EP3375898B1 - Kupferlegierungsmaterial - Google Patents

Kupferlegierungsmaterial Download PDF

Info

Publication number
EP3375898B1
EP3375898B1 EP16863936.7A EP16863936A EP3375898B1 EP 3375898 B1 EP3375898 B1 EP 3375898B1 EP 16863936 A EP16863936 A EP 16863936A EP 3375898 B1 EP3375898 B1 EP 3375898B1
Authority
EP
European Patent Office
Prior art keywords
mass
less
copper alloy
crystal grain
alloy material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP16863936.7A
Other languages
English (en)
French (fr)
Other versions
EP3375898A4 (de
EP3375898A1 (de
Inventor
Shoichiro Yano
Kanta DAIRAKU
Toshio Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of EP3375898A1 publication Critical patent/EP3375898A1/de
Publication of EP3375898A4 publication Critical patent/EP3375898A4/de
Application granted granted Critical
Publication of EP3375898B1 publication Critical patent/EP3375898B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22C—FOUNDRY MOULDING
    • B22C9/00—Moulds or cores; Moulding processes
    • B22C9/06—Permanent moulds for shaped castings
    • B22C9/061—Materials which make up the mould
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Definitions

  • the present invention relates to a copper alloy material suitable for a part used in a high temperature environment such as a molding material for casting and a welding part such as a contact tip.
  • Cu-Cr-Zr-based alloys such as C18150 are used as a material for casting mold materials and welding members which are used at high temperatures, since they have excellent heat resistance and electrical conductivity as shown in Patent Literatures 1 and 2.
  • Cu-Cr-Zr-based alloy are usually produced by a production process, in which a cast made of Cu-Cr-Zr-based alloy is subjected to a plastic working; a solution treatment, for example in a condition of 950-1050°C of a retention temperature and 0.5-1.5 hours of a retention time, and an aging treatment, for example in a condition of 400-500°C of a retention temperature and 2-4 hours of a retention time, are performed on the plastically worked material; and then the material subjected to the solution and aging treatments is finished into a predetermined shape by machine working in the end.
  • a solution treatment for example in a condition of 950-1050°C of a retention temperature and 0.5-1.5 hours of a retention time
  • an aging treatment for example in a condition of 400-500°C of a retention temperature and 2-4 hours of a retention time
  • Cr and Zr are dissolved in the matrix of Cu by the solution treatment and fine precipitates of Cr and Zr are dispersed by the aging treatment to improve strength and conductivity.
  • Patent Literature 3 (PTL 3) describes a Cu alloy for a continuous casting mold consisting of 0.4 to 1.5 mass% Cr, 0.01 to 0.30 mass% Zr, 0.05 to 0.80 mass% Al, optionally 0.05 to 1.0 mass% of one or more of Fe, Ni and Co, optionally 0.01 to 0.60 mass% of one or two of Ti and Si and a balance being Cu and unavoidable impurities.
  • Non-Patent Literature 1 reports on the effect of zirconium and heat treatment on the microstructure and properties of cast chromium bronze for conductive parts and inter alia describes an alloy consisting of 0.31 mass% Cr, 0.043 mass% Zr and a balance being Cu.
  • the above-described Cu-Cr-Zr-based alloy has excellent heat resistance, when it is exposed to a use environment with a peak temperature of 500°C or more, occasionally, re-solution of precipitate starts for the strength and the conductivity to be reduced and for coarsening of the crystal grain to occur.
  • the present invention has been made in view of the above-described circumstances.
  • An object of the present invention to provide a copper alloy material which is stable in characteristics and excellent in service life even when it is used in a high temperature environment of 500°C or more.
  • the present invention is directed to a copper alloy material having a composition including: 0.3 mass% or more and less than 0.5 mass% of Cr; 0.01 mass% or more and 0.15 mass% or less of Zr; optionally 0.1 mass% or more and 2.0 mass% or less of Al; optionally one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg in a range of 0.005 mass% or more and 0.1 mass% or less as a total; and a balance being Cu and inevitable impurities, wherein an average of crystal grain sizes is in a range of 0.1 mm or more and 2.0 mm or less, a standard deviation of the crystal grain sizes is 0.6 or less, and an area ratio of crystallized Cr in cross section observation is 0.5 % or less (hereinafter, referred as "a copper alloy material of the present invention").
  • the composition includes 0.3 mass% or more and less than 0.5 mass% of Cr; 0.01 mass% or more and 0.15 mass% or less of Zr; optionally 0.1 mass% or more and 2.0 mass% or less of Al; optionally one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg in a range of 0.005 mass% or more and 0.1 mass% or less as a total; and a balance being Cu and inevitable impurities.
  • strength (hardness) and conductivity can be improved.
  • crystallized Cr is reduced since the Cr content is set to a relatively low level at 0.3 mass% or more and less than 0.5 mass%.
  • occurrence of unevenly-sized re-crystallized grains because of accumulation of local strain due to these crystallized Cr can be suppressed. Therefore, local coarsening of crystal grains can be suppressed even in a case of being used under high temperature condition.
