EP3715488A1 - Formwerkstoff für guss und kupferlegierungsmaterial - Google Patents
Formwerkstoff für guss und kupferlegierungsmaterial Download PDFInfo
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- EP3715488A1 EP3715488A1 EP18881052.7A EP18881052A EP3715488A1 EP 3715488 A1 EP3715488 A1 EP 3715488A1 EP 18881052 A EP18881052 A EP 18881052A EP 3715488 A1 EP3715488 A1 EP 3715488A1
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- 238000005266 casting Methods 0.000 title claims abstract description 73
- 239000000463 material Substances 0.000 title claims abstract description 71
- 239000000956 alloy Substances 0.000 title claims description 38
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 32
- 229910052802 copper Inorganic materials 0.000 claims abstract description 24
- 239000000203 mixture Substances 0.000 claims abstract description 15
- 239000012535 impurity Substances 0.000 claims abstract description 12
- 239000007769 metal material Substances 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims description 28
- 239000013078 crystal Substances 0.000 claims description 26
- 230000032683 aging Effects 0.000 claims description 21
- 229910052782 aluminium Inorganic materials 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 15
- 229910052719 titanium Inorganic materials 0.000 claims description 15
- 229910052742 iron Inorganic materials 0.000 claims description 14
- 229910052749 magnesium Inorganic materials 0.000 claims description 14
- 229910052748 manganese Inorganic materials 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 229910052725 zinc Inorganic materials 0.000 claims description 14
- 150000001875 compounds Chemical class 0.000 description 49
- 239000002244 precipitate Substances 0.000 description 30
- 230000007423 decrease Effects 0.000 description 24
- 230000000694 effects Effects 0.000 description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 239000000243 solution Substances 0.000 description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 12
- 239000011159 matrix material Substances 0.000 description 10
- 239000006104 solid solution Substances 0.000 description 10
- 229910045601 alloy Inorganic materials 0.000 description 9
- 238000001816 cooling Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000002994 raw material Substances 0.000 description 7
- 229910052726 zirconium Inorganic materials 0.000 description 7
- 229910052804 chromium Inorganic materials 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 230000003247 decreasing effect Effects 0.000 description 5
- 238000005728 strengthening Methods 0.000 description 5
- 229910017526 Cu-Cr-Zr Inorganic materials 0.000 description 4
- 229910017810 Cu—Cr—Zr Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000008646 thermal stress Effects 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000000265 homogenisation Methods 0.000 description 3
- 238000005098 hot rolling Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910017813 Cu—Cr Inorganic materials 0.000 description 2
- 238000009749 continuous casting Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001376 precipitating effect Effects 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000001095 inductively coupled plasma mass spectrometry Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/04—Continuous casting of metals, i.e. casting in indefinite lengths into open-ended moulds
- B22D11/059—Mould materials or platings
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Definitions
- the present invention relates to a casting mold material used when casting a metal material such as steel, aluminum, and copper, and a copper alloy material suitable for a member used in a high-temperature environment, such as the casting mold material described above.
- a casting mold material used when casting a metal material such as steel, aluminum, and copper is required to be excellent in properties such as high-temperature strength to withstand large thermal stress, high-temperature elongation to withstand a severe thermal fatigue environment, wear resistance (hardness) at high temperature, and thermal conductivity.
- a Cu-Cr-Zr alloy such as C18150 has excellent heat resistance and conductive property (thermal conductivity), and thus is used as a material such as a casting mold material which is used in an environment at high temperature, as shown in PTLs 1 and 2.
- the Cu-Cr-Zr alloy described above is usually produced by a production step in which a Cu-Cr-Zr alloy ingot is subjected to plastic working, a solution treatment, for example, at a holding temperature of 950°C to 1050°C for a holding time of 0.5 to 1.5 hours and an aging treatment, for example, at a holding temperature of 400°C to 500°C for a holding time of 2 to 4 hours, and finally a predetermined shape is obtained by machining.
- the Cu-Cr-Zr alloy has improve strength and conductive property (thermal conductivity) by dissolving Cr and Zr in a Cu matrix by solution treatment and finely dispersing a Cr precipitate (Cu-Cr) or a Zr precipitate (Cu-Zr) by an aging treatment.
