EP3438299B1 - Kupferlegierungsband für elektronische und elektrische vorrichtungen, komponente, anschlussklemme, sammelschiene und bewegliches teil für relais - Google Patents
Kupferlegierungsband für elektronische und elektrische vorrichtungen, komponente, anschlussklemme, sammelschiene und bewegliches teil für relais Download PDFInfo
- Publication number
- EP3438299B1 EP3438299B1 EP17775267.2A EP17775267A EP3438299B1 EP 3438299 B1 EP3438299 B1 EP 3438299B1 EP 17775267 A EP17775267 A EP 17775267A EP 3438299 B1 EP3438299 B1 EP 3438299B1
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- electronic
- electrical equipment
- copper alloy
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 78
- 238000005096 rolling process Methods 0.000 claims description 45
- 238000007747 plating Methods 0.000 claims description 41
- 239000010949 copper Substances 0.000 claims description 34
- 238000009864 tensile test Methods 0.000 claims description 18
- 239000012535 impurity Substances 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 description 87
- 239000000463 material Substances 0.000 description 37
- 238000005452 bending Methods 0.000 description 29
- 238000010438 heat treatment Methods 0.000 description 29
- 229910052802 copper Inorganic materials 0.000 description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 20
- 238000005336 cracking Methods 0.000 description 19
- 238000000034 method Methods 0.000 description 19
- 229910052749 magnesium Inorganic materials 0.000 description 18
- 230000007547 defect Effects 0.000 description 14
- 238000012360 testing method Methods 0.000 description 14
- 229910045601 alloy Inorganic materials 0.000 description 13
- 239000000956 alloy Substances 0.000 description 13
- 229910052698 phosphorus Inorganic materials 0.000 description 13
- 238000007788 roughening Methods 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 238000005266 casting Methods 0.000 description 11
- 238000001816 cooling Methods 0.000 description 11
- 238000011156 evaluation Methods 0.000 description 10
- 239000013078 crystal Substances 0.000 description 9
- 239000007789 gas Substances 0.000 description 9
- 238000002844 melting Methods 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- 239000012071 phase Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- 239000002994 raw material Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- 229910000765 intermetallic Inorganic materials 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000006104 solid solution Substances 0.000 description 6
- 230000003247 decreasing effect Effects 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 229910052717 sulfur Inorganic materials 0.000 description 5
- 229910017818 Cu—Mg Inorganic materials 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 238000010791 quenching Methods 0.000 description 4
- 230000000171 quenching effect Effects 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 238000005482 strain hardening Methods 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 230000000593 degrading effect Effects 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 238000001953 recrystallisation Methods 0.000 description 3
- 238000005204 segregation Methods 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000009749 continuous casting Methods 0.000 description 2
- 238000005242 forging Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910000905 alloy phase Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000001887 electron backscatter diffraction Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010731 rolling oil Substances 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000002798 spectrophotometry method Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000008207 working material Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/46—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for sheet metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/14—Terminal arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/54—Contact arrangements
- H01H50/56—Contact spring sets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/02—Single bars, rods, wires, or strips
Definitions
- the invention of the present application relates to a copper alloy plate strip for electronic and electrical equipment, a component for electronic and electrical equipment, a terminal, a busbar, and a movable piece for a relay formed of the copper alloy plate strip for electronic and electrical equipment.
- a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar, copper or a copper alloy with high conductivity has been used.
- the material constituting the component for electronic and electrical equipment is required to have high strength or excellent bending workability.
- a terminal such as a connector used in a high-temperature environment such as an engine room of a vehicle is required to have stress relaxation resistance.
- a Cu-Mg-based alloy is suggested in PTLs 1 and 2 as the material used for the terminal such as a connector or a press fit or the component for electronic and electrical equipment such as a movable piece for a relay, a lead frame, or a busbar.
- PTL 3 relates to a Cu-Mg-P based copper alloy Sn plated sheet including a copper alloy sheet as a base material, having a composition containing 0.2 to 1.2 mass% of Mg and 0.001 to 0.2 mass% of P and the balance Cu with inevitable impurities; and a plating coating film layer after a reflow treatment constituted of a Sn phase having a thickness of 0.3 to 0.8 ⁇ m, a Sn-Cu alloy phase having a thickness of 0.3 to 0.8 ⁇ m, a Cu phase having a thickness of 0 to 0.3 ⁇ m in this order from a surface to the base material.
- the ratio (A/B) of Mg concentration of the Sn phase (A) to Mg concentration of the base material (B) is 0.005 to 0.05.
- the ratio (C/B) of Mg concentration (C) at a boundary layer between the plating film layer and the base material and having a thickness of 0.2 to 0.6 ⁇ m to Mg concentration of the base material (B) is 0.1 to 0.3.
- PTL 4 relates to a copper alloy sheet having a composition containing 0.2% to 1.2% by mass of Mg, and 0.001% to 0.2% by mass of P, the balance being Cu and unavoidable impurities.