  • the average of the crystal grain sizes is set in the range of 0.1 mm or more and 2.0 mm or less in the copper alloy material of the present invention.
  • accumulation of strain is relatively low for the copper alloy material to be re-crystallized.
  • the standard deviation of the crystal grain sizes is set to 0.6 or less.
  • the crystal grain sizes are uniform, accumulation of local strain is less. Accordingly, local coarsening of crystal grains can be suppressed even in a case of being used under high temperature condition.
  • an area ratio of crystallized Cr in cross section observation is 0.5 % or less.
  • the area ratio of the crystallized Cr in cross section observation is set to 0.5 % or less, accumulation of local strain is less. Accordingly, local coarsening of crystal grains can be reliably suppressed even in a case of being used under high temperature condition.
  • an average of crystal grain sizes is in a range of 0.1 mm or more and 3.0 mm or less, and a standard deviation of the crystal grain sizes is 1.5 or less
  • the composition of the copper alloy material may further include Al in a range of 0.1 mass% or more and 2.0 mass% or less.
  • composition of the copper alloy material further includes Al in a range of 0.1 mass% or more and 2.0 mass% or less, conductivity can be adjusted to about 30-60 %IACS.
  • the copper alloy material having such a conductivity is particularly suitable as a casting mold material for electromagnetic stirring applications.
  • the composition of the copper alloy material may further include one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg in a range of 0.005 mass% or more and 0.1 mass% or less as a total.
  • composition of the copper alloy material further includes one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg in the above-described range, coarsening of crystal grain sizes can be suppressed more reliably because of the grain boundary pinning effect by a compound including these elements.
  • the present invention it is possible to provide a copper alloy material having stable characteristics and excellent service life even when it is used in a high temperature environment of 500°C or more.
  • the copper alloy material of the present embodiment is a material for a part used in a high temperature environment such as a molding material for casting and a welding part.
  • the copper alloy material according to the present embodiment has a composition including: 0.3 mass% or more and less than 0.5 mass% of Cr; 0.01 mass% or more and 0.15 mass% or less of Zr; and a balance being Cu and inevitable impurities.
  • Al may be contained in the range of 0.1 mass% or more and 2.0 mass% or less, if necessary.
  • one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg may be contained in a total amount of 0.005 mass% or more and 0.1 mass% or less.
  • the average of crystal grain sizes is in a range of 0.1 mm or more and 2.0 mm or less, and the standard deviation of the crystal grain sizes is 0.6 or less.
  • the area ratio of crystallized Cr in cross section observation is 0.5 % or less.
  • the area ratio of the crystallized Cr is determined by observing the structure of an arbitrary cross section of the copper alloy material (for example, a cross section parallel to the rolling direction) with microscopic etching, observing the structure with SEM or the like, and analyzing it.
  • the average of crystal grain sizes is in a range of 0.1 mm or more and 3.0 mm or less, and the standard deviation of the crystal grain sizes is 1.5 or less.
  • Cr is an element having an action effect that improves strength (hardness) and electrical conductivity by finely precipitating Cr-based precipitates in crystal grains of the parent phase by means of an aging treatment.
  • the precipitation amount during the aging treatment becomes insufficient, and there is a concern that the strength (hardness) improvement effect cannot be sufficiently obtained.
  • the content of Cr is 0.5 mass% or more, a relatively large amount of crystallized Cr exist even after the solution treatment; local strain is accumulated due to these crystallized Cr; and sizes of recrystallized grains becomes uneven. When it is used under a high temperature environment, it is possible that the crystal grains are coarsened.
  • the content of Cr is set in a range of 0.3 mass% or more and less than 0.5 mass%. Meanwhile, in order to reliably exhibit the above-described action effect, the lower limit of the content of Cr is preferably set to 0.35 mass% or more, and the upper limit of the content of Cr is preferably set to 0.45 mass% or less.
  • Zr is an element having an action effect that improves strength (hardness) and electrical conductivity by finely precipitating Zr-based precipitates in the crystal grain boundaries of the parent phase by means of the aging treatment.
  • the precipitation amount during the aging treatment becomes insufficient, and there is a concern that the strength (hardness) improvement effect cannot be sufficiently obtained.
  • the content of Zr exceeds 0.15 mass%, there is a concern that electrical conductivity and thermal conductivity may decrease.
  • an additional strength improvement effect cannot be obtained.
  • the content of Zr is set in a range of 0.01 mass% or more and 0.15 mass% or less. Meanwhile, in order to reliably exhibit the above-described action effect, the lower limit of the content of Zr is preferably set to 0.05 mass% or more, and the upper limit of the content of Zr is preferably set to 0.13 mass% or less.
