EP3438298B1 - Kupferlegierung für elektronische/elektrische vorrichtungen, kupferlegierungsband für elektronische und elektrische vorrichtungen, komponente für elektronische und elektrische vorrichtung, endgerät, sammelschiene und bewegliches teil für relais - Google Patents

Kupferlegierung für elektronische/elektrische vorrichtungen, kupferlegierungsband für elektronische und elektrische vorrichtungen, komponente für elektronische und elektrische vorrichtung, endgerät, sammelschiene und bewegliches teil für relais Download PDF

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Publication number
EP3438298B1
EP3438298B1 EP17775233.4A EP17775233A EP3438298B1 EP 3438298 B1 EP3438298 B1 EP 3438298B1 EP 17775233 A EP17775233 A EP 17775233A EP 3438298 B1 EP3438298 B1 EP 3438298B1
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EP
European Patent Office
Prior art keywords
electronic
electrical equipment
copper alloy
mass
plate strip
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EP17775233.4A
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English (en)
French (fr)
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EP3438298A1 (de
EP3438298A4 (de
Inventor
Hirotaka Matsunaga
Kazunari Maki
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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Priority claimed from PCT/JP2017/012914 external-priority patent/WO2017170699A1/ja
Publication of EP3438298A1 publication Critical patent/EP3438298A1/de
Publication of EP3438298A4 publication Critical patent/EP3438298A4/de
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/002—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working by rapid cooling or quenching; cooling agents used therefor
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/14—Terminal arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/54—Contact arrangements
    • H01H50/56—Contact spring sets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members

Definitions

  • the invention of the present application relates to a copper alloy for electronic and electrical equipment suitable for a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar, and a copper alloy plate strip for electronic and electrical equipment, a component for electronic and electrical equipment, a terminal, a busbar, and a movable piece for a relay formed of the copper alloy for electronic and electrical equipment.
  • a terminal such as a connector or a press fit
  • a movable piece for a relay a lead frame, or a busbar
  • a copper alloy plate strip for electronic and electrical equipment
  • a component for electronic and electrical equipment a terminal, a busbar, and a movable piece for a relay formed of the copper alloy for electronic and electrical equipment.
  • a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar, copper or a copper alloy with high conductivity has been used.
  • the material constituting the component for electronic and electrical equipment is required to have high strength or high bending workability.
  • a terminal such as a connector used in a high temperature environment such as an engine room of a vehicle is required to have stress relaxation resistance.
  • a Cu-Mg-based alloy is suggested in PTLs 1 and 2 as the material used for the terminal such as a connector or a press fit or the component for electronic and electrical equipment such as a movable piece for a relay, a lead frame, or a busbar.
  • PTL 3 relates to a Sn-plated Cu-Mg-P based copper alloy sheet including: a copper alloy sheet as a base material having a composition containing 0.2 to 1.2 mass% of Mg and 0.001 to 0.2 mass% of P and the balance Cu with inevitable impurities; and a plating coating film layer composed of a Sn phase having a thickness of 0.3 to 0.8 ⁇ m, a Sn-Cu alloy phase having a thickness of 0.3 to 0.8 ⁇ m, and a Cu phase having a thickness of 0 to 0.3 ⁇ m in this order from the surface to the base material.
  • the ratio of the Mg concentration of the Sn phase (A) to the Mg concentration of the base material (B), (A/B), is 0.005 to 0.05.
  • the ratio of the Mg concentration (C) at a boundary layer between the plating film layer and the base material and having a thickness of 0.2 to 0.6 ⁇ m to the Mg concentration of the base material (B), (C/B), is
  • PTL 4 relates to a copper alloy sheet having a composition containing 0.2% by mass to 1.2% by mass of Mg, and 0.001% by mass to 0.2% by mass of P, the balance being Cu and unavoidable impurities.
  • X-ray diffraction intensity of a ⁇ 110 ⁇ crystal plane is set as I ⁇ 110 ⁇
  • X-ray diffraction intensity of ⁇ 110 ⁇ crystal plane of a pure copper standard powder is set as I0 ⁇ 110 ⁇
  • a surface crystal orientation of the copper alloy sheet satisfies a relation of 4.0 ⁇ I ⁇ 110 ⁇ /I0 ⁇ 110 ⁇ ⁇ 6.0.
  • PTL 5 relates to a Cu alloy extra fine wire formed of an alloy having a composition composed of, by weight, 0.1 to 1% Mg and 0.001 to 0.02% P, and the balance Cu with inevitable impurities and ⁇ 10ppm O and ⁇ 15ppm S.
