EP3375898B1 - Copper alloy material - Google Patents
Copper alloy material Download PDFInfo
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- EP3375898B1 EP3375898B1 EP16863936.7A EP16863936A EP3375898B1 EP 3375898 B1 EP3375898 B1 EP 3375898B1 EP 16863936 A EP16863936 A EP 16863936A EP 3375898 B1 EP3375898 B1 EP 3375898B1
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- 239000000956 alloy Substances 0.000 title claims description 51
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 49
- 239000013078 crystal Substances 0.000 claims description 70
- 229910052742 iron Inorganic materials 0.000 claims description 19
- 229910052710 silicon Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 18
- 229910052698 phosphorus Inorganic materials 0.000 claims description 18
- 229910052718 tin Inorganic materials 0.000 claims description 18
- 229910052725 zinc Inorganic materials 0.000 claims description 18
- 229910052749 magnesium Inorganic materials 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 15
- 239000012535 impurity Substances 0.000 claims description 11
- 239000011651 chromium Substances 0.000 description 57
- 238000011282 treatment Methods 0.000 description 36
- 238000010438 heat treatment Methods 0.000 description 26
- 230000032683 aging Effects 0.000 description 21
- 230000000694 effects Effects 0.000 description 18
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 18
- 239000000463 material Substances 0.000 description 17
- 239000000243 solution Substances 0.000 description 15
- 230000014759 maintenance of location Effects 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 229910052726 zirconium Inorganic materials 0.000 description 12
- 229910052804 chromium Inorganic materials 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 238000005266 casting Methods 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000002244 precipitate Substances 0.000 description 9
- 239000002994 raw material Substances 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 238000001816 cooling Methods 0.000 description 7
- 230000007423 decrease Effects 0.000 description 7
- 238000009825 accumulation Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229910017526 Cu-Cr-Zr Inorganic materials 0.000 description 5
- 229910017810 Cu—Cr—Zr Inorganic materials 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000004453 electron probe microanalysis Methods 0.000 description 4
- 238000000265 homogenisation Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000005098 hot rolling Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
- 230000001376 precipitating effect Effects 0.000 description 3
- 238000007669 thermal treatment Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- NRNCYVBFPDDJNE-UHFFFAOYSA-N pemoline Chemical compound O1C(N)=NC(=O)C1C1=CC=CC=C1 NRNCYVBFPDDJNE-UHFFFAOYSA-N 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- 229910019580 Cr Zr Inorganic materials 0.000 description 1
- 229910017061 Fe Co Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000001095 inductively coupled plasma mass spectrometry Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C9/00—Moulds or cores; Moulding processes
- B22C9/06—Permanent moulds for shaped castings
- B22C9/061—Materials which make up the mould
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/01—Alloys based on copper with aluminium as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Definitions
- the present invention relates to a copper alloy material suitable for a part used in a high temperature environment such as a molding material for casting and a welding part such as a contact tip.
- Cu-Cr-Zr-based alloys such as C18150 are used as a material for casting mold materials and welding members which are used at high temperatures, since they have excellent heat resistance and electrical conductivity as shown in Patent Literatures 1 and 2.
- Cu-Cr-Zr-based alloy are usually produced by a production process, in which a cast made of Cu-Cr-Zr-based alloy is subjected to a plastic working; a solution treatment, for example in a condition of 950-1050°C of a retention temperature and 0.5-1.5 hours of a retention time, and an aging treatment, for example in a condition of 400-500°C of a retention temperature and 2-4 hours of a retention time, are performed on the plastically worked material; and then the material subjected to the solution and aging treatments is finished into a predetermined shape by machine working in the end.
- a solution treatment for example in a condition of 950-1050°C of a retention temperature and 0.5-1.5 hours of a retention time
- an aging treatment for example in a condition of 400-500°C of a retention temperature and 2-4 hours of a retention time
- Cr and Zr are dissolved in the matrix of Cu by the solution treatment and fine precipitates of Cr and Zr are dispersed by the aging treatment to improve strength and conductivity.
- Patent Literature 3 (PTL 3) describes a Cu alloy for a continuous casting mold consisting of 0.4 to 1.5 mass% Cr, 0.01 to 0.30 mass% Zr, 0.05 to 0.80 mass% Al, optionally 0.05 to 1.0 mass% of one or more of Fe, Ni and Co, optionally 0.01 to 0.60 mass% of one or two of Ti and Si and a balance being Cu and unavoidable impurities.
- Non-Patent Literature 1 reports on the effect of zirconium and heat treatment on the microstructure and properties of cast chromium bronze for conductive parts and inter alia describes an alloy consisting of 0.31 mass% Cr, 0.043 mass% Zr and a balance being Cu.
- the above-described Cu-Cr-Zr-based alloy has excellent heat resistance, when it is exposed to a use environment with a peak temperature of 500°C or more, occasionally, re-solution of precipitate starts for the strength and the conductivity to be reduced and for coarsening of the crystal grain to occur.
- the present invention has been made in view of the above-described circumstances.
- An object of the present invention to provide a copper alloy material which is stable in characteristics and excellent in service life even when it is used in a high temperature environment of 500°C or more.
- the present invention is directed to a copper alloy material having a composition including: 0.3 mass% or more and less than 0.5 mass% of Cr; 0.01 mass% or more and 0.15 mass% or less of Zr; optionally 0.1 mass% or more and 2.0 mass% or less of Al; optionally one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg in a range of 0.005 mass% or more and 0.1 mass% or less as a total; and a balance being Cu and inevitable impurities, wherein an average of crystal grain sizes is in a range of 0.1 mm or more and 2.0 mm or less, a standard deviation of the crystal grain sizes is 0.6 or less, and an area ratio of crystallized Cr in cross section observation is 0.5 % or less (hereinafter, referred as "a copper alloy material of the present invention").
- the composition includes 0.3 mass% or more and less than 0.5 mass% of Cr; 0.01 mass% or more and 0.15 mass% or less of Zr; optionally 0.1 mass% or more and 2.0 mass% or less of Al; optionally one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg in a range of 0.005 mass% or more and 0.1 mass% or less as a total; and a balance being Cu and inevitable impurities.
- strength (hardness) and conductivity can be improved.
- crystallized Cr is reduced since the Cr content is set to a relatively low level at 0.3 mass% or more and less than 0.5 mass%.
- occurrence of unevenly-sized re-crystallized grains because of accumulation of local strain due to these crystallized Cr can be suppressed. Therefore, local coarsening of crystal grains can be suppressed even in a case of being used under high temperature condition.
- the average of the crystal grain sizes is set in the range of 0.1 mm or more and 2.0 mm or less in the copper alloy material of the present invention.