  • Al 0.1 mass% or more and less than 2.0 mass%
  • Al is an element having an action effect that decreases electrical conductivity by forming a solid solution in copper alloys. Therefore, it is possible to adjust the electrical conductivity of the copper alloy material to approximately 30% to 60%IACS by controlling the amount of Al added.
  • the content of Al is less than 0.1 mass%, it becomes difficult to suppress the electrical conductivity at a low level.
  • the content of Al is 2.0 mass% or more, there is a concern that the electrical conductivity may significantly decrease and the thermal conductivity may become insufficient.
  • the content of Al is set in a range of 0.1 mass% or more and less than 2.0 mass% in the case of adding Al. Meanwhile, in order to reliably exhibit the above-described action effect, the lower limit of the content of Al is preferably set to 0.3 mass% or more, and the upper limit of the content of Al is preferably set to 1.5 mass% or less. In the case where Al is not intentionally added, Al may be included in the inevitable impurities at less than 0.1 mass%.
  • Elements of Fe, Co, Sn, Zn, P, Si and Mg are elements that form fine compounds and exhibit a pinning effect to suppress crystal growth.
  • the total content of one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg is set in a range of 0.005 mass% or more and 0.1 mass% or less.
  • the lower limit of the total content of one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg P is preferably set to 0.02 mass% or more
  • the upper limit of the total content of one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg is preferably set to 0.07 mass% or less.
  • elements such as Fe, Co, Sn, Zn, P, Si and Mg are not intentionally added, these elements may be contained as impurities in a total amount of less than 0.005 mass%.
  • examples of the inevitable impurities other than Cr, Zr, Al, Fe, Co, Sn, Zn, P, Si, and Mg described above include B, Ag, Ca, Te, Mn, Ni, Sr, Ba, Sc , Y, Ti, Hf, V, Nb, Ta, Mo, W, Re, Ru, Os, Se, Rh, Ir, Pd, Pt, Au, Cd, Ga, In, Li, Ge, As, Sb, Tl, Pb, Be, N, H, Hg, Tc, Na, K, Rb, Cs, Po, Bi, lanthanoids, O, S, C and the like. Since there is a concern that these inevitable impurities may decrease the electrical conductivity and the thermal conductivity, the total amount thereof is preferably set to 0.05 mass% or less.
  • the standard deviation of the crystal grain size exceeds 0.6, the deviation of the crystal grain sizes becomes large and strain is locally accumulated. Thus, when used under a high temperature environment, the crystal grains become coarse. In addition, the mechanical properties may be deteriorated.
  • the average crystal grain size is set in the range of 0.1 mm or more and 2.0 mm or less, and the standard deviation of the crystal grain size is set to be 0.6 or less.
  • the lower limit of the average crystal grain size is preferably 0.15 mm or more, and the upper limit of the average crystal grain size is preferably 1.0 mm or less.
  • the area ratio of the crystallized Cr in the cross sectional observation is set to be 0.5% or less.
  • the upper limit of the area ratio of the crystallized Cr is preferably 0.3% or less.
  • the average crystal grain size after the heat treatment maintained at 1000°C for 1 hour is set in the range of 0.1 mm to 3.0 mm, the standard deviation of the crystal grain size is 1.5 or less.
  • the lower limit of the average crystal grain size is preferably 0.2 mm or more, and the upper limit of the average crystal grain size is preferably 0.5 mm or less.
  • a copper raw material made of oxygen-free copper having a copper purity of 99.99 mass% or higher is loaded into a carbon crucible and is melted using a vacuum melting furnace, thereby obtaining molten copper.
  • the above-described additive elements are added to the obtained molten metal so as to obtain a predetermined concentration, and components are formulated, thereby obtaining a molten copper alloy.
  • raw materials of Cr, and Zr which are the additive elements Cr, and Zr having a high purity are used, and, for example, Cr having a purity of 99.99 mass% or higher is used as a raw material of Cr, and Zr having a purity of 99.95 mass% or higher is used as a raw material of Zr.
  • Al, Fe, Co, Sn, Zn, P, Si and Mg are added thereto as necessary.
  • parent alloys with Cu may also be used as raw materials of Al, Fe, Co, Sn, Zn, P, Si and Mg.
  • the component-formulated molten copper alloy is injected into a die, thereby obtaining an ingot.
  • a homogenization treatment is carried out on the ingot in the atmosphere under conditions of 950°C or higher and 1,050°C or lower for one hour or longer.
  • hot rolling with a working percentage of 50% or higher and 99% or lower is carried out on the ingot in a temperature range of 900°C or higher and 1,000°C or lower, thereby obtaining a rolled material.
  • the method of the hot working may be hot forging. After this hot working, the rolled material is immediately cooled by means of water cooling.
  • a heating treatment is carried out on the rolled material obtained in the hot working step S03 under conditions of 920°C or higher and 1,050°C or lower for 0.5 hours or longer and five hours or shorter, thereby carrying out a solution treatment.
  • the heating treatment is carried out, for example, in the atmosphere or an inert gas atmosphere, and as cooling after the heating, water cooling is carried out.