  • PTL 6 relates to a copper alloy sheet having a composition comprising, by mass, 0.2 to 1.2% Mg and 0.001 to 0.2% P, and the balance Cu with inevitable impurities.
  • the grain orientation density is 4 to 19%
  • the copper orientation density is 2 to 13%
  • the total grain size is 10 ⁇ m or less
  • the area ratio of the crystal grains with the crystal grain sizes of 5 ⁇ m or less is 75% or more.
  • a component for electronic and electrical equipment for example, a terminal such as a connector, a movable piece for a relay, or a lead frame which has been used for electronic equipment or electrical equipment has been attempted along with reduction in weight of electronic and electrical equipment. Therefore, in the terminal such as a connector, it is necessary to perform severe bend working in order to ensure the contact pressure. Accordingly, bending workability is required more than ever before.
  • the present invention has been made in consideration of the above-described circumstances, and an object thereof is to provide a copper alloy for electronic and electrical equipment, a copper alloy plate strip for electronic and electrical equipment, a component for electronic and electrical equipment, a terminal, a busbar, and a movable piece for a relay with high conductivity and bending workability.
  • a copper alloy for electronic and electrical equipment including: 0.15 mass% or greater and less than 0.35 mass% of Mg; 0.0005 mass% or greater and less than 0.01 mass% of P; and a remainder which is formed of Cu and unavoidable impurities, in which a conductivity is greater than 75% IACS, and an average number of compounds containing Mg and P with a particle diameter of 0.1 ⁇ m or greater is 0.5 pieces/ ⁇ m 2 or less in observation using a scanning electron microscope.
  • the content of Mg is 0.15 mass% or greater and less than 0.35 mass%. Therefore, by solid-dissolving Mg in a mother phase of copper, the strength and the stress relaxation resistance can be improved without significantly degrading the conductivity. Specifically, since the conductivity is greater than 75% IACS, the copper alloy can be used for applications requiring high conductivity. Further, since the content of P is 0.0005 mass% or greater and less than 0.01 mass%, the viscosity of a molten copper alloy containing Mg can be decreased and the castability can be improved.
  • the average number of compounds containing Mg and P with a particle diameter of 0.1 ⁇ m or greater is 0.5 pieces/ ⁇ m 2 or less in observation using a scanning electron microscope, the compounds containing coarse Mg and P serving as a starting point of cracking are not largely dispersed in a mother phase and thus the bending workability is improved. Accordingly, it is possible to form a component for electronic and electrical equipment, for example, a terminal such as a connector, a movable piece for a relay, or a lead frame in a complicated shape.
  • a content [Mg] (mass%) of Mg and a content [P] (mass%) of P satisfy a relational expression of [Mg] + 20 ⁇ [P] ⁇ 0.5.
  • a content [Mg] (mass%) of Mg and a content [P] (mass%) of P satisfy a relational expression of [Mg]/[P] ⁇ 400.
  • the castability can be reliably improved by specifying the ratio between the content of Mg that decreases the castability and the content of P that improves the castability, as described above.
  • a 0.2% proof stress measured at the time of a tensile test performed in a direction orthogonal to a rolling direction is 300 MPa or greater.
  • the copper alloy is not easily deformed and is particularly suitable as a copper alloy constituting a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar.
  • a residual stress ratio is 50% or greater under conditions of 150°C for 1000 hours.
  • the stress relaxation rate is specified as described above, permanent deformation can be suppressed to the minimum when used in a high temperature environment, and a decrease in contact pressure of a connector terminal or the like can be prevented. Therefore, the alloy can be applied as a material of a component for electronic equipment to be used in a high temperature environment such as an engine room.
  • a copper alloy plate strip for electronic and electrical equipment according to another aspect of the invention of the present application (hereinafter, referred to as a "copper alloy plate strip for electronic and electrical equipment”) includes the copper alloy for electronic and electrical equipment.
  • the copper alloy plate strip for electronic and electrical equipment since the copper alloy plate strip is formed of the copper alloy for electronic and electrical equipment, the conductivity, the strength, the bending workability, and the stress relaxation resistance are excellent. Accordingly, the copper alloy plate strip is particularly suitable as a material of a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar.
  • the copper alloy plate strip for electronic and electrical equipment of the present disclosure includes a plate material and a strip formed by winding the plate material in a coil shape.
  • the copper alloy plate strip for electronic and electrical equipment of the present disclosure, it is preferable that the copper alloy plate strip includes a Sn plating layer or a Ag plating layer on a surface of the copper alloy plate strip.