- accumulation of strain is relatively low for the copper alloy material to be re-crystallized.
- the standard deviation of the crystal grain sizes is set to 0.6 or less.
- the crystal grain sizes are uniform, accumulation of local strain is less. Accordingly, local coarsening of crystal grains can be suppressed even in a case of being used under high temperature condition.
- an area ratio of crystallized Cr in cross section observation is 0.5 % or less.
- the area ratio of the crystallized Cr in cross section observation is set to 0.5 % or less, accumulation of local strain is less. Accordingly, local coarsening of crystal grains can be reliably suppressed even in a case of being used under high temperature condition.
- an average of crystal grain sizes is in a range of 0.1 mm or more and 3.0 mm or less, and a standard deviation of the crystal grain sizes is 1.5 or less
- the composition of the copper alloy material may further include Al in a range of 0.1 mass% or more and 2.0 mass% or less.
- composition of the copper alloy material further includes Al in a range of 0.1 mass% or more and 2.0 mass% or less, conductivity can be adjusted to about 30-60 %IACS.
- the copper alloy material having such a conductivity is particularly suitable as a casting mold material for electromagnetic stirring applications.
- the composition of the copper alloy material may further include one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg in a range of 0.005 mass% or more and 0.1 mass% or less as a total.
- composition of the copper alloy material further includes one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg in the above-described range, coarsening of crystal grain sizes can be suppressed more reliably because of the grain boundary pinning effect by a compound including these elements.
- the present invention it is possible to provide a copper alloy material having stable characteristics and excellent service life even when it is used in a high temperature environment of 500°C or more.
- the copper alloy material of the present embodiment is a material for a part used in a high temperature environment such as a molding material for casting and a welding part.
- the copper alloy material according to the present embodiment has a composition including: 0.3 mass% or more and less than 0.5 mass% of Cr; 0.01 mass% or more and 0.15 mass% or less of Zr; and a balance being Cu and inevitable impurities.
- Al may be contained in the range of 0.1 mass% or more and 2.0 mass% or less, if necessary.
- one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg may be contained in a total amount of 0.005 mass% or more and 0.1 mass% or less.
- the average of crystal grain sizes is in a range of 0.1 mm or more and 2.0 mm or less, and the standard deviation of the crystal grain sizes is 0.6 or less.
- the area ratio of crystallized Cr in cross section observation is 0.5 % or less.
- the area ratio of the crystallized Cr is determined by observing the structure of an arbitrary cross section of the copper alloy material (for example, a cross section parallel to the rolling direction) with microscopic etching, observing the structure with SEM or the like, and analyzing it.
- the average of crystal grain sizes is in a range of 0.1 mm or more and 3.0 mm or less, and the standard deviation of the crystal grain sizes is 1.5 or less.
- Cr is an element having an action effect that improves strength (hardness) and electrical conductivity by finely precipitating Cr-based precipitates in crystal grains of the parent phase by means of an aging treatment.
- the precipitation amount during the aging treatment becomes insufficient, and there is a concern that the strength (hardness) improvement effect cannot be sufficiently obtained.
- the content of Cr is 0.5 mass% or more, a relatively large amount of crystallized Cr exist even after the solution treatment; local strain is accumulated due to these crystallized Cr; and sizes of recrystallized grains becomes uneven. When it is used under a high temperature environment, it is possible that the crystal grains are coarsened.
- the content of Cr is set in a range of 0.3 mass% or more and less than 0.5 mass%. Meanwhile, in order to reliably exhibit the above-described action effect, the lower limit of the content of Cr is preferably set to 0.35 mass% or more, and the upper limit of the content of Cr is preferably set to 0.45 mass% or less.
- Zr is an element having an action effect that improves strength (hardness) and electrical conductivity by finely precipitating Zr-based precipitates in the crystal grain boundaries of the parent phase by means of the aging treatment.
- the precipitation amount during the aging treatment becomes insufficient, and there is a concern that the strength (hardness) improvement effect cannot be sufficiently obtained.
- the content of Zr exceeds 0.15 mass%, there is a concern that electrical conductivity and thermal conductivity may decrease.
- an additional strength improvement effect cannot be obtained.
- the content of Zr is set in a range of 0.01 mass% or more and 0.15 mass% or less. Meanwhile, in order to reliably exhibit the above-described action effect, the lower limit of the content of Zr is preferably set to 0.05 mass% or more, and the upper limit of the content of Zr is preferably set to 0.13 mass% or less.
- Al 0.1 mass% or more and less than 2.0 mass%
- Al is an element having an action effect that decreases electrical conductivity by forming a solid solution in copper alloys. Therefore, it is possible to adjust the electrical conductivity of the copper alloy material to approximately 30% to 60%IACS by controlling the amount of Al added.
- the content of Al is less than 0.1 mass%, it becomes difficult to suppress the electrical conductivity at a low level.
- the content of Al is 2.0 mass% or more, there is a concern that the electrical conductivity may significantly decrease and the thermal conductivity may become insufficient.
- the content of Al is set in a range of 0.1 mass% or more and less than 2.0 mass% in the case of adding Al. Meanwhile, in order to reliably exhibit the above-described action effect, the lower limit of the content of Al is preferably set to 0.3 mass% or more, and the upper limit of the content of Al is preferably set to 1.5 mass% or less. In the case where Al is not intentionally added, Al may be included in the inevitable impurities at less than 0.1 mass%.
- Elements of Fe, Co, Sn, Zn, P, Si and Mg are elements that form fine compounds and exhibit a pinning effect to suppress crystal growth.
- the total content of one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg is set in a range of 0.005 mass% or more and 0.1 mass% or less.
- the lower limit of the total content of one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg P is preferably set to 0.02 mass% or more
- the upper limit of the total content of one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg is preferably set to 0.07 mass% or less.
- elements such as Fe, Co, Sn, Zn, P, Si and Mg are not intentionally added, these elements may be contained as impurities in a total amount of less than 0.005 mass%.
- examples of the inevitable impurities other than Cr, Zr, Al, Fe, Co, Sn, Zn, P, Si, and Mg described above include B, Ag, Ca, Te, Mn, Ni, Sr, Ba, Sc , Y, Ti, Hf, V, Nb, Ta, Mo, W, Re, Ru, Os, Se, Rh, Ir, Pd, Pt, Au, Cd, Ga, In, Li, Ge, As, Sb, Tl, Pb, Be, N, H, Hg, Tc, Na, K, Rb, Cs, Po, Bi, lanthanoids, O, S, C and the like. Since there is a concern that these inevitable impurities may decrease the electrical conductivity and the thermal conductivity, the total amount thereof is preferably set to 0.05 mass% or less.