  • the first aging treatment is carried out under conditions of, for example, 400°C or higher and 530°C or lower for 0.5 hours or longer and five hours or shorter.
  • the thermal treatment method during the aging treatment is not particularly limited, but the thermal treatment is preferably carried out in an inert gas atmosphere.
  • the cooling method after the heating treatment is not particularly limited, but water cooling is preferably carried out.
  • the copper alloy material that is the present embodiment is manufactured.
  • the casting mold material of the present invention since the casting mold material is provided with a composition including 0.3 mass% or more and less than 0.5 mass% of Cr, 0.01 mass% or more and 0.15 mass% or less of Zr, and a balance being Cu and inevitable impurities, fine precipitates can be precipitated by performing the solution and aging treatments. Thus, strength and electrical conductivity can be improved.
  • the Cr content is set to a relatively low content of 0.3 mass% or more and less than 0.5 mass%, crystallized Cr hardly exists after the solution treatment. Specifically, the area ratio of crystallized Cr in cross section observation is 0.5% or less. Therefore, occurrence of unevenly sized recrystallized grains by accumulation of local strain due to the crystallized Cr can be suppressed. Accordingly, local coarsening of crystal grains can be reliably suppressed even when it is used under a high temperature environment.
  • the average crystal grain size is set in the range of 0.1 mm or more and 2.0 mm or less, and the standard deviation of the crystal grain size is set to 0.6 or less, so that there is less accumulation of local strain. Accordingly, local coarsening of crystal grains can be reliably suppressed even when it is used under a high temperature environment.
  • the average crystal grain size after the heat treatment maintained at 1000°C for 1 hour is set in the range of 0.1 mm or more and 3.0 mm or less, and the standard deviation of the crystal grain size is set to 1.5 or less.
  • the conductivity when Al is contained in the range of 0.1 mass% or more and 2.0 mass% or less, the conductivity can be adjusted to about 30 to 60 %IACS.
  • the copper alloy material further includes one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg in a range of 0.005 mass% or more and 0.1 mass% or less as a total, coarsening of crystal grains can be more reliably suppressed by the pinning effect of a compound containing these elements.
  • a copper raw material made of oxygen-free copper having a copper purity of 99.99 mass% or higher was prepared, was loaded into a carbon crucible, and was melted using a vacuum melting furnace (with a degree of vacuum of 10 -2 Pa or lower), thereby obtaining molten copper.
  • a variety of additive elements were added to the obtained molten copper so as to formulate a component composition shown in Table 1, the component composition was maintained for five minutes, and then the molten copper alloy was injected into a cast iron die, thereby obtaining an ingot.
  • the sizes of the ingot were set to a width of approximately 80 mm, a thickness of approximately 50 mm, and a length of approximately 130 mm.
  • a homogenization treatment was carried out in the atmosphere under conditions of 1,000°C for one hour, and then hot rolling was carried out.
  • the rolling reduction in the hot rolling was set to 80%, thereby obtaining a hot-rolled material having a width of approximately 100 mm, a thickness of approximately 10 mm, and a length of approximately 520 mm.
  • the structure of the copper alloy material after the aging treatment was observed, and the standard deviation of the average crystal grain size and crystal grain size was measured.
  • the average crystal grain size and the standard deviation of the crystal grain diameter after the heat treatment for 1 hour at 1000°C retention were measured for this copper alloy material.
  • FIGS. 2A and 2B show the structure observation pictures of the copper alloy materials of Example 1 of the present invention and Comparative Example 4, respectively, after the above-described aging treatment and before the heat treatment at 1000°C for 1 hour retention.
  • FIG. 3A and FIG. 3B show the structure observation pictures of the copper alloy materials of Example 1 of the present invention and Comparative Example 4, respectively, after the above-described aging treatment and the heat treatment at 1000°C for 1 hour retention.
  • the component composition of the obtained copper alloy material was measured by ICP-MS analysis. The measurement results are shown in Table 1.
  • a sample of 10 mm ⁇ 15 mm from the central portion of the plate width was cut out from the obtained thickness of the copper alloy material and the surface in the rolling direction (RD direction) was polished and then micro etching was performed.
  • a sample of 10 mm ⁇ 15 mm from the central portion of the plate width was cut out from the thickness of the copper alloy material and the surface in the rolling direction (RD direction) was polished and then micro etching was performed.
  • FIGS. 4A to 4D show SEM-EPMA images of Example 1 of the present invention and Comparative Example 4.
  • FIGS. 2A and 3A in Examples 1 to 6 of the present invention, local grain coarsening was suppressed even after being placed in a high-temperature environment.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)