  • the copper alloy plate strip since the surface of the copper alloy plate strip has a Sn plating layer or a Ag plating layer, the copper alloy plate strip is particularly suitable as a material of a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar.
  • the "Sn plating” includes pure Sn plating or Sn alloy plating
  • the "Ag plating” includes pure Ag plating or Ag alloy plating.
  • a component for electronic and electrical equipment according to another aspect of the invention of the present application includes the copper alloy plate strip for electronic and electrical equipment described above. Further, as the component for electronic and electrical equipment of the present disclosure, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, and a busbar are exemplified.
  • the component for electronic and electrical equipment with such a configuration is produced using the copper alloy plate strip for electronic and electrical equipment described above, excellent characteristics can be exhibited even in a case of miniaturization and reduction in thickness.
  • the component includes a Sn plating layer or a Ag plating layer on a surface of the component.
  • the Sn plating layer and the Ag plating layer may be formed on the copper alloy plate strip for electronic and electrical equipment in advance or may be formed after the component for electronic and electrical equipment is formed.
  • a terminal according to another aspect of the invention of the present application (hereinafter, referred to as a "terminal of the present disclosure") includes the copper alloy plate strip for electronic and electrical equipment described above.
  • the terminal with such a configuration is produced using the copper alloy plate strip for electronic and electrical equipment described above, excellent characteristics can be exhibited even in a case of miniaturization and reduction in thickness.
  • the terminal includes a Sn plating layer or a Ag plating layer on a surface of the terminal. Further, the Sn plating layer and the Ag plating layer may be formed on the copper alloy plate strip for electronic and electrical equipment in advance or may be formed after the terminal is formed.
  • a busbar according to another aspect of the invention of the present application (hereinafter, referred to as a "busbar of the present disclosure") includes the copper alloy plate strip for electronic and electrical equipment described above.
  • busbar with such a configuration is produced using the copper alloy plate strip for electronic and electrical equipment described above, excellent characteristics can be exhibited even in a case of miniaturization and reduction in thickness.
  • the busbar includes a Sn plating layer or a Ag plating layer on a surface of the busbar. Further, the Sn plating layer and the Ag plating layer may be formed on the copper alloy plate strip for electronic and electrical equipment in advance or may be formed after the busbar is formed.
  • a movable piece for a relay according to another aspect of the invention of the present application (hereinafter, referred to as a "movable piece for a relay of the present disclosure") includes the copper alloy plate strip for electronic and electrical equipment described above.
  • the movable piece for a relay with such a configuration is produced using the copper alloy plate strip for electronic and electrical equipment described above, excellent characteristics can be exhibited even in a case of miniaturization and reduction in thickness.
  • the movable piece for a relay of the present disclosure includes a Sn plating layer or a Ag plating layer on a surface of the movable piece. Further, the Sn plating layer and the Ag plating layer may be formed on the copper alloy plate strip for electronic and electrical equipment in advance or may be formed after the movable piece for a relay is formed.
  • a copper alloy for electronic and electrical equipment a copper alloy plate strip for electronic and electrical equipment, a component for electronic and electrical equipment, a terminal, a busbar, and a movable piece for a relay with excellent conductivity and bending workability.
  • Mg is an element having a function of improving the strength and the stress relaxation resistance without significantly degrading the conductivity through solid solution in a mother phase of a copper alloy.
  • the content of Mg is less than 0.15 mass%, there is a concern that the effects of the function are not sufficiently achieved. Further, in a case where the content of Mg is 0.35 mass% or greater, there is a concern that the conductivity is significantly degraded, the viscosity of a molten copper alloy is increased, and the castability is degraded.
  • the content of Mg is set to be 0.15 mass% or greater and less than 0.35 mass%.
  • the lower limit of the content of Mg is set to preferably 0.16 mass% or greater and more preferably 0.17 mass% or greater. Further, in order to reliably suppress degradation of the conductivity and degradation of the castability, the upper limit of the content of Mg is set to preferably 0.30 mass% or less and more preferably 0.28 mass% or less.
  • P is an element having a function of improving the castability.
  • the content of P is less than 0.0005 mass%, there is a concern that the effects of the function are not fully achieved. Further, in a case where the content of P is 0.01 mass% or greater, there is a concern that, since coarse compounds containing Mg and P with a particle diameter of 0.1 ⁇ m or greater are likely to be generated, the compounds serve as a starting point of fracture and cracking occurs during cold working or bend working.
  • the content of P is set to be 0.0005 mass% or greater and less than 0.01 mass%.