- the standard deviation of the crystal grain size exceeds 0.6, the deviation of the crystal grain sizes becomes large and strain is locally accumulated. Thus, when used under a high temperature environment, the crystal grains become coarse. In addition, the mechanical properties may be deteriorated.
- the average crystal grain size is set in the range of 0.1 mm or more and 2.0 mm or less, and the standard deviation of the crystal grain size is set to be 0.6 or less.
- the lower limit of the average crystal grain size is preferably 0.15 mm or more, and the upper limit of the average crystal grain size is preferably 1.0 mm or less.
- the area ratio of the crystallized Cr in the cross sectional observation is set to be 0.5% or less.
- the upper limit of the area ratio of the crystallized Cr is preferably 0.3% or less.
- the average crystal grain size after the heat treatment maintained at 1000°C for 1 hour is set in the range of 0.1 mm to 3.0 mm, the standard deviation of the crystal grain size is 1.5 or less.
- the lower limit of the average crystal grain size is preferably 0.2 mm or more, and the upper limit of the average crystal grain size is preferably 0.5 mm or less.
- a copper raw material made of oxygen-free copper having a copper purity of 99.99 mass% or higher is loaded into a carbon crucible and is melted using a vacuum melting furnace, thereby obtaining molten copper.
- the above-described additive elements are added to the obtained molten metal so as to obtain a predetermined concentration, and components are formulated, thereby obtaining a molten copper alloy.
- raw materials of Cr, and Zr which are the additive elements Cr, and Zr having a high purity are used, and, for example, Cr having a purity of 99.99 mass% or higher is used as a raw material of Cr, and Zr having a purity of 99.95 mass% or higher is used as a raw material of Zr.
- Al, Fe, Co, Sn, Zn, P, Si and Mg are added thereto as necessary.
- parent alloys with Cu may also be used as raw materials of Al, Fe, Co, Sn, Zn, P, Si and Mg.
- the component-formulated molten copper alloy is injected into a die, thereby obtaining an ingot.
- a homogenization treatment is carried out on the ingot in the atmosphere under conditions of 950°C or higher and 1,050°C or lower for one hour or longer.
- hot rolling with a working percentage of 50% or higher and 99% or lower is carried out on the ingot in a temperature range of 900°C or higher and 1,000°C or lower, thereby obtaining a rolled material.
- the method of the hot working may be hot forging. After this hot working, the rolled material is immediately cooled by means of water cooling.
- a heating treatment is carried out on the rolled material obtained in the hot working step S03 under conditions of 920°C or higher and 1,050°C or lower for 0.5 hours or longer and five hours or shorter, thereby carrying out a solution treatment.
- the heating treatment is carried out, for example, in the atmosphere or an inert gas atmosphere, and as cooling after the heating, water cooling is carried out.
- the first aging treatment is carried out under conditions of, for example, 400°C or higher and 530°C or lower for 0.5 hours or longer and five hours or shorter.
- the thermal treatment method during the aging treatment is not particularly limited, but the thermal treatment is preferably carried out in an inert gas atmosphere.
- the cooling method after the heating treatment is not particularly limited, but water cooling is preferably carried out.
- the copper alloy material that is the present embodiment is manufactured.
- the casting mold material of the present invention since the casting mold material is provided with a composition including 0.3 mass% or more and less than 0.5 mass% of Cr, 0.01 mass% or more and 0.15 mass% or less of Zr, and a balance being Cu and inevitable impurities, fine precipitates can be precipitated by performing the solution and aging treatments. Thus, strength and electrical conductivity can be improved.
- the Cr content is set to a relatively low content of 0.3 mass% or more and less than 0.5 mass%, crystallized Cr hardly exists after the solution treatment. Specifically, the area ratio of crystallized Cr in cross section observation is 0.5% or less. Therefore, occurrence of unevenly sized recrystallized grains by accumulation of local strain due to the crystallized Cr can be suppressed. Accordingly, local coarsening of crystal grains can be reliably suppressed even when it is used under a high temperature environment.
- the average crystal grain size is set in the range of 0.1 mm or more and 2.0 mm or less, and the standard deviation of the crystal grain size is set to 0.6 or less, so that there is less accumulation of local strain. Accordingly, local coarsening of crystal grains can be reliably suppressed even when it is used under a high temperature environment.
- the average crystal grain size after the heat treatment maintained at 1000°C for 1 hour is set in the range of 0.1 mm or more and 3.0 mm or less, and the standard deviation of the crystal grain size is set to 1.5 or less.
- the conductivity when Al is contained in the range of 0.1 mass% or more and 2.0 mass% or less, the conductivity can be adjusted to about 30 to 60 %IACS.
- the copper alloy material further includes one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg in a range of 0.005 mass% or more and 0.1 mass% or less as a total, coarsening of crystal grains can be more reliably suppressed by the pinning effect of a compound containing these elements.
- a copper raw material made of oxygen-free copper having a copper purity of 99.99 mass% or higher was prepared, was loaded into a carbon crucible, and was melted using a vacuum melting furnace (with a degree of vacuum of 10 -2 Pa or lower), thereby obtaining molten copper.
- a variety of additive elements were added to the obtained molten copper so as to formulate a component composition shown in Table 1, the component composition was maintained for five minutes, and then the molten copper alloy was injected into a cast iron die, thereby obtaining an ingot.
- the sizes of the ingot were set to a width of approximately 80 mm, a thickness of approximately 50 mm, and a length of approximately 130 mm.
- a homogenization treatment was carried out in the atmosphere under conditions of 1,000°C for one hour, and then hot rolling was carried out.
- the rolling reduction in the hot rolling was set to 80%, thereby obtaining a hot-rolled material having a width of approximately 100 mm, a thickness of approximately 10 mm, and a length of approximately 520 mm.
- the structure of the copper alloy material after the aging treatment was observed, and the standard deviation of the average crystal grain size and crystal grain size was measured.
- the average crystal grain size and the standard deviation of the crystal grain diameter after the heat treatment for 1 hour at 1000°C retention were measured for this copper alloy material.
- FIGS. 2A and 2B show the structure observation pictures of the copper alloy materials of Example 1 of the present invention and Comparative Example 4, respectively, after the above-described aging treatment and before the heat treatment at 1000°C for 1 hour retention.
- FIG. 3A and FIG. 3B show the structure observation pictures of the copper alloy materials of Example 1 of the present invention and Comparative Example 4, respectively, after the above-described aging treatment and the heat treatment at 1000°C for 1 hour retention.
- the component composition of the obtained copper alloy material was measured by ICP-MS analysis. The measurement results are shown in Table 1.