- the temperature of a molten metal injected into a mold may be set high, and high-temperature strength superior to that of the related art is required. Also, in the mold, the temperature near a molten metal surface tends to increase locally. Therefore, a dispersion state of the precipitate changes in a region where the temperature is high, and local decrease in strength and improvement of conductive property (improvement of thermal conductivity) occur in the mold, and a cooling state becomes unstable. Thus, there was a concern that casting could not be performed stably.
- the present invention has been made in view of the above-described circumstances, and an object thereof is to provide a casting mold material which is excellent in high-temperature strength, prevents local decrease in strength and improvement of conductive property (thermal conductivity) from occurring even in the case of being used under high-temperature conditions, and is capable of stably performing casting, and a copper alloy material suitable for the casting mold material.
- a casting mold material of the present invention used when casting a metal material includes, as a composition: Cr within a range of 0.3 mass% or more and 0.7 mass% or less; Zr within a range of 0.025 mass% or more and 0.15 mass% or less; Sn within a range of 0.005 mass% or more and 0.04 mass% or less; P within a range of 0.005 mass% or more and 0.03 mass% or less; and a balance consisting of Cu and inevitable impurities, in which a Zr content [Zr] (mass%) and a P content [P] (mass%) have a relationship of [Zr]/[P] ⁇ 5, and a Sn content [Sn] (mass%) and a P content [P] (mass%) have a relationship of [Sn]/[P] ⁇ 5.
- Cr is included within the range of 0.3 mass% or more and 0.7 mass% or less and Zr is included within the range of 0.025 mass% or more and 0.15 mass% or less. Therefore, a fine precipitate can be precipitated by an aging treatment, and strength and electrical conductivity can be improved.
- Sn is included within the range of 0.005 mass% or more and 0.04 mass% or less. Therefore, strength can be improved by solid solution strengthening.
- P is included within the range of 0.005 mass% or more and 0.03 mass% or less. Therefore, a Zr-P compound or a Cr-Zr-P compound is formed by reacting with Zr and Cr. These Zr-P compound and the Cr-Zr-P compound are stable even at high temperature. Therefore, even in the case of being used under high-temperature conditions, it is possible to prevent local decrease in strength and improvement of conductive property (thermal conductivity) from occurring. In addition, crystal grain size can be prevented from becoming coarse, and high-temperature strength can be improved.
- the Zr content [Zr] (mass%) and the P content [P] (mass%) have the relationship of [Zr]/[P] ⁇ 5. Therefore, even when the Zr-P compound or the Cr-Zr-P compound is formed, the number of the Cu-Zr precipitates contributing to strength improvement is secured, and strength improvement can be achieved.
- the Sn content [Sn] (mass%) and P content [P] (mass%) have the relationship of [Sn]/[P] ⁇ 5. Therefore, the decrease in electrical conductivity due to a solid solution of Sn can be compensated for by an increase in electrical conductivity due to the formation of the Zr-P compound or the Cr-Zr-P compound, and excellent conductive property (thermal conductivity) can be secured.
- the casting mold material of the present invention may further include 0.005 mass% or more and 0.03 mass% or less of Si.
- the strength can be further improved by solid solution strengthening due to dissolving of Si in the copper matrix.
- a total content of elements of Mg, Al, Fe, Ni, Zn, Mn, Co, and Ti is preferably 0.03 mass% or less.
- the total content of elements of Mg, Al, Fe, Ni, Zn, Mn, Co, and Ti, which are impurity elements, is limited to 0.03 mass% or less. Therefore, it is possible to prevent a conductive property (thermal conductivity) from decreasing.
- electrical conductivity is preferably higher than 70% IACS.
- the electrical conductivity is higher than 70% IACS. Therefore, Cr precipitates and Zr precipitates are sufficiently dispersed, and the Zr-P compound or the Cr-Zr-P compound is formed. Accordingly, even in the case of being used under high-temperature conditions, it is possible to prevent local decrease in strength and improvement of conductive property (thermal conductivity) from occurring. In addition, crystal grain size can be prevented from becoming coarse, and high-temperature strength can be improved.