- a surface crystal orientation of the copper alloy sheet satisfies a relation of 4.0 ⁇ I ⁇ 110 ⁇ /I0 ⁇ 110 ⁇ ⁇ 6.0.
- PTL 5 relates to a Cu alloy extra fine wire formed of an alloy having a composition constituted of, by weight, 0.1 to 1% Mg and 0.001 to 0.02% P, and the balance being Cu with unavoidable impurities and ⁇ 10ppm O and ⁇ 15ppm S.
- PTL 6 relates to a copper alloy sheet having a composition comprising, by mass, 0.2 to 1.2% Mg and 0.001 to 0.2% P, and the balance being Cu and inevitable impurities.
- the Bragg orientation density is 4 to 19%
- Copper orientation density is 2 to 13%
- all crystal grain sizes are 10 ⁇ m
- the area ratio of the crystal grains with the crystal grain sizes of 5 ⁇ m or lower is 75% or higher.
- the content of O or the content of S is not considered. Therefore, there is a concern that defects occur during processing due to generation of inclusions formed of Mg oxide or Mg sulfide and thus the cold workability and the bending workability are degraded. Further, since the content of H is not considered, there is a concern that defects occur during processing due to the occurrence of blow-hole defects in an ingot and thus the cold workability and the bending workability are degraded. In addition, since the content of C is not considered, there is a concern that the cold workability is degraded due to defects caused by C during casting.
- the present invention has been made in consideration of the above-described circumstances, and an object thereof is to provide a copper alloy plate strip for electronic and electrical equipment, a component for electronic and electrical equipment, a terminal, a busbar, and a movable piece for a relay with excellent conductivity, cold workability, bending workability, and castability.
- a copper alloy plate strip for electronic and electrical equipment (hereinafter, referred to as a "copper alloy plate strip for electronic and electrical equipment of the present invention") is provided as defined in the claims.
- the content of Mg is 0.15 mass% or greater and less than 0.35 mass%. Therefore, by solid-dissolving Mg in a mother phase of copper, the strength and the stress relaxation resistance can be improved without significantly degrading the conductivity.
- the content of P is 0.0005 mass% or greater and less than 0.01 mass%, the castability can be improved.
- the content [Mg] of Mg and the content [P] of P satisfy a relational expression of [Mg] + 20 ⁇ [P] ⁇ 0.5 in terms of mass ratio, generation of a coarse crystallized material containing Mg and P can be suppressed and degradation of cold workability and bending workability can be suppressed.
- the content of O is 100 mass ppm or less and the content of S is 50 mass ppm or less, inclusions formed of Mg oxide or Mg sulfide can be reduced and the occurrence of defects during processing can be suppressed. Moreover, consumption of Mg can be prevented by reacting with O and S and deterioration of mechanical characteristics can be suppressed.
- the content of H is 10 mass ppm or less, the occurrence of blow-hole defects in an ingot can be suppressed and the occurrence of defects during processing can be suppressed.
- the content of C is 10 mass ppm or less, the cold workability can be ensured and the occurrence of defects during processing can be suppressed.
- the alloy can be used for applications where pure copper has been used in the related art.
- the content [Mg] (mass%) of Mg and the content [P] (mass%) of P satisfy a relational expression of [Mg]/[P] ⁇ 400.
- the castability can be reliably improved by specifying the ratio between the content of Mg that decreases the castability and the content of P that improves the castability, as described above.
- a 0.2% proof stress measured at the time of a tensile test performed in a direction orthogonal to a rolling direction is 300 MPa or greater.
- the copper alloy is not easily deformed and is particularly suitable as a copper alloy constituting a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar.
- a residual stress ratio is 50% or greater under conditions of 150°C for 1000 hours.
- the alloy can be applied as a material of a component for electronic equipment to be used in a high-temperature environment such as an engine room.
- the copper alloy plate strip for electronic and electrical equipment since the copper alloy plate strip is formed of the copper alloy for electronic and electrical equipment, the conductivity, the strength, the cold workability, the bending workability, and the stress relaxation resistance are excellent. Accordingly, the copper alloy plate strip is particularly suitable as a material of a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar.
- the copper alloy plate strip for electronic and electrical equipment of the invention of the present application includes a plate material and a strip formed by winding the plate material in a coil shape.
- the copper alloy plate strip for electronic and electrical equipment of the invention of the present application, it is preferable that the copper alloy plate strip includes a Sn plating layer or a Ag plating layer on a surface of the copper alloy plate strip.
- the copper alloy plate strip since the surface of the copper alloy plate strip has a Sn plating layer or a Ag plating layer, the copper alloy plate strip is particularly suitable as a material of a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar.
- the "Sn plating” includes pure Sn plating or Sn alloy plating
- the "Ag plating" includes pure Ag plating or Ag alloy plating.