- a sample of 10 mm ⁇ 15 mm from the central portion of the plate width was cut out from the obtained thickness of the copper alloy material and the surface in the rolling direction (RD direction) was polished and then micro etching was performed.
- a sample of 10 mm ⁇ 15 mm from the central portion of the plate width was cut out from the thickness of the copper alloy material and the surface in the rolling direction (RD direction) was polished and then micro etching was performed.
- FIGS. 4A to 4D show SEM-EPMA images of Example 1 of the present invention and Comparative Example 4.
- FIGS. 2A and 3A in Examples 1 to 6 of the present invention, local grain coarsening was suppressed even after being placed in a high-temperature environment.
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Description
- The present invention relates to a copper alloy material suitable for a part used in a high temperature environment such as a molding material for casting and a welding part such as a contact tip.
- Priority is claimed on
Japanese Patent Application No. 2015-219852, filed on November 9, 2015 - Conventionally, Cu-Cr-Zr-based alloys such as C18150 are used as a material for casting mold materials and welding members which are used at high temperatures, since they have excellent heat resistance and electrical conductivity as shown in
Patent Literatures 1 and 2. - These Cu-Cr-Zr-based alloy are usually produced by a production process, in which a cast made of Cu-Cr-Zr-based alloy is subjected to a plastic working; a solution treatment, for example in a condition of 950-1050°C of a retention temperature and 0.5-1.5 hours of a retention time, and an aging treatment, for example in a condition of 400-500°C of a retention temperature and 2-4 hours of a retention time, are performed on the plastically worked material; and then the material subjected to the solution and aging treatments is finished into a predetermined shape by machine working in the end.
- In the above-described methods, Cr and Zr are dissolved in the matrix of Cu by the solution treatment and fine precipitates of Cr and Zr are dispersed by the aging treatment to improve strength and conductivity.
- Patent Literature 3 (PTL 3) describes a Cu alloy for a continuous casting mold consisting of 0.4 to 1.5 mass% Cr, 0.01 to 0.30 mass% Zr, 0.05 to 0.80 mass% Al, optionally 0.05 to 1.0 mass% of one or more of Fe, Ni and Co, optionally 0.01 to 0.60 mass% of one or two of Ti and Si and a balance being Cu and unavoidable impurities.
- Non-Patent Literature 1 (NPL 1) reports on the effect of zirconium and heat treatment on the microstructure and properties of cast chromium bronze for conductive parts and inter alia describes an alloy consisting of 0.31 mass% Cr, 0.043 mass% Zr and a balance being Cu.
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- [PTL 1]
Japanese Examined Patent Application, Second Publication No. S62-097748 - [PTL 2]
Japanese Unexamined Patent Application, First Publication No. H05-339688 - [PTL 3]
JP S 58218239 - [NPL 1] Zhi Xiaohui et al., "Effect of zirconium and heat treatment on the microstructure and properties of cast chromium bronze for conductive parts", Zeitschrift für Metallkunde, Carl Hanser, Munich, DE, No.2, pages 192-194
- Although the above-described Cu-Cr-Zr-based alloy has excellent heat resistance, when it is exposed to a use environment with a peak temperature of 500°C or more, occasionally, re-solution of precipitate starts for the strength and the conductivity to be reduced and for coarsening of the crystal grain to occur.
- When coarsening of the crystal grains occurs, the propagation speed of the crack increases and the service life of the product may be shortened. In addition, there has been a problem that mechanical properties such as strength and elongation are remarkably deteriorated due to local occurrence of coarsening of crystal grains.
- The present invention has been made in view of the above-described circumstances. An object of the present invention to provide a copper alloy material which is stable in characteristics and excellent in service life even when it is used in a high temperature environment of 500°C or more.
- To solve the above-described technical problem, the present invention is directed to a copper alloy material having a composition including: 0.3 mass% or more and less than 0.5 mass% of Cr; 0.01 mass% or more and 0.15 mass% or less of Zr; optionally 0.1 mass% or more and 2.0 mass% or less of Al; optionally one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg in a range of 0.005 mass% or more and 0.1 mass% or less as a total; and a balance being Cu and inevitable impurities, wherein an average of crystal grain sizes is in a range of 0.1 mm or more and 2.0 mm or less, a standard deviation of the crystal grain sizes is 0.6 or less, and an area ratio of crystallized Cr in cross section observation is 0.5 % or less (hereinafter, referred as "a copper alloy material of the present invention").
- In the copper alloy material as configured above, the composition includes 0.3 mass% or more and less than 0.5 mass% of Cr; 0.01 mass% or more and 0.15 mass% or less of Zr; optionally 0.1 mass% or more and 2.0 mass% or less of Al; optionally one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg in a range of 0.005 mass% or more and 0.1 mass% or less as a total; and a balance being Cu and inevitable impurities. Thus, by precipitating fine precipitates by the aging treatment, strength (hardness) and conductivity can be improved. In addition, crystallized Cr is reduced since the Cr content is set to a relatively low level at 0.3 mass% or more and less than 0.5 mass%. Thus, occurrence of unevenly-sized re-crystallized grains because of accumulation of local strain due to these crystallized Cr can be suppressed. Therefore, local coarsening of crystal grains can be suppressed even in a case of being used under high temperature condition.
- In addition, the average of the crystal grain sizes is set in the range of 0.1 mm or more and 2.0 mm or less in the copper alloy material of the present invention. Thus, accumulation of strain is relatively low for the copper alloy material to be re-crystallized. In addition, the standard deviation of the crystal grain sizes is set to 0.6 or less. Thus, the crystal grain sizes are uniform, accumulation of local strain is less. Accordingly, local coarsening of crystal grains can be suppressed even in a case of being used under high temperature condition.
- In the copper alloy material of the present invention, an area ratio of crystallized Cr in cross section observation is 0.5 % or less.
- In this case, since the area ratio of the crystallized Cr in cross section observation is set to 0.5 % or less, accumulation of local strain is less. Accordingly, local coarsening of crystal grains can be reliably suppressed even in a case of being used under high temperature condition.
- In the copper alloy material of the present invention, it is preferable that after performing a heat treatment at 1000°C for 1 hour retention, an average of crystal grain sizes is in a range of 0.1 mm or more and 3.0 mm or less, and a standard deviation of the crystal grain sizes is 1.5 or less
- In this case, even after performing the heat treatment at 1000°C for 1 hour retention, crystal grains are not coarsened and the crystal grain sizes are kept relatively uniform. Accordingly, mechanical properties and conductivity are stable even in a case of being used under high temperature condition at 500°C or more.
- In the copper alloy material of the present invention, the composition of the copper alloy material may further include Al in a range of 0.1 mass% or more and 2.0 mass% or less.
