CN108350530A - Cu alloy material - Google Patents
Cu alloy material Download PDFInfo
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- CN108350530A CN108350530A CN201680065499.1A CN201680065499A CN108350530A CN 108350530 A CN108350530 A CN 108350530A CN 201680065499 A CN201680065499 A CN 201680065499A CN 108350530 A CN108350530 A CN 108350530A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/01—Alloys based on copper with aluminium as the next major constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C9/00—Moulds or cores; Moulding processes
- B22C9/06—Permanent moulds for shaped castings
- B22C9/061—Materials which make up the mould
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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Abstract
The Cu alloy material of the present invention, which is characterized in that there is following composition：Containing 0.3 mass % less than the Cr of 0.5 mass %, 0.01 mass % or more and 0.15 mass % Zr below, remainder is made of Cu and inevitable impurity, average crystal grain diameter is located in the range of 0.1mm or more and 2.0mm or less, also, the standard deviation of crystal grain diameter is 0.6 or less.
Description
Technical field
The present application is related to a kind of Cu alloy material, is suitable for the welding such as casting molds material and contact chip
The component used under high temperature environment with component etc..
This application claims based on November 9th, 2015 in the priority of the patent application 2015-219852 of Japanese publication,
And its content is applied at this.
Background technology
In the past, the Cu-Cr-Zr such as C18150 systems alloy had excellent heat resistance and electric conductivity, therefore such as patent document 1,2
Be shown as use environment is utilized for the casting molds material of high temperature and the material of welding component.
This Cu-Cr-Zr systems alloy is usually manufactured by the following process to manufacture：Cu-Cr-Zr systems alloy ingot is implemented
Plastic processing, for example keep temperature is 950~1050 DEG C and the retention time is 0.5~1.5 hour solution treatment and
Such as the ageing treatment that temperature is 400~500 DEG C and the retention time is 2~4 hours is kept finally to do established practice by mechanical processing
Shape shape.
In solution treatment, Cr and Zr are solid-solution in the parent phase of Cu, and make the precipitate of Cr and Zr by ageing treatment
Imperceptibly disperse, is achieved in the raising of intensity and conductivity.
Patent document 1：Japanese Unexamined Patent Application 62-097748 bulletins (A)
Patent document 2：Japanese Unexamined Patent Publication 05-339688 bulletins (A)
Although above-mentioned Cu-Cr-Zr systems alloy have excellent heat resistance, if be exposed to peak temperature be 500 DEG C with
On use environment under, then proceed by being dissolved again for precipitate, as this is dissolved again, intensity and conductivity reduce sometimes, and
And generate the coarsening of crystal grain.
Leading to the coarsening of crystal grain, it is possible to which the spread speed of cracking increases, and life of product shortens.And
And since part generates the coarsening of crystal grain, there are problems that the mechanical properties such as intensity and elongation percentage significantly decrease.
Invention content
The present application is to complete in view of the foregoing, even if its purpose is to provide a kind of at 500 DEG C or more
Under hot environment in the case of use, performance also stablizes and the excellent Cu alloy material of service life.
In order to solve the above problems, Cu alloy material (hereinafter referred to as " the present application of a mode of the present application
Cu alloy material ") be characterized in that there is following composition：Containing 0.3 mass % less than 0.5 mass % Cr,
0.01 mass % or more and 0.15 mass % Zr below, remainder are made of Cu and inevitable impurity, average crystal grain
Diameter is located in the range of 0.1mm or more and 2.0mm or less, and the standard deviation of crystal grain diameter is 0.6 or less.
In the Cu alloy material of the structure, it is set as forming as follows：Containing 0.3 mass % less than 0.5 mass %
Cr, 0.01 mass % or more and 0.15 mass % Zr below, remainder be made of Cu and inevitable impurity, therefore
Fine precipitate is precipitated by ageing treatment, thus, it is possible to improve intensity (hardness) and conductivity.Also, the content of Cr compared with
It is 0.3 mass % less less than 0.5 mass %, therefore Cr crystalline materials are few, can inhibit to lead because of the Cr crystalline materials
The Strain Accumulation of part is caused to become non-uniform phenomenon to the size of recrystal grain.Therefore, make even in a high temperature environment
In the case of, it can also inhibit local coarse grains.