- a component for electronic and electrical equipment according to another aspect of the invention of the present application includes the copper alloy plate strip for electronic and electrical equipment described above. Further, as the component for electronic and electrical equipment of the invention of the present application, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, and a busbar are exemplified.
- the component for electronic and electrical equipment with such a configuration is produced using the copper alloy plate strip for electronic and electrical equipment described above, excellent characteristics can be exhibited even in a case of miniaturization and reduction in thickness.
- the component includes a Sn plating layer or a Ag plating layer on a surface of the component.
- the Sn plating layer and the Ag plating layer may be formed on the copper alloy plate strip for electronic and electrical equipment in advance or may be formed after the component for electronic and electrical equipment is formed.
- a terminal according to another aspect of the invention of the present application includes the copper alloy plate strip for electronic and electrical equipment described above.
- the terminal with such a configuration is produced using the copper alloy plate strip for electronic and electrical equipment described above, excellent characteristics can be exhibited even in a case of miniaturization and reduction in thickness.
- the terminal includes a Sn plating layer or a Ag plating layer on a surface of the terminal.
- the Sn plating layer and the Ag plating layer may be formed on the copper alloy plate strip for electronic and electrical equipment in advance or may be formed after the terminal is formed.
- a busbar according to another aspect of the invention of the present application (hereinafter, referred to as a "busbar of the invention of the present application") includes the copper alloy plate strip for electronic and electrical equipment described above.
- busbar with such a configuration is produced using the copper alloy plate strip for electronic and electrical equipment described above, excellent characteristics can be exhibited even in a case of miniaturization and reduction in thickness.
- the busbar includes a Sn plating layer or a Ag plating layer on a surface of the busbar.
- the Sn plating layer and the Ag plating layer may be formed on the copper alloy plate strip for electronic and electrical equipment in advance or may be formed after the busbar is formed.
- a movable piece for a relay according to another aspect of the invention of the present application includes the copper alloy plate strip for electronic and electrical equipment described above.
- the movable piece for a relay with such a configuration is produced using the copper alloy plate strip for electronic and electrical equipment described above, excellent characteristics can be exhibited even in a case of miniaturization and reduction in thickness.
- the movable piece for a relay of the invention of the present application includes a Sn plating layer or a Ag plating layer on a surface of the movable piece. Further, the Sn plating layer and the Ag plating layer may be formed on the copper alloy plate strip for electronic and electrical equipment in advance or may be formed after the movable piece for a relay is formed.
- a copper alloy plate strip for electronic and electrical equipment for electronic and electrical equipment, a component for electronic and electrical equipment, a terminal, a busbar, and a movable piece for a relay with excellent conductivity, cold workability, bending workability, and castability.
- FIG. 1 is a flow chart showing a method of producing a copper alloy for electronic and electrical equipment for use in an embodiment of the present invention.
- Mg is an element having a function of improving the strength and the stress relaxation resistance without significantly degrading the conductivity through solid solution in a mother phase of a copper alloy.
- the content of Mg is set to be 0.15 mass% or greater and less than 0.35 mass%.
- the lower limit of the content of Mg is set to preferably 0.16 mass% or greater and more preferably 0.17 mass% or greater. Further, in order to reliably suppress degradation of the conductivity and degradation of the castability, the upper limit of the content of Mg is set to preferably 0.30 mass% or less and more preferably 0.28 mass% or less.
- P is an element having a function of improving the castability.
- the content of P is set to be 0.0005 mass% or greater and less than 0.01 mass%.
- the lower limit of the content of P is set to preferably 0.0007 mass% and more preferably 0.001 mass%.
- the upper limit of the content of P is set to preferably less than 0.009 mass%, more preferably less than 0.008 mass%, and preferably 0.0075 mass% or less. Further, the upper limit thereof is set to even still more preferably 0.0060 mass% or less and most preferably less than 0.0050 mass%.
- [Mg] + 20 ⁇ [P] is set to less than 0.5. Further, in order to reliably suppress coarsening and densification of the crystallized material and to suppress the occurrence of cracking during the cold working and the bend working, [Mg] + 20 ⁇ [P] is set to preferably less than 0.48 and more preferably less than 0.46. Further, [Mg] + 20 ⁇ [P] is set to still more preferably less than 0.44 and most preferably less than 0.42. Mg / P ⁇ 400
- Mg is an element having a function of increasing the viscosity of the molten copper alloy and decreasing the castability, it is necessary to optimize the ratio between the content of Mg and the content of P in order to reliably improve the castability.
- [Mg]/[P] is set to 400 or less. In order to further improve the castability, [Mg]/[P] is set to preferably 350 or less and more preferably 300 or less.
- the lower limit of [Mg]/[P] is set to preferably greater than 20 and more preferably greater than 25.