- In this case, since the composition of the copper alloy material further includes Al in a range of 0.1 mass% or more and 2.0 mass% or less, conductivity can be adjusted to about 30-60 %IACS. The copper alloy material having such a conductivity is particularly suitable as a casting mold material for electromagnetic stirring applications.
- In the copper alloy material of the present invention, the composition of the copper alloy material may further include one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg in a range of 0.005 mass% or more and 0.1 mass% or less as a total.
- In this case, since the composition of the copper alloy material further includes one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg in the above-described range, coarsening of crystal grain sizes can be suppressed more reliably because of the grain boundary pinning effect by a compound including these elements.
- According to the present invention, it is possible to provide a copper alloy material having stable characteristics and excellent service life even when it is used in a high temperature environment of 500°C or more.
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FIG. 1 is a flowchart of a method of manufacturing a copper alloy material that is an embodiment of the present invention. -
FIG. 2A is a structural observation photograph of Example 1 of the present invention. -
FIG. 2B is a structural observation photograph of Comparative Example 4. -
FIG. 3A is a structure observation photograph of Example 1 of the present invention after performing the heat treatment at 1000°C for 1 hour retention time. -
FIG. 3B is a structure observation photograph of Comparative Example 4 after performing the heat treatment at 1000°C for 1 hour retention time. -
FIG. 4A is an observation photograph of crystallized Cr and an SEM image in Example 1 of the present invention. -
FIG. 4B is an EPMA (Cr) image in Example 1 of the present invention. -
FIG. 4C is an observation photograph of crystallized Cr and an SEM image in Comparative Example 4. -
FIG. 4D is an EPMA (Cr) image in Comparative Example 4. - Hereinafter, a copper alloy material is an embodiment of the present invention will be described.
- The copper alloy material of the present embodiment is a material for a part used in a high temperature environment such as a molding material for casting and a welding part.
- The copper alloy material according to the present embodiment has a composition including: 0.3 mass% or more and less than 0.5 mass% of Cr; 0.01 mass% or more and 0.15 mass% or less of Zr; and a balance being Cu and inevitable impurities. In the copper alloy material of the present embodiment, Al may be contained in the range of 0.1 mass% or more and 2.0 mass% or less, if necessary. Further, one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg may be contained in a total amount of 0.005 mass% or more and 0.1 mass% or less.
- In the copper alloy material of the present embodiment, the average of crystal grain sizes is in a range of 0.1 mm or more and 2.0 mm or less, and the standard deviation of the crystal grain sizes is 0.6 or less.
- In addition, in the copper alloy material of the present embodiment, the area ratio of crystallized Cr in cross section observation is 0.5 % or less.
- The area ratio of the crystallized Cr is determined by observing the structure of an arbitrary cross section of the copper alloy material (for example, a cross section parallel to the rolling direction) with microscopic etching, observing the structure with SEM or the like, and analyzing it.
- Furthermore, in the copper alloy material of the present embodiment, after performing a heat treatment at 1000°C for 1 hour retention, the average of crystal grain sizes is in a range of 0.1 mm or more and 3.0 mm or less, and the standard deviation of the crystal grain sizes is 1.5 or less.
- The reasons why the composition of the copper alloy material according to the present embodiment, the crystal structure and the like are defined as described above will be described below.
- Cr is an element having an action effect that improves strength (hardness) and electrical conductivity by finely precipitating Cr-based precipitates in crystal grains of the parent phase by means of an aging treatment.
- Here, in a case where the content of Cr is less than 0.3 mass%, the precipitation amount during the aging treatment becomes insufficient, and there is a concern that the strength (hardness) improvement effect cannot be sufficiently obtained. In addition, in a case where the content of Cr is 0.5 mass% or more, a relatively large amount of crystallized Cr exist even after the solution treatment; local strain is accumulated due to these crystallized Cr; and sizes of recrystallized grains becomes uneven. When it is used under a high temperature environment, it is possible that the crystal grains are coarsened.
- On the basis of what has been described above, in the present embodiment, the content of Cr is set in a range of 0.3 mass% or more and less than 0.5 mass%. Meanwhile, in order to reliably exhibit the above-described action effect, the lower limit of the content of Cr is preferably set to 0.35 mass% or more, and the upper limit of the content of Cr is preferably set to 0.45 mass% or less.
- Zr is an element having an action effect that improves strength (hardness) and electrical conductivity by finely precipitating Zr-based precipitates in the crystal grain boundaries of the parent phase by means of the aging treatment.
- Here, in a case where the content of Zr is less than 0.01 mass%, the precipitation amount during the aging treatment becomes insufficient, and there is a concern that the strength (hardness) improvement effect cannot be sufficiently obtained. In addition, in a case where the content of Zr exceeds 0.15 mass%, there is a concern that electrical conductivity and thermal conductivity may decrease. In addition, even when more than 0.15 mass% of Zr is included, there is a concern that an additional strength improvement effect cannot be obtained.
- On the basis of what has been described above, in the present embodiment, the content of Zr is set in a range of 0.01 mass% or more and 0.15 mass% or less. Meanwhile, in order to reliably exhibit the above-described action effect, the lower limit of the content of Zr is preferably set to 0.05 mass% or more, and the upper limit of the content of Zr is preferably set to 0.13 mass% or less.
- Al is an element having an action effect that decreases electrical conductivity by forming a solid solution in copper alloys. Therefore, it is possible to adjust the electrical conductivity of the copper alloy material to approximately 30% to 60%IACS by controlling the amount of Al added.
- Here, in a case where the content of Al is less than 0.1 mass%, it becomes difficult to suppress the electrical conductivity at a low level. In addition, in a case where the content of Al is 2.0 mass% or more, there is a concern that the electrical conductivity may significantly decrease and the thermal conductivity may become insufficient.
- On the basis of what has been described above, in the present embodiment, the content of Al is set in a range of 0.1 mass% or more and less than 2.0 mass% in the case of adding Al. Meanwhile, in order to reliably exhibit the above-described action effect, the lower limit of the content of Al is preferably set to 0.3 mass% or more, and the upper limit of the content of Al is preferably set to 1.5 mass% or less. In the case where Al is not intentionally added, Al may be included in the inevitable impurities at less than 0.1 mass%.
- Elements of Fe, Co, Sn, Zn, P, Si and Mg are elements that form fine compounds and exhibit a pinning effect to suppress crystal growth.
- Here, in a case where the total content of one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg is less than 0.005 mass%, there is a concern that the above-described pinning effect cannot be exhibited sufficiently. On the other hand, in a case where the total content of one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg exceeds 0.1 mass%, there is a concern that the electrical conductivity and the thermal conductivity may decrease.