Claims (1)

  1. Kupferlegierungsmaterial mit einer Zusammensetzung, enthaltend:
    0,3 Masse-% oder mehr und weniger als 0,5 Masse-% Cr,
    0,01 Masse-% oder mehr und 0,15 Masse-% oder weniger Zr,
    optional 0,1 Masse-% oder mehr und 2,0 Masse-% oder weniger Al,
    optional ein oder mehrere Elemente, ausgewählt aus Fe, Co, Sn, Zn, P, Si und Mg, in einem Bereich von insgesamt 0,005 Masse-% oder mehr und 0,1 Masse-% oder weniger und
    einen Rest, der Cu und unvermeidliche Verunreinigungen sind,
    wobei ein Durchschnitt der Kristallkorngrößen in einem Bereich von 0,1 mm oder mehr uns 2,0 mm oder weniger liegt,
    eine Standardabweichung der Kristallkorngrößen 0,6 oder weniger beträgt und
    ein Flächenanteil von kristallisiertem Cr in einer Querschnittsbetrachtung 0,5 % oder weniger beträgt.
EP16863936.7A 2015-11-09 2016-10-11 Kupferlegierungsmaterial Active EP3375898B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015219852A JP6693092B2 (ja) 2015-11-09 2015-11-09 銅合金素材
PCT/JP2016/080125 WO2017081972A1 (ja) 2015-11-09 2016-10-11 銅合金素材