  • the lower limit of the content of P is set to preferably 0.0007 mass% and more preferably 0.001 mass%.
  • the upper limit of the content of P is set to preferably less than 0.009 mass%, more preferably less than 0.008 mass%, still more preferably 0.0075 mass% or less, and even still more preferably 0.0050 mass% or less.
  • [Mg] + 20 ⁇ [P] is set to less than 0.5. Further, in order to reliably suppress coarsening and densification of the compounds and to suppress occurrence of cracking during the cold working and the bend working, [Mg] + 20 ⁇ [P] is set to preferably less than 0.48 and more preferably less than 0.46. Further, [Mg] + 20 ⁇ [P] is set to still more preferably less than 0.44. Mg / P ⁇ 400
  • Mg is an element having a function of increasing the viscosity of the molten copper alloy and decreasing the castability, it is necessary to optimize the ratio between the content of Mg and the content of P in order to reliably improve the castability.
  • [Mg]/[P] is set to 400 or less. In order to further improve the castability, [Mg]/[P] is set to preferably 350 or less and more preferably 300 or less.
  • the lower limit of [Mg]/[P] is set to preferably greater than 20 and more preferably greater than 25.
  • unavoidable impurities include Ag, B, Ca, Sr, Ba, Sc, Y, rare earth elements, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Fe, Ru, Os, Co, Se, Te, Rh, Ir, Ni, Pd, Pt, Au, Zn, Cd, Hg, Al, Ga, In, Ge, Sn, As, Sb, Tl, Pb, Bi, Be, N, C, Si, Li, H, O, and S. Since these unavoidable impurities have a function of decreasing the conductivity, the total amount thereof is set to 0.1 mass% or less.
  • the total amount of the unavoidable elements is set to less than 500 mass ppm.
  • the content of Sn is set to less than 50 mass ppm.
  • the total amount of these elements is set to less than 500 mass ppm.
  • the average number of compounds containing Mg and P with a particle diameter of 0.1 ⁇ m or greater is 0.5 pieces/ ⁇ m 2 or less. In a case where a large amount of compounds with a large size are present, these compounds serve as a starting point of cracking and thus the bending workability significantly deteriorates.
  • the number of compounds containing Mg and P with a particle diameter of 0.05 ⁇ m or greater is 0.5 pieces/ ⁇ m 2 or less in the alloy.
  • the average number of compounds containing Mg and P is obtained by observing 10 visual fields at a magnification of 50000 times and a visual field of approximately 4.8 ⁇ m 2 using a field emission type scanning electron microscope and calculating the average value thereof.
  • the particle diameter of the compound containing Mg and P is set as an average value of the long diameter (the length of the longest straight line which can be drawn in a grain under a condition in which the line does not come into contact with the grain boundary in the middle of drawing) of the compound and the short diameter (the length of the longest straight line which can be drawn under a condition in which the line does not come into contact with the grain boundary in the middle of drawing in a direction orthogonal to the long diameter) of the compound.
  • the average number (number density) of the compounds containing Mg and P with a particle diameter of 0.1 ⁇ m or greater per unit area can be controlled mainly by the casting rate, the intermediate heat treatment temperature, and the heat treatment time.
  • the average number (number density) of the compounds per unit area can be reduced by increasing the casting rate and setting the intermediate heat treatment to be carried out at a high temperature for a short time.
  • the casting rate and the intermediate heat treatment conditions are selected as appropriate.
  • the alloy by setting the conductivity to greater than 75% IACS, the alloy can be satisfactorily used as a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar.
  • the conductivity is set to preferably greater than 76% IACS, more preferably greater than 77% IACS, still more preferably greater than 78% IACS, and even still more preferably greater than 80% IACS.
  • the alloy for electronic and electrical equipment by setting the 0.2% proof stress to 300 MPa or greater, the alloy becomes particularly suitable as a material of a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar. Further, in the present embodiment, the 0.2% proof stress measured at the time of the tensile test performed in a direction orthogonal to the rolling direction is set to 300 MPa or greater.
  • the 0.2% proof stress described above is set to preferably 325 MPa or greater and more preferably 350 MPa or greater.
  • the residual stress ratio is set to 50% or greater under conditions of 150°C for 1000 hours as described above.
  • the copper alloy for electronic equipment according to the present embodiment can be applied as a terminal to be used in a high temperature environment such as the periphery of an engine room of a vehicle.
  • the residual stress ratio measured at the time of a stress relaxation test performed in a direction orthogonal to the rolling direction is set to 50% or greater under conditions of 150°C for 1000 hours.