- Vickers hardness is preferably 115 Hv or more. In this case, the Vickers hardness is 115 Hv or more. Therefore, sufficient hardness is obtained, and it is possible to prevent deformation from occurring during use and use the material favorably as a casting mold material.
- an average crystal grain size after performing heat treatment at 1000°C for 30 minutes is preferably 100 ⁇ m or smaller.
- the crystal grain size is prevented from becoming coarse, and a decrease in strength can be prevented from occurring.
- propagation speed of a fracture can be suppressed and a large breakage due to thermal stress or the like can be prevented from occurring.
- a copper alloy material of the present invention includes, as a composition: Cr within a range of 0.3 mass% or more and 0.7 mass% or less; Zr within a range of 0.025 mass% or more and 0.15 mass% or less; Sn within a range of 0.005 mass% or more and 0.04 mass% or less; P within a range of 0.005 mass% or more and 0.03 mass% or less; and a balance consisting of Cu and inevitable impurities, in which a Zr content [Zr] (mass%) and a P content [P] (mass%) have a relationship of [Zr]/[P] ⁇ 5, a Sn content [Sn] (mass%) and a P content [P] (mass%) have a relationship of [Sn]/[P] ⁇ 5; and electrical conductivity after performing a solution treatment at 1015°C for 1.5 hours and then performing an aging treatment at 475°C for 3 hours is higher than 70% IACS.
- the copper alloy material of the present invention may further include 0.005 mass% or more and 0.03 mass% or less of Si.
- the strength can be further improved by solid solution strengthening due to dissolving of Si in the copper matrix.
- a total content of elements of Mg, Al, Fe, Ni, Zn, Mn, Co, and Ti is preferably 0.03 mass% or less.
- the total content of elements of Mg, Al, Fe, Ni, Zn, Mn, Co, and Ti, which are impurity elements, is limited to 0.03 mass% or less. Therefore, it is possible to prevent a conductive property (thermal conductivity) from decreasing.
- the present invention it is possible to provide a casting mold material which is excellent in high-temperature strength, prevents local decrease in strength and improvement of conductive property (thermal conductivity) from occurring even in the case of being used under high-temperature conditions, and is capable of stably performing casting, and a copper alloy material suitable for the casting mold material.
- the casting mold material is used as a continuous casting mold when casting continuously a metal material such as steel, aluminum, and copper.
- the copper alloy material is used as a material for the casting mold material described above.
- the casting mold material and the copper alloy material include, as a composition: Cr within a range of 0.3 mass% or more and 0.7 mass% or less; Zr within a range of 0.025 mass% or more and 0.15 mass% or less; Sn within a range of 0.005 mass% or more and 0.04 mass% or less; P within a range of 0.005 mass% or more and 0.03 mass% or less; and a balance consisting of Cu and inevitable impurities.
- a Sn content [Sn] (mass%) and a P content [P] (mass%) have a relationship of [Sn]/[P] ⁇ 5.
- the casting mold material and the copper alloy material may include Si within a range of 0.005 mass% or more and 0.03 mass% or less.
- a total content of elements of Mg, Al, Fe, Ni, Zn, Mn, Co, and Ti may be 0.03 mass% or less.
- electrical conductivity is preferably higher than 70% IACS.
- Vickers hardness is preferably 115 Hv or more.
- an average crystal grain size after performing heat treatment at 1000°C for 30 minutes is preferably 100 ⁇ m or smaller.
- electrical conductivity after performing a solution treatment at 1015°C for 1.5 hours and then performing an aging treatment at 475°C for 3 hours is preferably higher than 70% IACS.
- Cr is an element having an effect of improving strength (hardness) and electrical conductivity by finely precipitating Cr precipitates (for example, Cu-Cr) in the crystal grains of a matrix by the aging treatment.
- Cr content is less than 0.3 mass%, the amount of precipitation becomes insufficient in the aging treatment, and the effect of improving the strength (hardness) and the electrical conductivity may not be sufficiently obtained.
- the Cr content is more than 0.7 mass%, a relatively coarse Cr crystallized product may be formed.