Moreover, in the Cu alloy material of the present application, average crystal grain diameter is located at 0.1mm or more and 2.0mm or less
In the range of, therefore Strain Accumulation is less, and be not easy to recrystallize.Also, the standard deviation of crystal grain diameter be set as 0.6 hereinafter, because
This crystal grain diameter becomes uniform, and local Strain Accumulation is few, even in a high temperature environment in the case of use, can also inhibit office
The coarse grains in portion.
Here, in the Cu alloy material of the present application, the area ratio of the Cr crystalline materials in preferred cross-sections observation
It is 0.5% or less.
In this case, the area ratio of the Cr crystalline materials in cross-section is limited in 0.5% hereinafter, therefore local answer
It is few to become accumulation, even in a high temperature environment in the case of use, can also be reliably suppressed local coarse grains.
Also, in the Cu alloy material of the present application, preferably implement 1000 DEG C at keep 1 hour heat treatment it
Average crystal grain diameter afterwards is located in the range of 0.1mm or more and 3.0mm or less, and the standard deviation of crystal grain diameter is 1.5
Below.
In this case, even if without coarsening and crystalline substance if crystal grain after the heat treatment for keeping 1 hour at implementing 1000 DEG C
Grain diameter is more uniform, therefore even if mechanical property and conductivity if are steady in the case of use under 500 DEG C or more of hot environment
It is fixed.
Also, in the Cu alloy material of the present application, more than 0.1 mass % and 2.0 mass % ranges below
It is interior further to contain Al.
In this case, other than Cr and Zr, more than 0.1 mass % and in the range of 2.0 mass % or less further
Containing Al, therefore conductivity can be adjusted to 30~60%IACS or so.The Cu alloy material of this conductivity is especially suitable for
Casting molds material as electromagnetic agitation purposes.
Also, in the Cu alloy material of the present application, in total 0.005 mass % or more and 0.1 mass % or less
In the range of, it can further contain the element selected from one or more of Fe, Co, Sn, Zn, P, Si and Mg.
In this case, other than Cr and Zr, the further member containing Fe, Co, Sn, Zn, P, Si, Mg within the above range
Element, therefore the pinning-in effect (pinning effect) of the crystal boundary by being generated by the compound containing these elements, Neng Goujin
One step is reliably suppressed the coarsening of crystal grain.
According to the present application, even if being capable of providing a kind of under 500 DEG C or more of hot environment in the case of use, property
Can also it stablize and Cu alloy material that service life is excellent.
Description of the drawings
Fig. 1 is the flow chart of the manufacturing method of the Cu alloy material of an embodiment of the present application.
Fig. 2A is the structure observation photo of embodiment.Indicate the structure observation photo of example 1 of the present invention.
Fig. 2 B are the structure observation photos of embodiment.Indicate the structure observation photo of comparative example 4.
Fig. 3 A be in embodiment implement 1000 DEG C at keep heat treatment in 1 hour after structure observation photo.Table
Show the structure observation photo after the heat treatment of example 1 of the present invention.
Fig. 3 B be in embodiment implement 1000 DEG C at keep heat treatment in 1 hour after structure observation photo.Table
Show the structure observation photo after the heat treatment of comparative example 4.
Fig. 4 A are the Cr crystal qualitative observation photos in embodiment.It is the SEM image in example 1 of the present invention.
Fig. 4 B are EPMA (Cr) images of example 1 of the present invention.
Fig. 4 C are the Cr crystal qualitative observation photos in embodiment.It is the SEM image in comparative example 4.
Fig. 4 D are EPMA (Cr) images of comparative example 4.
Specific implementation mode
Hereinafter, being illustrated to the Cu alloy material of an embodiment of the present application.
The Cu alloy material of present embodiment is used in such as casting molds and welding component under high temperature environment
The component used.
The Cu alloy material of present embodiment has following composition：Containing 0.3 mass % less than 0.5 mass %'s
Cr, 0.01 mass % or more and 0.15 mass % Zr below, remainder are made of Cu and inevitable impurity.In addition,
It, as needed, and can in the range of 2.0 mass % or less more than 0.1 mass % in the Cu alloy material of present embodiment
Further to contain Al.Also, in the range of total 0.005 mass % or more and 0.1 mass % or less, can further it contain
There is the element selected from one or more of Fe, Co, Sn, Zn, P, Si and Mg.
Moreover, in the Cu alloy material of present embodiment, average crystal grain diameter is located at 0.1mm or more and 2.0mm or less
In the range of, and the standard deviation of crystal grain diameter is set as 0.6 or less.