  • the above-described residual stress ratio is set to preferably 60% or greater under conditions of 150°C for 1000 hours and more preferably 70% or greater under conditions of 150°C for 1000 hours.
  • the above-described elements are added to molten copper obtained by melting the copper raw material to adjust components, thereby producing a molten copper alloy.
  • a single element, a mother alloy, or the like can be used.
  • raw materials containing the above-described elements may be melted together with the copper raw material.
  • a recycled material or a scrap material of the present alloy may be used.
  • the molten copper so-called 4 NCu having a purity of 99.99 mass% or greater or so-called 5 NCu having a purity of 99.999 mass% or greater is preferably used.
  • the holding time at the time of melting is set to the minimum by performing atmosphere melting using an inert gas atmosphere (for example, Ar gas) in which the vapor pressure of H 2 O is low.
  • an inert gas atmosphere for example, Ar gas
  • the molten copper alloy in which the components have been adjusted is injected into a mold to produce an ingot.
  • the size of the compound containing Mg and P can be set to be finer by increasing the solidification rate. Accordingly, the cooling rate of the molten metal is set to preferably 0.5°C/sec or greater, more preferably 1°C/sec or greater, and most preferably 15°C/sec or greater.
  • a heat treatment is performed for homogenization and solutionization of the obtained ingot.
  • Intermetallic compounds and the like containing Cu and Mg, as the main components, generated due to concentration through the segregation of Mg in the process of solidification are present in the ingot.
  • Mg is allowed to be homogeneously diffused or solid-dissolved in a mother phase in the ingot by performing the heat treatment of heating the ingot to a temperature range of 300°C to 900°C for the purpose of eliminating or reducing the segregation and the intermetallic compounds.
  • this homogenizing and solutionizing step S02 is performed in a non-oxidizing or reducing atmosphere.
  • the heating temperature is set to be in a range of 300°C to 900°C.
  • hot working may be performed after the above-described homogenizing and solutionizing step S02 for the purpose of increasing efficiency of roughening and homogenizing the structure described below.
  • the working method is not particularly limited, and examples of the method which can be used include rolling, drawing, extruding, groove rolling, forging, and pressing. It is preferable that the hot working temperature be in a range of 300°C to 900°C.
  • the temperature condition in this roughening step S03 is not particularly limited, but is preferably in a range of -200°C to 200°C, which is the range for cold or warm working, and particularly preferably room temperature in order to suppress re-crystallization or improve dimensional accuracy.
  • the working ratio is preferably 20% or greater and more preferably 30% or greater.
  • the working method is not particularly limited, and examples of the method which can be used include rolling, drawing, extruding, groove rolling, forging, and pressing.
  • a heat treatment is performed for the softening after the roughening step S03.
  • a method of the heat treatment is not particularly limited. However, since the heat treatment step needs to be performed at a high temperature for a short time in order not to increase the particle diameter of the compound formed due to crystallization or the like, the heat treatment is performed preferably in a holding temperature range of 400°C to 900°C for a holding time of 5 seconds to 1 hour and more preferably in a holding temperature range of 500°C to 900°C for a holding time of 5 seconds to 30 minutes. Further, the heat treatment is performed in a non-oxidizing atmosphere or a reducing atmosphere.
  • the cooling method after the working is not particularly limited, but it is preferable that a method in which the cooling rate for water quenching or the like is set to 200°C/min or greater is employed.
  • the roughening step S03 and the intermediate heat treatment step S04 may be repeatedly performed.
  • the temperature condition in this finishing step S05 is not particularly limited, but is set to be preferably in a range of -200°C to 200°C, which is the range for cold or warm working, and particularly preferably room temperature in order to suppress re-crystallization or softening.
  • the working ratio is appropriately selected such that the shape of the copper material approximates the final shape, but it is preferable that the working ratio is set to 20% or greater from the viewpoint of improving the strength through work hardening in the finishing step S05. In a case of further improving the strength, the working ratio is set to more preferably 30% or greater, still more preferably 40% or greater, and most preferably 60% or greater. Further, since the bending workability deteriorates due to an increase of the working ratio, it is preferable that the working ratio is set to 99% or less.
  • a finish heat treatment is performed on the plastic working material obtained from the finishing step S05.