- the Cr content is set within the range of 0.3 mass% or more and 0.7 mass% or less.
- a lower limit of the Cr content is preferably set to 0.4 mass% or more, and an upper limit of the Cr content is preferably set to 0.6 mass% or less.
- Zr is an element having an effect of improving strength (hardness) and electrical conductivity by finely precipitating Zr precipitates (for example, Cu-Zr) at a grain boundary of a matrix by the aging treatment.
- Zr content is less than 0.025 mass%, the amount of precipitation becomes insufficient in the aging treatment, and the effect of improving the strength (hardness) and the electrical conductivity may not be sufficiently obtained.
- the electrical conductivity may decrease, or the Zr precipitate may be coarsened and the effect of improving the strength may not be obtained.
- the Zr content is set within the range of 0.025 mass% or more and 0.15 mass% or less.
- a lower limit of the Zr content is preferably set to 0.05 mass% or more, and an upper limit of the Zr content is preferably set to 0.13 mass% or less.
- Sn is an element having an effect of improving strength by being dissolved in a copper matrix.
- Sn also has an effect of increasing a peak temperature of softening characteristics.
- the effect of improving the strength (hardness) by being dissolved may not be sufficiently obtained.
- the conductive property (thermal conductivity) may decrease.
- the Sn content is set within the range of 0.005 mass% or more and 0.04 mass% or less.
- a lower limit of the Sn content is preferably set to 0.01 mass% or more, and an upper limit of the Sn content is preferably set to 0.03 mass% or less.
- P is an element having effects of stably forming a Zr-P compound or a Cr-Zr-P compound at high temperature, together with Zr and Cr, and preventing the crystal grain size in a high-temperature state from becoming coarse.
- the P content is less than 0.005 mass%, there are concerns that the Zr-P compound or the Cr-Zr-P compound may not be formed sufficiently, and the effect of preventing the crystal grain size in a state of from becoming coarse at high temperature may not be obtained sufficiently.
- the P content is more than 0.03 mass%, there are concerns that the Zr-P compound or the Cr-Zr-P compound may be excessively formed, the number of the Cu-Zr precipitates contributing to strength improvement may be insufficient, and strength improvement cannot be achieved.
- the P content is set within the range of 0.005 mass% or more and 0.03 mass% or less.
- a lower limit of the P content is preferably set to 0.008 mass% or more, and an upper limit of the P content is preferably set to 0.020 mass% or less.
- the ratio [Zr]/[P] between the Zr content and the P content is set to be more than 5.
- the ratio [Zr]/[P] between the Zr content and the P content be 7 or more.
- Sn decreases the conductive property (thermal conductivity) by being dissolved in the copper matrix.
- P improves the conductive property (thermal conductivity) by forming the Zr-P compound or the Cr-Zr-P compound.
- the ratio [Sn]/[P] between the Sn content [Sn] (mass%) and the P content [P] (mass%) is more than 5
- the ratio [Sn]/[P] between the Sn content and the P content is set to be 5 or less.
- the ratio [Sn]/[P] between the Sn content and the P content is preferably 3 or less.
- Sn is an element having an effect of improving strength by being dissolved in a copper matrix, and may be added as needed.
- the Si content is less than 0.005 mass%, the effect of improving the strength (hardness) by being dissolved may not be sufficiently obtained.
- the conductive property thermal conductivity
- the Si content be set within a range of 0.005 mass% or more and 0.03 mass% or less.
- a lower limit of the Si content is preferably set to 0.010 mass% or more, and an upper limit of the Si content is preferably set to 0.025 mass% or less.
- Total content of Mg, Al, Fe, Ni, Zn, Mn, Co, and Ti 0.03 mass% or less
- Elements such as Mg, Al, Fe, Ni, Zn, Mn, Co, and Ti can significantly decrease the conductive property (thermal conductivity). Therefore, in order to reliably maintain a high conductive property (thermal conductivity), it is preferable to limit the total content of Mg, Al, Fe, Ni, Zn, Mn, Co, and Ti to 0.03 mass% or less. Furthermore, it is preferable to limit the total content of Mg, Al, Fe, Ni, Zn, Mn, Co, and Ti to 0.01 mass% or less.
