MX2018011711A - Aleacion de cobre para equipo electronico y electrico, tira de placa de aleacion de cobre para equipo electronico y electrico, componente para equipo electronico y electrico, terminal, barra colectora y pieza movil para rele. - Google Patents

Aleacion de cobre para equipo electronico y electrico, tira de placa de aleacion de cobre para equipo electronico y electrico, componente para equipo electronico y electrico, terminal, barra colectora y pieza movil para rele.

Info

Publication number
MX2018011711A
MX2018011711A MX2018011711A MX2018011711A MX2018011711A MX 2018011711 A MX2018011711 A MX 2018011711A MX 2018011711 A MX2018011711 A MX 2018011711A MX 2018011711 A MX2018011711 A MX 2018011711A MX 2018011711 A MX2018011711 A MX 2018011711A
Authority
MX
Mexico
Prior art keywords
electronic
electrical equipment
copper alloy
busbar
relays
Prior art date
Application number
MX2018011711A
Other languages
English (en)
Spanish (es)
Inventor
Maki Kazunari
Matsunaga Hirotaka
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority claimed from PCT/JP2017/012993 external-priority patent/WO2017170733A1/ja
Publication of MX2018011711A publication Critical patent/MX2018011711A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C21D9/46—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for sheet metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/14—Terminal arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/54—Contact arrangements
    • H01H50/56—Contact spring sets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electromagnetism (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
MX2018011711A 2016-03-30 2017-03-29 Aleacion de cobre para equipo electronico y electrico, tira de placa de aleacion de cobre para equipo electronico y electrico, componente para equipo electronico y electrico, terminal, barra colectora y pieza movil para rele. MX2018011711A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016069079 2016-03-30
JP2017063258A JP6226097B2 (ja) 2016-03-30 2017-03-28 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片
PCT/JP2017/012993 WO2017170733A1 (ja) 2016-03-30 2017-03-29 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片

Publications (1)

Publication Number Publication Date
MX2018011711A true MX2018011711A (es) 2018-12-19

Family

ID=60045499

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018011711A MX2018011711A (es) 2016-03-30 2017-03-29 Aleacion de cobre para equipo electronico y electrico, tira de placa de aleacion de cobre para equipo electronico y electrico, componente para equipo electronico y electrico, terminal, barra colectora y pieza movil para rele.

Country Status (6)

Country Link
EP (1) EP3438299B1 (de)
JP (1) JP6226097B2 (de)
KR (1) KR102327539B1 (de)
CN (1) CN108431256A (de)
MX (1) MX2018011711A (de)
TW (1) TWI709651B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI701351B (zh) 2015-09-09 2020-08-11 日商三菱綜合材料股份有限公司 電子／電氣機器用銅合金、電子／電氣機器用銅合金塑性加工材、電子／電氣機器用零件、端子以及匯流排
US11203806B2 (en) 2016-03-30 2021-12-21 Mitsubishi Materials Corporation Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay
US11319615B2 (en) 2016-03-30 2022-05-03 Mitsubishi Materials Corporation Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay
US11104977B2 (en) 2018-03-30 2021-08-31 Mitsubishi Materials Corporation Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar
JP6780187B2 (ja) 2018-03-30 2020-11-04 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
JP7180102B2 (ja) * 2018-03-30 2022-11-30 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
JP7180101B2 (ja) * 2018-03-30 2022-11-30 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
JP6863409B2 (ja) * 2018-12-26 2021-04-21 三菱マテリアル株式会社 銅合金板、めっき皮膜付銅合金板及びこれらの製造方法
MX2021007760A (es) 2018-12-26 2021-08-05 Mitsubishi Materials Corp Placa de aleacion de cobre, placa de aleacion de cobre con pelicula de recubrimiento unida y metodos respectivos para la fabrica cion de estos productos.
CN110172609A (zh) * 2019-05-16 2019-08-27 红河学院 一种高强度高导电率铜镁系合金及其制备方法
CN114787400B (zh) * 2019-11-29 2023-05-26 三菱综合材料株式会社 铜合金、铜合金塑性加工材、电子电气设备用组件、端子、汇流条及散热基板
US20220403485A1 (en) * 2019-11-29 2022-12-22 Mitsubishi Materials Corporation Copper alloy, copper alloy plastic working material, electronic/electrical device component, terminal, busbar, and heat-diffusing substrate
JP7443737B2 (ja) * 2019-12-10 2024-03-06 三菱マテリアル株式会社 銅合金板、めっき皮膜付銅合金板及びこれらの製造方法