  • the heat treatment temperature is set to be preferably in a range of 100°C to 800°C and more preferably in a range of 200°C to 700°C. Further, in this finish heat treatment step S06, it is necessary to set heat treatment conditions (the temperature, the time, and the cooling rate) for the purpose of avoiding a significant decrease of the strength due to re-crystallization. For example, it is preferable that the material is held at 300°C for 1 second to 120 seconds. It is preferable that this heat treatment is performed in a non-oxidizing or reducing atmosphere.
  • a method of performing the heat treatment is not particularly limited, but it is preferable that the heat treatment is performed using a continuous annealing furnace for a short period of time from the viewpoint of the effects of reducing the production cost.
  • finishing step S05 and the finish heat treatment step S06 may be repeatedly performed.
  • a copper alloy plate strip for electronic and electrical equipment (a plate material or a strip obtained by forming a plate material in a coil shape) according to the present embodiment is produced.
  • the plate thickness of the copper alloy plate strip for electronic and electrical equipment is greater than 0.05 mm and 3.0 mm or less, and preferably greater than 0.1 mm and less than 3.0 mm. In a case where the plate thickness of the copper alloy plate strip for electronic and electrical equipment is 0.05 mm or less, the copper alloy plate strip is not suitable for use as a conductor in high current applications. In a case where the plate thickness is greater than 3.0 mm, it is difficult to carry out press punching.
  • the copper alloy plate strip for electronic and electrical equipment may be used as a component for electronic and electrical equipment as it is, but a Sn plating layer or a Ag plating layer having a film thickness of 0.1 to 100 ⁇ m may be formed on one or both plate surfaces.
  • the plate thickness of the copper alloy plate strip for electronic and electrical equipment is set to 10 to 1000 times the thickness of the plating layer.
  • the copper alloy for electronic and electrical equipment (the copper alloy plate strip for electronic and electrical equipment) according to the present embodiment as a material, for example, a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar is formed by performing punching or bending on the material.
  • the copper alloy plate strip for electronic and electrical equipment is formed of the copper alloy for electronic and electrical equipment described above, a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar can be produced by performing bending working or the like on this copper alloy plate strip for electronic and electrical equipment.
  • the plate strip is particularly suitable as a material of a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar.
  • the component for electronic and electrical equipment (a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar) according to the present embodiment is formed of the copper alloy for electronic and electrical equipment described above, excellent characteristics can be exhibited even in a case of miniaturization and reduction in thickness.
  • the copper alloy for electronic and electrical equipment the copper alloy plate strip for electronic and electrical equipment, and the component for electronic and electrical equipment (such as a terminal or a busbar) according to the embodiment of the present disclosure have been described, but the present disclosure is not limited thereto and can be appropriately changed within the range not departing from the technical ideas of the invention.
  • the example of the method of producing the copper alloy for electronic and electrical equipment has been described, but the method of producing the copper alloy for electronic and electrical equipment is not limited to the description of the embodiment, and the copper alloy may be produced by appropriately selecting a production method of the related art.
  • a copper raw material formed of oxygen-free copper (ASTM B152 C10100) having a purity of 99.99 mass% or greater was prepared, a high-purity graphite crucible was charged with this material, and the material was high-frequency-melted in an atmosphere furnace in an Ar gas atmosphere.
  • Various elements were added to the obtained molten copper to prepare the component composition listed in Table 1, and the composition was smelted in a mold to produce an ingot.
  • a heat insulating material (isowool) mold was used in Examples 2, 19, and 20 of the present invention
  • a carbon mold was used in Examples 21 and 22 of the present invention
  • a copper alloy mold having a water cooling function was used in Examples 1, 3 to 18, 23 to 34 of the present invention and Comparative Examples 1 to 3
  • an iron mold provided with a heater having a heating function was used in Comparative Examples 4 and 5, as a casting mold.
  • the size of an ingot was set to have a thickness of approximately 100 mm, a width of approximately 150 mm, and a length of approximately 300 mm.
  • This block was heated for 4 hours under the temperature conditions listed in Table 2 in an Ar gas atmosphere and was subjected to a homogenizing and solutionizing treatment.
  • the copper material which had been subjected to the heat treatment was appropriately cut to have a shape suitable as the final shape and surface grinding was performed in order to remove an oxide film.
  • finish rolling was performed at room temperature and a rolling ratio listed in Table 2 to produce a thin plate having a thickness of 0.5 mm, a width of approximately 150 mm, and a length of 200 mm.
  • the obtained plate was subjected to a finish heat treatment in an Ar atmosphere under the conditions listed in Table 2 after the finish rolling (finishing). Thereafter, water quenching was performed, thereby preparing a thin plate for evaluating characteristics.
  • the depth of the surface roughening indicates the depth of surface roughening formed toward the central portion from an end portion of an ingot.