Publications (3)

Publication Number Publication Date
EP3375898A1 EP3375898A1 (de) 2018-09-19
EP3375898A4 EP3375898A4 (de) 2019-04-03
EP3375898B1 true EP3375898B1 (de) 2022-05-11

Family

ID=58695049

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16863936.7A Active EP3375898B1 (de) 2015-11-09 2016-10-11 Kupferlegierungsmaterial

Country Status (6)

Country Link
US (1) US20190062874A1 (de)
EP (1) EP3375898B1 (de)
JP (1) JP6693092B2 (de)
KR (1) KR20180078245A (de)
CN (1) CN108350530A (de)
WO (1) WO2017081972A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106350698B (zh) * 2016-09-09 2018-03-27 宁波博威合金板带有限公司 抗软化铜合金、制备方法及其应用
JP7035478B2 (ja) * 2017-11-21 2022-03-15 三菱マテリアル株式会社 鋳造用モールド材
WO2020170956A1 (ja) * 2019-02-20 2020-08-27 三菱マテリアル株式会社 銅合金材、整流子片、電極材
CN112981170B (zh) * 2021-02-05 2022-04-12 宁波金田铜业(集团)股份有限公司 一种冷镦用铬锆铜合金及其制备方法
CN114318049A (zh) * 2021-12-16 2022-04-12 镇江市镇特合金材料有限公司 一种用于焊头箱体的高寿命铜合金及其制备方法
CN115896535B (zh) * 2022-11-26 2023-12-12 广州番禺职业技术学院 一种铜香炉材料及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946699B2 (ja) * 1979-03-27 1984-11-14 日立造船株式会社 連続鋳造設備の鋳型材
JPS58107459A (ja) * 1981-12-21 1983-06-27 Chuetsu Gokin Chuko Kk 析出硬化型連続鋳造用鋳型材料
JPS58107462A (ja) * 1981-12-21 1983-06-27 Chuetsu Gokin Chuko Kk 析出硬化型連続鋳造用鋳型材料
JPS58212839A (ja) * 1982-06-03 1983-12-10 Mitsubishi Metal Corp 連続鋳造鋳型用Ｃｕ合金
JPS59193233A (ja) * 1983-04-15 1984-11-01 Toshiba Corp 銅合金
JPS6297748A (ja) * 1985-03-25 1987-05-07 Fujikura Ltd 鋳造輪とその製造方法
JPH05339688A (ja) * 1992-06-05 1993-12-21 Furukawa Electric Co Ltd:The 金属鋳造用鋳型材の製造方法
JP3303623B2 (ja) * 1995-09-22 2002-07-22 三菱マテリアル株式会社 製鋼連続鋳造用銅合金モールド素材の製造方法およびそれにより製造されたモールド
WO2010079707A1 (ja) * 2009-01-09 2010-07-15 三菱伸銅株式会社 高強度高導電銅合金圧延板及びその製造方法
WO2012026611A1 (ja) * 2010-08-27 2012-03-01 古河電気工業株式会社 銅合金板材及びその製造方法
CN102534291A (zh) * 2010-12-09 2012-07-04 北京有色金属研究总院 一种高强高导CuCrZr合金及其制备和加工方法
KR101364542B1 (ko) * 2011-08-11 2014-02-18 주식회사 풍산 연속주조 몰드용 동합금재 및 이의 제조 방법