Also, in the Cu alloy material of present embodiment, the area ratio of the Cr crystalline materials in cross-section is set as
0.5% or less.
After carrying out microetch to the arbitrary section of Cu alloy material (such as section parallel with rolling direction), lead to
It crosses SEM etc. and carries out structure observation, in turn, elemental analysis is carried out to the section for being used as the observation object by EPMA etc., thus
To the area ratio of Cr crystalline materials.
Further, in the Cu alloy material of present embodiment, implement 1000 DEG C at keep 1 hour heat treatment it
Average crystal grain diameter afterwards is located in the range of 0.1mm or more and 3.0mm or less, and the standard deviation of crystal grain diameter is set as
1.5 following.
Hereinafter, in the Cu alloy material of present embodiment, to predetermined component as described above composition and texture etc.
Reason illustrates.
(Cr：0.3 mass % is less than 0.5 mass %)
Cr is the element for having following function and effect, i.e., makes the precipitate of Cr systems in the crystal grain of parent phase by ageing treatment
It is imperceptibly precipitated, to improve intensity (hardness) and conductivity.
Here, in the case that the content of Cr is less than 0.3 mass %, amount of precipitation is insufficient when ageing treatment, it is possible to can not
Fully obtain the effect of intensity (hardness) raising.Also, in the case that the content of Cr is 0.5 mass % or more, even if being dissolved
There is also more Cr crystalline materials after processing, cause localized accumulated to strain by the Cr crystalline materials, the ruler of recrystal grain
It is very little to become uneven, to which crystal grain is possible to coarsening when using under high temperature environment.
According to the above, in the present embodiment, the content of Cr is set in 0.3 mass % less than 0.5 matter
In the range of amount %.In addition, in order to reliably play above-mentioned function and effect, the lower limit of the content of Cr is preferably set as 0.35 matter
% or more is measured, the upper limit of the content of Cr is preferably set as 0.45 mass % or less.
(Zr：0.01 mass % or more and 0.15 mass % or less)
Zr is the element for having following function and effect, i.e., Zr systems is imperceptibly precipitated into the crystal grain of parent phase by ageing treatment
Precipitate, to improve intensity (hardness) and conductivity.
Here, in the case that the content of Zr is less than 0.01 mass %, amount of precipitation is insufficient when ageing treatment, it is possible to can not
Fully obtain the effect of intensity (hardness) raising.Also, in the case that the content of Zr is more than 0.15 mass %, conductivity and heat conduction
Rate is possible to decline.Also, even if when being more than 0.15 mass % containing Zr, it is also possible to be unable to get further intensity and improve
Effect.
According to the above, in present embodiment, the content of Zr is set in 0.01 mass % or more and 0.15 mass %
In following range.In addition, in order to reliably play above-mentioned function and effect, the lower limit of the content of Zr is preferably set as 0.05 matter
% or more is measured, the upper limit of the content of Zr is set as 0.13 mass % or less.
(Al：0.1 mass % is less than 2.0 mass %)
Al is with the element for reducing the function and effect of conductivity by being solid-solution in copper alloy.Therefore, as needed, lead to
The additive amount for crossing control Al, can be adjusted to 30~60%IACS or so by the conductivity of Cu alloy material.
Here, in the case that the content of Al is less than 0.1 mass %, it is difficult to conductivity is suppressed to relatively low.Also, Al's contains
In the case that amount is 2.0 mass % or more, it is possible to which conductivity is greatly reduced, and thermal conductivity is insufficient.
According to the above, in present embodiment, in the case where adding Al, the content of Al is set in 0.1 mass %
In the range of 2.0 mass %.In addition, in order to reliably play above-mentioned function and effect, preferably by the content of Al
Lower limit is set as 0.3 mass % or more, and the upper limit of the content of Al is preferably set as 1.5 mass % or less.Also, it is not adding intentionally
In the case of Al, the Al less than 0.1 mass % can be contained as impurity.
(the element selected from one or more of Fe, Co, Sn, Zn, P, Si, Mg：Total 0.005 mass % or more
And 0.1 below mass %)
These elements of Fe, Co, Sn, Zn, P, Si, Mg are to form fine compound and show the nail for inhibiting crystal growth
The firmly element of effect.