- H is an element that becomes water vapor by being connected with O during casting and allows blow-hole defects to occur in an ingot. Defects such as cracking during casting and swelling and peeling during rolling are caused by the blow-hole defects. It is known that the strength and the stress corrosion cracking characteristics deteriorate because the defects such as cracking, swelling, and peeling lead to stress concentration and cause fracture.
- the content of H is greater than 10 mass ppm, the above-described blow-hole defects easily occur.
- the content of H is specified to 10 mass ppm or less. Further, in order to further suppress the occurrence of the blow-hole defects, the content of H is set to preferably 4 mass ppm or less and more preferably 2 mass ppm or less.
- the lower limit of the content of H is not particularly limited, but extreme reduction of the content of H results in an increase of production cost. Therefore, the content of H is typically 0.1 mass ppm or greater.
- O is an element that reacts with each component element in a copper alloy to form oxides. Since these oxides serve as a starting point of fracture, the cold workability is degraded and the bending workability also deteriorates. Further, in a case where the content of O is greater than 100 mass ppm, since Mg is consumed due to the reaction between O and Mg, there is a concern that the solid solution amount of Mg in a mother phase of Cu is decreased and the mechanical characteristics deteriorate.
- the content of O is specified to 100 mass ppm or less.
- the content of O is particularly preferably 50 mass ppm or less and more preferably 20 mass ppm or less.
- the lower limit of the content of O is not particularly limited, but extreme reduction of the content of O results in an increase of production cost. Therefore, the content of O is typically 0.1 mass ppm or greater.
- S is an element that is present on a crystal grain boundary in the form of an intermetallic compound or a complex sulfide.
- the intermetallic compound or the complex sulfide present on the grain boundary causes grain boundary cracks during hot working and working cracks. Further, since the intermetallic compound or the complex sulfide serves as a starting point of fracture, the cold workability or bend workability deteriorates. Further, since Mg is consumed due to the reaction between S and Mg, there is a concern that the solid solution amount of Mg in a mother phase of Cu is decreased and the mechanical characteristics deteriorate.
- the content of S is specified to 50 mass ppm or less.
- the content of S is particularly preferably 40 mass ppm or less and more preferably 30 mass ppm or less.
- the lower limit of the content of S is not particularly limited, but extreme reduction of the content of S results in an increase of production cost. Therefore, the content of S is typically 1 mass ppm or greater.
- C is an element that is used to coat the surface of molten metal during melting and casting for the purpose of deoxidizing the molten metal and may be unavoidably mixed. In a case where the content of C is greater than 10 mass ppm, the mixture of C during the casting is increased.
- the element C or a complex carbide and segregation of a solid solution of C deteriorate the cold workability.
- the content of C is specified to 10 mass ppm or less.
- the content of C is particularly preferably 5 mass ppm or less and more preferably 1 mass ppm or less.
- the lower limit of the content of C is not particularly limited, but extreme reduction of the content of C results in an increase of production cost. Therefore, the content of C is typically 0.1 mass ppm or greater.
- unavoidable impurities include Ag, B, Ca, Sr, Ba, Sc, Y, rare earth elements, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Fe, Ru, Os, Co, Se, Te, Rh, Ir, Ni, Pd, Pt, Au, Zn, Cd, Hg, Al, Ga, In, Ge, Sn, As, Sb, Tl, Pb, Bi, Be, N, Si, and Li. Since these unavoidable elements have a function of decreasing the conductivity, the total amount thereof is set to 0.1 mass% or less.
- the total amount thereof is less than 500 mass ppm.
- the content of Sn is set to less than 50 mass ppm.
- the total amount of these elements is set to less than 500 mass ppm.
- the alloy by setting the conductivity to greater than 75% IACS, the alloy can be satisfactorily used as a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar.
- the conductivity is set to preferably greater than 76% IACS, more preferably greater than 77% IACS, still more preferably greater than 78% IACS, and even still more preferably greater than 80% IACS.
- the alloy for electronic and electrical equipment by setting the 0.2% proof stress to 300 MPa or greater, the alloy becomes particularly suitable as a material of a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar. Further, in the present embodiment, the 0.2% proof stress measured at the time of the tensile test performed in a direction orthogonal to the rolling direction is set to 300 MPa or greater.
- the 0.2% proof stress described above is set to preferably 325 MPa or greater and more preferably 350 MPa or greater.
- the residual stress ratio is set to 50% or greater under conditions of 150°C for 1000 hours as described above.
- the copper alloy for electronic equipment according to the present embodiment can be applied as a terminal to be used in a high-temperature environment such as the periphery of an engine room of a vehicle.
- the residual stress ratio measured at the time of a stress relaxation test performed in a direction orthogonal to the rolling direction is set to is set to 50% or greater under conditions of 150°C for 1000 hours.
- the residual stress ratio is set to preferably 60% or greater under conditions of 150°C for 1000 hours and more preferably 70% or greater under conditions of 150°C for 1000 hours.