- On the basis of what has been described above, in the present embodiment, the total content of one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg is set in a range of 0.005 mass% or more and 0.1 mass% or less. Meanwhile, in order to reliably exhibit the above-described action effect, the lower limit of the total content of one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg P is preferably set to 0.02 mass% or more, and the upper limit of the total content of one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg is preferably set to 0.07 mass% or less. In addition, when elements such as Fe, Co, Sn, Zn, P, Si and Mg are not intentionally added, these elements may be contained as impurities in a total amount of less than 0.005 mass%.
- Meanwhile, examples of the inevitable impurities other than Cr, Zr, Al, Fe, Co, Sn, Zn, P, Si, and Mg described above include B, Ag, Ca, Te, Mn, Ni, Sr, Ba, Sc , Y, Ti, Hf, V, Nb, Ta, Mo, W, Re, Ru, Os, Se, Rh, Ir, Pd, Pt, Au, Cd, Ga, In, Li, Ge, As, Sb, Tl, Pb, Be, N, H, Hg, Tc, Na, K, Rb, Cs, Po, Bi, lanthanoids, O, S, C and the like. Since there is a concern that these inevitable impurities may decrease the electrical conductivity and the thermal conductivity, the total amount thereof is preferably set to 0.05 mass% or less.
- In the case of having a fine crystal structure with an average crystal grain size of less than 0.1 mm, the driving force in recrystallization increases and there is a possibility that high strain is introduced locally. Therefore, when used under a high temperature environment, the crystal grains may be coarsened. On the other hand, when the average crystal grain size exceeds 2.0 mm, workability becomes insufficient and it is difficult to use industrially. Specifically, since the grain boundary strength decreases, the tensile strength and elongation are lowered and the crack propagation speed also increases, which makes it difficult to use it industrially.
- In addition, when the standard deviation of the crystal grain size exceeds 0.6, the deviation of the crystal grain sizes becomes large and strain is locally accumulated. Thus, when used under a high temperature environment, the crystal grains become coarse. In addition, the mechanical properties may be deteriorated.
- On the basis of what has been described above, in the present embodiment, the average crystal grain size is set in the range of 0.1 mm or more and 2.0 mm or less, and the standard deviation of the crystal grain size is set to be 0.6 or less. The lower limit of the average crystal grain size is preferably 0.15 mm or more, and the upper limit of the average crystal grain size is preferably 1.0 mm or less. In addition, it is preferable to set the upper limit of the standard deviation of crystal grain size to 0.5 or less.
- When the area ratio of the crystallized Cr exceeds 0.5%, the strain is locally accumulated, so that the size of the recrystallized grains is difficult to be uniform. Thus, when used in a high temperature environment, there is a possibility that crystal grains becomes coarse.
- From the above, in the present embodiment, the area ratio of the crystallized Cr in the cross sectional observation is set to be 0.5% or less. The upper limit of the area ratio of the crystallized Cr is preferably 0.3% or less.
- By setting the average crystal grain size after the heat treatment maintained at 1000°C for 1 hour within the above range, coarsening of crystal grains when used in a high temperature environment is reliably suppressed. In addition, by setting the standard deviation after heat treatment held at 1000°C for 1 to 1.5 hours or less, occurrence of unevenly sized crystal grains when used under a high temperature environment is reliably suppressed.
- From the above description, in the present embodiment, the average crystal grain size after the heat treatment maintained at 1000°C for 1 hour is set in the range of 0.1 mm to 3.0 mm, the standard deviation of the crystal grain size is 1.5 or less. The lower limit of the average crystal grain size is preferably 0.2 mm or more, and the upper limit of the average crystal grain size is preferably 0.5 mm or less. In addition, it is preferable to set the upper limit of the standard deviation of crystal grain size to 1.3 or less.
- Next, a method for manufacturing the casting mold material according to the embodiment of the present invention will be described with reference to a flowchart of
FIG. 1 . - First, a copper raw material made of oxygen-free copper having a copper purity of 99.99 mass% or higher is loaded into a carbon crucible and is melted using a vacuum melting furnace, thereby obtaining molten copper. Next, the above-described additive elements are added to the obtained molten metal so as to obtain a predetermined concentration, and components are formulated, thereby obtaining a molten copper alloy.
- Here, as raw materials of Cr, and Zr which are the additive elements, Cr, and Zr having a high purity are used, and, for example, Cr having a purity of 99.99 mass% or higher is used as a raw material of Cr, and Zr having a purity of 99.95 mass% or higher is used as a raw material of Zr. In addition, Al, Fe, Co, Sn, Zn, P, Si and Mg are added thereto as necessary. Meanwhile, as raw materials of Al, Fe, Co, Sn, Zn, P, Si and Mg, parent alloys with Cu may also be used.
- In addition, the component-formulated molten copper alloy is injected into a die, thereby obtaining an ingot.
- Next, a thermal treatment is carried out in order for the homogenization of the obtained ingot.
- Specifically, a homogenization treatment is carried out on the ingot in the atmosphere under conditions of 950°C or higher and 1,050°C or lower for one hour or longer.
- Next, hot rolling with a working percentage of 50% or higher and 99% or lower is carried out on the ingot in a temperature range of 900°C or higher and 1,000°C or lower, thereby obtaining a rolled material. Meanwhile, the method of the hot working may be hot forging. After this hot working, the rolled material is immediately cooled by means of water cooling.
- Next, a heating treatment is carried out on the rolled material obtained in the hot working step S03 under conditions of 920°C or higher and 1,050°C or lower for 0.5 hours or longer and five hours or shorter, thereby carrying out a solution treatment. The heating treatment is carried out, for example, in the atmosphere or an inert gas atmosphere, and as cooling after the heating, water cooling is carried out.
- Next, after the solution treatment step S04, an aging treatment is carried out, and precipitates such as Cr-based precipitates and Zr-based precipitates are finely precipitated, thereby obtaining a first aging treatment material.
- Here, the first aging treatment is carried out under conditions of, for example, 400°C or higher and 530°C or lower for 0.5 hours or longer and five hours or shorter.
- Meanwhile, the thermal treatment method during the aging treatment is not particularly limited, but the thermal treatment is preferably carried out in an inert gas atmosphere. In addition, the cooling method after the heating treatment is not particularly limited, but water cooling is preferably carried out.
- By means of the above-described steps, the copper alloy material that is the present embodiment is manufactured.
- According to the copper alloy material of the present invention provided with the above-described constitution, since the casting mold material is provided with a composition including 0.3 mass% or more and less than 0.5 mass% of Cr, 0.01 mass% or more and 0.15 mass% or less of Zr, and a balance being Cu and inevitable impurities, fine precipitates can be precipitated by performing the solution and aging treatments. Thus, strength and electrical conductivity can be improved.