- Examples of other inevitable impurities other than Mg, Al, Fe, Ni, Zn, Mn, Co, and Ti described above include B, Ag, Ca, Te, Sr, Ba, Sc, Y, Ti, Hf, V, Nb, Ta, Mo, W, Re, Ru, Os, Se, Rh, Ir, Pd, Pt, Au, Cd, Ga, In, Li, Ge, As, Sb, Tl, Pb, Be, N, H, Hg, Tc, Na, K, Rb, Cs, Po, Bi, lanthanoid, O, S, and C. Since these inevitable impurities may decrease the conductive property (thermal conductivity), the total amount thereof is preferably 0.05 mass% or less.
- the electrical conductivity of the casting mold material is higher than 70% IACS
- Cr precipitates and Zr precipitates are sufficiently dispersed, and the Zr-P compound or the Cr-Zr-P compound is formed. Accordingly, the strength and the conductive property (thermal conductivity) are improved, and even in the case of being used under high-temperature conditions, the crystal grain size can be prevented from becoming coarse.
- the electrical conductivity of the casting mold material is set to be higher than 70% IACS.
- the electrical conductivity of the casting mold material is further preferably set to be 75% IACS or more.
- the Vickers hardness of the casting mold material is 115 Hv or more, sufficient hardness can be secured and deformation during use can be suppressed.
- the Vickers hardness is set to 115 Hv or more.
- the Vickers hardness of the casting mold material is further preferably set to 130 Hv or more.
- the crystal grain size in a high-temperature state can be prevented from becoming coarse. Therefore, when limiting the average crystal grain size to 100 ⁇ m or smaller after performing heat treatment at 1000°C for 30 minutes, the Zr-P compound or the Cr-Zr-P compound can be stably formed at high temperature. Therefore, it is possible to prevent the strength from decreasing when used under high-temperature conditions. In addition, propagation speed of a fracture can be suppressed and a large breakage due to thermal stress or the like can be prevented from occurring.
- the average crystal grain size after performing the heat treatment at 1000°C for 30 minutes is set to 100 ⁇ m or smaller.
- an average crystal grain size after performing the heat treatment at 1000°C for 30 minutes is preferably set to 5 ⁇ m or larger and 70 ⁇ m or smaller.
- the copper alloy material in the case where electrical conductivity after performing a solution treatment at 1015°C for 1.5 hours and then performing an aging treatment at 475°C for 3 hours is higher than 70% IACS, Cr precipitates and Zr precipitates are sufficiently dispersed, and the Zr-P compound or the Cr-Zr-P compound is formed. Accordingly, even in the case of using the copper alloy material under high-temperature conditions, it is possible to prevent local decrease in strength or improvement of conductive property (thermal conductivity) from occurring. In addition, a crystal grain size can be prevented from becoming coarse, and high-temperature strength can be improved.
- electrical conductivity after performing a solution treatment at 1015°C for 1.5 hours and then performing an aging treatment at 475°C for 3 hours is set to be higher than 70% IACS.
- electrical conductivity after performing the solution treatment at 1015°C for 1.5 hours and then performing the aging treatment at 475°C for 3 hours is further preferably higher than 75% IACS.
- a copper raw material formed of oxygen-free copper with a copper purity of 99.99 mass% or higher is charged into a carbon crucible and melted using a vacuum melting furnace to obtain molten copper.
- the additive elements described above are added to the obtained molten metal so as to have a predetermined concentration, and the components are formulated to obtain molten copper alloy.
- raw materials for the additive elements Cr, Zr, Sn, and P for example, it is preferable that a Cr raw material with a purity of 99.9 mass% or higher be used, a Zr raw material with a purity of 99 mass% or higher be used, a Sn material with a purity of 99.9 mass% or higher be used, and P be used as a mother alloy with Cu.
- Si may be added as needed. In the case where Si is added, it is preferable to use a mother alloy with Cu.
- the molten copper alloy is poured into a mold to obtain an ingot.