Here, total content of the element selected from one or more of Fe, Co, Sn, Zn, P, Si, Mg is less than
In the case of 0.005 mass %, it is possible to play above-mentioned pinning-in effect with being unable to fully.On the other hand, selected from Fe, Co, Sn,
In the case that total content of the element of one or more of Zn, P, Si, Mg is more than 0.1 mass %, conductivity and lead
Heating rate may reduce.
According to the above, in the present embodiment, in the case where adding these elements, will be selected from Fe, Co, Sn, Zn,
P, total content of the element of one or more of Si, Mg is set in 0.005 mass % or more and 0.1 mass % or less
In the range of.In addition, in order to reliably play above-mentioned function and effect, preferably by one in Fe, Co, Sn, Zn, P, Si, Mg
Kind or the lower limit of total content of two or more elements be set as 0.02 mass % or more, will preferably be selected from Fe, Co, Sn, Zn, P,
The upper limit of total content of the element of one or more of Si, Mg is set as 0.07 mass % or less.Also, intentionally not
In the case of these elements of addition Fe, Co, Sn, Zn, P, Si, Mg, these elements of 0.005 mass % can be less than containing total amount
As impurity.
(other inevitable impurity：0.05 mass % or less)
In addition, as other than above-mentioned Cr, Zr, Al, Fe, Co, Sn, Zn, P, Si, Mg other inevitably it is miscellaneous
Matter, can enumerate B, Ag, Ca, Te, Mn, Ni, Sr, Ba, Sc, Y, Ti, Hf, V, Nb, Ta, Mo, W, Re, Ru, Os, Se, Rh, Ir,
Pd, Pt, Au, Cd, Ga, In, Li, Ge, As, Sb, Tl, Pb, Be, N, H, Hg, Tc, Na, K, Rb, Cs, Po, Bi, group of the lanthanides, O, S, C
Deng.These inevitable impurity are possible to that conductivity and thermal conductivity can be reduced, thus be preferably set to 0.05 mass % of total amount with
Under.
(average crystal grain diameter：0.1mm or more and 2.0mm hereinafter, crystal grain diameter standard deviation：0.6 or less)
In the case where being less than the fine texture of 0.1mm with average crystal grain diameter, it is possible to when recrystallizing
Driving force becomes larger, and is locally imported with high strain.Therefore, under high temperature environment in use, crystal grain is possible to coarsening.Separately
On the one hand, in the case where average crystal grain diameter is more than 2.0mm, processability is insufficient, is industrially difficult with.It is specific and
Speech, since grain-boundary strength declines, tensile strength and elongation percentage reduce, and crevasse crack propagation speed also rises, therefore in work
It is difficult to be used in industry.
Also, in the case where the standard deviation of crystal grain diameter is more than 0.6, the deviation of crystal grain diameter is big, and localized accumulated
Strain, under high temperature environment in use, crystal grain is possible to coarsening.Also, mechanical property is likely to decrease.
According to the above, in the present embodiment, average crystal grain diameter is located at 0.1mm or more and 2.0mm is below
In range, and the standard deviation of crystal grain diameter is defined as 0.6 or less.Additionally, it is preferred that the lower limit of average crystal grain diameter is set as
The upper limit of average crystal grain diameter is preferably set as 1.0mm or less by 0.15mm or more.Also, it is preferred that by the standard deviation of crystal grain diameter
The upper limit of difference is set as 0.5 or less.
(the area ratio of the Cr crystalline materials in cross-section：0.5% or less)
In the case where the area ratio of Cr crystalline materials is more than 0.5%, localized accumulated strain, therefore recrystal grain
Size is difficult to become uniform, under high temperature environment in use, crystal grain is possible to coarsening.
According to the above, in the present embodiment, the area ratio of the Cr crystalline materials in cross-section is defined as
0.5% or less.In addition, the upper limit of the area ratio of Cr crystalline materials is preferably set to 0.3% or less.
(the average crystal grain diameter after keeping heat treatment in 1 hour at implementing 1000 DEG C：0.1mm or more 3.0mm with
Under, the standard deviation of crystal grain diameter：1.5 or less)
The average crystal grain diameter after heat treatment in 1 hour is kept to set within the above range at 1000 DEG C, thus reliably
The coarsening of crystal grain when ground inhibits to use under high temperature environment.Also, the mark after heat treatment in 1 hour is kept at 1000 DEG C
Quasi- deviation is set as 1.5 hereinafter, being thus reliably suppressed the deviation for generating crystal grain diameter when using under high temperature environment.
