus exposed to the attachment elements 11.
- the soldering pin 3 is in a nominal target position at Structural unit 12 attached component 1 not in contact with wall sections of the soldering point 4 formed as a via, in particular a circumferential inner edge 410 of the upper edge section 41 of the soldering point 4.
- the soldering pin 3 with the insertion walls 310 on the insertion section 31 does not come into contact with the soldering point 4, whereby the The insertion section 31 comes to lie partly in the opening 40 of the solder joint 4 and partly outside the opening 40.
- soldering pin 3 Due to tolerances, for example in the arrangement of the soldering pin 3 on the housing 10 and also in the arrangement of several soldering pins 3 of the component 1 to one another, there may be deviations from the target position of the soldering pin 3 relative to the soldering point 4.
- the soldering pin 3 with one or both insertion walls 310 can run onto the circumferential inner edge 410 of the edge section 41 and thus center itself in the opening 40, this being done in a substantially powerless manner and when the soldering pin 3 is applied to the soldering point 4 no clamping effect occurs between the soldering pin 3 and the soldering point 4.
- the assembly of the structural unit 2 can in particular take place using an automatic assembly machine 6, as is shown schematically in FIG. 10.
- a component 1 can be gripped with a gripping device 60 of the automatic assembly machine 6, for example by applying a negative pressure, in order to attach the component 1 to the assigned assembly 2 and solder pins 3 of the component 1 with assigned soldering points 4 on the assembly 2 in To bring intervention.
- the assembly process in particular the insertion of the soldering pins 3 into openings 40 of the associated soldering points 4, takes place in an essentially powerless manner, it can be prevented that a force is exerted on the component 1 during assembly that would lead to the component 1 being released from the gripping device 60 of the automatic placement machine 6 could lead.
- soldered connections 5 are made between the soldering pins 3 and the associated soldering points of the circuit board 2 in order to electrically connect the component 1 to the unit 2 and also to fix it mechanically to the unit 2.
- a component can be connected to an associated electrical component, for example a printed circuit board, via one or more soldering pins.
- the THR technology can be used to produce soldered connections, although other soldering methods can also be used.
- a soldering pin can have a flat basic shape, as described with reference to the exemplary embodiment according to FIGS. 5 to 9. Instead, however, the soldering pin can also have, for example, a rotationally symmetrical basic shape with a conical insertion section.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102019113788.8A DE102019113788A1 (de) | 2019-05-23 | 2019-05-23 | Baugruppe mit einem Lötstift und einer Lötstelle |
| PCT/EP2020/064374 WO2020234478A1 (de) | 2019-05-23 | 2020-05-25 | Baugruppe mit einem lötstift und einer lötstelle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP3973595A1 true EP3973595A1 (de) | 2022-03-30 |
Family
ID=70847399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP20728019.9A Pending EP3973595A1 (de) | 2019-05-23 | 2020-05-25 | Baugruppe mit einem lötstift und einer lötstelle |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12170431B2 (de) |
| EP (1) | EP3973595A1 (de) |
| CN (1) | CN113875092B (de) |
| DE (1) | DE102019113788A1 (de) |
| WO (1) | WO2020234478A1 (de) |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3059152A (en) * | 1959-02-05 | 1962-10-16 | Globe Union Inc | Plug-in electronic circuit units and mounting panels |
| FR2562725B1 (fr) * | 1984-04-10 | 1987-02-20 | Souriau & Cie | Procede d'insertion d'un contact male dans un contact femelle, et moyen de mise en oeuvre du procede |
| US4894911A (en) * | 1989-02-09 | 1990-01-23 | Gte Products Corporation | Method and apparatus for loading electrical contacts into a connector body |
| US5208968A (en) * | 1991-11-27 | 1993-05-11 | Amp Incorporated | Programmable insertion tool for a pin header |
| JP3093476B2 (ja) * | 1992-08-31 | 2000-10-03 | ローム株式会社 | 電子部品およびその実装方法 |
| JPH09330753A (ja) * | 1996-06-10 | 1997-12-22 | Matsushita Electric Ind Co Ltd | 接続端子 |
| US5964596A (en) * | 1998-02-02 | 1999-10-12 | Samtec, Inc. | Removable body for an electrical connector |
| JP2000200642A (ja) | 1999-01-04 | 2000-07-18 | Yazaki Corp | 基板接続用端子 |
| JP3287810B2 (ja) * | 1999-04-28 | 2002-06-04 | モレックス インコーポレーテッド | 電気コネクタ |
| US6593535B2 (en) | 2001-06-26 | 2003-07-15 | Teradyne, Inc. | Direct inner layer interconnect for a high speed printed circuit board |
| DE102008004882A1 (de) | 2008-01-17 | 2009-07-23 | Robert Bosch Gmbh | Einpresskontakt mit einem Sockel, einem Kontaktstift und einem zweiten Stift |
| DE102008041497A1 (de) * | 2008-08-25 | 2010-03-04 | Robert Bosch Gmbh | Bauteil mit einem mechanischen Kontakt und Verfahren zur Herstellung des Bauteils |
| DE102010047458A1 (de) * | 2010-10-06 | 2012-04-12 | Phoenix Contact Gmbh & Co. Kg | Anschlussklemme |
| JP2012134106A (ja) | 2010-12-24 | 2012-07-12 | Aisin Seiki Co Ltd | はんだ付け端子 |
| DE102011087616A1 (de) * | 2011-12-02 | 2013-06-06 | Robert Bosch Gmbh | Kontaktstift |
| DE102013111073A1 (de) * | 2013-10-07 | 2015-04-09 | Hella Kgaa Hueck & Co. | Elektronische Schaltung |
| JP6303957B2 (ja) * | 2014-09-26 | 2018-04-04 | 株式会社デンソー | 駆動装置 |
| DE102015111543A1 (de) * | 2015-07-16 | 2017-01-19 | Phoenix Contact Gmbh & Co. Kg | Grundleiste zum Verbinden mit mindestens einem Steckverbinderteil |
| DE102016124072B4 (de) | 2016-12-12 | 2020-07-16 | Te Connectivity Germany Gmbh | Kontakteinrichtung und Anordnung |
-
2019
- 2019-05-23 DE DE102019113788.8A patent/DE102019113788A1/de active Pending
-
2020
- 2020-05-25 CN CN202080038323.3A patent/CN113875092B/zh active Active
- 2020-05-25 US US17/612,583 patent/US12170431B2/en active Active
- 2020-05-25 WO PCT/EP2020/064374 patent/WO2020234478A1/de not_active Ceased
- 2020-05-25 EP EP20728019.9A patent/EP3973595A1/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN113875092B (zh) | 2024-05-07 |
| DE102019113788A1 (de) | 2020-11-26 |
| CN113875092A (zh) | 2021-12-31 |
| WO2020234478A1 (de) | 2020-11-26 |
| US12170431B2 (en) | 2024-12-17 |
| US20220239047A1 (en) | 2022-07-28 |
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