- heat treatment is performed to homogenize the obtained ingot. Specifically, the ingot is subjected to a homogenization treatment in an air atmosphere under conditions of 950°C or higher and 1050°C or lower for 1 hour or longer.
- hot rolling is performed at a processing rate of 50% or higher and 99% or less in a temperature range of 900°C or higher and 1000°C or lower to obtain a rolled material.
- a method of hot working may be hot forging.
- cooling is performed by water cooling.
- the copper alloy material is produced by such steps.
- the rolled material obtained in the hot working step S03 is subjected to a solution treatment by performing heat treatment under conditions of 920°C or higher and 1050°C or lower and 0.5 hours or longer and 5 hours or shorter.
- the heat treatment is performed in, for example, an air or inert gas atmosphere, and cooling after the heating is performed by water cooling.
- an aging treatment is performed to finely precipitate precipitates such as Cr precipitates and Zr precipitates.
- the electrical conductivity after the solution treatment becomes higher than 70% IACS.
- the aging treatment is performed, for example, under conditions of 400°C or higher and 530°C or lower for 0.5 hours or longer and 5 hours or shorter.
- the method of heat treatment during the aging treatment is not particularly limited, and is preferably carried out in an inert gas atmosphere.
- a method of cooling after the heat treatment is not particularly limited, and is preferably carried out by water cooling.
- the casting mold material is produced by such steps.
- Cr is included within the range of 0.3 mass% or more and 0.7 mass% or less and Zr is included within the range of 0.025 mass% or more and 0.15 mass% or less. Therefore, a fine precipitate can be precipitated by an aging treatment, and strength and electrical conductivity can be improved.
- Sn is included within the range of 0.005 mass% or more and 0.04 mass% or less. Therefore, strength can be improved by solid solution strengthening.
- P is included within the range of 0.005 mass% or more and 0.03 mass% or less. Therefore, a Zr-P compound or a Cr-Zr-P compound is formed by reacting with Zr and Cr.
- the Zr-P compound and the Cr-Zr-P compound are stable even at high temperature. Therefore, even in the case of being used under high-temperature conditions, it is possible to prevent local decrease in strength and improvement of conductive property (thermal conductivity) from occurring.
- a crystal grain size can be prevented from becoming coarse, and high-temperature strength can be improved.
- the Zr content [Zr] (mass%) and the P content [P] (mass%) have the relationship of [Zr]/[P] ⁇ 5. Therefore, even when the Zr-P compound or the Cr-Zr-P compound is formed, the number of the Cu-Zr precipitates contributing to strength improvement is secured, and strength improvement can be achieved.
- the Sn content [Sn] (mass%) and P content [P] (mass%) have the relationship of [Sn]/[P] ⁇ 5. Therefore, the decrease in electrical conductivity due to a solid solution of Sn can be compensated for by an increase in electrical conductivity due to the formation of the Zr-P compound or the Cr-Zr-P compound, and excellent conductive property (thermal conductivity) can be secured.
- the casting mold material and the copper alloy material further include Si in an amount of 0.005 mass% or more and 0.03 mass% or less. Therefore, strength can be further improved by solid solution strengthening due to dissolving of Si in the copper matrix. In addition, since Si is not contained excessively, it is possible to prevent electrical conductivity from decreasing.
- the total content of elements of Mg, Al, Fe, Ni, Zn, Mn, Co, and Ti, which are impurity elements, is limited to 0.03 mass% or less. Therefore, it is possible to prevent a conductive property (thermal conductivity) from decreasing.
- the electrical conductivity is higher than 70% IACS, Cr precipitates and Zr precipitates are sufficiently dispersed, and the Zr-P compound or the Cr-Zr-P compound is formed. Accordingly, even in the case of being used under high-temperature conditions, it is possible to prevent local decrease in strength and improvement of conductive property (thermal conductivity) from occurring. In addition, crystal grain size can be prevented from becoming coarse, and high-temperature strength can be improved.
- the Vickers hardness is 115 Hv or more, sufficient hardness is obtained, and it is possible to prevent deformation from occurring and use the material favorably as a casting mold material.