It, in the present embodiment, will be flat after keeping heat treatment in 1 hour at implementing 1000 DEG C according to the above
Equal crystal grain diameter is located in the range of 0.1mm or more and 3.0mm or less, and the standard deviation of crystal grain diameter is set as 1.5 or less.
Additionally, it is preferred that the lower limit of average crystal grain diameter is set as 0.2mm or more, the upper limit of average crystal grain diameter is preferably set as 0.5mm
Below.Also, it is preferred that the upper limit of the standard deviation of crystal grain diameter is set as 1.3 or less.
Then, the manufacture of the Cu alloy material involved by the embodiment with reference to the flow chart of figure 1 to the present application
Method illustrates.
(melting, casting process S01)
First, the copper raw material being made of the oxygen-free copper that the purity of copper is 99.99 mass % or more is packed into carbon crucible, utilized
Vacuum melting furnace carries out melting and obtains copper melt.Then, aforementioned addition element is added in obtained melt to become rule
Fixed concentration, and carry out prepared composition and obtain molten alloyed copper.
Here, the raw material for using purity high as the raw material of Cr, Zr of addition element, such as the raw material of Cr use purity
The raw material of 99.99 mass % or more, the raw material of Zr use the raw material of 99.95 mass % of purity or more.Also, as needed, add
Add Al, Fe, Co, Sn, Zn, P, Si, Mg.In addition, the raw material as Cr, Zr, Al, Fe, Co, Sn, Zn, P, Si, Mg, can use
With the master alloy of Cu.
Moreover, will be through obtaining ingot bar in molten alloyed copper injection mold made of prepared composition.
(homogenize process process S02)
Then, it is heat-treated for obtained homogenizing for ingot bar.
Specifically, under air atmosphere, 950 DEG C or more and under conditions of 1050 DEG C or less, 1 hour or more to ingot bar into
Row homogenize process.
(hot procedure S03)
Then, within the scope of 900 DEG C or more and 1000 DEG C or less of temperature to ingot bar be processed 50% or more rate and
99% hot rolling below and obtain stocking.In addition, hot worked method can also be hot forging.After the hot-working, pass through water immediately
It is cold to be cooled down.
(solution treatment process S04)
Then, under the conditions of 920 DEG C or more and 1050 DEG C or less, 0.5 hour or more and 5 hours below, to hot-working
Obtained stocking implements heat treatment in process S03, and carries out solution treatment.Heat treatment is for example in air or inert gas
It is carried out under atmosphere, the cooling after heating is carried out by water cooling.
(ageing treatment process S05)
Then, after solution treatment process S04, implement the first ageing treatment, Cr system's precipitates and Zr is imperceptibly precipitated
It is the precipitate of precipitate etc., to obtain the first ageing treatment material.
Here, ageing treatment is for example in 400 DEG C or more and 530 DEG C or less, 0.5 hour or more and 5 hours conditions below
Lower progress.
In addition, heat treatment method when ageing treatment is not particularly limited, but preferably carry out under inert gas atmosphere.And
And the cooling means after heat treatment is not particularly limited, but preferably carried out by water cooling.
The Cu alloy material of present embodiment is produced by this process.
According to the Cu alloy material being set as involved by the present embodiment of the above structure, due to being set as forming as follows：Contain
There is 0.3 mass % less than the Cr of 0.5 mass %, 0.01 mass % or more and 0.15 mass % Zr below, remainder
Divide and be made of Cu and inevitable impurity, therefore fine precipitation can be precipitated by carrying out solution treatment and ageing treatment
Object, and intensity and conductivity can be improved.
Also, it is 0.3 mass % less than 0.5 mass % that the content of Cr is less, therefore after solution treatment, Cr
Crystalline material there's almost no.Specifically, the area ratio of the Cr crystalline materials in cross-section becomes 0.5% or less.Cause
This can inhibit to lead to local Strain Accumulation because of Cr crystalline materials, and the size of recrystal grain becomes uneven, even if
Under high temperature environment in the case of use, it can also be reliably suppressed local coarse grains.
Moreover, in the present embodiment, average crystal grain diameter is located in the range of 0.1mm or more and 2.0mm or less, and
The standard deviation of crystal grain diameter is set as 0.6 hereinafter, therefore local Strain Accumulation is few, the case where use even in a high temperature environment
Under, it can also inhibit local coarse grains.