- the above-described elements are added to molten copper obtained by melting the copper raw material to adjust components, thereby producing a molten copper alloy. Further, a single element, a mother alloy, or the like can be used for addition of various elements. In addition, raw materials containing the above-described elements may be melted together with the copper raw material. Further, a recycled material or a scrap material of the present alloy may be used.
- the molten copper so-called 4 NCu having a purity of 99.99 mass% or greater or so-called 5 NCu having a purity of 99.999 mass% or greater is preferably used.
- raw materials with small contents of these elements are selected and used. Specifically, it is preferable to use a raw material having a H content of 0.5 mass ppm or less, an O content of 2.0 mass ppm or less, a S content of 5.0 mass ppm or less, and a C content of 1.0 mass ppm or less.
- the holding time at the time of melting is set to the minimum by performing atmosphere melting using an inert gas atmosphere (for example, Ar gas) in which the vapor pressure of H 2 O is low.
- an inert gas atmosphere for example, Ar gas
- the molten copper alloy in which the components have been adjusted is injected into a mold to produce an ingot.
- the size of the crystallized material can be set to be finer by increasing the solidification rate. Accordingly, the cooling rate of the molten metal is set to preferably 0. l°C/sec or greater, more preferably 0.5°C/sec or greater, and most preferably 1°C/sec or greater.
- a heat treatment is performed for homogenization and solutionization of the obtained ingot.
- Intermetallic compounds and the like containing Cu and Mg, as the main components, generated due to concentration through the segregation of Mg in the process of solidification are present in the ingot.
- Mg is allowed to be homogeneously diffused or solid-dissolved in a mother phase in the ingot by performing the heat treatment of heating the ingot to a temperature range of 400°C to 900°C for the purpose of eliminating or reducing the segregation and the intermetallic compounds.
- this homogenizing and solutionizing step S02 is performed in a non-oxidizing or reducing atmosphere.
- the copper material heated to a temperature range of 400°C to 900°C is cooled to a temperature of 200°C or lower at a cooling rate of 60°C/min or greater.
- the heating temperature is set to be in a range of 400°C to 900°C.
- the heating temperature is set to more preferably 500°C to 850°C and still more preferably 520°C to 800°C.
- Hot working may be performed for the purpose of increasing efficiency of roughening and homogenizing the structure.
- the temperature condition in this hot working step S03 is not particularly limited, but is preferably set to be in a range of 400°C to 900°C. According to a cooling method after the working, it is preferable that the cooling is performed to a temperature of 200°C or lower at a cooling rate of 60°C/min or greater through water quenching or the like. Further, the working method is not particularly limited, and examples of the method which can be employed include rolling, drawing, extruding, groove rolling, forging, and pressing.
- the temperature condition in this roughening step S04 is not particularly limited, but is set to be preferably in a range of -200°C to 200°C, which is the range for cold or warm working, and particularly preferably room temperature in order to suppress re-crystallization or improve dimensional accuracy.
- the working ratio (rolling ratio) is preferably 20% or greater and more preferably 30% or greater.
- the working method is not particularly limited, and examples of the method which can be employed include rolling, drawing, extruding, groove rolling, forging, and pressing.
- a heat treatment is performed for the softening purpose after the roughening step S04.
- a method of the heat treatment is not particularly limited, and the heat treatment is performed in a non-oxidizing atmosphere or a reducing atmosphere preferably in a holding temperature range of 400°C to 900°C for a holding time of 10 seconds to 10 hours.
- the cooling method after the working is not particularly limited, but it is preferable that a method in which the cooling rate for water quenching or the like is set to 200°C/min or greater is used.
- the roughening step S04 and the intermediate heat treatment step S05 may be repeatedly performed.
- the temperature condition in this finishing step S06 is not particularly limited, but is set to be preferably in a range of -200°C to 200°C, which is the range for cold or warm working, and particularly preferably room temperature in order to suppress re-crystallization or softening.
- the working ratio is appropriately selected such that the shape of the copper material approximates the final shape, but it is preferable that the working ratio is set to 20% or greater from the viewpoint of improving the strength through work hardening in the finishing step S06. In a case of further improving the strength, the working ratio is set to more preferably 30% or greater, still more preferably 40% or greater, and most preferably 60% or greater. Further, since the bending workability deteriorates due to an increase of the working ratio, it is preferable that the working ratio is set to 99% or less.
- the heat treatment temperature is set to be in a range of 100°C to 800°C. Further, in this finish heat treatment step S07, it is necessary to set heat treatment conditions (the temperature, the time, and the cooling rate) for the purpose of avoiding a significant decrease of the strength due to re-crystallization. For example, it is preferable that the material is held at 300°C for 1 second to 120 seconds. This heat treatment is performed in a non-oxidizing or reducing atmosphere.
