EP3766097A4 - Planarisation pour processus de fabrication de boîtier de dispositif à semi-conducteur - Google Patents
Planarisation pour processus de fabrication de boîtier de dispositif à semi-conducteur Download PDFInfo
- Publication number
- EP3766097A4 EP3766097A4 EP19766870.0A EP19766870A EP3766097A4 EP 3766097 A4 EP3766097 A4 EP 3766097A4 EP 19766870 A EP19766870 A EP 19766870A EP 3766097 A4 EP3766097 A4 EP 3766097A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- planarization
- semiconductor device
- device package
- fabrication processes
- package fabrication
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Formation Of Insulating Films (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862643222P | 2018-03-15 | 2018-03-15 | |
PCT/US2019/018154 WO2019177742A1 (fr) | 2018-03-15 | 2019-02-15 | Planarisation pour processus de fabrication de boîtier de dispositif à semi-conducteur |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3766097A1 EP3766097A1 (fr) | 2021-01-20 |
EP3766097A4 true EP3766097A4 (fr) | 2022-04-13 |
Family
ID=67908338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19766870.0A Pending EP3766097A4 (fr) | 2018-03-15 | 2019-02-15 | Planarisation pour processus de fabrication de boîtier de dispositif à semi-conducteur |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP3766097A4 (fr) |
JP (1) | JP7258906B2 (fr) |
KR (1) | KR102521991B1 (fr) |
CN (1) | CN111868920A (fr) |
TW (1) | TWI717690B (fr) |
WO (1) | WO2019177742A1 (fr) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11342256B2 (en) | 2019-01-24 | 2022-05-24 | Applied Materials, Inc. | Method of fine redistribution interconnect formation for advanced packaging applications |
IT201900006736A1 (it) | 2019-05-10 | 2020-11-10 | Applied Materials Inc | Procedimenti di fabbricazione di package |
IT201900006740A1 (it) | 2019-05-10 | 2020-11-10 | Applied Materials Inc | Procedimenti di strutturazione di substrati |
US11931855B2 (en) | 2019-06-17 | 2024-03-19 | Applied Materials, Inc. | Planarization methods for packaging substrates |
US11862546B2 (en) | 2019-11-27 | 2024-01-02 | Applied Materials, Inc. | Package core assembly and fabrication methods |
US11257790B2 (en) | 2020-03-10 | 2022-02-22 | Applied Materials, Inc. | High connectivity device stacking |
US11454884B2 (en) | 2020-04-15 | 2022-09-27 | Applied Materials, Inc. | Fluoropolymer stamp fabrication method |
US11400545B2 (en) | 2020-05-11 | 2022-08-02 | Applied Materials, Inc. | Laser ablation for package fabrication |
US11752519B2 (en) | 2020-06-19 | 2023-09-12 | Canon Kabushiki Kaisha | Planarization method and photocurable composition |
TWI751600B (zh) * | 2020-07-03 | 2022-01-01 | 財團法人工業技術研究院 | 封裝結構 |
US11232951B1 (en) | 2020-07-14 | 2022-01-25 | Applied Materials, Inc. | Method and apparatus for laser drilling blind vias |
US11676832B2 (en) | 2020-07-24 | 2023-06-13 | Applied Materials, Inc. | Laser ablation system for package fabrication |
US11521937B2 (en) | 2020-11-16 | 2022-12-06 | Applied Materials, Inc. | Package structures with built-in EMI shielding |
US11404318B2 (en) | 2020-11-20 | 2022-08-02 | Applied Materials, Inc. | Methods of forming through-silicon vias in substrates for advanced packaging |
US11705365B2 (en) | 2021-05-18 | 2023-07-18 | Applied Materials, Inc. | Methods of micro-via formation for advanced packaging |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010018229A1 (en) * | 2000-02-28 | 2001-08-30 | Nbc Corporation | Semiconductor device and method for fabricating same |