Also Published As

Publication number Publication date
JP6693092B2 (ja) 2020-05-13
WO2017081972A1 (ja) 2017-05-18
US20190062874A1 (en) 2019-02-28
CN108350530A (zh) 2018-07-31
EP3375898A4 (de) 2019-04-03
JP2017088949A (ja) 2017-05-25
EP3375898A1 (de) 2018-09-19
KR20180078245A (ko) 2018-07-09

Similar Documents

Publication Publication Date Title
EP3375898B1 (de) Kupferlegierungsmaterial
KR101477884B1 (ko) 전자 기기용 구리 합금, 전자 기기용 구리 합금의 제조 방법, 전자 기기용 구리 합금 압연재, 및 전자 기기용 구리 합금이나 전자 기기용 구리 합금 압연재로 이루어지는 전자 전기 부품, 단자 또는 커넥터
JP6758746B2 (ja) 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
TWI513833B (zh) 電子機器用銅合金、電子機器用銅合金之製造方法、電子機器銅合金用塑性加工材、以及電子機器用零件
JP6680041B2 (ja) 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品、端子、及び、バスバー
KR20120130344A (ko) 전자 재료용 Ｃｕ-Ｎｉ-Ｓｉ-Ｃｏ 계 구리 합금 및 그 제조 방법
JP6156600B1 (ja) 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品、端子、及び、バスバー
EP3199651B1 (de) Giessformmaterial aus einer cu-cr-zr-legierung und verfahren zu dessen herstellung
JP5834528B2 (ja) 電気・電子機器用銅合金
JP4834781B1 (ja) 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系合金
JP2019178398A (ja) 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
EP3375897B1 (de) Kupferlegierungsmaterial
CN111212923B (zh) 铸造用模具材料及铜合金原材料
JP6248388B2 (ja) 電子・電気機器用銅合金、電子・電気機器用部品及び端子
TWI509091B (zh) 電子電氣機器用銅合金、電子電氣機器用銅合金薄板、電子電氣機器用導電零件及端子
WO2017043558A1 (ja) 電子・電気機器用銅合金、電子・電気機器用部品、端子、及びバスバー
JP2013117060A (ja) 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系合金
JP2020070476A (ja) 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子
JP2019173093A (ja) 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20180423

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20190306

RIC1 Information provided on ipc code assigned before grant

Ipc: C22F 1/08 20060101ALI20190227BHEP

Ipc: C22C 9/01 20060101ALI20190227BHEP

Ipc: C22C 9/00 20060101AFI20190227BHEP

Ipc: B22C 9/06 20060101ALI20190227BHEP

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: MITSUBISHI MATERIALS CORPORATION

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20191212

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20220217

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1491475

Country of ref document: AT

Kind code of ref document: T

Effective date: 20220515

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602016072126

Country of ref document: DE

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG9D

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20220511

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220511

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220912

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220811

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220511

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220511

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220511

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220812

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220511

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220511

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220811

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220511

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220511

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220511

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220911

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220511

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220511

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220511

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220511

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220511

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220511

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602016072126

Country of ref document: DE

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220511

26N No opposition filed

Effective date: 20230214

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220511

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220511

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20221031

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20221011

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20221031

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20221031

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20221031

REG Reference to a national code

Ref country code: AT

Ref legal event code: UEP

Ref document number: 1491475

Country of ref document: AT

Kind code of ref document: T

Effective date: 20220511

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20221011

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20231020

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20231026

Year of fee payment: 8

Ref country code: FR

Payment date: 20231026

Year of fee payment: 8

Ref country code: DE

Payment date: 20231020

Year of fee payment: 8

Ref country code: AT

Payment date: 20231020

Year of fee payment: 8

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20161011

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220511

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220511

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220511