- In addition, since the Cr content is set to a relatively low content of 0.3 mass% or more and less than 0.5 mass%, crystallized Cr hardly exists after the solution treatment. Specifically, the area ratio of crystallized Cr in cross section observation is 0.5% or less. Therefore, occurrence of unevenly sized recrystallized grains by accumulation of local strain due to the crystallized Cr can be suppressed. Accordingly, local coarsening of crystal grains can be reliably suppressed even when it is used under a high temperature environment.
- In the present embodiment, the average crystal grain size is set in the range of 0.1 mm or more and 2.0 mm or less, and the standard deviation of the crystal grain size is set to 0.6 or less, so that there is less accumulation of local strain. Accordingly, local coarsening of crystal grains can be reliably suppressed even when it is used under a high temperature environment.
- Furthermore, the average crystal grain size after the heat treatment maintained at 1000°C for 1 hour is set in the range of 0.1 mm or more and 3.0 mm or less, and the standard deviation of the crystal grain size is set to 1.5 or less. Thus, even after heat treatment at 1000°C for 1 hour retention, crystal grains are not coarsened locally and even when used under a high temperature environment of 500°C or more, mechanical properties and conductivity are stable.
- Further, in this embodiment, when Al is contained in the range of 0.1 mass% or more and 2.0 mass% or less, the conductivity can be adjusted to about 30 to 60 %IACS.
- As a result, it is possible to obtain a copper alloy material particularly suitable as a casting mold material for electromagnetic stirring applications.
- In addition, in the present embodiment, when the copper alloy material further includes one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg in a range of 0.005 mass% or more and 0.1 mass% or less as a total, coarsening of crystal grains can be more reliably suppressed by the pinning effect of a compound containing these elements.
- Hitherto, the embodiment of the present invention has been described, but the present invention is not limited thereto and can be appropriately modified in the scope of the technical concept of the invention.
- Hereinafter, the results of confirmation tests carried out in order to confirm the effects of the present invention will be described.
- A copper raw material made of oxygen-free copper having a copper purity of 99.99 mass% or higher was prepared, was loaded into a carbon crucible, and was melted using a vacuum melting furnace (with a degree of vacuum of 10-2 Pa or lower), thereby obtaining molten copper. A variety of additive elements were added to the obtained molten copper so as to formulate a component composition shown in Table 1, the component composition was maintained for five minutes, and then the molten copper alloy was injected into a cast iron die, thereby obtaining an ingot. The sizes of the ingot were set to a width of approximately 80 mm, a thickness of approximately 50 mm, and a length of approximately 130 mm.
- Meanwhile, as a raw material of Cr which was an additive element, Cr having a purity of 99.99 mass% or higher was used, and as a raw material of Zr, Zr having a purity of 99.95 mass% or higher was used.
- Next, a homogenization treatment was carried out in the atmosphere under conditions of 1,000°C for one hour, and then hot rolling was carried out. The rolling reduction in the hot rolling was set to 80%, thereby obtaining a hot-rolled material having a width of approximately 100 mm, a thickness of approximately 10 mm, and a length of approximately 520 mm.
- A solution treatment was carried out on this hot-rolled material under conditions of 1,000°C for 1.5 hours, and then cooled at the cooling rates shown in Table 2.
- Next, a aging treatment was carried out under conditions of 500 (±15)°C for three hours. By following above-described procedures, the copper alloy materials were obtained.
- For the obtained copper alloy material, the structure of the copper alloy material after the aging treatment was observed, and the standard deviation of the average crystal grain size and crystal grain size was measured.
- In addition, the average crystal grain size and the standard deviation of the crystal grain diameter after the heat treatment for 1 hour at 1000°C retention were measured for this copper alloy material.
- Further, cross-section observation was performed on the material after the solution treatment, and the area ratio of crystallized Cr was measured.
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FIGS. 2A and 2B show the structure observation pictures of the copper alloy materials of Example 1 of the present invention and Comparative Example 4, respectively, after the above-described aging treatment and before the heat treatment at 1000°C for 1 hour retention. - Similarly,
FIG. 3A and FIG. 3B show the structure observation pictures of the copper alloy materials of Example 1 of the present invention and Comparative Example 4, respectively, after the above-described aging treatment and the heat treatment at 1000°C for 1 hour retention. - The component composition of the obtained copper alloy material was measured by ICP-MS analysis. The measurement results are shown in Table 1.
- A sample of 10 mm × 15 mm from the central portion of the plate width was cut out from the obtained thickness of the copper alloy material and the surface in the rolling direction (RD direction) was polished and then micro etching was performed.
- This sample was observed and the average crystal grain size was measured by the intercept method prescribed in JIS H 0501.
- A sample of 10 mm × 15 mm from the central portion of the plate width was cut out from the thickness of the copper alloy material and the surface in the rolling direction (RD direction) was polished and then micro etching was performed.
- This sample was observed by SEM, and in a SEM-EPMA image of 1500 times magnification (field of view of approximately 70 µm × 70 µm), a region where the Cr concentration was higher than that of the parent phase was judged to be "crystallized Cr", and ratios of crystallized Cr were determined by the following formula.
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FIGS. 4A to 4D show SEM-EPMA images of Example 1 of the present invention and Comparative Example 4. - JIS Z 2241 No. 2 test piece was taken with the rolling direction as the pulling direction and subjected to the test using a 100 kN tensile tester.