US20090179317A1 (en) * | 2008-01-11 | 2009-07-16 | Kabushiki Kaisha Toshiba | Semiconductor device and method for manufacturing the same |
US20090209052A1 (en) * | 2006-08-22 | 2009-08-20 | 3D Plus | Process for the collective fabrication of 3d electronic modules |
JP2011032436A (ja) * | 2009-08-05 | 2011-02-17 | Nitto Denko Corp | 電子部品封止用のシート状エポキシ樹脂組成物およびそれを用いた電子部品装置 |
US20110115125A1 (en) * | 2009-11-13 | 2011-05-19 | Freescale Semiconductor, Inc | Method and apparatus for molding substrate |
US20120126395A1 (en) * | 2010-11-18 | 2012-05-24 | Stats Chippac, Ltd. | Semiconductor Device and Method of Forming Uniform Height Insulating Layer Over Interposer Frame as Standoff for Semiconductor Die |
US20150357256A1 (en) * | 2014-06-08 | 2015-12-10 | UTAC Headquarters Pte. Ltd. | Semiconductor packages and methods of packaging semiconductor devices |
US20160126286A1 (en) * | 2012-05-30 | 2016-05-05 | Olympus Corporation | Method for producing image pickup apparatus and method for producing semiconductor apparatus |
US20160148887A1 (en) * | 2014-11-26 | 2016-05-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Device Package with Reduced Thickness and Method for Forming Same |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3420590B2 (ja) * | 1996-11-11 | 2003-06-23 | 触媒化成工業株式会社 | 基材の平坦化方法、被膜付基材および半導体装置の製造方法 |
US20060003600A1 (en) * | 2004-06-30 | 2006-01-05 | Barns Chris E | Contact planarization for integrated circuit processing |
US20070032083A1 (en) * | 2005-08-05 | 2007-02-08 | Hynix Semiconductor, Inc. | Planarization method for manufacturing semiconductor device |
JP2008114195A (ja) * | 2006-11-08 | 2008-05-22 | Tokyo Ohka Kogyo Co Ltd | 平坦化塗布方法 |
EP2214204B1 (fr) * | 2007-10-17 | 2013-10-02 | Panasonic Corporation | Structure de montage |
US20120064720A1 (en) * | 2010-09-10 | 2012-03-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Planarization control for semiconductor devices |
US9349622B2 (en) * | 2013-03-12 | 2016-05-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for planarization of substrate coatings |
WO2017203888A1 (fr) * | 2016-05-26 | 2017-11-30 | アピックヤマダ株式会社 | Procédé d'alimentation en résine, dispositif d'alimentation en résine, dispositif de moulage de résine, procédé de durcissement de résine et procédé de moulage de résine |
-
2019
- 2019-02-15 CN CN201980019163.5A patent/CN111868920A/zh active Pending
- 2019-02-15 WO PCT/US2019/018154 patent/WO2019177742A1/fr active Application Filing
- 2019-02-15 JP JP2020547376A patent/JP7258906B2/ja active Active
- 2019-02-15 KR KR1020207029381A patent/KR102521991B1/ko active IP Right Grant
- 2019-02-15 EP EP19766870.0A patent/EP3766097A4/fr active Pending
- 2019-02-18 TW TW108105230A patent/TWI717690B/zh active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010018229A1 (en) * | 2000-02-28 | 2001-08-30 | Nbc Corporation | Semiconductor device and method for fabricating same |
US20090209052A1 (en) * | 2006-08-22 | 2009-08-20 | 3D Plus | Process for the collective fabrication of 3d electronic modules |
US20090179317A1 (en) * | 2008-01-11 | 2009-07-16 | Kabushiki Kaisha Toshiba | Semiconductor device and method for manufacturing the same |
JP2011032436A (ja) * | 2009-08-05 | 2011-02-17 | Nitto Denko Corp | 電子部品封止用のシート状エポキシ樹脂組成物およびそれを用いた電子部品装置 |