- a method of performing the heat treatment is not particularly limited, but it is preferable that the heat treatment is performed using a continuous annealing furnace for a short period of time from the viewpoint of the effects of reducing the production cost.
- finishing step S06 and the finish heat treatment step S07 may be repeatedly performed.
- a copper alloy plate strip for electronic and electrical equipment (a plate material or a strip obtained by forming a plate material in a coil shape) according to the present embodiment is produced.
- the plate thickness of the copper alloy plate strip for electronic and electrical equipment is greater than 0.05 mm and 3.0 mm or less and preferably greater than 0.1 mm and less than 3.0 mm.
- the plate thickness of the copper alloy plate strip for electronic and electrical equipment is 0.05 mm or less, the copper alloy plate strip is not suitable for use as a conductor in high current applications.
- the plate thickness is greater than 3.0 mm, it is difficult to carry out press punching.
- the copper alloy plate strip for electronic and electrical equipment may be used as a component for electronic and electrical equipment as it is, but a Sn plating layer or a Ag plating layer having a film thickness of 0.1 to 100 ⁇ m may be formed on one or both plate surfaces. At this time, it is preferable that the plate thickness of the copper alloy plate strip for electronic and electrical equipment is set to 10 to 1000 times the thickness of the plating layer.
- the copper alloy for electronic and electrical equipment (the copper alloy plate strip for electronic and electrical equipment) according to the present embodiment as a material, for example, a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar is formed by performing punching or bending on the material.
- Selected copper having a H content of 0.1 mass ppm or less, an O content of 1.0 mass ppm or less, a S content of 1.0 mass ppm or less, a C content of 0.3 mass ppm or less, and a Cu purity of 99.99 mass% or greater was prepared as a raw material, a high-purity alumina crucible was charged with the copper, and the copper was melted in a high-purity Ar gas (a dew point of -80°C or lower) atmosphere using a high-frequency melting furnace.
- a high-purity Ar gas a dew point of -80°C or lower
- an Ar-N 2 -H 2 and Ar-O 2 mixed gas atmosphere was prepared as the atmosphere at the time of melting using high-purity Ar gas (a dew point of -80°C or lower), high-purity N 2 gas (a dew point of -80°C or lower), high-purity O 2 gas (a dew point of -80°C or lower), and high-purity H 2 gas (a dew point of -80°C or lower).
- Ar gas a dew point of -80°C or lower
- high-purity N 2 gas a dew point of -80°C or lower
- high-purity O 2 gas a dew point of -80°C or lower
- high-purity H 2 gas a dew point of -80°C or lower
- Example 11 of the present invention a carbon mold was used in Example 11 of the present invention
- a heat insulating material (isowool) mold was used in Example 28 of the present invention
- a copper alloy mold having a water cooling function was used in Examples 1 to 10, 12 to 27, and 29 to 37 and Comparative Examples 1 to 11 as a casting mold.
- the size of an ingot was set to have a thickness of approximately 20 mm, a width of approximately 200 mm, and a length of approximately 300 mm.
- the vicinity of the casting surface was chamfered from the obtained ingot such that a block having a size of 16 mm ⁇ 200 mm ⁇ 100 mm was cut out.
- This block was heated for 4 hours under the temperature conditions listed in Tables 3 and 4 in an Ar gas atmosphere and was subjected to a homogenizing and solutionizing treatment.
- the copper material which had been subjected to a heat treatment was appropriately cut to have a shape suitable as the final shape and surface grinding was performed.
- rough rolling was performed at room temperature and a rolling ratio listed in Tables 3 and 4.
- the obtained strip was subjected to an intermediate heat treatment under the conditions listed in Tables 3 and 4 in an Ar gas atmosphere. Thereafter, water quenching was performed.
- finish rolling was performed at a rolling ratio listed in Tables 3 and 4 so that a thin plate having a thickness of 0.5 mm and a width of approximately 200 mm was produced.
- finish rolling was performed after the surface thereof was coated with rolling oil.
- the components were analyzed using the thin plate for evaluating characteristics obtained in the above-described manner.
- Mg and P were analyzed according to inductively coupled plasma atomic emission spectrophotometry.
- H was analyzed according to a thermal conductivity method, and O, S, and C were analyzed according to an infrared absorption method.
- the depth of the surface roughening indicates the depth of surface roughening formed toward the central portion from an end portion of an ingot.
- test pieces specified in JIS Z 2241 were collected from each strip for evaluating characteristics and the 0.2% proof stress was measured according to the offset method in JIS Z 2241. Further, the test pieces were collected in a direction orthogonal to the rolling direction. The evaluation results are listed in Tables 5 and 6.
- the measurement was performed such that the tensile test was performed ten times using the above-described No. 13B test pieces, and the number of times that the tensile test pieces were broken in an elastic region before the 0.2% proof stress was counted was set as the breakage number of the tensile test.