- the average crystal grain size after performing the heat treatment at 1000°C for 30 minutes is set to 100 ⁇ m or smaller, even when used under high-temperature conditions, the crystal grain size is prevented from becoming coarse, and a decrease in strength can be prevented from occurring. In addition, propagation speed of a fracture can be suppressed and a large breakage due to thermal stress or the like can be prevented from occurring.
- a method of producing the casting mold material is not limited to the present embodiment, and the casting mold material may be produced by another production method.
- a continuous casting apparatus may be used in the melt casting step.
- a copper raw material formed of oxygen-free copper with a copper purity of 99.99 mass% or higher was prepared and charged into a carbon crucible and melted using a vacuum melting furnace (vacuum degree 10 -2 Pa or lower) to obtain molten copper.
- Other elements were added to the obtained molten copper to have the component compositions shown in Table 1, and after kept for 5 minutes, the molten copper alloy was poured into a cast iron mold to obtain an ingot.
- the size of the ingot was approximately 80 mm wide, approximately 50 mm thick, and approximately 130 mm long.
- a Cr raw material with a purity of 99.99 mass% or higher a Cr raw material with a purity of 99.99 mass% or higher, a Zr raw material with a purity of 99.95 mass% or higher, and a Sn material with a purity of 99.99 mass% or higher were used.
- homogenization treatment was performed in an air atmosphere under conditions of 1000°C for 1 hour, and then hot rolling was performed.
- a rolling reduction during hot rolling was set to 80%, and a hot-rolled material having a width of approximately 100 mm ⁇ thickness of approximately 10 mm ⁇ length of approximately 520 mm was obtained.
- solution treatment was performed under conditions of 1000°C for 1.5 hours, and then water-cooled.
- the obtained casting mold material was evaluated for a component composition, Vickers hardness (rolled surface), and electrical conductivity. In addition, an average crystal grain size after being kept at 1000°C for 30 minutes was measured. Evaluation results are shown in Table 1.
- the component composition of the obtained casting mold material was measured by ICP-MS analysis. Measurement results are shown in Table 1.
- Vickers hardness was measured using a Vickers hardness tester (manufactured by Akashi Seisakusho, Ltd.) at nine locations on the test piece as shown in FIG. 2 , and an average value of seven measured values excluding the maximum and minimum values was determined.
- a 10 mm ⁇ 15 mm test piece was collected for observation from the plate width center, and a surface thereof in a rolling direction was polished and then microetched.
- the microstructure was observed using an optical microscope, the crystal grain sizes were measured based on JIS H 0501: 1986 (cutting method), and the average crystal grain size was calculated.
- the present invention it is possible to provide a casting mold material which is excellent in high-temperature strength, prevents local decrease in strength and improvement of conductive property (thermal conductivity) from occurring even in the case of being used under high-temperature conditions, and is capable of stably performing casting and a copper alloy material suitable for the casting mold material.
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- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
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- Crystallography & Structural Chemistry (AREA)