US20110115125A1 (en) * | 2009-11-13 | 2011-05-19 | Freescale Semiconductor, Inc | Method and apparatus for molding substrate |
US20120126395A1 (en) * | 2010-11-18 | 2012-05-24 | Stats Chippac, Ltd. | Semiconductor Device and Method of Forming Uniform Height Insulating Layer Over Interposer Frame as Standoff for Semiconductor Die |
US20160126286A1 (en) * | 2012-05-30 | 2016-05-05 | Olympus Corporation | Method for producing image pickup apparatus and method for producing semiconductor apparatus |
US20150357256A1 (en) * | 2014-06-08 | 2015-12-10 | UTAC Headquarters Pte. Ltd. | Semiconductor packages and methods of packaging semiconductor devices |
US20160148887A1 (en) * | 2014-11-26 | 2016-05-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Device Package with Reduced Thickness and Method for Forming Same |
Non-Patent Citations (1)
Title |
---|
See also references of WO2019177742A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN111868920A (zh) | 2020-10-30 |
TW201946162A (zh) | 2019-12-01 |
KR20200120766A (ko) | 2020-10-21 |
WO2019177742A1 (fr) | 2019-09-19 |
KR102521991B1 (ko) | 2023-04-13 |
TWI717690B (zh) | 2021-02-01 |
EP3766097A1 (fr) | 2021-01-20 |
JP2021517360A (ja) | 2021-07-15 |
JP7258906B2 (ja) | 2023-04-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3766097A4 (fr) | Planarisation pour processus de fabrication de boîtier de dispositif à semi-conducteur | |
EP3698395A4 (fr) | Source de plasma sans appariement servant à la fabrication de tranches de semi-conducteurs | |
EP3534413A4 (fr) | Boîtier de dispositif à semi-conducteur | |
EP3846204A4 (fr) | Dispositif semi-conducteur | |
EP3901993A4 (fr) | Dispositif à semi-conducteur | |
EP3442038A4 (fr) | Tranche de semi-conducteur | |
EP3872844A4 (fr) | Dispositif à semi-conducteur | |
EP3823044A4 (fr) | Dispositif à semi-conducteur | |
EP3751622A4 (fr) | Dispositif à semi-conducteur | |
EP3828921A4 (fr) | Dispositif à semi-conducteur | |
EP3439024A4 (fr) | Film adhésif pour le traitement d'une tranche de semi-conducteur | |
EP3787011A4 (fr) | Procédé de fabrication de dispositif à semi-conducteur | |
EP3748688A4 (fr) | Dispositif à semi-conducteur | |
EP3916806A4 (fr) | Dispositif à semi-conducteur | |
EP4084064A4 (fr) | Dispositif à semi-conducteur | |
EP3974491A4 (fr) | Procédé de fabrication d'un dispositif à semi-conducteur | |
SG10202003905SA (en) | Semiconductor device | |
EP3872876A4 (fr) | Dispositif à semi-conducteur | |
EP3854916A4 (fr) | Procédé de fabrication d'une tranche de fabrication d'un dispositif | |
EP3761356A4 (fr) | Dispositif à semi-conducteur | |
EP3857603A4 (fr) | Fabrication de dispositif à semi-conducteur à super-jonction | |
EP3748855A4 (fr) | Dispositif à semi-conducteur | |
EP3591693A4 (fr) | Procédé de fabrication de dispositif à semi-conducteur | |
EP3703120A4 (fr) | Procédé de fabrication de dispositif à semiconducteur | |
EP4080561A4 (fr) | Dispositif à semi-conducteur |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
17P | Request for examination filed |
Effective date: 20201007 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 23/31 20060101ALI20211109BHEP Ipc: H01L 21/56 20060101AFI20211109BHEP |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20220315 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 23/31 20060101ALI20220309BHEP Ipc: H01L 21/56 20060101AFI20220309BHEP |