[Table 1] Composition (mass%) Cr Zr Al Fe Co Sn Zn P Si Mg Cu Examples of the present invention 1 0.35 0.14 - - - - - - - - balance 2 0.35 0.14 0.02 - - 0.02 0.02 - - - balance 3 0.39 0.14 0.93 - - - - - - - balance 4 0.45 0.08 - 0.01 - - - 0.01 - - balance 5 0.45 0.07 - - - - - - 0.02 0.01 balance 6 0.50 0.02 1.90 - 0.07 - - 0.02 - - balance Comparative Examples 1 0.20 0.10 - - - - - - - - balance 2 0.70 0.14 - - - - - - - - balance 3 0.70 0.02 - - - - - - 0.01 - balance 4 0.90 0.08 - - - - - - - 0.20 balance [Table 2] Cooling rate after solution treatment (°C/min) After aging treatment After heat treatment at 1000°C for 1 hour Area ratio of crystallized Cr after solution treatment (%) Average crystal grain size (mm) Standard deviation Tensile strength (MPa) Average crystal grain size (mm) Standard deviation Tensile strength (MPa) Examples of the present invention 1 1000 0.144 0.58 433 0.243 1.21 413 0.3 2 1000 0.162 0.55 430 0.451 1.25 407 0.3 3 1000 0.169 0.56 423 0.331 1.34 420 0.3 4 1000 0.110 0.49 417 0.207 1.29 419 0.5 5 1000 0.161 0.52 433 0.303 1.30 401 0.4 6 27 0.142 0.55 427 0.213 1.45 389 0.5 Comparative Examples 1 9 0.120 0.62 383 0.270 1.53 357 0.7 2 1000 0.078 0.70 432 0.292 1.56 339 1.8 3 1000 0.081 0.65 422 0.346 1.52 331 1.8 4 1000 0.096 0.68 434 0.261 1.63 353 2.0 -
FIGS. 2A and3A , in Examples 1 to 6 of the present invention, local grain coarsening was suppressed even after being placed in a high-temperature environment. - On the other hand, as shown in
FIGS. 2B and3B , in Comparative Examples 1 to 4, the crystal grains coarsened locally after being placed in a high-temperature environment. - In Comparative Example 1 in which the Cr content was less than the range of the scope of the present invention and the standard deviation of the crystal grain size was more than the range of the scope of the present invention, the tensile strength after the aging heat treatment and after the heat treatment at 1000°C for 1 hour was insufficient.
- In Comparative Example 2-4 in which the content of Cr was more than the range of the scope of the present invention and the average crystal grain size was less than the scope of the present invention and the standard deviation of crystal grain size was more than the range of the scope of the present invention, the tensile strength greatly decreased after the heat treatment at 1000°C for 1 hour.
- In contrast, in Examples 1-6 of the present invention, the tensile strength after aging heat treatment was high and the tensile strength did not decrease greatly after the heat treatment at 1000°C for 1 hour.
- From the above-described results, according to the example of the present invention, it is confirmed that a copper alloy material having stable properties and excellent service life even when it is used under a high temperature environment of 500°C or more was provided.
- It is possible to suppress property deterioration of a part made of the Cu-Cr-Zr-based alloy in a high temperature environment and prolong the service life of the casting molding material, the welding part and the like.
Claims (1)
- A copper alloy material having a composition including:0.3 mass% or more and less than 0.5 mass% of Cr;0.01 mass% or more and 0.15 mass% or less of Zr;optionally 0.1 mass% or more and 2.0 mass% or less of Al;optionally one or more elements selected from Fe, Co, Sn, Zn, P, Si and Mg in a range of 0.005 mass% or more and 0.1 mass% or less as a total; anda balance being Cu and inevitable impurities,wherein an average of crystal grain sizes is in a range of 0.1 mm or more and 2.0 mm or less,a standard deviation of the crystal grain sizes is 0.6 or less, andan area ratio of crystallized Cr in cross section observation is 0.5 % or less.
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CN106350698B (en) * | 2016-09-09 | 2018-03-27 | 宁波博威合金板带有限公司 | Anti-softening copper alloy, preparation method and applications |
JP7035478B2 (en) * | 2017-11-21 | 2022-03-15 | 三菱マテリアル株式会社 | Molding material for casting |
US20220119919A1 (en) * | 2019-02-20 | 2022-04-21 | Mitsubishi Materials Corporation | Copper alloy material, commutator segment, and electrode material |
CN112981170B (en) * | 2021-02-05 | 2022-04-12 | 宁波金田铜业(集团)股份有限公司 | Chromium-zirconium-copper alloy for cold heading and preparation method thereof |
CN114318049A (en) * | 2021-12-16 | 2022-04-12 | 镇江市镇特合金材料有限公司 | Long-life copper alloy for welding head box body and preparation method thereof |
CN115896535B (en) * | 2022-11-26 | 2023-12-12 | 广州番禺职业技术学院 | Copper incense burner material and preparation method thereof |
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JPS5946699B2 (en) * | 1979-03-27 | 1984-11-14 | 日立造船株式会社 | Mold material for continuous casting equipment |
JPS58107459A (en) * | 1981-12-21 | 1983-06-27 | Chuetsu Gokin Chuko Kk | Mold material for precipitation hardening type continuous casting |
JPS58107462A (en) * | 1981-12-21 | 1983-06-27 | Chuetsu Gokin Chuko Kk | Mold material for precipitation hardening type continuous casting |
JPS58212839A (en) * | 1982-06-03 | 1983-12-10 | Mitsubishi Metal Corp | Cu alloy for continuous casting mold |
JPS59193233A (en) * | 1983-04-15 | 1984-11-01 | Toshiba Corp | Copper alloy |
JPS6297748A (en) * | 1985-03-25 | 1987-05-07 | Fujikura Ltd | Cast wheel and its production |
JPH05339688A (en) * | 1992-06-05 | 1993-12-21 | Furukawa Electric Co Ltd:The | Production of molding material for casting metal |
JP3303623B2 (en) * | 1995-09-22 | 2002-07-22 | 三菱マテリアル株式会社 | Method for producing copper alloy mold material for steelmaking continuous casting and mold produced thereby |
WO2010079707A1 (en) * | 2009-01-09 | 2010-07-15 | 三菱伸銅株式会社 | High-strength high-conductivity copper alloy rolled sheet and method for producing same |
CN103080347A (en) * | 2010-08-27 | 2013-05-01 | 古河电气工业株式会社 | Copper alloy sheet and method for producing same |
CN102534291A (en) * | 2010-12-09 | 2012-07-04 | 北京有色金属研究总院 | CuCrZr alloy with high strength and high conductivity, and preparation and processing method thereof |
KR101364542B1 (en) * | 2011-08-11 | 2014-02-18 | 주식회사 풍산 | Copper alloy material for continuous casting mold and process of production same |
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2015
- 2015-11-09 JP JP2015219852A patent/JP6693092B2/en active Active
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2016
- 2016-10-11 EP EP16863936.7A patent/EP3375898B1/en active Active
- 2016-10-11 KR KR1020187012111A patent/KR20180078245A/en not_active Application Discontinuation
- 2016-10-11 US US15/771,847 patent/US20190062874A1/en not_active Abandoned
- 2016-10-11 WO PCT/JP2016/080125 patent/WO2017081972A1/en unknown
- 2016-10-11 CN CN201680065499.1A patent/CN108350530A/en active Pending
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JP2017088949A (en) | 2017-05-25 |
JP6693092B2 (en) | 2020-05-13 |
WO2017081972A1 (en) | 2017-05-18 |
EP3375898A1 (en) | 2018-09-19 |
CN108350530A (en) | 2018-07-31 |
US20190062874A1 (en) | 2019-02-28 |
KR20180078245A (en) | 2018-07-09 |
EP3375898A4 (en) | 2019-04-03 |
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