Moreover, kept in the case where implementing 1000 DEG C the average crystal grain diameter after heat treatment in 1 hour be located at 0.1mm or more and
In the range of 3.0mm or less, and the standard deviation of crystal grain diameter is set as 1.5 hereinafter, even if holding 1 is small in the case where implementing 1000 DEG C
When heat treatment after, crystal grain will not local coarsening, even if under 500 DEG C or more of hot environment in the case of use,
Mechanical property and conductivity are also stablized.
Also, in the present embodiment, further contain more than 0.1 mass % and in the range of 2.0 mass % or less
In the case of Al, conductivity can be adjusted to 30~60%IACS or so.
Thereby, it is possible to obtain the Cu alloy material for the casting molds material for being particularly suitable as electromagnetic agitation purposes.
Also, choosing further in the present embodiment, is contained with total 0.005 mass % or more and 0.1 mass % or less
In the case of the element of one or more of Fe, Co, Sn, Zn, P, Si, Mg, by by the change containing these elements
The pinning-in effect that object generates is closed, the coarsening of crystal grain can be further reliably suppressed.
More than, the embodiment of the present application is illustrated, but it's not limited to that for the present application, is not being taken off
It can be suitably changed in the range of technological thought from the present invention.
Embodiment
Hereinafter, being illustrated to the result of the confirmation experiment carried out to confirm the effect of the present application.
Prepare the copper raw material being made of the oxygen-free copper of 99.99 mass % of purity or more, is loaded into carbon crucible, and in vacuum
Smelting furnace (vacuum degree 10-2Pa or less) in melting and obtain copper melt.Various addition element are added in obtained copper melt
And be prepared into shown in table 1 at being grouped as, after being kept for 5 minutes, mold made of iron is cast into molten alloyed copper injection and is cast
Block.The size of ingot bar is width about 80mm, thickness about 50mm, length about 130mm.
In addition, the raw material of the Cr as addition element uses the raw material of 99.99 mass % of purity or more, the raw material of Zr to use
Purity is the raw material of 99.95 mass % or more.
Then, at 1000 DEG C, after 1 hour condition progress homogenize process, to implement hot rolling under air atmosphere.
Rolling rate when by hot rolling is set as 80%, has obtained the hot rolling material of width about 100mm × thickness about 10mm × length about 520mm
Material.
Using the hot-finished material, solution treatment was carried out with 1.5 hours at 1000 DEG C conditions, later, shown in table 2
Cooling velocity is cooled down.
Then, ageing treatment is implemented under conditions of 500 (± 15) DEG C and 3 hours.Result in Cu alloy material.
The structure observation of the Cu alloy material after ageing treatment is carried out about obtained Cu alloy material, and is determined flat
The standard deviation of equal crystal grain diameter and crystal grain diameter.
Also, the average crystalline substance after keeping heat treatment in 1 hour at implementing 1000 DEG C is determined to the Cu alloy material
The standard deviation of grain diameter and crystal grain diameter.
In turn, cross-section is carried out about the material after solution treatment, and determines the area ratio of Cr crystalline materials.
Heat treatment after being shown respectively above-mentioned ageing treatment in Fig. 2A and Fig. 2 B, after being kept for 1 hour at carrying out 1000 DEG C
Before, the structure observation photo of the Cu alloy material of example 1 of the present invention and comparative example 4.
Similarly, after being shown respectively above-mentioned ageing treatment in Fig. 3 A and Fig. 3 B, after being kept for 1 hour at carrying out 1000 DEG C
The structure observation photo of the Cu alloy material of example 1 after heat treatment, of the present invention and comparative example 4.
(composition analysis)
Obtained Cu alloy material at be grouped as according to ICP-MS analyze and measure.Measurement result is shown in Table 1.
(standard deviation of average crystal grain diameter and crystal grain diameter)
On the plate thickness of obtained Cu alloy material, the sample of 10mm × 15mm is cut out from plate widthwise central portion, right
The surface of rolling direction (directions RD) has carried out microetch after being ground.
The sample is observed, and average crystal grain diameter is determined by the patterning method of defined in JIS H 0501.
(area ratio of Cr crystalline materials)
On the plate thickness of Cu alloy material, the sample of 10mm × 15mm is cut out from plate widthwise central portion, to rolling direction
The surface in (directions RD) has carried out microetch after being ground.