  • the rolled surface of each sample was subjected to mirror surface polishing and ion etching.
  • a visual field approximately 120 ⁇ m 2 /visual field
  • FE-SEM field emission type scanning electron microscope
  • a visual field (approximately 120 ⁇ m 2 /visual field) at a magnification of 10000 was selected, and 10 visual fields (approximately 4.8 ⁇ m 2 /visual field) continued at a magnification of 50000 were imaged in the region.
  • the particle diameter of the intermetallic compound was set as an average value of the long diameter (the length of the longest straight line which can be drawn in a grain under a condition in which the line does not come into contact with the grain boundary in the middle of drawing) of the intermetallic compound and the short diameter (the length of the longest straight line which can be drawn under a condition in which the line does not come into contact with the grain boundary in the middle of drawing in a direction orthogonal to the long diameter) of the intermetallic compound.
  • the density (piece/ ⁇ m 2 ) of compounds containing Mg and P with a particle diameter of 0.1 ⁇ m or greater and compounds containing Mg and P with a particle diameter of 0.05 ⁇ m or greater was measured. An example of the results obtained from observation of compounds is shown in FIGS. 2A and 2B .
  • test pieces specified in JIS Z 2241 were collected from each strip for evaluating characteristics and the 0.2% proof stress was measured according to the offset method in JIS Z 2241. Further, the test pieces were collected in a direction orthogonal to the rolling direction. The evaluation results are listed in Table 3.
  • Test pieces having a width of 10 mm and a length of 150 mm were collected from each strip for evaluating characteristics and the electric resistance was measured according to a 4 terminal method. Further, the dimension of each test piece was measured using a micrometer and the volume of the test piece was calculated. In addition, the conductivity was calculated from the measured electric resistance value and volume. Further, the test pieces were collected such that the longitudinal directions thereof were perpendicular to the rolling direction of each strip for evaluating characteristics. The evaluation results are listed in Table 3.
  • a stress relaxation resistance test was carried out by loading stress according to a method in conformity with a cantilever screw type in Japan Elongated Copper Association Technical Standard JCBA-T309:2004 and measuring the residual stress ratio after storage at a temperature of 150°C for 1000 hours. The evaluation results are listed in Table 3.
  • test pieces (width of 10 mm) were collected in a direction orthogonal to the rolling direction from each strip for evaluating characteristics, the initial deflection displacement was set to 2 mm such that the maximum surface stress of each test piece was 80% of the proof stress, and the span length was adjusted.
  • the maximum surface stress was determined according to the following equation.
  • Maximum surface stress MPa 1.5 Et ⁇ 0 / L s 2
  • Residual stress ratio % 1 ⁇ ⁇ t / ⁇ 0 ⁇ 100
  • Bend working was performed in conformity with a 4 test method in Japan Elongated Copper Association Technical Standard JCBA-T307:2007.
  • a plurality of test pieces having a width of 10 mm and a length of 30 mm were collected from each thin plate for evaluating characteristics such that the bending axis was in a direction orthogonal to the rolling direction.

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  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
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  • Non-Insulated Conductors (AREA)

Claims (15)

  1. Kupferlegierung für elektronische und elektrische Geräte, umfassend:
    0,15 Masse-% oder größer und weniger als 0,35 Masse-% Mg,
    0,0005 Masse-% oder größer und weniger als 0,01 Masse-% P und
    einen Rest, der aus Cu und unvermeidlichen Verunreinigungen gebildet ist,
    wobei die Leitfähigkeit größer als 75 % IACS ist und
    eine durchschnittliche Anzahl an Verbindungen, die Mg und P enthalten, mit einem Partikeldurchmesser von 0,1 µm oder größer 0,5 Teile/µm2 oder weniger bei der Betrachtung unter Verwendung eines Rasterelektronenmikroskops beträgt.
  2. Kupferlegierung für elektronische und elektrische Geräte gemäß Anspruch 1,
    wobei ein Gehalt [Mg] (Masse-%) von Mg und ein Gehalt [P] (Masse-%) von P den Beziehungsausdruck [Mg] + 20 × [P] < 0,5 erfüllen.
  3. Kupferlegierung für elektronische und elektrische Geräte gemäß Anspruch 1 oder 2,
    wobei ein Gehalt [Mg] (Masse-%) von Mg und ein Gehalt [P] (Masse-%) von P den Beziehungsausdruck [Mg]/[P] ≤ 400 erfüllen.