- the evaluation results are listed in Tables 5 and 6.
- the elastic region indicates a region that satisfies a linear relationship in a stress-strain curve. As this breakage number becomes larger, the workability is degraded due to inclusions.
- Test pieces having a width of 10 mm and a length of 150 mm were collected from each strip for evaluating characteristics and the electric resistance was calculated according to a 4-terminal method. Further, the dimension of each test piece was measured using a micrometer and the volume of the test piece was calculated. In addition, the conductivity was calculated from the measured electric resistance and volume. Further, the test pieces were collected such that the longitudinal directions thereof were perpendicular to the rolling direction of each strip for evaluating characteristics. The evaluation results are listed in Tables 5 and 6.
- a stress relaxation resistance test was carried out by loading stress according to a method in conformity with a cantilever screw type in Japan Elongated Copper Association Technical Standard JCBA-T309:2004 and measuring the residual stress ratio after storage at a temperature of 150°C for 1000 hours.
- test pieces (width of 10 mm) were collected in a direction orthogonal to the rolling direction from each strip for evaluating characteristics, the initial deflection displacement was set to 2 mm such that the maximum surface stress of each test piece was 80% of the proof stress, and the span length was adjusted.
- the maximum surface stress was determined according to the following equation.
- Maximum surface stress MPa 1.5 Et ⁇ 0 / L s 2
- Residual stress ratio % 1 ⁇ ⁇ t / ⁇ 0 ⁇ 100
- Bend working was performed in conformity with a 4 test method in Japan Elongated Copper Association Technical Standard JCBA-T307:2007.
- a plurality of test pieces having a width of 10 mm and a length of 30 mm were collected from each thin plate for evaluating characteristics such that the bending axis was in a direction orthogonal to the rolling direction.
- Comparative Example 8 the content of O was larger than the range of the invention of the present application (100 mass ppm or less). As a result of performing the tensile test ten times, the number of times that the tensile test pieces were broken in an elastic region was 8 times and deterioration of the workability due to inclusions was recognized. The bending workability was insufficient.
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Claims (13)
- Kupferlegierungsband für elektronische und elektrische Geräte, umfassend:0,15 Masse-% oder größer und weniger als 0,35 Masse-% Mg,0,0005 Masse-% oder größer und weniger als 0,01 Masse-% P undeinen Rest, der aus Cu und unvermeidlichen Verunreinigungen gebildet ist,wobei eine Leitfähigkeit größer als 75 % IACS ist,ein Gehalt [Mg] (Masse-%) von Mg und ein Gehalt [P] (Masse-%) von P den Vergleichsausdruck [Mg] + 20 × [P] < 0,5 erfüllen,ein H-Gehalt 10 Masse-ppm oder weniger beträgt, ein O-Gehalt 100 Masse-ppm oder weniger beträgt, ein S-Gehalt 50 Masse-ppm oder weniger beträgt und ein C-Gehalt 10 Masse-ppm oder weniger beträgt,Mg einen Mischkristall in einer Cu-Mutterphase bildet,eine Gesamtmenge der unvermeidlichen Verunreinigungen 0,1 Masse-% oder weniger beträgt undeine Gesamtmenge von Ag, Zn und Sn als unvermeidliche Verunreinigungen weniger als 500 Masse-ppm beträgt.
- Kupferlegierungsband für elektronische und elektrische Geräte gemäß Anspruch 1,
wobei der Gehalt [Mg] (Masse-%) von Mg und der Gehalt [P] (Masse-%) von P den Vergleichsausdruck [Mg]/[P] ≤ 400 erfüllen. - Kupferlegierungsband für elektronische und elektrische Geräte gemäß Anspruch 1 oder 2,
wobei eine 0,2 %-Dehngrenze, gemessen zum Zeitpunkt eines Zugversuchs, der in einer orthogonalen Richtung zu einer Walzrichtung durchgeführt wird, 300 MPa oder größer ist. - Kupferlegierungsband für elektronische und elektrische Geräte gemäß einem der Ansprüche 1 bis 3,
wobei ein Eigenspannungsverhältnis 50 % oder größer unter Bedingungen von 150°C für 1.000 Stunden ist. - Kupferlegierungsband für elektronische und elektrische Geräte gemäß einem der Ansprüche 1 bis 4,
wobei das Kupferlegierungsband eine Sn-Plattierungsschicht oder eine Ag-Plattierungsschicht auf einer Oberfläche des Kupferlegierungsbands einschließt. - Komponente für elektronische und elektrische Geräte, umfassend:
das Kupferlegierungsband für elektronische und elektrische Geräte gemäß einem der Ansprüche 1 bis 5. - Komponente für elektronische und elektrische Geräte gemäß Anspruch 6,
wobei die Komponente eine Sn-Plattierungsschicht oder eine Ag-Plattierungsschicht auf einer Oberfläche der Komponente einschließt. - Anschlussklemme, umfassend:
das Kupferlegierungsband für elektronische und elektrische Geräte gemäß einem der Ansprüche 1 bis 5. - Anschlussklemme gemäß Anspruch 8,
wobei die Anschlussklemme eine Sn-Plattierungsschicht oder eine Ag-Plattierungsschicht auf einer Oberfläche der Anschlussklemme einschließt. - Sammelschiene, umfassend:
das Kupferlegierungsband für elektronische und elektrische Geräte gemäß einem der Ansprüche 1 bis 5. - Sammelschiene gemäß Anspruch 10,
wobei die Sammelschiene eine Sn-Plattierungsschicht oder eine Ag-Plattierungsschicht auf einer Oberfläche der Sammelschiene einschließt. - Bewegliches Teil für ein Relais, umfassend:
das Kupferlegierungsband für elektronische und elektrische Geräte gemäß einem der Ansprüche 1 bis 5. - Bewegliches Teil für ein Relais gemäß Anspruch 12,
wobei das bewegliche Teil eine Sn-Plattierungsschicht oder eine Ag-Plattierungsschicht auf einer Oberfläche des beweglichen Teils einschließt.