SEM observations are carried out to the sample, it, will in 1500 times of SEM-EPMA images (visual field of 70 μm of general 70 μ m)
The high region decision of Cr concentration ratio parent phases is " Cr crystalline materials ", and the area ratio of Cr crystalline materials is found out by following formula.
Area ratio=(area shared by Cr crystalline materials)/(70 70 μm of μ m)
The SEM-EPMA images of example 1 of the present invention and comparative example 4 are shown in Fig. 4 A~Fig. 4 D.
(tensile strength)
Rolling direction is set as draw direction, samples JIS 2241 No. 2 test films of Z, and use 100kN cupping machines
It is provided in experiment.
[table 1]
[table 2]
As representated by Fig. 2A and Fig. 3 A, in example 1~6 of the present invention, in the case where being placed in hot environment after
Inhibit the coarse grains of part.
On the other hand, as representated by Fig. 2 B and Fig. 3 B, in comparative example 1~4, in the case where being placed in hot environment
Later, crystal grain part coarsening.
Range of the standard deviation fewer than the range of the present application and crystal grain diameter than the present application in the content of Cr
In big comparative example 1, the tensile strength after aging strengthening model and at 1000 DEG C after heat treatment in 1 hour is insufficient.
The content of Cr is more than the range of the present application, average crystal grain diameter is smaller than the present application and crystal grain diameter
The standard deviation comparative example 2~4 bigger than the range of the present application in, resist after heat treatment in 1 hour at 1000 DEG C
Tensile strength is greatly reduced.
In contrast, in example 1~6 of the present invention, the tensile strength after aging strengthening model is high, and through 1 at 1000 DEG C
Tensile strength is not greatly reduced after the heat treatment of hour.
It is confirmed by the above, according to example of the present invention, even if the case where being used under 500 DEG C or more of hot environment
Under, also it is capable of providing the Cu alloy material that performance is also stablized and service life is excellent.
Industrial availability
It can inhibit the component being made of Cu-Cr-Zr systems alloy property-deterioration in a high temperauture environment, and casting can be extended
Make the service life with the products such as mold materials and welding component.
Claims (5)
1. a kind of Cu alloy material, which is characterized in that
With following composition：Containing 0.3 mass % less than the Cr, 0.01 mass % or more and 0.15 matter of 0.5 mass %
% Zr below are measured, remainder is made of Cu and inevitable impurity,
Average crystal grain diameter is located in the range of 0.1mm or more and 2.0mm or less, and the standard deviation of crystal grain diameter is 0.6
Below.
2. Cu alloy material according to claim 1, which is characterized in that
The area ratio of Cr crystalline materials in cross-section is 0.5% or less.
3. Cu alloy material according to claim 1 or 2, which is characterized in that
The average crystal grain diameter after heat treatment in 1 hour is kept to be located at 0.1mm or more and 3.0mm or less in the case where implementing 1000 DEG C
In the range of, and the standard deviation of crystal grain diameter is 1.5 or less.
4. Cu alloy material according to any one of claim 1 to 3, which is characterized in that
Further contain Al more than 0.1 mass % and in the range of 2.0 mass % or less.