  4. Kupferlegierung für elektronische und elektrische Geräte gemäß irgendeinem der Ansprüche 1 bis 3,
    wobei die 0,2 %-Dehngrenze, gemessen zum Zeitpunkt eines Zugversuchs, der in einer Richtung senkrecht zu einer Walzrichtung durchgeführt wird, 300 MPa oder größer ist.
  5. Kupferlegierung für elektronische und elektrische Geräte gemäß irgendeinem der Ansprüche 1 bis 4,
    wobei ein Restspannungsverhältnis 50 % oder größer unter Bedingungen von 150°C für 1.000 Stunden ist.
  6. Kupferlegierungsplattenstreifen für elektronische und elektrische Geräte, umfassend:
    die Kupferlegierung für elektronische und elektrische Geräte gemäß irgendeinem der Ansprüche 1 bis 5.
  7. Kupferlegierungsplattenstreifen für elektronische und elektrische Geräte gemäß Anspruch 6,
    wobei der Kupferlegierungsplattenstreifen eine Sn-Plattierungsschicht oder eine Ag-Plattierungsschicht auf einer Oberfläche des Kupferlegierungsplattenstreifens einschließt.
  8. Bauteil für elektronische und elektrische Geräte, umfassend:
    den Kupferlegierungsplattenstreifen für elektronische und elektrische Geräte gemäß Anspruch 6 oder 7.
  9. Bauteil für elektronische und elektrische Geräte gemäß Anspruch 8,
    wobei das Bauteil eine Sn-Plattierungsschicht oder eine Ag-Plattierungsschicht auf einer Oberfläche des Bauteils einschließt.
  10. Anschluss, umfassend:
    den Kupferlegierungsplattenstreifen für elektronische und elektrische Geräte gemäß Anspruch 6 oder 7.
  11. Anschluss gemäß Anspruch 10,
    wobei der Anschluss eine Sn-Plattierungsschicht oder eine Ag-Plattierungsschicht auf einer Oberfläche des Anschlusses einschließt.
  12. Sammelschiene, umfassend:
    den Kupferlegierungsplattenstreifen für elektronische und elektrische Geräte gemäß Anspruch 6 oder 7.
  13. Sammelschiene gemäß Anspruch 12,
    wobei die Sammelschiene eine Sn-Plattierungsschicht oder eine Ag-Plattierungsschicht auf einer Oberfläche der Sammelschiene einschließt.
  14. Bewegliches Teil für ein Relais, umfassend:
    den Kupferlegierungsplattenstreifen für elektronische und elektrische Geräte gemäß Anspruch 6 oder 7.
  15. Bewegliches Teil für ein Relais gemäß Anspruch 14, wobei das bewegliche Teil eine Sn-Plattierungsschicht oder eine Ag-Plattierungsschicht auf einer Oberfläche des beweglichen Teils einschließt.
EP17775233.4A 2016-03-30 2017-03-29 Kupferlegierung für elektronische/elektrische vorrichtungen, kupferlegierungsband für elektronische und elektrische vorrichtungen, komponente für elektronische und elektrische vorrichtung, endgerät, sammelschiene und bewegliches teil für relais Active EP3438298B1 (de)

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PCT/JP2017/012914 WO2017170699A1 (ja) 2016-03-30 2017-03-29 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片

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FI3438299T3 (fi) 2016-03-30 2023-05-23 Mitsubishi Materials Corp Kupariseoksesta valmistettu nauha elektronisia laitteita ja sähkölaitteita varten, komponentti, liitosnapa, virtakisko sekä liikuteltava kappale releitä varten
US11203806B2 (en) 2016-03-30 2021-12-21 Mitsubishi Materials Corporation Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay
JP6780187B2 (ja) 2018-03-30 2020-11-04 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
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JP7180101B2 (ja) * 2018-03-30 2022-11-30 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
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FI3904549T3 (fi) 2018-12-26 2023-10-19 Mitsubishi Materials Corp Kupariseoslevy, pinnoitekalvoon liitetty kupariseoslevy, ja menetelmät vastaavasti näiden tuotteiden valmistamiseksi
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TW201738394A (zh) 2017-11-01
TWI703225B (zh) 2020-09-01
KR102296652B1 (ko) 2021-08-31
MX2018011658A (es) 2018-12-19
EP3438298A1 (de) 2019-02-06
EP3438298A4 (de) 2019-12-11
CN108431257A (zh) 2018-08-21
JP2017186664A (ja) 2017-10-12
JP6226098B2 (ja) 2017-11-08
KR20180125449A (ko) 2018-11-23

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