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2017223760A JP7035478B2 (ja) | 2017-11-21 | 2017-11-21 | 鋳造用モールド材 |
PCT/JP2018/036324 WO2019102716A1 (ja) | 2017-11-21 | 2018-09-28 | 鋳造用モールド材、及び、銅合金素材 |
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EP3715488A1 true EP3715488A1 (de) | 2020-09-30 |
EP3715488A4 EP3715488A4 (de) | 2021-03-31 |
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EP18881052.7A Pending EP3715488A4 (de) | 2017-11-21 | 2018-09-28 | Formwerkstoff für guss und kupferlegierungsmaterial |
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US (1) | US20200215604A1 (de) |
EP (1) | EP3715488A4 (de) |
JP (1) | JP7035478B2 (de) |
KR (1) | KR102486303B1 (de) |
CN (1) | CN111212923B (de) |
WO (1) | WO2019102716A1 (de) |
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JP2020133000A (ja) * | 2019-02-20 | 2020-08-31 | 三菱マテリアル株式会社 | 銅合金材、整流子片、電極材 |
US20220119919A1 (en) * | 2019-02-20 | 2022-04-21 | Mitsubishi Materials Corporation | Copper alloy material, commutator segment, and electrode material |
CN115558874B (zh) * | 2022-11-04 | 2023-12-19 | 烟台万隆真空冶金股份有限公司 | 一种薄壁铜基合金玻璃模具的制备方法 |
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JPS58107460A (ja) | 1981-12-21 | 1983-06-27 | Chuetsu Gokin Chuko Kk | 析出硬化型連続鋳造用鋳型材料 |
JPS6141751A (ja) * | 1984-08-03 | 1986-02-28 | Sumitomo Light Metal Ind Ltd | リ−ドフレ−ム用銅合金材の製造法 |
JPH0593230A (ja) * | 1990-12-20 | 1993-04-16 | Toshiba Corp | リードフレーム材 |
DE69110435T2 (de) * | 1990-12-20 | 1995-11-16 | Toshiba Kawasaki Kk | Kupferlegierungen und daraus hergestellte Leitergitter. |
JP4951517B2 (ja) * | 2005-09-30 | 2012-06-13 | 三菱伸銅株式会社 | 溶融固化処理物並びに溶融固化処理用銅合金材及びその製造方法 |
CN101113498B (zh) * | 2007-07-13 | 2010-04-14 | 宁波博威合金材料股份有限公司 | 高强高导的低钙硼铬锆铜合金及其制造方法 |
JP5590990B2 (ja) | 2010-06-30 | 2014-09-17 | 株式会社Shカッパープロダクツ | 銅合金 |
KR101811080B1 (ko) * | 2010-08-27 | 2017-12-20 | 후루카와 덴키 고교 가부시키가이샤 | 구리합금판재 및 그의 제조방법 |
KR102385768B1 (ko) * | 2014-09-25 | 2022-04-11 | 미쓰비시 마테리알 가부시키가이샤 | 주조용 몰드재 및 Cu-Cr-Zr 합금 소재 |
JP6488951B2 (ja) * | 2014-09-25 | 2019-03-27 | 三菱マテリアル株式会社 | 鋳造用モールド材及びCu−Cr−Zr合金素材 |
JP6611222B2 (ja) * | 2015-02-24 | 2019-11-27 | 株式会社神戸製鋼所 | 高強度、高導電率で耐応力緩和特性に優れた電気電子部品用銅合金板及びその製造方法 |
JP2017057476A (ja) * | 2015-09-18 | 2017-03-23 | Dowaメタルテック株式会社 | 銅合金板材およびその製造方法 |
JP6693078B2 (ja) * | 2015-10-15 | 2020-05-13 | 三菱マテリアル株式会社 | 鋳造用モールド材 |
JP6693092B2 (ja) * | 2015-11-09 | 2020-05-13 | 三菱マテリアル株式会社 | 銅合金素材 |
JP6736869B2 (ja) * | 2015-11-09 | 2020-08-05 | 三菱マテリアル株式会社 | 銅合金素材 |
JP2017223760A (ja) | 2016-06-14 | 2017-12-21 | キヤノン株式会社 | 撮像装置及び焦点調節方法 |
-
2017
- 2017-11-21 JP JP2017223760A patent/JP7035478B2/ja active Active
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2018
- 2018-09-28 US US16/648,061 patent/US20200215604A1/en not_active Abandoned
- 2018-09-28 WO PCT/JP2018/036324 patent/WO2019102716A1/ja unknown
- 2018-09-28 EP EP18881052.7A patent/EP3715488A4/de active Pending
- 2018-09-28 CN CN201880066982.0A patent/CN111212923B/zh active Active
- 2018-09-28 KR KR1020207008276A patent/KR102486303B1/ko active IP Right Grant
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Publication number | Publication date |
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EP3715488A4 (de) | 2021-03-31 |
CN111212923B (zh) | 2021-12-14 |
KR20200087123A (ko) | 2020-07-20 |
KR102486303B1 (ko) | 2023-01-06 |
JP2019094530A (ja) | 2019-06-20 |
JP7035478B2 (ja) | 2022-03-15 |
US20200215604A1 (en) | 2020-07-09 |
CN111212923A (zh) | 2020-05-29 |
WO2019102716A1 (ja) | 2019-05-31 |
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