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US10676803B2 (en) | 2015-09-09 | 2020-06-09 | Mitsubishi Materials Corporation | Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar |
WO2017170699A1 (ja) | 2016-03-30 | 2017-10-05 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片 |
FI3438299T3 (fi) | 2016-03-30 | 2023-05-23 | Mitsubishi Materials Corp | Kupariseoksesta valmistettu nauha elektronisia laitteita ja sähkölaitteita varten, komponentti, liitosnapa, virtakisko sekä liikuteltava kappale releitä varten |
JP7180101B2 (ja) * | 2018-03-30 | 2022-11-30 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー |
EP3778941A4 (de) | 2018-03-30 | 2021-11-24 | Mitsubishi Materials Corporation | Kupferlegierung für elektronische/elektrische vorrichtung, kupferlegierungsblech/-bandmaterial für elektronische/elektrische vorrichtung, komponente für elektronische/elektrische vorrichtung, endgerät und sammelschiene |
JP6780187B2 (ja) | 2018-03-30 | 2020-11-04 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー |
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MX2021007760A (es) | 2018-12-26 | 2021-08-05 | Mitsubishi Materials Corp | Placa de aleacion de cobre, placa de aleacion de cobre con pelicula de recubrimiento unida y metodos respectivos para la fabrica cion de estos productos. |
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JP6076724B2 (ja) | 2012-12-06 | 2017-02-08 | 古河電気工業株式会社 | 銅合金材料およびその製造方法 |
JP5962707B2 (ja) * | 2013-07-31 | 2016-08-03 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用銅合金塑性加工材の製造方法、電子・電気機器用部品及び端子 |
JP6140032B2 (ja) * | 2013-08-30 | 2017-05-31 | Dowaメタルテック株式会社 | 銅合金板材およびその製造方法並びに通電部品 |
JP5847787B2 (ja) * | 2013-11-26 | 2016-01-27 | Jx日鉱日石金属株式会社 | 導電性及び応力緩和特性に優れる銅合金板 |
EP3348658B1 (de) * | 2015-09-09 | 2022-01-26 | Mitsubishi Materials Corporation | Kupferlegierung für elektronische/elektrische vorrichtung, plastisch verformtes kupferlegierungsmaterial für elektronische/elektrische vorrichtung, komponente für elektronische/elektrische vorrichtung, endgerät und sammelschiene |
MY170901A (en) * | 2015-09-09 | 2019-09-13 | Mitsubishi Materials Corp | Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar |
-
2017
- 2017-03-28 JP JP2017063258A patent/JP6226097B2/ja active Active
- 2017-03-29 KR KR1020187020683A patent/KR102327539B1/ko active IP Right Grant
- 2017-03-29 EP EP17775267.2A patent/EP3438299B1/de active Active
- 2017-03-29 MX MX2018011711A patent/MX2018011711A/es unknown
- 2017-03-29 CN CN201780005496.3A patent/CN108431256A/zh active Pending
- 2017-03-30 TW TW106110852A patent/TWI709651B/zh active
Also Published As
Publication number | Publication date |
---|---|
EP3438299A4 (de) | 2019-12-18 |
JP6226097B2 (ja) | 2017-11-08 |
KR20180125446A (ko) | 2018-11-23 |
CN108431256A (zh) | 2018-08-21 |
EP3438299A1 (de) | 2019-02-06 |
TW201807204A (zh) | 2018-03-01 |
MX2018011711A (es) | 2018-12-19 |
KR102327539B1 (ko) | 2021-11-16 |
JP2017186662A (ja) | 2017-10-12 |
TWI709651B (zh) | 2020-11-11 |
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