5. Cu alloy material according to any one of claim 1 to 4, which is characterized in that
In the range of total 0.005 mass % or more and 0.1 mass % or less, further contain selected from Fe, Co, Sn, Zn, P,
The element of one or more of Si and Mg.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015219852A JP6693092B2 (en) | 2015-11-09 | 2015-11-09 | Copper alloy material |
| JP2015-219852 | 2015-11-09 | ||
| PCT/JP2016/080125 WO2017081972A1 (en) | 2015-11-09 | 2016-10-11 | Copper alloy material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108350530A true CN108350530A (en) | 2018-07-31 |
Family
ID=58695049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680065499.1A Pending CN108350530A (en) | 2015-11-09 | 2016-10-11 | Cu alloy material |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20190062874A1 (en) |
| EP (1) | EP3375898B1 (en) |
| JP (1) | JP6693092B2 (en) |
| KR (1) | KR20180078245A (en) |
| CN (1) | CN108350530A (en) |
| WO (1) | WO2017081972A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112981170A (en) * | 2021-02-05 | 2021-06-18 | 宁波金田铜业(集团)股份有限公司 | Chromium-zirconium-copper alloy for cold heading and preparation method thereof |
| CN114318049A (en) * | 2021-12-16 | 2022-04-12 | 镇江市镇特合金材料有限公司 | Long-life copper alloy for welding head box body and preparation method thereof |
| CN115896535A (en) * | 2022-11-26 | 2023-04-04 | 广州番禺职业技术学院 | Copper incense burner material and preparation method thereof |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106350698B (en) * | 2016-09-09 | 2018-03-27 | 宁波博威合金板带有限公司 | Anti-softening copper alloy, preparation method and applications |
| JP7035478B2 (en) * | 2017-11-21 | 2022-03-15 | 三菱マテリアル株式会社 | Molding material for casting |
| US20220119919A1 (en) * | 2019-02-20 | 2022-04-21 | Mitsubishi Materials Corporation | Copper alloy material, commutator segment, and electrode material |
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| JPS58212839A (en) * | 1982-06-03 | 1983-12-10 | Mitsubishi Metal Corp | Cu alloy for continuous casting mold |
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| JPS58107459A (en) * | 1981-12-21 | 1983-06-27 | Chuetsu Gokin Chuko Kk | Mold material for precipitation hardening type continuous casting |
| JPS59193233A (en) * | 1983-04-15 | 1984-11-01 | Toshiba Corp | Copper alloy |
| JPS6297748A (en) * | 1985-03-25 | 1987-05-07 | Fujikura Ltd | Cast wheel and its production |
| JPH05339688A (en) * | 1992-06-05 | 1993-12-21 | Furukawa Electric Co Ltd:The | Production of molding material for casting metal |
| JP3303623B2 (en) * | 1995-09-22 | 2002-07-22 | 三菱マテリアル株式会社 | Method for producing copper alloy mold material for steelmaking continuous casting and mold produced thereby |
| US9455058B2 (en) * | 2009-01-09 | 2016-09-27 | Mitsubishi Shindoh Co., Ltd. | High-strength and high-electrical conductivity copper alloy rolled sheet and method of manufacturing the same |
| JP5170916B2 (en) * | 2010-08-27 | 2013-03-27 | 古河電気工業株式会社 | Copper alloy sheet and manufacturing method thereof |
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| KR101364542B1 (en) * | 2011-08-11 | 2014-02-18 | 주식회사 풍산 | Copper alloy material for continuous casting mold and process of production same |
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2016
- 2016-10-11 US US15/771,847 patent/US20190062874A1/en not_active Abandoned
- 2016-10-11 WO PCT/JP2016/080125 patent/WO2017081972A1/en unknown
- 2016-10-11 EP EP16863936.7A patent/EP3375898B1/en active Active
- 2016-10-11 KR KR1020187012111A patent/KR20180078245A/en not_active Application Discontinuation
- 2016-10-11 CN CN201680065499.1A patent/CN108350530A/en active Pending
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| JPS58212839A (en) * | 1982-06-03 | 1983-12-10 | Mitsubishi Metal Corp | Cu alloy for continuous casting mold |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112981170A (en) * | 2021-02-05 | 2021-06-18 | 宁波金田铜业(集团)股份有限公司 | Chromium-zirconium-copper alloy for cold heading and preparation method thereof |
| CN112981170B (en) * | 2021-02-05 | 2022-04-12 | 宁波金田铜业(集团)股份有限公司 | Chromium-zirconium-copper alloy for cold heading and preparation method thereof |
| CN114318049A (en) * | 2021-12-16 | 2022-04-12 | 镇江市镇特合金材料有限公司 | Long-life copper alloy for welding head box body and preparation method thereof |
| CN115896535A (en) * | 2022-11-26 | 2023-04-04 | 广州番禺职业技术学院 | Copper incense burner material and preparation method thereof |
| CN115896535B (en) * | 2022-11-26 | 2023-12-12 | 广州番禺职业技术学院 | Copper incense burner material and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3375898A4 (en) | 2019-04-03 |
| WO2017081972A1 (en) | 2017-05-18 |
| US20190062874A1 (en) | 2019-02-28 |
| EP3375898A1 (en) | 2018-09-19 |
| KR20180078245A (en) | 2018-07-09 |
| JP6693092B2 (en) | 2020-05-13 |
| JP2017088949A (en) | 2017-05-25 |
| EP3375898B1 (en) | 2022-05-11 |
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