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US3778318A (en) 1969-02-24 1973-12-11 Cooper Range Co Copper base composition
JP2661462B2 (ja) * 1992-05-01 1997-10-08 三菱伸銅株式会社 繰り返し曲げ性にすぐれた直経：０．１ｍｍ以下のＣｕ合金極細線
JP3796784B2 (ja) * 1995-12-01 2006-07-12 三菱伸銅株式会社 コネクタ製造用銅合金薄板およびその薄板で製造したコネクタ
JP4756197B2 (ja) 2005-08-23 2011-08-24 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｍｇ−Ｐ系銅合金およびその製造法
CN1924048A (zh) * 2005-08-31 2007-03-07 上海科泰铜业有限公司 汽车电器用高导电率铜镁合金
JP5311283B2 (ja) 2009-03-11 2013-10-09 住友電気工業株式会社 非水電解質電池、およびその製造方法
JP4516154B1 (ja) * 2009-12-23 2010-08-04 三菱伸銅株式会社 Ｃｕ−Ｍｇ−Ｐ系銅合金条材及びその製造方法
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JP5848169B2 (ja) 2012-03-14 2016-01-27 Ｄｏｗａメタルテック株式会社 銀めっき材
WO2013150627A1 (ja) * 2012-04-04 2013-10-10 三菱伸銅株式会社 優れた耐疲労特性を有するＣｕ－Ｍｇ－Ｐ系銅合金板及びその製造方法
JP6054085B2 (ja) * 2012-07-24 2016-12-27 三菱伸銅株式会社 曲げ加工後のばね限界値特性及び耐疲労特性に優れたＣｕ−Ｍｇ−Ｐ系銅合金板及びその製造方法
JP6055242B2 (ja) * 2012-08-30 2016-12-27 三菱伸銅株式会社 Ｃｕ−Ｍｇ−Ｐ系銅合金Ｓｎめっき板及びその製造方法
JP6076724B2 (ja) 2012-12-06 2017-02-08 古河電気工業株式会社 銅合金材料およびその製造方法
JP5962707B2 (ja) * 2013-07-31 2016-08-03 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用銅合金塑性加工材の製造方法、電子・電気機器用部品及び端子
JP6140032B2 (ja) * 2013-08-30 2017-05-31 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法並びに通電部品
JP5847787B2 (ja) * 2013-11-26 2016-01-27 Jx日鉱日石金属株式会社 導電性及び応力緩和特性に優れる銅合金板
KR102473001B1 (ko) * 2015-09-09 2022-11-30 미쓰비시 마테리알 가부시키가이샤 전자·전기 기기용 구리 합금, 전자·전기 기기용 구리 합금 소성 가공재, 전자·전기 기기용 부품, 단자, 및 버스 바
MY170901A (en) * 2015-09-09 2019-09-13 Mitsubishi Materials Corp Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar

Also Published As

Publication number Publication date
CN108431256A (zh) 2018-08-21
EP3438299A4 (de) 2019-12-18
TWI709651B (zh) 2020-11-11
JP6226097B2 (ja) 2017-11-08
EP3438299A1 (de) 2019-02-06
TW201807204A (zh) 2018-03-01
KR102327539B1 (ko) 2021-11-16
JP2017186662A (ja) 2017-10-12
KR20180125446A (ko) 2018-11-23
EP3438299B1 (de) 2023-05-03

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